Pick-and-place photographing mechanism of scribing machine
By using the pick-and-place photographing mechanism of the dicing machine, the silicon wafer and the separator paper are processed simultaneously and broken wafers are detected, which solves the problem of low efficiency in the existing technology and improves the safety and efficiency of silicon wafer transportation.
Patent Information
- Application Number
- CN202520439524.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-03-12
AI Technical Summary
In existing technologies, silicon wafers require two sets of robotic arms to handle the separator paper and silicon wafers separately during transportation, which is inefficient and makes it difficult to effectively detect broken wafers.
A wafer dicing machine pick-and-place photographing mechanism is adopted, which simultaneously controls the pick-and-place of silicon wafers and separator paper through a set of transverse modules. Combined with the silicon wafer conveying track and detection device, it realizes the intermittent gripping of silicon wafers and separator paper and the detection of broken wafers.
It improves the efficiency of silicon wafer handling and placement, ensures that silicon wafers are not damaged during transportation, and enables rapid detection of broken wafers, preparing for subsequent dicing operations.
Smart Images
Figure CN223813121U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of silicon wafer taking and placing, and particularly relates to a taking and placing photographing mechanism of a scribe machine. BACKGROUND
[0002] Photovoltaic solar silicon wafer is the core part of a solar power generation system and the most valuable part of the solar power generation system. The silicon wafer functions to convert solar energy into electric energy, which is stored by a storage battery or directly used for work. At present, the silicon wafer is stored in a stacking mode by using a box in the transportation process, and the two silicon wafers are separated by a paper separator. In the process of taking and placing the silicon wafer, the paper separator needs to be taken away. In the conventional structure, two sets of mechanical hands work simultaneously, one set takes away the paper separator, and the other set takes away the silicon wafer, and the two sets of mechanical hands have the function of judging broken pieces. SUMMARY
[0003] An object of the utility model is to provide a taking and placing photographing mechanism of a scribe machine. One set of horizontal movement module simultaneously controls the taking and placing of the silicon wafer and the paper separator, improves the efficiency, and can detect broken pieces to prepare for subsequent scribing.
[0004] To achieve the object, the utility model adopts the following technical scheme.
[0005] A taking and placing photographing mechanism of a scribe machine comprises a taking and placing assembly and a silicon wafer conveying track.
[0006] The taking and placing assembly comprises a horizontal movement taking and placing module, a silicon wafer lifting module, and a paper separator lifting module. A paper separator grabbing plate and a silicon wafer grabbing plate are installed on the driving end of the horizontal movement taking and placing module. A silicon wafer box is connected to the driving end of the silicon wafer lifting module. A paper separator box is connected to the driving end of the paper separator lifting module.
[0007] A silicon wafer clamping plate motor is installed below the middle part of the silicon wafer conveying track. A clamping plate synchronous wheel is connected to the driving end of the silicon wafer clamping plate motor. A clamping plate synchronous belt is in transmission connection with the clamping plate synchronous wheel. A clamping plate arm is installed on the clamping plate synchronous belt. Two clamping plate arms are respectively arranged on the two sides of the silicon wafer conveying track. A taking and placing detection light source is installed below the rear end of the silicon wafer conveying track. A taking and placing detection camera is installed above the rear end of the silicon wafer conveying track.
[0008] As a preferred technical scheme, a paper separator suction nozzle is installed around the paper separator grabbing plate. A back-blowing air nozzle is installed around the silicon wafer grabbing plate.
[0009] As a preferred technical scheme, a paper separator lifting cylinder and a silicon wafer lifting cylinder are respectively installed on the two sides of the driving end of the horizontal movement taking and placing module. The driving end of the paper separator lifting cylinder is connected to the paper separator grabbing plate. The driving end of the silicon wafer lifting cylinder is connected to the silicon wafer grabbing plate.
[0010] As a preferred technical scheme, a folded wafer preventing sensor is installed above the middle part of the wafer conveying track.
[0011] As a preferred technical scheme, wafer clamping guide wheels are distributed along the front-rear direction on the clamping plate arms.
[0012] As a preferred technical scheme, a wafer taking and placing limiting arm is arranged at the rear end of the wafer conveying track and moves along the front-rear direction.
[0013] As a preferred technical scheme, a wafer taking and placing cylinder is fixed on the wafer conveying track, and the driving end of the wafer taking and placing cylinder is connected with the lower end of the wafer taking and placing limiting arm.
[0014] As a preferred technical scheme, a track wheel is rotatably connected on the wafer conveying track, and a track belt is transmissionally connected between the track wheels and located on both sides of the wafer conveying track.
[0015] The wafer taking and photographing mechanism of the wafer cutting machine has the advantages that: the wafer taking and photographing mechanism of the wafer cutting machine can put the paper separator between the wafers into the magazine when the wafers are put into the conveying track through interval type grabbing, so that the wafer grabbing time is not affected, and the conveying track has the wafer clamping positioning function and the broken wafer photographing function. BRIEF DESCRIPTION OF DRAWINGS
[0016] The utility model will be further explained in detail in the basis of the drawings and the embodiment.
[0017] Figure 1 The whole structure schematic view of the wafer taking and photographing mechanism of the wafer cutting machine is described in the embodiment.
[0018] Figure 2 The structure schematic view of three groups of taking and placing assemblies is described in the embodiment.
[0019] Figure 3 The structure schematic view of a single group of taking and placing assembly is described in the embodiment.
[0020] Figure 4 The structure schematic view of the transverse moving taking and placing module is described in the embodiment.
[0021] Figure 5 The rear end structure diagram of the wafer conveying track is described in the embodiment.
[0022] Figures 1 to 5 MIDDLE:
[0023] 1. Silicon wafer conveyor track; 2. Lateral transfer pick-and-place module; 3. Silicon wafer lifting module; 4. Paper separator lifting module; 5. Paper separator gripper plate; 6. Silicon wafer gripper plate; 7. Silicon wafer cassette; 8. Paper separator cassette; 9. Silicon wafer clamping plate motor; 10. Clamping plate synchronous pulley; 11. Clamping plate synchronous belt; 12. Clamping plate arm; 13. Pick-and-place detection light source; 14. Pick-and-place detection camera; 15. Paper separator suction nozzle; 16. Back-blowing nozzle; 17. Paper separator lifting cylinder; 18. Silicon wafer lifting cylinder; 19. Anti-overlapping sensor; 20. Clamping plate guide wheel; 21. Pick-and-place wafer limit arm; 22. Pick-and-place wafer cylinder; 23. Track wheel; 24. Track belt. Detailed Implementation
[0024] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0025] like Figures 1 to 5 As shown in this embodiment, a wafer pick-up and placement imaging mechanism for a dicing machine includes a pick-up and placement assembly and a silicon wafer conveying track 1. The pick-up and placement assembly includes a transverse pick-up and placement module 2, a silicon wafer lifting module 3, and a paper-separating lifting module 4. A paper-separating gripping plate 5 and a silicon wafer gripping plate 6 are installed on the drive end of the transverse pick-up and placement module 2. A silicon wafer cassette 7 is connected to the drive end of the silicon wafer lifting module 3, and a paper-separating cassette 8 is connected to the drive end of the paper-separating lifting module 4. A silicon wafer clamping motor 9 is installed below the middle of the silicon wafer conveying track 1. A clamping synchronous wheel 10 is connected to the drive end of the silicon wafer clamping motor 9. A clamping synchronous belt 11 is connected to the clamping synchronous wheel 10. A clamping arm 12 is installed on the clamping synchronous belt 11. The two clamping arms 12 are located on both sides of the silicon wafer conveying track 1. A pick-up and placement detection light source 13 is installed below the rear end of the silicon wafer conveying track 1, and a pick-up and placement detection camera 14 is installed above the rear end of the silicon wafer conveying track 1.
[0026] Inside the silicon wafer cassette 7, silicon wafers and spacers are stacked alternately to effectively protect them from scratching each other. The horizontal transfer module 2 synchronously controls the spacer gripping plate 5 and the silicon wafer gripping plate 6 to move left and right, placing the gripped silicon wafers into the silicon wafer conveying track 1. At this time, the spacer gripping plate 5 also moves to the silicon wafer cassette 7 to grip the spacers. When the spacer gripping plate 5 puts the spacers back into the spacer cassette 8, the silicon wafer gripping plate 6 also returns to the silicon wafer cassette 7 to grip the silicon wafers, performing intermittent processing through reciprocating motion.
[0027] The silicon wafer on the silicon wafer transport track 1 moves backward, and the silicon wafer clamping plate motor 9 controls the clamping plate synchronous wheel 10 to rotate, so that the clamping plate synchronous belt 11 drives the clamping plate arm 12 to move closer to the middle of the silicon wafer transport track 1, and straighten the tilted and offset silicon wafer, so that when it is above the pick-up and place detection light source 13, the pick-up and place detection camera 14 can perform fragment detection and position detection on the silicon wafer.
[0028] The four sides of the separator grabbing plate 5 are provided with separator suction nozzles 15, and the four sides of the silicon wafer grabbing plate 6 are provided with back-blowing nozzles 16. When the silicon wafer and the separator are grabbed, the separator is sucked up by the suction nozzles, and the back-blowing nozzles 16 blow the separator downward to prevent the silicon wafers from being stacked.
[0029] The driving ends of the separator lifting cylinder 17 and the silicon wafer lifting cylinder 18 are respectively arranged on the two sides of the driving end of the transverse moving pick-and-place module 2. The driving end of the separator lifting cylinder 17 is connected with the separator grabbing plate 5, and the driving end of the silicon wafer lifting cylinder 18 is connected with the silicon wafer grabbing plate 6. In order to ensure that the current other structures are not affected when the separator and the silicon wafer are grabbed each time, the separator lifting cylinder 17 is used to control the separator grabbing plate 5 to put down the separator to the separator box 8, and the silicon wafer lifting cylinder 18 is used to control the silicon wafer grabbing plate 6 to put down the silicon wafer to the silicon wafer conveying track 1.
[0030] The middle part of the silicon wafer conveying track 1 is provided with an anti-stacking sensor 19. The anti-stacking sensor 19 is used to detect whether the silicon wafers are stacked or not, and whether the separator is attached or not, so as to ensure that the subsequent photographing function can be smoothly performed.
[0031] The clamping plate guide wheels 20 are arranged on the clamping plate arms 12 along the front-to-back direction. When the clamping plate arms 12 are close to each other, the clamping plate guide wheels 20 reduce the hard contact between the clamping plate arms 12 and the side edges of the silicon wafers, thereby protecting the integrity of the silicon wafers.
[0032] The rear end of the silicon wafer conveying track 1 is provided with a pick-and-place limiting arm 21. The pick-and-place limiting arm 21 moves along the front-to-back direction. The pick-and-place cylinder 22 is fixed on the silicon wafer conveying track 1. The driving end of the pick-and-place cylinder 22 is connected with the lower end of the pick-and-place limiting arm 21. Under the action of the pick-and-place cylinder 22, the pick-and-place limiting arm 21 retreats, and the position of the silicon wafer is fixed at a position where the image can be photographed.
[0033] The track wheels 23 are rotatably connected to the silicon wafer conveying track 1. The track belts 24 are transmissionally connected between the track wheels 23. The track belts 24 are located on the two sides of the silicon wafer conveying track 1. In the conveying process of the silicon wafer conveying track 1, the rotating track wheels 23 control the track belts 24 to move, thereby driving the silicon wafers to move forward in parallel.
[0034] The modules involved in the present application are all linear modules.
[0035] It should be stated that the above specific embodiments are only the preferred embodiments of the present application and the technical principles applied, and any changes or replacements easily thought of by those skilled in the art within the technical range disclosed by the present application should be covered in the protection range of the present application.
Claims
1. A pick-and-place photographing mechanism of a wafer scriber, characterized in that, The device comprises a pick-and-place assembly and a silicon wafer conveying track. The pick-and-place assembly comprises a horizontal movement pick-and-place module, a silicon wafer lifting module and a paper separator lifting module. A silicon wafer clamping plate motor is installed below the middle part of the silicon wafer conveying track.
2. The pick-and-place photographing mechanism of the scribing machine according to claim 1, wherein A clamping plate synchronous wheel is connected to the driving end of the silicon wafer clamping plate motor.
3. The pick-and-place and photograph mechanism of the scriber according to claim 1, wherein, A clamping plate synchronous belt is in transmission connection with the clamping plate synchronous wheel.
4. The pick-and-place camera mechanism of a scribing machine according to claim 1, wherein, A clamping plate arm is installed on the clamping plate synchronous belt.
5. The pick-and-place camera mechanism of a scribe machine according to claim 1, wherein, Two clamping plate arms are respectively arranged on the two sides of the silicon wafer conveying track.
6. The pick-and-place and photograph mechanism of the scriber according to claim 1, wherein, A pick-and-place detection light source is installed below the rear end of the silicon wafer conveying track.
7. The pick-and-place and photograph mechanism of the scriber according to claim 6, wherein, A pick-and-place detection camera is installed above the rear end of the silicon wafer conveying track.
8. The pick-and-place and photograph mechanism of the scriber according to claim 1, wherein, A paper separator suction nozzle is installed around the paper separator grabbing plate. A silicon wafer grabbing plate is installed around the silicon wafer grabbing plate. A paper separator lifting air cylinder and a silicon wafer lifting air cylinder are respectively installed on the driving end of the horizontal movement pick-and-place module. The driving end of the paper separator lifting air cylinder is connected with the paper separator grabbing plate. The driving end of the silicon wafer lifting air cylinder is connected with the silicon wafer grabbing plate. A paper separator lifting air cylinder and a silicon wafer lifting air cylinder are respectively installed on the driving end of the horizontal movement pick-and-place module. The driving end of the paper separator lifting air cylinder is connected with the paper separator grabbing plate. The driving end of the silicon wafer lifting air cylinder is connected with the silicon wafer grabbing plate. A paper separator lifting air cylinder and a silicon wafer lifting air cylinder are respectively installed on the driving end of the horizontal movement pick-and-place module. The driving end of the paper separator lifting air cylinder is connected with the paper separator grabbing plate. The driving end of the silicon wafer lifting air cylinder is connected with the silicon wafer grabbing plate. A paper separator lifting air cylinder and a silicon wafer lifting air cylinder are respectively installed on the driving end of the horizontal movement pick-and-place module. The driving end of the paper separator lifting air cylinder is connected with the paper separator grabbing plate. The driving end of the silicon wafer lifting air cylinder is connected with the silicon wafer grabbing plate. A paper separator lifting air cylinder and a silicon wafer lifting air cylinder are respectively installed on the driving end of the horizontal movement pick-and-place module. The driving end of the paper separator lifting air cylinder is connected with the paper separator grabbing plate. The driving end of the silicon wafer lifting air cylinder is connected with the silicon wafer grabbing plate. A paper separator lifting air cylinder and a silicon wafer lifting air cylinder are respectively installed on the driving end of the horizontal movement pick-and-place module. The driving end of the paper separator lifting air cylinder is connected with the paper separator grabbing plate. The driving end of the silicon wafer lifting air cylinder is connected with the silicon wafer grabbing plate. A paper separator lifting air cylinder and a silicon wafer lifting air cylinder are respectively installed on the driving end of the horizontal movement pick-and-place module. The driving end of the paper separator lifting air cylinder is connected with the paper separator grabbing plate. The driving end of the silicon wafer lifting air cylinder is connected with the silicon wafer grabbing plate.