Heat dissipation module of inverter and photovoltaic inverter
By designing a heat dissipation module in the photovoltaic inverter, and utilizing the contact between the electrode body and the heat sink combined with an insulating thermally conductive layer, the problem of heat dissipation difficulties for electronic components is solved, achieving a more efficient heat dissipation effect and a simplified installation process.
Patent Information
- Application Number
- CN202520331951.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-02-27
AI Technical Summary
Existing photovoltaic inverters suffer from difficulties in heat dissipation of electronic components and have high thermal resistance on circuit boards, resulting in poor heat dissipation performance.
The inverter adopts a heat dissipation module design, which involves stacking the main body of the electrode on the heat sink and making contact with it, bending the connection pins and connecting them to the circuit board, and combining an insulating thermal conductive layer to reduce interface thermal resistance and improve heat exchange efficiency.
It effectively fixes the position of electronic components, reduces thermal resistance, enhances heat dissipation, simplifies the installation process, and improves the heat dissipation performance of the radiator.
Smart Images
Figure CN223816264U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to power electronics technical field, concretely relates to a heat dissipation module of inverter and photovoltaic inverter. BACKGROUND
[0002] The electronic components in the photovoltaic inverter include a package shell, a pin, a main body, a chip disposed in the package shell, one end of the pin is connected with the chip, and the other end of the pin passes through the package shell and is connected with a circuit board to electrically connect the electronic components with the circuit board.
[0003] The current arrangement mode is that the circuit board is located between the electronic components and the heat sink, this scheme makes the electronic components difficult to dissipate heat, in order to solve this problem, copper is laid on the surface of the circuit board or slots are opened on the circuit board to lead out heat to the other side of the circuit board, and finally the heat is led out through the heat sink, but the thermal resistance of the circuit board is large, which is not conducive to the heat dissipation of the electronic components. UTILITY MODEL CONTENTS
[0004] In order to solve the above technical problems, the utility model provides a heat dissipation module of inverter and photovoltaic inverter, and the heat dissipation effect is good.
[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0006] A heat dissipation module of inverter includes a circuit board, a heat sink and electronic components, the electronic components include a shell and a plurality of electrodes extending outward from the shell, at least one of the electrodes includes a main body and a connecting pin, the main body is laminated on the heat sink and contacts the heat sink, and the connecting pin is bent from the heat sink towards the circuit board and connected with the circuit board.
[0007] In a preferred embodiment, a plurality of the electrodes are electrically connected with the circuit board.
[0008] In a preferred embodiment, the main body is a flat plate.
[0009] In a preferred embodiment, the width of the connecting pin is less than the width of the main body.
[0010] In a preferred embodiment, the plurality of electrodes include a drain electrode, and the drain electrode is the main body and the connecting pin.
[0011] In a preferred embodiment, the electronic components are disposed between the circuit board and the heat sink, and the shell is laminated on the main body.
[0012] In a preferred embodiment, the electronic components include a MOS tube.
[0013] In a preferred embodiment, the heat sink comprises a substrate, and an insulating heat-conducting layer is arranged between the main body and the substrate. The insulating heat-conducting layer further increases the contact area or heat exchange area, reduces the interface thermal resistance, and thus improves the heat exchange efficiency.
[0014] The utility model discloses still uses following technical scheme:
[0015] A photovoltaic inverter comprises the heat dissipation module.
[0016] In a preferred embodiment, the photovoltaic inverter comprises a box, the circuit board and the electronic components are arranged in the box, and the heat sink is arranged on the back of the box. The heat dissipation surface of the electronic components abuts against the heat sink, thereby improving the heat dissipation effect.
[0017] The utility model discloses above scheme, compared with prior art has following advantages:
[0018] The heat dissipation module of the inverter, the connecting pin on the electronic component in the inverter is fixedly connected with the circuit board, and the main body of the electrode abuts against the heat sink. On one hand, the position of the electronic component is fixed by the pin, and on the other hand, the thermal resistance is reduced, thereby enhancing the heat dissipation effect of the electronic component. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical scheme of the utility model, the following will be needed to use the drawings in the embodiment description briefly introduced, obviously, the following description in the drawings is only some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, can also obtain other drawings according to these drawings.
[0020] Figure 1 It is a schematic view of the photovoltaic inverter according to the embodiment of the utility model;
[0021] Figure 2 It is a perspective view of the MOS tube according to the embodiment of the utility model;
[0022] Figure 3 It is another perspective view of the MOS tube according to the embodiment of the utility model;
[0023] Figure 4 It is a top view of the MOS tube according to the embodiment of the utility model;
[0024] Figure 5 It is a bottom view of the MOS tube according to the embodiment of the utility model;
[0025] Figure 6 It is a schematic view of the cooperation connection of the MOS tube and the circuit board.
[0026] Among them,
[0027] 1. A circuit board;
[0028] 2. A MOS tube; 21. A shell; 211. A mounting surface; 212. A heat dissipation surface; 22. A connecting pin; 221. A drain; 222. A source; 223. A gate; 224. A bending part; 24. A main body;
[0029] 3. A heat sink; 31. A base plate; 32. A heat dissipation fin;
[0030] 4. An insulating and heat conducting layer. DETAILED DESCRIPTION
[0031] The preferred embodiments of the present application will be described in detail with reference to the drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is used to help understand the present application, but does not constitute a limitation on the present application. In addition, the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0032] Referring to Figures 1 to 6 The present embodiment provides a photovoltaic inverter, which comprises a box body (not shown in the figure) and a heat dissipation module. The heat dissipation module comprises a circuit board 1, electronic components and a heat sink 3. The electronic components are arranged between the circuit board 1 and the heat sink 3. The circuit board 1 and the electronic components are arranged inside the box body, and the heat sink 3 is arranged at the back of the box body. The electronic components are mainly used to realize the conversion of direct current to alternating current, and its function is to output alternating current after the conversion of the input direct current through the inverter.
[0033] Further, the electronic components include MOS tubes, diodes and IGBTs, etc. Specifically, the electronic components of the present embodiment are MOS tubes 2, which are high-performance, low-voltage drop and high-switching-speed switching devices. More specifically, the MOS tubes 2 of the present embodiment are N-channel MOS tubes.
[0034] Referring to Figure 2 As shown in the figure, the MOS tube 2 comprises a shell 21, a chip arranged in the shell 21 and a plurality of electrodes extending outward from the shell 21. The plurality of electrodes are electrically connected to the circuit board 1. At least one of the electrodes comprises a main body 24 and a connecting pin 22. Specifically, in the present embodiment, the number of electrodes is three. One of the electrodes has a main body 24 and a connecting pin 22, and the other two electrodes only have a connecting pin 22. Further, the main body 24 is stacked on the heat sink 3 and in contact with the heat sink 3, thereby improving the heat dissipation effect. The shell 21 is stacked on the main body 24. The three connecting pins 22 are bent from the heat sink 3 towards the circuit board 1 and are electrically connected to the circuit board 1.
[0035] More specifically, one end of the connecting pin 22 is connected with the chip, and the other end of the connecting pin 22 is connected through the shell 21 and the circuit board 1. Further, the connecting pin of the MOS tube 2 is a patch type connecting pin, which is bent to the side of the mounting surface after being extended from the main body of the electronic component, and then extends to the direction of the main body of the electronic component in parallel to the mounting surface of the electronic component.
[0036] Further, the plurality of electrodes include a drain 221, a source 222, and a gate 223. The gate 223 is a key pin for controlling the switch of the MOS tube, and the conduction and turn-off of the MOS tube 2 are controlled by controlling the voltage of the gate 223. The gate 223, the source 222, and the drain 221 are isolated by an insulating layer, so that the impedance of the gate 223 is very high in the absence of electricity, and there is no significant connection with the other two pins. The source 222 is a pin for current inflow, and is usually connected to the negative electrode of the MOS tube 2. In an N-channel MOS tube, the source is usually grounded. The drain is the main body 24 and the connecting pin 22 integrally provided with the main body 24 in this embodiment. The drain 221 is a pin for current outflow, and is connected to the positive electrode of the external circuit. In an N-channel MOS tube, the drain is connected to the positive power supply or the load. For an N-channel MOS tube, the current flows from the drain 221 to the source 222.
[0037] Further, referring to FIG. 2, Figure 1 the source 222, the gate 223, and the drain 221 of the MOS tube 2 are respectively welded and fixed to the circuit board 1. The drain 221 and the source 222 are oppositely arranged, the connecting pin 22 of the MOS tube 2 is fixedly connected with the circuit board 1 to fix the MOS tube 2, avoiding the use of a crystal cover to fix the MOS tube. Compared with the crystal cover in the prior art, the area occupied by the crystal cover is larger, and the reliability and flatness during long-term use are difficult to guarantee. The mounting structure of the photovoltaic inverter of this embodiment is relatively simple.
[0038] The main body 24 and the drain 221 are integrally provided in this embodiment, the main body 24 is a flat plate, and the structure of the main body 24 is specifically a rectangle. The width of the connecting pin 22 is smaller than the width of the main body 24. The drain 221 is connected with the short side of the main body 24, and the area of the main body 24 is substantially equal to the area of the shell 21. The main body 24 of this embodiment not only plays a role in heat dissipation, but also plays a role in current conduction. The specific current routing is circuit board 1→drain 221→source 222→circuit board 1.
[0039] Further, the material of the main body 24 is copper, and more specifically, the material of the main body 24 is red copper with good heat conduction performance, so as to improve the heat transfer effect of the main body 24, thereby improving the heat dissipation performance of the electronic component. Moreover, it is also because the material of the main body 24 is metal that the main body 24 can play a role in electric conduction.
[0040] Referring to FIG. 2,Figure 1 As shown, the main body 24 and the heat sink 3 are in abutment. Specifically, the heat sink 3 comprises a base plate 31 and heat dissipation fins 32, the heat sink 3 is in one-piece structure, the base plate 31 and the heat dissipation fins 32 are made of aluminum, the main body 24 and the base plate 31 are in abutment; the number of the heat dissipation fins 32 is multiple, two adjacent heat dissipation fins 32 form a heat dissipation channel, the heat dissipation fins 32 increase the heat exchange area of the heat sink 1 with the outside, and quickly export heat to the outside environment.
[0041] Further, the main body 24 and the base plate 31 of the embodiment are provided with an insulating heat conducting layer 4, the purpose of setting the insulating heat conducting layer 4 is to further increase the contact area or heat exchange area, reduce the interface thermal resistance, and thus improve the heat exchange efficiency. The insulating heat conducting layer 4 can be selected from a thermally conductive and insulating film, a thermally conductive pad and other TIMs (Therm Interface Material). By filling the insulating heat conducting layer 4 between the circuit board 1 and the heat sink 3, the insulating heat conducting layer 4 is a liquid with good flowability before curing, even if the area of the circuit board 1 increases, the insulating heat conducting layer 4 can also automatically fill between the circuit board 1 and the heat sink 3, and the heat dissipation effect is enhanced.
[0042] Further, the main body 24 and the shell 21 are in one-piece structure by insert injection molding process, and the manufacturing process is relatively simple. Figure 2 and Figure 3 As shown, the shell 21 has a mounting surface 211 and a heat dissipation surface 212 opposite to the mounting surface 211, the main body 24 is arranged on the heat dissipation surface 212 of the shell 21, the bent part 224 of the connecting pin 22 faces the mounting surface 211 of the shell 21, and the bent part 224 and the circuit board 1 are welded and fixed. The bent part 224 refers to the part away from the shell 21, the heat dissipation surface 212 refers to the upper end part of the shell 21, the mounting surface 211 refers to the lower end part of the shell 21, and the "upper end part" and "lower end part" in this paper refer to the up-down direction as shown in Figure 2
[0043] The upper end part of the shell 21 of the MOS tube 2 of the embodiment faces the circuit board 1, and another pin is led out close to the main body 24 of the heat sink 3 for conducting current, and the bending direction of all pins is no longer towards the heat sink 3, but towards the circuit board 1. When assembling, after the three pins are welded to the circuit board 1, the main body 24 is close to the heat sink 3, so that the main body 24 can be directly in abutment with the heat sink 3 after the thermally conductive interface material is applied on the main body 24, the distance between the main body 24 and the heat sink 3 is shortened, and the heat dissipation effect is increased.
[0044] The photovoltaic inverter of the embodiment directly welds and fixes the drain 221, the source 222 and the gate 223 of the MOS tube 2 with the circuit board 1, is simple and convenient to install, the main body 24 contacts the radiator 3, and the insulating heat conducting layer 4 is further arranged between the main body 24 and the radiator 3, so that the thermal resistance is reduced, the heat dissipation effect is improved, and the cost is almost unchanged.
[0045] As shown in the specification and claims, the term "comprising" only indicates that the steps and elements explicitly identified are included, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements. The term "and / or" used herein includes any combination of one or more related listed items.
[0046] It should be noted that, unless otherwise specified, when a certain feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. In addition, the up, down, left, right and other descriptions used in the utility model are only relative to the mutual position relationship of the components of the utility model in the drawings.
[0047] The above embodiments are only for illustrating the technical concept and characteristics of the utility model, and are preferred embodiments, and the purpose is to enable those skilled in the art to understand the content of the utility model and implement it, and the protection scope of the utility model cannot be limited. Any equivalent transformation or modification according to the principle of the utility model should be covered within the protection scope of the utility model.
Claims
1. A heat dissipation module of an inverter, characterized in that, The electronic component includes a circuit board, a heat sink, and an electronic component, the electronic component including a housing and a plurality of electrodes extending outward from the housing, at least one of the electrodes including a main body and a connecting pin, the main body being laminated on the heat sink and being in contact with the heat sink, the connecting pin being bent from the heat sink toward the circuit board and being connected to the circuit board.
2. The heat dissipation module of claim 1, wherein, The plurality of electrodes are electrically connected to the circuit board.
3. The heat dissipation module of claim 2, wherein, The main body is flat.
4. The heat dissipation module of claim 3, wherein, The width of the connecting pin is smaller than the width of the main body.
5. The heat dissipation module of claim 1, wherein, The plurality of electrodes include a drain, the drain being the main body and the connecting pin.
6. The heat dissipation module of claim 5, wherein, The electronic component is disposed between the circuit board and the heat sink, the housing being laminated on the main body.
7. The heat dissipation module of claim 5, wherein, The electronic component includes a MOS tube.
8. The heat dissipation module of claim 1, wherein, The heat sink includes a substrate, and an insulating and heat-conducting layer between the main body and the substrate.
9. A photovoltaic inverter, characterized by The heat dissipation module includes the heat dissipation module as claimed in any one of claims 1 to 8.
10. The photovoltaic inverter of claim 9, wherein, The photovoltaic inverter includes a box, the circuit board and the electronic component being disposed in the box, and the heat sink being disposed on the back of the box.