Slide glass heating mechanism for probe station
By using a ceramic heating plate and a staggered threaded hole fixing structure, the problems of complex structure, easy deformation and leakage of existing probe heating mechanisms are solved, achieving more stable heating and electrical insulation effects.
Patent Information
- Application Number
- CN202422982633.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2034-12-02
AI Technical Summary
The heating mechanism of existing probe stations is complex, easily deformed, and has unstable leakage current performance, making it difficult to meet the stability requirements of connections at high temperatures.
The heating plate is made of ceramic material, with the resistance wire wound in an annular groove and fixed to the metal screw through staggered threaded holes. Combined with the ceramic pad and the steel base plate, a stable connection structure is formed to avoid current leakage and thermal deformation.
This design achieves a simple and rigid structure, avoids damage to the resistance wire and heat transfer, and improves the stability and electrical insulation performance of the heating mechanism.
Smart Images
Figure CN223815378U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor test equipment technical field especially relates to a slide heating mechanism for probe station. BACKGROUND
[0002] The existing conductor device manufacturing process, probe station is mainly applied to the semiconductor industry, photoelectric industry, integrated circuit and the test of packaging, is widely used in the development of complex, high-speed device precision electrical measurement, aims at ensuring quality and reliability, and reduces the development time and device manufacturing process cost. Wafer processing needs to carry out processing treatment of multiple processes, in some processing processes need to use heating disc to heat wafer first, and then carry out subsequent processing, the purpose of heating is to detect the chip in wafer, so the actual use environment of chip needs to be simulated during detection, so the heating mode is used.
[0003] One kind of structure is: suction cup, heating disc is the same component, suction cup bottom fixed resistance wire, resistance wire outer sleeve insulating rubber, this mode is because the insulating sleeve outer wall is thin, can not stably solve the problem of electric leakage, and the existing suction cup is generally made of aluminum, and is easy to deform when heating.
[0004] Another structure is: heating disc, suction cup is split structure, and the heating disc is made of aluminum, and the bottom of the heating disc is processed into a concave shape, the resistance wire is first laid on the silica gel pad, and then hot-pressed in the concave surface of the heating disc, and the heating disc and the suction cup are separated by a ceramic disc to control the electrical performance; This way is complex, and the irregular shape of the heating disc is easy to deform when heating, and because the metal screw is used to fix the heating disc and the suction cup, the non-metal screw will deform at high temperature, which can easily lead to unstable connection, so the electric leakage performance cannot meet the use demand. SUMMARY
[0005] The utility model discloses a kind of slide heating mechanisms for probe station, which is simple in structure, has better rigidity, is not easy to deform after heating, and can avoid that resistance wire is damaged by current caused by excessive voltage.
[0006] To achieve the above object, the utility model adopts the following technical scheme:
[0007] A slide heating mechanism for probe station includes a bottom plate, a suction cup and a heating disc are sequentially arranged on the top of the bottom plate from top to bottom, and a plurality of annular grooves are formed on the bottom surface of the heating disc corresponding to the top surface of the bottom plate.
[0008] In the embodiment, the heating disc is made of ceramic, and the bottom plate is made of steel.
[0009] In the embodiment, the annular grooves are annularly distributed on the lower surface of the heating disc, and the annular grooves are located at the same center.
[0010] In the embodiment, the lower surface of the heating disc is further provided with a plurality of connecting grooves, and each connecting groove is used for connecting two adjacent annular grooves.
[0011] In the embodiment, the lower surface of the heating disc is further provided with a resistance wire, and the resistance wire is wound in the annular grooves and the connecting grooves.
[0012] In the embodiment, the heating disc is provided with a plurality of first staggered threaded holes and second staggered threaded holes.
[0013] In the embodiment, the first staggered threaded holes and the second staggered threaded holes are arranged away from the annular grooves and are arranged in the same radius, and the first staggered threaded holes are arranged between the second staggered threaded holes in the same radius.
[0014] In the embodiment, the heating disc is locked to the lower surface of the suction disc through the metal screws passing through the first staggered threaded holes.
[0015] In the embodiment, the heating disc and the bottom plate are further provided with a plurality of pads, the pads are made of ceramic material, the pads are one-to-one corresponding to the second staggered threaded holes, and the heating disc is locked to the upper surface of the bottom plate through the metal screws passing through the pads and the second staggered threaded holes.
[0016] In the embodiment, the bottom plate is further provided with at least one clamping plate, and at least one wire slot is formed at the edge of the lower surface of the heating disc, and the wire slot is used for leading out the resistance wire.
[0017] Compared with the prior art, the utility model provides a slide glass heating mechanism for probe station, has the following beneficial effect:
[0018] The utility model discloses a heating disc is changed into ceramic material through the heating disc, and the structure whole rigidity is better, and then the resistance wire is wound in the annular groove of the lower surface of the heating disc, and then is fixed by the metal screw, satisfies the locking demand between the resistance wire and each component;
[0019] Through setting first staggered threaded hole and second staggered threaded hole, make heating disc and suction disc, heating disc and bottom plate fixed connection, have saved multilayer structure, structure is simpler, simultaneously because first staggered threaded hole and second staggered threaded hole staggered arrangement, can pass through staggered mode, block current downward transmission, avoid voltage too big and lead to resistance wire being destroyed by current, and utilize ceramic insulation performance insulation, perfect leakage performance, make it not easy to deform after heating;
[0020] By setting the ceramic pad, the heating disc and the bottom plate are not in large-area direct contact, and since air itself is a good heat insulation material, the heat transferred from the heating disc to the bottom plate can be further reduced. BRIEF DESCRIPTION OF DRAWINGS
[0021] The above and other objects, features and advantages of the presently disclosed example embodiments will become more apparent from the following detailed description, taken in conjunction with the accompanying drawings, in which several example embodiments of the present disclosure are illustrated by way of example and not limitation. In the drawings, like or similar elements and / or features are referenced by like or similar reference numbers, in which:
[0022] Figure 1 is an exploded view of the slide heating mechanism for the probe station of the present application;
[0023] Figure 2 is a schematic view of the slide heating mechanism for the probe station of the present application;
[0024] Figure 3 is a side view of the slide heating mechanism for the probe station of the present application;
[0025] Figure 4 is a schematic view of the heating disc structure of the slide heating mechanism for the probe station of the present application;
[0026] Figure 5 is a schematic view of the staggered holes of the slide heating mechanism for the probe station of the present application.
[0027] Reference signs: 1, bottom plate; 11, clamping plate; 2, suction disc; 3, heating disc; 31, annular groove; 32, connecting groove; 33, first staggered threaded hole; 34, second staggered threaded hole; 35, pad; 36, wire slot. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present disclosure.
[0029] Some embodiments of the present application will be described in detail below with reference to the drawings. In the case of no conflict, the following embodiments and the features in the embodiments can be combined with each other.
[0030] The conventional heating disc and suction disc are of split structure, and the heating disc is made of aluminum, the overall structure is complex, and the irregular shape of the heating disc is easily deformed during heating.
[0031] Therefore, asFigures 1-5 As shown in the figure, a slide heating mechanism for a probe station comprises a base plate 1, and at least one clamping plate 11 is arranged around the base plate 1. In the embodiment, a circular hole is arranged on the clamping plate 11 for fixing connection. The clamping plate 11 can facilitate the taking and fixing of the base plate 1. Meanwhile, the base plate 1 is made of steel, which can enhance the stability of the structure.
[0032] Further, a suction disc 2 and a heating disc 3 are sequentially arranged above the base plate 1 from top to bottom. The heating disc 3 is made of ceramic material, which has good rigidity and is not easy to deform after being heated.
[0033] Further, a plurality of annular grooves 31 are arranged on the lower surface of the heating disc 3, which corresponds to the upper surface of the base plate 1. The number of the annular grooves 31 is at least 2, such as 2, 3, 4, 5, 6, 7, 8, 9, 10, etc. In an embodiment, the number of the annular grooves 31 is 8. Specifically, the annular grooves 31 are uniformly distributed in a ring shape on the lower surface of the heating disc 3, and the plurality of annular grooves 31 are located at the same center. Meanwhile, a plurality of connecting grooves 32 are arranged on the lower surface of the heating disc 3. The direction of the connecting grooves 32 is opposite to that of the annular grooves 31, and each connecting groove 32 is used to connect two adjacent annular grooves 31.
[0034] Further, a resistance wire (not shown) is arranged on the lower surface of the heating disc 3, and the resistance wire is coiled in the annular grooves 31 and the connecting grooves 32. At least one wire groove 36 is arranged at the edge of the lower surface of the heating disc 3, which is used to lead out the resistance wire. Specifically, the resistance wire coiled in the annular grooves 31 and the connecting grooves 32 does not need to be insulated by rubber, and the connecting grooves 32 can arrange the resistance wire neatly during the coiling process. Since the direction of the connecting grooves 32 is opposite to that of the annular grooves 31, the resistance wire is not easy to slide off after winding through the connecting grooves 32, which can prevent the distribution position from deviating and make the heating disc 3 heat evenly. The wire groove 36 can lead out both ends of the resistance wire to connect with external equipment. Of course, according to the actual situation, grooves for coiling the resistance wire can be arranged, including but not limited to the annular grooves 31 and the connecting grooves 32 in the embodiment.
[0035] Further, the heating disc 3 is provided with a plurality of first staggered threaded holes 33 and second staggered threaded holes 34. Specifically, the first staggered threaded holes 33 and the second staggered threaded holes 34 are arranged away from the annular groove 31, and the first staggered threaded holes 33 and the second staggered threaded holes 34 in the same radius are arranged alternately. Among them, at least one first staggered threaded hole 33 is arranged between the second staggered threaded holes 34 in the same radius. In the specific embodiment, the structures of the first staggered threaded holes 33 and the second staggered threaded holes 34 are consistent, but in other embodiments, only the first staggered threaded holes 33 or the second staggered threaded holes 34 can be arranged in the same radius, as long as the first staggered threaded holes 33 and the second staggered threaded holes 34 are arranged staggered.
[0036] In the specific embodiment, there are A-Z holes, among which A / C / E / G / I / K / M / O / S / V / Y are second staggered threaded holes 34, and B / D / F / H / J / L / N / P / Q / R / T / U / W / X / Z are first staggered threaded holes 33. Of course, the number of holes is not limited to the above.
[0037] Further, the heating disc 3 is locked to the lower surface of the suction disc 2 by metal screws passing through the first staggered threaded holes 33. In the specific embodiment, the screws are not limited to metal materials, but can also be resin screws. Since the electrical performance needs to be met, resin screws are also an option. However, due to the expansion of various parts during heating, the resin screws may fail due to insufficient strength, so the structure preferably uses metal screws for locking.
[0038] Further, a plurality of pads 35 are arranged between the heating disc 3 and the bottom plate 1, and the pads 35 are made of ceramic material. In the specific embodiment, the pads 35 are cylindrical, but are not limited to cylindrical and can be any other shape. The pads 35 correspond one-to-one to the second staggered threaded holes 34, and the heating disc 3 is locked to the upper surface of the bottom plate 1 by metal screws passing through the pads 35 and the second staggered threaded holes 34. By arranging the first staggered threaded holes 33 and the second staggered threaded holes 34, the heating disc 3 is fixedly connected to the suction disc 2 and the bottom plate 1, thereby eliminating the multi-layer structure and simplifying the structure. At the same time, due to the staggered arrangement of the first staggered threaded holes 33 and the second staggered threaded holes 34, the current can be blocked downward by staggering, thereby preventing the resistance wire from being damaged by excessive current and improving the leakage performance by using the insulation performance of ceramic. The pads 35 are arranged between the heating disc 3 and the bottom plate 1, so that they do not directly contact each other in a large area. Since air itself is a good heat insulation material, the heat transferred from the heating disc 3 to the bottom plate 1 can be further reduced.
[0039] The working principle of the utility model discloses: resistance wire is heated by electricity, because the heating disc 3 is ceramic material, rigidity is good, the sucking disc 2 is more difficult to produce thermal deformation, and ceramic pad 35 is arranged between the heating disc 3 and the bottom plate 1, the heat of the heating disc 3 is reduced to the bottom plate 1, and because the connecting form of the ceramic heating disc 3, the first staggered threaded hole 33 and the second staggered threaded hole 34 are staggered, wherein, the heating disc 3 is locked to the lower surface of the sucking disc 2 through the first staggered threaded hole 33, and the heating disc 3 is locked to the upper surface of the bottom plate 1 through the second staggered threaded hole 34, so that all the screws are locked through the staggered mode, and the ceramic insulation performance is used for insulation, the current is blocked to be transmitted downward, and the resistance wire is prevented from being damaged by the current caused by excessive voltage.
[0040] In the above description of the present specification, unless otherwise explicitly specified and limited, the terms "fixed", "mounted", "connected" or "connected" and the like should be understood in a broad sense. For example, as for the term "connected", it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements. Therefore, unless otherwise explicitly limited in the present specification, those skilled in the art can understand the specific meaning of the above terms in the present application according to the specific circumstances.
[0041] According to the above description of the present specification, those skilled in the art can also understand that the terms used, such as "up", "down", "front", "back", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "center", "longitudinal", "transverse", "clockwise" or "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings of the present specification, which is only for the purpose of facilitating the description of the present application and simplifying the description, and is not explicitly or implicitly indicated that the device or element involved must have the specific orientation, be constructed and operated in a specific orientation, therefore the above orientation or positional relationship terms cannot be understood or interpreted as a limitation on the present application.
[0042] In addition, the terms "first" or "second" and the like used in the present specification are used to refer to the terms of number or ordinal only for the purpose of description, and cannot be understood as explicitly or implicitly indicating relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" or "second" can explicitly or implicitly include at least one feature. In the description of the present specification, the meaning of "a plurality of" is at least two, such as two, three or more, etc., unless otherwise explicitly specified and limited.
[0043] While the specification has illustrated and described various embodiments of the application, it will be clear to those skilled in the art that modifications, variations, and alternatives to the embodiments described herein can be made without departing from the spirit and scope of the application. It is understood that various alternatives to the embodiments of the application described herein can be employed in practicing the application. The appended claims are intended to cover all such alternatives as would be included within the spirit and scope of the present application.
Claims
1. A substrate heating mechanism for a probe station, comprising a base plate (1), characterized in that, The bottom plate (1) is provided with a suction cup (2) and a heating plate (3) from top to bottom. The heating plate (3) is made of ceramic material and has several annular grooves (31) on its lower surface.
2. The wafer heating mechanism for a probe station according to claim 1, characterized in that, The base plate (1) is made of steel.
3. The wafer heating mechanism for a probe station according to claim 1, characterized in that, The annular grooves (31) are distributed in a ring on the lower surface of the heating plate (3), and several of the annular grooves (31) are located at the same center.
4. The wafer heating mechanism for a probe station according to claim 1, characterized in that, The lower surface of the heating plate (3) is also provided with a plurality of connecting grooves (32), each of the connecting grooves (32) being used to connect two adjacent annular grooves (31).
5. The wafer heating mechanism for a probe station according to claim 4, characterized in that, The heating plate (3) is also provided with a resistance wire on its lower surface, which is coiled in the annular groove (31) and the connecting groove (32).
6. The wafer heating mechanism for a probe station according to claim 1, characterized in that, The heating plate (3) is provided with a plurality of first misaligned threaded holes (33) and second misaligned threaded holes (34).
7. The wafer heating mechanism for a probe station according to claim 6, characterized in that, The first misaligned threaded hole (33) and the second misaligned threaded hole (34) are arranged to avoid the annular groove (31), and the first misaligned threaded hole (33) and the second misaligned threaded hole (34) located within the same radius are staggered, wherein at least one first misaligned threaded hole (33) is provided between the second misaligned threaded holes (34) located within the same radius.
8. The wafer heating mechanism for a probe station according to claim 6, characterized in that, The heating plate (3) is locked to the lower surface of the suction cup (2) by a metal screw passing through the first misaligned threaded hole (33).
9. The wafer heating mechanism for a probe station according to claim 6, characterized in that, Several pads (35) are provided between the heating plate (3) and the base plate (1). The pads (35) are made of ceramic material. The pads (35) correspond one-to-one with the second misaligned threaded holes (34). The heating plate (3) is locked to the upper surface of the base plate (1) by metal screws passing through the pads (35) and the second misaligned threaded holes (34).
10. The wafer heating mechanism for a probe station according to claim 1, characterized in that, The base plate (1) is provided with at least one card plate (11) around its perimeter, and the heating plate (3) has at least one groove (36) at the edge of its lower surface.