Novel semiconductor chip welding head

Abstract

The utility model discloses a novel semiconductor chip welding head, and relates to the technical field of semiconductor chip welding. The welding head comprises the focus lens, the mounting plate and the fixing mechanism, the fixing mechanism comprises the sliding groove, the sliding groove, the sliding block and the spring clamping block are arranged, the stability and reliability of welding head connection are enhanced, the sliding block is stably clamped in the sliding groove, and the automatic locking function of the spring clamping block is matched, so that the welding head is more stable and reliable. Connection looseness caused by vibration or movement of external positioning equipment is effectively prevented, the risk of equipment damage is reduced, meanwhile, the mounting and dismounting process of the fixing mechanism is simple and rapid, a user can easily complete fixing and fixing releasing of the welding head by pushing a sliding block and operating a spring clamping block, the working efficiency is improved, and the welding head is convenient to use. And through the arrangement of a clamping groove and a clamping block, the stability of the welding head structure is further enhanced, the stability of the sliding block is enhanced through the clamping mechanism, and the safety of welding operation is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip welding technology, specifically a novel semiconductor chip welding head. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and non-conductors. Semiconductors have wide applications in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. Semiconductors are materials whose conductivity can be controlled, ranging from that of insulators to conductors. The importance of semiconductors is enormous. Today, most electronic products, such as computers, mobile phones, or digital recorders, have core components that are closely related to semiconductors. Common semiconductor materials include silicon, germanium, and gallium arsenide, among which silicon is the most influential in commercial applications.

[0003] Currently, existing semiconductor chip welding heads need to be connected to bolts and external positioning equipment via mounting plates to perform welding operations. After prolonged use, the bolts may loosen due to vibration of the semiconductor chip welding head and movement of the external positioning equipment, which can easily cause the welding head to loosen and fall off, resulting in equipment damage and economic losses. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a new type of semiconductor chip welding head to solve the technical problems of bolt loosening, welding head detachment and equipment damage caused by welding head vibration and external positioning equipment movement.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a novel semiconductor chip welding head, comprising a focusing lens, a mounting plate, and a fixing mechanism, wherein the fixing mechanism comprises a sliding groove, a slider is engaged and slidably disposed in the sliding groove, a snap-fit ​​groove is provided on one side of the slider, a snap-fit ​​block is engaged in the snap-fit ​​groove, a spring snap-fit ​​block is provided inside the sliding groove, and a push block is provided at one end of the spring snap-fit ​​block.

[0006] By adopting the above technical solution, the mounting plate provides a stable mounting base for the welding head, making it easy to fix the welding head in the required position.

[0007] Furthermore, there are two slides, which are symmetrically arranged along the central axis of the mounting plate.

[0008] By adopting the above technical solution and symmetrically setting two grooves along the central axis of the mounting plate, the welding head can achieve better stability during installation and use.

[0009] Furthermore, the spring clip is wedge-shaped, and there are two push blocks mirror-imaged along the central axis of the mounting plate.

[0010] By adopting the above technical solution, the wedge-shaped spring block can automatically pop out when the slider passes through, and use its wedge structure to firmly lock the slider, ensuring the stability and reliability of the welding head during the welding process.

[0011] Furthermore, the outer surface of the mounting plate is connected to bolts via threads.

[0012] By adopting the above technical solution, the threaded connection enables the bolt to be tightly engaged with the mounting plate, providing strong connection force and stability.

[0013] Furthermore, a beam-splitting and refraction module is provided on the top of the focusing lens, and a collimating lens is provided on one side of the beam-splitting and refraction module.

[0014] By adopting the above technical solution, the beam splitting and refraction module is used to monitor the welding process in real time, and optimizes the welding quality and efficiency by adjusting the path and direction of the beam.

[0015] Furthermore, a temperature measurement interface is provided on the other side of the beam splitting and refraction module, and an imaging interface is provided on the top of the beam splitting and refraction module.

[0016] By adopting the above technical solution, the main function of the beam splitting and refraction module is to split and refraction the light generated during the welding process, which can help operators or testing equipment to observe and monitor the welding process more clearly, thereby improving the accuracy and quality of welding.

[0017] In summary, the present invention has the following main advantages:

[0018] 1. This utility model enhances the stability and reliability of the welding head connection by setting a sliding groove, a sliding block, and a spring clip. The stable engagement of the sliding block in the sliding groove, combined with the automatic locking function of the spring clip, effectively prevents the connection from loosening due to vibration or movement of external positioning equipment. This not only reduces the risk of equipment damage, but also makes the installation and disassembly of the fixing mechanism simple and quick. By pushing the sliding block and operating the spring clip, users can easily fix and release the welding head, improving work efficiency.

[0019] 2. By setting a snap-fit ​​groove and a snap-fit ​​block, this utility model further enhances the stability of the welding head structure. This snap-fit ​​mechanism enhances the stability of the slider, improves the safety of welding operations, and effectively avoids equipment damage caused by the welding head loosening or falling off, thereby reducing the resulting economic losses. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a rear-view three-dimensional structural diagram of the present invention;

[0022] Figure 3 This is a partial cross-sectional structural diagram of the fixing mechanism of this utility model;

[0023] Figure 4 This is a schematic diagram of the snap-fit ​​groove of this utility model.

[0024] In the diagram: 1. Focusing lens; 2. Beam splitter and refraction module; 3. Collimating lens; 4. Imaging interface; 5. Temperature measurement interface; 6. Mounting plate; 7. Fixing mechanism; 701. Slide groove; 702. Slider; 703. Snap-fit ​​groove; 704. Snap-fit ​​block; 705. Spring snap-fit ​​block; 706. Push block; 8. Bolt. Detailed Implementation

[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0026] A new type of semiconductor chip welding head, such as Figures 1-4 As shown, the device includes a focusing lens 1, a mounting plate 6, and a fixing mechanism 7. The fixing mechanism 7 includes a sliding groove 701, a slider 702 that engages and slides in the sliding groove 701, a locking groove 703 on one side of the slider 702 that engages with a locking block 704, a spring locking block 705 inside the sliding groove 701, and a push block 706 at one end of the spring locking block 705. The mounting plate 6 provides a stable mounting base for the welding head, making it easy to fix the welding head in the required position. The focusing lens 1 can accurately focus the laser beam to the welding point, improving the welding accuracy and efficiency.

[0027] See Figure 3 , Figure 4 There are two slide grooves 701, which are symmetrically arranged along the central axis of the mounting plate 6. By symmetrically arranging two slide grooves 701 along the central axis of the mounting plate 6, the welding head can obtain better stability during installation and use. By setting two symmetrical slide grooves 701, the overall structure of the welding head can be made compact while ensuring structural stability.

[0028] See Figure 3 The spring clip 705 is wedge-shaped, and there are two push blocks 706 mirrored along the central axis of the mounting plate 6. The wedge-shaped spring clip 705 can automatically pop out when the slider 702 passes through, and its wedge structure firmly engages the slider 702, ensuring the stability and reliability of the welding head during the welding process. The mirrored arrangement of the two push blocks 706 makes the operation more convenient and intuitive.

[0029] See Figure 2 The outer surface of the mounting plate 6 is connected to bolts 8 by threads. The threaded connection allows the bolts 8 to be tightly engaged with the mounting plate 6, providing strong connection force and stability. By rotating the bolts 8, they can be easily screwed into or out of the threaded holes of the mounting plate 6, thereby realizing the quick installation and removal of the welding head.

[0030] See Figure 1 A beam splitting and refraction module 2 is provided on the top of the focusing lens 1, and a collimating lens 3 is provided on one side of the beam splitting and refraction module 2. The beam splitting and refraction module 2 is used to monitor the welding process in real time and optimize the welding quality and efficiency by adjusting the path and direction of the beam. The collimating lens 3 is used to adjust the laser beam into parallel light to ensure that the laser beam maintains a stable direction and energy distribution during transmission.

[0031] See Figure 1 On the other side of the beam splitting and refraction module 2, there is a temperature measurement interface 5, and on the top of the beam splitting and refraction module 2, there is an imaging interface 4. The main function of the beam splitting and refraction module 2 is to split and refraction the light generated during the welding process, which can help the operator or detection equipment to observe and monitor the welding process more clearly, thereby improving the accuracy and quality of welding. The position of the imaging interface 4 enables it to capture a clear image of the welding area, providing the operator with real-time visual feedback.

[0032] The implementation principle of this utility model is as follows: First, during installation, the bolt 8 is tightened to connect the mounting plate 6 with the external positioning device. Then, the slider 702 is pushed to slide in the slide groove 701, so that the locking groove 703 engages with the locking block 704. At the same time, the slider 702 presses the spring locking block 705 through the inclined surface of the spring locking block 705, causing the spring locking block 705 to retract. When the slider 702 has completely slid past the spring locking block 705, the spring locking block 705 pops out due to elasticity and locks the slider 702. When it is necessary to remove the welding head, first, the push block 706 is pushed to retract the spring locking block 705. Then, the slider 702 is pushed to slide in the slide groove 701, so that the bolt 8 under the slider 702 is exposed. Then, the bolt 8 is tightened to separate the mounting plate 6 from the external positioning device.

[0033] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A novel semiconductor chip welding head, characterized in that: The device includes a focusing lens (1), a mounting plate (6), and a fixing mechanism (7). The fixing mechanism (7) includes a slide groove (701), a slider (702) is engaged and slidably moved in the slide groove (701), a snap-fit ​​groove (703) is provided on one side of the slider (702), a snap-fit ​​block (704) is engaged in the snap-fit ​​groove (703), a spring snap-fit ​​block (705) is provided inside the slide groove (701), and a push block (706) is provided at one end of the spring snap-fit ​​block (705).

2. The novel semiconductor chip welding head according to claim 1, characterized in that: Two slides (701) are provided, and the two slides (701) are symmetrically arranged along the central axis of the mounting plate (6).

3. The novel semiconductor chip welding head according to claim 1, characterized in that: The spring clip (705) is wedge-shaped, and there are two push blocks (706) mirrored along the central axis of the mounting plate (6).

4. The novel semiconductor chip welding head according to claim 1, characterized in that: The outer surface of the mounting plate (6) is connected to bolts (8) by thread.

5. The novel semiconductor chip welding head according to claim 1, characterized in that: The top of the focusing lens (1) is provided with a beam-splitting and refraction module (2), and a collimating lens (3) is provided on one side of the beam-splitting and refraction module (2).

6. The novel semiconductor chip welding head according to claim 5, characterized in that: A temperature measurement interface (5) is provided on the other side of the beam splitting and refraction module (2), and an imaging interface (4) is provided on the top of the beam splitting and refraction module (2).

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