Radio frequency power amplifier PCB welding auxiliary device
By designing the guide components and pressure-applying components, the problem of loose welding between the PCB board and structural components was solved, achieving a welding effect with uniform stress and improving the heat dissipation and performance of the RF power amplifier module.
Patent Information
- Application Number
- CN202520412940.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-03-10
AI Technical Summary
In traditional soldering processes, the PCB board and structural components are prone to warping, resulting in loose soldering, which affects heat dissipation and damages the performance of the RF module.
The guide components and pressure components are symmetrically arranged. The guide components are detachably connected to the structural components. The elastic components and fixing components are used to achieve uniform pressure on the PCB board. The force is adjusted by the nut to ensure uniform force during the welding process.
It achieves tight welding between the PCB board and structural components, improves the heat dissipation and overall performance of the RF power amplifier module, and is easy to operate and low in cost.
Smart Images
Figure CN223819790U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to PCB board technical field, especially relates to a radio frequency power amplifier PCB board welding auxiliary device. BACKGROUND
[0002] The performance of radio frequency power amplifier is highly dependent on the transmission effect of PCB board on radio frequency signal. For high-power radio frequency power amplifier module, in addition to welding the tube shell to the copper block to realize effective heat dissipation, the PCB board on the radio frequency module also needs to be welded to the copper block to further ensure the stability of heat dissipation performance.
[0003] In the laboratory level PCB welding process, due to the large overall size of the PCB board and the soft material texture, the PCB board often appears to be warped in the traditional welding process. This phenomenon leads to a large gap between the PCB board and the structure, which not only affects the heat dissipation effect of the radio frequency module, but also has an adverse effect on its performance.
[0004] Therefore, it is urgent to solve the problems of loose welding between the PCB board and the structure, inconvenience and uneven welding force. UTILITY MODEL CONTENT
[0005] Therefore, the utility model aims to provide a radio frequency power amplifier PCB board welding auxiliary device to solve the problems in the background art.
[0006] A radio frequency power amplifier PCB board welding auxiliary device comprises:
[0007] Two guide pieces arranged symmetrically, the lower end of the guide piece is detachably connected with the structure, and the upper end extends above the upper surface of the structure;
[0008] A pressing assembly comprising a first pressing plate and a second pressing plate slidably arranged along the guide piece in the axial direction, an elastic piece arranged between the first pressing plate and the second pressing plate, and a fixing piece threadedly connected with the guide piece;
[0009] The first pressing plate is located between the elastic piece and the fixing piece, and the second pressing plate is located between the elastic piece and the structure. By tightening the fixing piece, the first pressing plate compresses the elastic piece, and then drives the second pressing plate to apply uniform pressure to the PCB board placed on the structure.
[0010] Compared with the prior art, the beneficial effects of the application are that: firstly, the back surface of the PCB board and the upper surface of the structural part are uniformly smeared with solder paste, the PCB board smeared with solder paste is simply fixed to the copper block by using screws, the positions of the two are relatively stable, then the lower layer plate is placed on the surface of the PCB board, so that each point of the PCB board can uniformly contact the lower layer plate, thereby ensuring that the PCB board is uniformly stressed during welding, the spring is placed in the circular groove of the lower layer plate, necessary elastic support is provided for the welding between the PCB board and the copper block, which helps to realize uniform stress, the upper layer plate is placed above the spring, the lower surface of the upper layer plate is also provided with a circular groove, which plays a role in fixing the spring and further stabilizes the whole structure, finally, the four nuts are fixed around the device, the stress between the PCB board and the copper block is controlled by adjusting the tightness of the nuts, and the stress during the welding process is ensured to be uniform. Through the above steps, the purpose of tightly welding and uniformly stressing between the PCB board and the structural part can be achieved, and the performance of the radio frequency power amplifier module is finally effectively improved.
[0011] Further, a plurality of first threaded holes are arranged at intervals on the two sides of the structural part, and a first fixing hole is formed in the guide piece, and the guide piece and the structural part are fixed by screws passing through the first fixing hole and the first threaded hole in sequence.
[0012] Further, the guide piece comprises a fixed block and a threaded column fixed on the top of the fixed block.
[0013] Further, a special-shaped through hole for the guide piece to pass through is formed on the first pressing plate and the second pressing plate, and the special-shaped through hole is a rectangular hole, so that the first pressing plate and the second pressing plate can move relative to the guide piece in the width direction of the structural part.
[0014] Further, a limiting groove is formed on the side of the first pressing plate and the second pressing plate close to each other, and the limiting groove is adapted to the elastic piece.
[0015] Further, a containing groove is formed on the side of the second pressing plate close to the structural part, and the containing groove is used for containing the protruding structure on the PCB board.
[0016] Further, the material of the first pressing plate and the second pressing plate is aluminum.
[0017] Further, a second threaded hole for fixing the PCB board is formed on the structural part. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is a three-dimensional structure schematic view of the radio frequency power amplifier PCB board welding auxiliary device of the utility model;
[0019] Figure 2The utility model discloses a schematic diagram of the state of PCB board placed on structural member,
[0020] Figure 3 The utility model discloses Figure 2 Schematic diagram of the state of structural member installation guide piece,
[0021] Figure 4 Schematic diagram of the second pressing plate of the utility model,
[0022] Figure 5 Schematic diagram of the first pressing plate of the utility model.
[0023] Main element symbol explanation: 10, guide piece, 11, first fixed hole, 12, fixed block, 13, threaded column, 20, structural member, 21, first threaded hole, 22, second threaded hole, 30, pressure applying subassembly, 31, first pressing plate, 32, second pressing plate, 33, elastic piece, 34, fixed piece, 35, special-shaped through -hole, 36, limit groove, 37, containing groove, 40, PCB board. Specific implementation
[0024] In order to facilitate understanding the utility model, below will be with reference to relevant drawings more comprehensive description of the utility model. The drawings show several embodiments of the utility model. However, the utility model can be realized in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.
[0025] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0027] Please refer to Figures 1 to 3 , it is a kind of radio frequency power amplifier PCB board welding auxiliary device in the utility model embodiment shown, including:
[0028] Two guide pieces 10 are symmetrically arranged, the lower end of the guide piece 10 is detachably connected with the structural member 20, and the upper end extends above the upper surface of the structural member 20;
[0029] The pressing assembly 30 comprises a first pressing plate 31 and a second pressing plate 32 which are slidably arranged along the guide piece 10, an elastic member 33 arranged between the first pressing plate 31 and the second pressing plate 32, and a fixing member 34 which is threadedly connected with the guide piece 10;
[0030] The first pressing plate 31 is located between the elastic member 33 and the fixing member 34, and the second pressing plate 32 is located between the elastic member 33 and the structural member 20. By screwing the fixing member 34, the first pressing plate 31 compresses the elastic member 33, and in turn drives the second pressing plate 32 to apply uniform pressure to the PCB board 40 placed on the structural member 20.
[0031] When the radio frequency power amplifier PCB board 40 is welded, the back surface of the PCB board 40 and the upper surface of the structural member 20 are uniformly coated with solder paste. The PCB board 40 coated with solder paste is simply fixed to the copper block using screws to ensure that the positions of the two are relatively stable. Then, the lower layer plate is placed on the surface of the PCB board 40, so that each point of the PCB board 40 can uniformly contact the lower layer plate, thereby ensuring that the PCB board 40 is uniformly stressed during welding. The spring is placed in the circular groove of the lower layer plate to provide necessary elastic support for the welding between the PCB board 40 and the copper block, which helps to achieve uniform stress. The upper layer plate is placed above the spring, and the lower surface of the upper layer plate is also provided with a circular groove to fix the spring and further stabilize the entire structure. Finally, the four nuts are fixed around the device, and the tightness of the nuts is adjusted to control the stress between the PCB board 40 and the copper block, thereby ensuring uniform stress during welding. Through the above steps, the purpose of tightly welding and uniformly stressing between the PCB board 40 and the structural member 20 can be achieved, and the performance of the radio frequency power amplifier module can be effectively improved.
[0032] Specifically, a plurality of first threaded holes 21 are arranged at intervals on both sides of the structural member 20, and a first fixing hole 11 is formed on the guide piece 10. Screws are sequentially passed through the first fixing hole 11 and the first threaded hole 21 to fix the guide piece 10 to the structural member 20.
[0033] More specifically, the guide piece 10 comprises a fixing block 12 and a threaded column 13 fixed on the top of the fixing block 12.
[0034] It can be understood that the fixing block 12 is fixed on the structural member 20 by sequentially passing the screws through the first fixing hole 11 and the first threaded hole 21, so that the guide piece 10 is fixed to the structural member 20.
[0035] In the embodiment, the fixing member 34 is a nut connected to the threaded column 13 below. The size of the nut can be selected according to actual needs. During welding, the stress between the PCB 40 and the copper block can be flexibly controlled by adjusting the nut up and down, which is simple to operate. The guide member 10 is fixed to the side wall of the copper block by a screw. The guide member 10 adopts a heterogeneous structure design, which is composed of a threaded column 13 and a cuboid fixing block 12. The diameter of the threaded column 13 can be adjusted according to actual needs to adapt to different sizes of radio frequency modules, wherein the smaller diameter is suitable for small radio frequency modules, and the larger diameter is suitable for large radio frequency modules. In addition, the number of guide members 10 can also be increased or decreased according to needs. The cuboid is punched in the middle to be fixed to the side wall of the copper block by a screw. The material of the guide member 10 is usually aluminum or other non-tin materials, which can prevent the solder between the copper block and the PCB 40 from overflowing and adhering to the fixing block 12 during welding, avoiding the problem of being difficult to remove after welding.
[0036] Please refer to Figures 4 to 5 , specifically, the first pressing plate 31 and the second pressing plate 32 are both provided with a special-shaped through hole 35 for the guide member 10 to pass through, the special-shaped through hole 35 is a rectangular hole, so that the first pressing plate 31 and the second pressing plate 32 can move relative to the guide member 10 in the width direction of the structural member 20, so as to adjust the position according to actual needs. The size of the special-shaped through hole 35 can be flexibly adjusted according to actual needs.
[0037] In the embodiment, the upper plate is a thin plate of a cuboid, made of aluminum material. The main function of the upper plate is to fix the spring and assist the nut to adjust the stress of the PCB 40.
[0038] The spring is fixed between the upper plate and the lower plate, and the number, position and size of the spring can be adjusted according to actual needs. The main function of the spring is to control the stress between the PCB 40 and the copper block, and to ensure the uniformity of the stress during welding.
[0039] Specifically, the first pressing plate 31 and the second pressing plate 32 are both provided with a limiting groove 36 on the side close to each other, and the limiting groove 36 is adapted to the elastic member 33.
[0040] In the embodiment, the limiting groove 36 is designed based on the size and number of the spring. In use, first, the lower plate is passed through the guide member 10, then the spring is fixed in the limiting groove 36. Next, the upper plate is passed through the guide member 10, ensuring that the limiting groove 36 on the back of the upper plate is aligned with the spring, and finally fixed by four nuts from above.
[0041] Specifically, the second pressing plate 32 is provided with a receiving groove 37 on the side close to the structural member 20, which is used to accommodate the structure protruding from the PCB 40.
[0042] In this embodiment, the lower layer plate is directly in contact with the PCB 40, and its structure is similar to that of the upper layer plate, but the surface is provided with a plurality of receiving grooves 37, which are used to accommodate the structure exposed from the PCB 40, such as the screw used to fix the PCB 40 on the top of the structural member 20. The size of the receiving groove 37 can be adjusted as needed. The material of the lower layer plate is also aluminum to prevent tin sticking. The function of the lower layer plate is to contact the PCB 40 in a large area, so as to ensure that the PCB 40 is evenly stressed during welding and achieves close contact.
[0043] In this embodiment, the first pressing plate 31 and the second pressing plate 32 are made of aluminum.
[0044] Specifically, the structural member 20 is provided with a second threaded hole 22 for fixing the PCB 40.
[0045] The operation example of the test product is as follows:
[0046] Preparation: First, clean the upper surface of the copper block and evenly and appropriately apply solder. Then, evenly and appropriately apply solder to the back of the PCB 40, and fix the two by screwing from the upper surface of the PCB 40.
[0047] Install the fixing block 12: Fix the fixing block 12 to the two sides of the copper block by screwing.
[0048] Place the lower layer plate: Then, place the lower layer plate above the PCB 40, and make sure that the screw on the PCB 40 passes through the special-shaped through hole 35 of the lower layer plate to ensure that the PCB 40 and the lower layer plate are in close contact. This step is the key to improving the welding quality of the welding auxiliary device.
[0049] Install the spring: Then, place the spring in the circular groove of the lower layer plate, and align the recess of the upper layer plate with the spring.
[0050] Fix the nut: Finally, tighten the nut slightly to stabilize the overall structure.
[0051] The heating process is as follows:
[0052] Heat: Place the overall structure on the heating table, and raise the temperature to the melting point temperature 220℃ of the solder.
[0053] Solder melting: After about 30 seconds, the solder between the PCB 40 and the copper block melts. At this time, tighten the nut again to make the excess solder overflow from between the PCB 40 and the copper block.
[0054] Cooling and removal: then, the whole structure is taken off from the heating table and placed on the heat sink, and after cooling, the welding auxiliary device is removed from top to bottom. At this point, the welding process is completed.
[0055] In summary, the RF power amplifier PCB welding auxiliary device in the above embodiments has the following advantages:
[0056] The welding between the traditional PCB 40 and the copper block usually adopts manual pressure connection or screw fixing, etc. These methods have poor welding effect, and often have problems such as operation danger and uneven welding. The present application increases the welding contact area through the lower plate, and improves the stress uniformity through the spring, realizes the close welding between the PCB 40 and the copper block, and the solder is uniformly distributed. The device has the advantages of good welding effect, easy assembly, easy disassembly, low cost, high reusability, high safety, etc. The contact area of the PCB 40 is increased by using the aluminum plate, the spring provides elastic force, the nut controls the elastic force by screwing, and the position of the screw fixing device, so as to realize the functions of accurate position, uniform stress, safety and reliability, etc.
[0057] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0058] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the present application. It should be noted that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.
Claims
1. A welding auxiliary device for RF power amplifier PCB boards, characterized in that, include: Two symmetrically arranged guide members, the lower end of which is detachably connected to the structural member, and the upper end of which extends to be higher than the upper surface of the structural member; The pressure application assembly includes a first pressure plate and a second pressure plate that are slidably disposed along the axial direction of the guide member, an elastic member disposed between the first pressure plate and the second pressure plate, and a fixing member that is threadedly connected to the guide member; The first pressure plate is located between the elastic element and the fixing element, and the second pressure plate is located between the elastic element and the structural element. By tightening the fixing element, the first pressure plate compresses the elastic element, thereby driving the second pressure plate to apply uniform pressure to the PCB board placed on the structural element.
2. The RF power amplifier PCB board soldering auxiliary device according to claim 1, characterized in that, Multiple first threaded holes are arranged at intervals on both sides of the structural component, and a first fixing hole is provided on the guide component. The guide component is fixed to the structural component by passing screws through the first fixing hole and the first threaded hole in sequence.
3. The RF power amplifier PCB board soldering auxiliary device according to claim 1, characterized in that, The guide includes a fixing block and a threaded post fixed to the top of the fixing block.
4. The RF power amplifier PCB board soldering auxiliary device according to claim 1, characterized in that, Both the first pressure plate and the second pressure plate are provided with irregularly shaped through holes for the guide member to pass through. The irregularly shaped through holes are rectangular holes, so that the first pressure plate and the second pressure plate can move relative to the guide member in the width direction of the structural member.
5. The RF power amplifier PCB board soldering auxiliary device according to claim 1, characterized in that, Both the first pressure plate and the second pressure plate have a limiting groove on their adjacent sides, and the limiting groove is used to fit the elastic element.
6. The RF power amplifier PCB board soldering auxiliary device according to claim 1, characterized in that, The second pressure plate has a receiving groove on the side near the structural component, which is used to receive the protruding structure on the PCB board.
7. The RF power amplifier PCB board soldering auxiliary device according to claim 1, characterized in that, The first pressure plate and the second pressure plate are made of aluminum.
8. The RF power amplifier PCB board soldering auxiliary device according to claim 1, characterized in that, The structural component has a second threaded hole for fixing the PCB board.