Magnetic array cooling device for super-atom beam source type selection

Abstract

The utility model relates to the technical field of semiconductor material processing, and discloses a magnetic array cooling device for super-atomic beam source type selection, which comprises a cooling cavity and a shell, the cooling cavity is wrapped on the periphery of a magnetic array, and a cooling medium is filled in the cooling cavity. The cooling cavity is arranged between the shell and the magnetic array to serve as a heat dissipation layer structure, and the magnetic array in the screening work can be cooled in time. The shell is arranged on the periphery of the cooling cavity in a sleeving mode, the relative position of the cooling cavity and the magnetic array in the extension direction of the model selection channel can be limited, and the installation structure of the cooling device is stabilized. According to the magnetic array cooling device for super-atom beam source type selection, the effect of a screening process can be improved, and the service life of a magnetic screening structure is protected.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor material processing technical field especially relates to a kind of magnetic array cooling device for ultra-atom beam source selection. BACKGROUND

[0002] With the development of ultra large scale integrated circuit, semiconductor surface processing technology is increasingly fine, especially in wafer surface polishing and etching process, the precision requirement of processing rate, surface damage, surface roughness reduction, heat accumulation is higher and higher.In conventional plasma process, gas molecules are ionized to form single atom ion bombardment wafer surface, which will have significant injection effect on wafer surface lattice, affect surface smoothness and lattice quality.

[0003] In recent years, depending on the development of polishing and etching equipment of ultra-atom beam, it begins to be applied in the field of superhard material polishing, precision optical device processing.Ultra atom is a nanometer level diameter of microparticle combined by gas molecules through van der waals force, which contains hundreds to thousands of gas molecules, and can be regarded as an "atom" when ionized collision and electromagnetic field motion, but compared with single atom, particle mass and collision cross section increase several to thousands.When ultra-atom collides with material surface, transverse sputtering effect and local thermal annealing effect can effectively improve surface smoothness and surface lattice quality, which has good process effect in wafer surface processing.

[0004] Ultra-atom beam shows broad application prospect in high-precision processing field.However, gas ultra-atom beam is usually generated by ultrasonic adiabatic expansion process, and not all gas molecules can form ultra-atom in the process of combining collision gas molecules by intermolecular van der waals force due to sharp reduction of thermal motion, and a large number of single gas molecules are mixed, which will form single atom ion after ionization, and if not filtered, these single atom ions will be mixed in ultra-atom beam incident on the surface of the wafer to be processed, which is different from the transverse sputtering effect of ultra-atom on material surface, and the small radius of single atom ion will have significant injection effect on surface lattice, affect surface smoothness and lattice quality, and the process effect will be poor.

[0005] A kind of magnetic screening device for ultra-atom beam source selection can screen single atom ion in ultra-atom beam, so as to improve the proportion of ultra-atom in ultra-atom beam and improve process effect.But a large number of single atom ions are shot on the inner wall of selection channel, which will cause the temperature of selection channel and magnetic screening device structure to rise sharply;Temperature is difficult to dissipate and will accumulate, and high temperature will not only affect the effect of screening process, but also cause long-term heat damage to structure and reduce service life. UTILITY MODEL CONTENTS

[0006] The utility model discloses a purpose lies in provide a kind of magnetic array cooling device for ultra-atom beam source selection, can be in screening work in time cooling to magnetic array, improve the effect of screening process, protect magnetic screening structure and service life.

[0007] To achieve this purpose, the utility model adopts the following technical scheme:

[0008] The magnetic array cooling device for ultra-atom beam source selection includes:

[0009] Cooling cavity, the cooling cavity is wrapped in the outer periphery of magnetic array, the inside of the cooling cavity is filled with cooling medium;

[0010] Shell, the shell is sleeved on the outer periphery of the cooling cavity, and the shell is used to limit the relative position of the cooling cavity and the magnetic array in the extension direction of selection channel.

[0011] As an optional technical scheme of the magnetic array cooling device for ultra-atom beam source selection, the cooling medium is liquid or gas.

[0012] As an optional technical scheme of the magnetic array cooling device for ultra-atom beam source selection, a plurality of positioning spacers are clamped between the cooling cavity and the magnetic array, and a plurality of the positioning spacers are arranged one by one corresponding to a plurality of magnetic bodies of the magnetic array.

[0013] As an optional technical scheme of the magnetic array cooling device for ultra-atom beam source selection, the cooling cavity is hollowed out along the extension direction of the selection channel, and a plurality of mounting planes are arranged on the hollow inner wall of the cooling cavity, and a plurality of the mounting planes are arranged one by one corresponding to a plurality of magnetic bodies of the magnetic array.

[0014] As an optional technical scheme of the magnetic array cooling device for ultra-atom beam source selection, a medium coil is arranged in the cooling cavity, and the cooling medium is filled in the medium coil.

[0015] As an optional technical scheme of the magnetic array cooling device for ultra-atom beam source selection, the winding density of the medium coil located at the relatively high-temperature position of the selection channel and the magnetic array is greater than the winding density of the medium coil located at the relatively low-temperature position of the selection channel and the magnetic array.

[0016] As an optional technical scheme of the magnetic array cooling device for ultra-atom beam source selection, a temperature-expanding medium is filled in the cooling cavity and outside the medium coil.

[0017] As an optional technical scheme of the magnetic array cooling device for the ultra-atom beam source selection type, the medium coil pipe is provided with a medium inlet and a medium outlet at two ends respectively, and the shell is provided with a pipe connecting groove, and the medium inlet and the medium outlet can be connected with the outside through the pipe connecting groove.

[0018] As an optional technical scheme of the magnetic array cooling device for the ultra-atom beam source selection type, the magnetic array cooling device for the ultra-atom beam source selection type further comprises a heat sink fixed on one side of the shell close to the exit end of the selection channel.

[0019] As an optional technical scheme of the magnetic array cooling device for the ultra-atom beam source selection type, the cooling cavity is detachably fixed in the shell through a connecting piece.

[0020] The beneficial effects of the present application are as follows:

[0021] The magnetic array cooling device for the ultra-atom beam source selection type comprises a cooling cavity and a shell, the cooling cavity is wrapped around the outer periphery of the magnetic array, and the inside of the cooling cavity is filled with a cooling medium, and the cooling cavity is arranged between the shell and the magnetic array as a heat dissipation layer structure, so that the magnetic array in the screening work can be cooled in time; the shell is sleeved on the outer periphery of the cooling cavity, so as to limit the relative position of the cooling cavity and the magnetic array in the extension direction of the selection channel, and stabilize the installation structure of the cooling device. The magnetic array cooling device for the ultra-atom beam source selection type can improve the effect of the screening process and protect the service life of the magnetic screening structure. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is the installation structure schematic view of the magnetic array cooling device for the ultra-atom beam source selection type and the magnetic array provided by the embodiment of the present application;

[0023] Figure 2 is Figure 1 the sectional view;

[0024] Figure 3 is the structure schematic view of the magnetic array cooling device for the ultra-atom beam source selection type provided by the embodiment of the present application;

[0025] Figure 4 is the structure perspective view of the magnetic array cooling device for the ultra-atom beam source selection type provided by the embodiment of the present application.

[0026] In the drawings:

[0027] 100, cooling cavity; 101, mounting plane; 110, medium coil pipe; 111, medium inlet; 112, medium outlet; 200, shell; 201, pipe connecting groove; 300, connecting piece;

[0028] 500, magnetic array; 510, magnetic body. DETAILED DESCRIPTION

[0029] The utility model will be described in further detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model, and not to limit the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.

[0030] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0031] In the utility model, unless otherwise explicitly specified and limited, the first feature is "on" or "below" the second feature, which can include direct contact between the first and second features, or indirect contact between the first and second features through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0032] In the description of the embodiment, the terms "up", "down", "right", "left" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0033] As Figures 1 to 4The utility model discloses a kind of magnetic array cooling devices for ultra-atom beam source selection type, it is installed on the magnetic screening device for ultra-atom beam source selection type, and auxiliary magnetic screening device further improves the process effect of screening super atom.The magnetic screening device for ultra-atom beam source selection type is ionized to super atom beam source, makes super atom beam source lose electron and show as positive electricity, applies electric field, makes super atom that loses electron directional acceleration movement, and forms beam after being received by collector.The beam is introduced into the passage of the aforementioned magnetic array 500 device and is screened, for the same kinetic energy super atom ion and single atom ion, only the difference in mass, super atom ion mass is several hundreds to several thousands times of single atom ion, deflection radius will difference dozens to hundreds times, so that single atom ion of low mass moves radius small, is more easily deflected and filtered out, and super atom ion of higher mass has large deflection radius, and almost not deflected by magnetic field, so that it can pass through magnetic filter.

[0034] In order to solve a large number of single atom ions are shot on the inner wall of the selection channel to cause the temperature of the selection channel and the magnetic screening device structure to rise sharply and be difficult to dissipate, the magnetic array cooling device for ultra-atom beam source selection type includes a cooling cavity 100 and an outer shell 200, the cooling cavity 100 is arranged between the outer shell 200 and the magnetic array 500 as a heat dissipation layer structure, the cooling cavity 100 is wrapped around the outer periphery of the magnetic array 500, and the inside of the cooling cavity 100 is filled with a cooling medium, which can timely cool the magnetic array 500 in the screening work, avoid structural damage due to long-term heating, and prolong the service life; the outer shell 200 is sleeved on the outer periphery of the cooling cavity 100, which can limit the relative position of the cooling cavity 100 and the magnetic array 500 along the extension direction of the selection channel, and stabilize the mounting structure of the cooling device.

[0035] In the embodiment, the cooling cavity 100 is detachably fixed inside the outer shell 200 by the connecting piece 300, and the connecting piece 300 can stably connect the cooling cavity 100 and the outer shell 200. The connecting piece 300 can be a threaded part, which has the characteristics of being easy to disassemble, can repeatedly install the cooling cavity 100 and the outer shell 200, and is convenient for debugging; when one of the two components is damaged and needs to be replaced or repaired, it can be disassembled and handled separately, which is more convenient for repair and can save replacement costs.

[0036] Exemplarily, the magnetic array 500 includes a plurality of magnetic bodies 510, and the shape of the magnetic body 510 is isosceles trapezoidal.

[0037] In an optional embodiment, in order to adapt to the peripheral structure of the magnetic array 500, a plurality of positioning spacers are clamped between the cooling cavity 100 and the magnetic array 500 to fix the relative installation of the two, the plurality of positioning spacers are arranged one by one corresponding to the plurality of magnetic bodies 510 of the magnetic array 500, and the loosening of a single magnetic body 510 can be avoided to cause the instability of the magnetic array 500. This is an indirect connection mode of the cooling cavity 100 and the magnetic array 500.

[0038] Preferably, the cooling cavity 100 and the magnetic array 500 can also be directly connected, the cooling cavity 100 is hollowed out along the extension direction of the selected channel, the hollow inner wall of the cooling cavity 100 is provided with a plurality of installation planes 101, and the plurality of installation planes 101 are arranged one by one corresponding to the plurality of magnetic bodies 510 of the magnetic array 500. The relative installation of the cooling cavity 100 and the magnetic array 500 can also be stabilized.

[0039] Specifically, the cooling medium is a liquid or a gas, as long as it can satisfy the heat dissipation and cooling of the magnetic array 500.

[0040] Further, the inside of the cooling cavity 100 is provided with a medium coil pipe 110, and the cooling medium is filled in the medium coil pipe 110, so that the magnetic array 500 can be cooled more specifically, and the use of the cooling medium can be saved. Correspondingly, the two ends of the medium coil pipe 110 are respectively provided with a medium inlet 111 and a medium outlet 112, which can be used to circulate and replace the cooling medium, accelerate the cooling speed of the magnetic array 500, and improve the heat dissipation effect of the magnetic array cooling device for super atomic beam source selection.

[0041] In the embodiment, the shell 200 is provided with a pipe joint groove 201, and the medium inlet 111 and the medium outlet 112 can be connected with the outside through the pipe joint groove 201. Further, in the inside of the cooling cavity 100 and outside the medium coil pipe 110, a temperature expansion medium should also be filled, which can quickly balance the local high temperature of the magnetic array 500, receive and diffuse the heat to the cooling cavity 100, uniformly heat, and assist to improve the cooling efficiency of the medium coil pipe 110 and the cooling medium.

[0042] In another optional scheme of the embodiment, by detecting the temperature in the selected channel, the winding density of the part of the medium coil pipe 110 located at the relatively high temperature position of the selected channel and the magnetic array 500 can be increased, and the winding density of the part of the medium coil pipe 110 located at the relatively low temperature position of the selected channel and the magnetic array 500 can be reduced, so as to save the manufacturing cost, and the specific high temperature position on the magnetic array 500 can be cooled specifically, so as to improve the cooling effect and rate of the magnetic array cooling device for super atomic beam source selection.

[0043] Specifically, since the density of the single-atom ion bombarding the sidewall is greater near the exit end side, the temperature of the magnetic array 500 on this side is also higher, therefore, the magnetic array cooling device for the super-atom beam source selection type further comprises a heat sink fixed on the side of the shell 200 near the exit end of the selection channel, which can further improve the cooling effect.

[0044] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the embodiments of the present application. For those skilled in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present application. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent substitution and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A magnetic array cooling device for ultra-atomic beam source selection, characterized in that, The application relates to a magnetic array cooling device for super-atom beam source selection. The cooling cavity (100) is filled with a cooling medium. The cooling medium is a liquid or a gas.

2. The magnetic array cooling device for ultra-atomic beam source selection type according to claim 1, characterized in that, A plurality of positioning spacers are clamped between the cooling cavity (100) and the magnetic array (500), and the plurality of positioning spacers are arranged in one-to-one correspondence with a plurality of magnetic bodies (510) of the magnetic array (500).

3. The magnetic array cooling device for ultra-atomic beam source selection type according to claim 1, characterized in that, The cooling cavity (100) is hollow along the extension direction of the selection channel, and the hollow inner wall of the cooling cavity (100) is provided with a plurality of mounting planes (101) arranged in one-to-one correspondence with the plurality of magnetic bodies (510) of the magnetic array (500).

4. The magnetic array cooling device for ultra-atomic beam source selection type according to claim 1, characterized in that, The cooling cavity (100) is internally provided with a medium coil pipe (110), and the cooling medium is filled in the medium coil pipe (110).

5. The magnetic array cooling device for ultra-atomic beam source selection type according to claim 1, characterized in that, The winding density of the medium coil pipe (110) located at a relatively high-temperature position of the selection channel and the magnetic array (500) is greater than the winding density of the medium coil pipe (110) located at a relatively low-temperature position of the selection channel and the magnetic array (500).

6. The magnetic array cooling device for ultra-atomic beam source selection type according to claim 5, characterized in that, A temperature-expanding medium is filled in the cooling cavity (100) and outside the medium coil pipe (110).

7. The magnetic array cooling device for ultra-atomic beam source selection type according to claim 5, characterized in that, The two ends of the medium coil pipe (110) are respectively provided with a medium inlet (111) and a medium outlet (112), and the shell (200) is provided with a pipe joint groove (201), and the medium inlet (111) and the medium outlet (112) can be connected with the outside through the pipe joint groove (201).

8. The magnetic array cooling device for ultra-atomic beam source selection type according to claim 5, characterized in that, The magnetic array cooling device for super-atom beam source selection further comprises a heat sink fixed to one side of the shell (200) close to the exit end of the selection channel.

9. The magnetic array cooling device for ultra-atomic beam source selection type according to claim 1, characterized in that, The cooling cavity (100) is detachably fixed in the shell (200) through a connecting piece (300).

10. The magnetic array cooling device for ultra-atomic beam source selection type according to any one of claims 1-9, characterized in that, ​

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