Laser marking machine capable of efficiently dissipating heat

Abstract

The utility model discloses a laser marking machine capable of efficiently dissipating heat, which comprises a machine table, a control panel is arranged on one side of the top end of the machine table, a working table is arranged on one side of the control panel, a rack is fixed on one side of the top end of the working table, an adjusting assembly is arranged in the rack, a laser is arranged on the adjusting assembly, and the laser is arranged on the working table. A heat dissipation assembly is arranged at the top end of the laser, the heat dissipation assembly comprises a heat dissipation hole formed in the top end of the laser, and a supporting frame is arranged on the outer side of the heat dissipation hole. Through the arrangement of the heat dissipation assembly, in the use process of the laser, the heat absorption end of the semiconductor chilling plate in the supporting frame continuously absorbs heat in the laser through the heat dissipation holes, the absorbed heat is discharged from the heat release end of the semiconductor chilling plate, and finally the heat is transmitted to the outside through the heat dissipation fan. Therefore, the laser is cooled, and the heat dissipation efficiency and the heat dissipation quality are improved.

Description

Technical Field

[0001] This utility model relates to the field of laser marking machine technology, and in particular to a laser marking machine with efficient heat dissipation. Background Technology

[0002] Laser marking machines use a laser beam to create permanent marks on the surfaces of various materials. The marking effect is achieved by evaporating the surface material to expose the deeper material, thus etching intricate patterns, trademarks, and text. Laser marking machines are mainly classified into CO2 laser marking machines, semiconductor laser marking machines, fiber laser marking machines, and YAG laser marking machines. Laser marking machines are primarily used in applications requiring higher precision and finer details. Applications include electronic components, integrated circuits (ICs), electrical appliances, mobile communications, hardware products, tool accessories, precision instruments, eyeglasses and watches, jewelry, automotive parts, plastic buttons, building materials, and PVC pipes. Current laser marking machines rely on internal cooling fans within the laser unit for heat dissipation, which is relatively inefficient. Utility Model Content

[0003] The main purpose of this invention is to provide a laser marking machine with efficient heat dissipation.

[0004] The objective of this utility model can be achieved by adopting the following technical solution:

[0005] A laser marking machine with efficient heat dissipation includes a machine base. A control panel is installed on one side of the top of the machine base. A worktable is provided on one side of the control panel. A frame is fixed on one side of the top of the worktable. An adjustment component is provided inside the frame. A laser is installed on the adjustment component. A heat dissipation component is provided at the top of the laser. The heat dissipation component includes heat dissipation holes opened at the top of the laser. A support frame is provided outside the heat dissipation holes. Multiple sets of semiconductor cooling chips are installed at equal intervals inside the support frame. A cooling fan is fixed at the top of the support frame.

[0006] Preferably, the heat-absorbing end of the thermoelectric cooler faces the heat dissipation hole, and the heat-releasing end of the thermoelectric cooler faces the heat dissipation fan.

[0007] Preferably, the adjustment assembly includes an adjustment screw that is rotatably connected to the frame, a guide rod is provided on the outer side of the adjustment screw, and a handwheel is installed at the top of the adjustment screw.

[0008] Preferably, both the adjusting screw and the guide rod are provided with sliding seats on their outer sides.

[0009] Preferably, a support plate is fixed to the outside of the sliding seat, and the laser is fixed to the support plate.

[0010] Preferably, a galvanometer is mounted on one side of the laser, and a field lens is connected to the bottom of the galvanometer.

[0011] Preferably, a connecting cable is installed on the back of the laser, and one end of the connecting cable is connected to the host.

[0012] The beneficial effects of this technology are:

[0013] By setting up a heat dissipation component, during the use of the laser, the heat-absorbing end of the semiconductor cooling chip in the support frame continuously absorbs heat from the laser through the heat dissipation holes. This absorbed heat is discharged from the heat-releasing end of the semiconductor cooling chip and finally transported to the outside through the cooling fan, thereby cooling the laser and improving heat dissipation efficiency and quality. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a preferred embodiment of a laser marking machine with high heat dissipation according to the present invention;

[0015] Figure 2 This is a schematic diagram showing the connection relationship between the adjustment component, laser, galvanometer, and field mirror in a preferred embodiment of a laser marking machine with high heat dissipation according to the present invention.

[0016] Figure 3 This is an exploded view of the laser and heat dissipation components in a preferred embodiment of a laser marking machine with high heat dissipation according to the present invention.

[0017] The annotations in the attached figures are explained as follows:

[0018] 1. Machine base; 2. Control panel; 3. Workbench; 4. Frame; 5. Adjustment components; 501. Adjustment screw; 502. Guide rod; 503. Sliding seat; 504. Support plate; 505. Handwheel; 6. Laser; 7. Heat dissipation components; 701. Heat dissipation holes; 702. Support frame; 703. Semiconductor cooling chip; 704. Cooling fan; 8. Galvanometer; 9. Field lens; 10. Connecting cable; 11. Main unit. Detailed Implementation

[0019] To enable those skilled in the art to understand the technical solution of this utility model more clearly, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of this utility model is not limited thereto.

[0020] like Figures 1-3As shown, this embodiment provides a laser marking machine with efficient heat dissipation, including a machine base 1. A control panel 2 is installed on one side of the top of the machine base 1, which allows the operator to control the host 11 and the laser 6. A workbench 3 is provided on one side of the control panel 2, and the workpiece is placed on the workbench 3 for marking. A frame 4 is fixed on one side of the top of the workbench 3. The frame 4 can support the adjustment component 5. The adjustment component 5 is provided inside the frame 4, and the laser 6 is installed on the adjustment component 5. A heat dissipation component 7 is provided at the top of the laser 6. The heat dissipation component 7 includes a heat dissipation hole 701 opened at the top of the laser 6, which facilitates the heat inside the laser 6 to be discharged through the heat dissipation hole 701. A support frame 702 is provided outside the heat dissipation hole 701. The support frame 702 can support a semiconductor cooling chip 703 and a cooling fan 704. Multiple sets of semiconductor cooling chips 703 are installed at equal intervals inside the support frame 702. The semiconductor cooling chips 703 can cool the laser 6. A cooling fan 704 is fixed at the top of the support frame 702, which can dissipate the heat generated by the semiconductor cooling chip 703.

[0021] like Figure 3 As shown, the heat-absorbing end of the semiconductor cooling chip 703 faces the heat dissipation hole 701, and the heat-releasing end of the semiconductor cooling chip 703 faces the heat dissipation fan 704, so that the semiconductor cooling chip 703 can absorb the heat inside the laser 6 through the heat dissipation hole 701, and this heat can be discharged through the heat dissipation fan 704.

[0022] like Figures 1-2 As shown, the adjustment assembly 5 includes an adjustment screw 501 that is rotatably connected to the frame 4. A guide rod 502 is provided on the outside of the adjustment screw 501, and a handwheel 505 is installed at the top of the adjustment screw 501, so that the operator can use the handwheel 505 to drive the adjustment screw 501 to rotate.

[0023] like Figures 1-2 As shown, both the adjusting screw 501 and the guide rod 502 are provided with sliding seats 503 on their outer sides, which can be driven by the adjusting screw 501 to move the sliding seats 503 up and down along the guide rod 502.

[0024] like Figures 1-2 As shown, a support plate 504 is fixed to the outside of the sliding seat 503, and the laser 6 is fixed on the support plate 504, so that the sliding seat 503 can drive the laser 6 to move up and down through the support plate 504.

[0025] like Figures 1-2 As shown, a galvanometer 8 is installed on one side of the laser 6, and a field lens 9 is connected to the bottom of the galvanometer 8. The galvanometer 8 can reflect the adjusted laser beam onto the surface of the object to be marked, so that it can be marked. The field lens 9 is an optical process that the laser beam passes through before marking. Its function is to adjust the laser beam into the required mark shape and size.

[0026] like Figures 1-2 As shown, a connecting cable 10 is installed on the back of the laser 6, and one end of the connecting cable 10 is connected to the host 11, so that the host 11 can be connected to the laser 6 through the connecting cable 10.

[0027] The working principle of this device is as follows: In actual use, the main unit 11 is connected to the laser 6 via the connecting cable 10. The operator places the workpiece on the workbench 3 and uses the handwheel 505 to drive the adjusting screw 501 to rotate. During the rotation of the adjusting screw 501, the sliding seat 503 can be driven to rise and fall along the guide rod 502. The sliding seat 503 can then drive the laser 6 to rise and fall via the support plate 504. After adjusting to the appropriate position, the device is started through the control panel 2. The laser generated by the laser 6 marks the workpiece through the galvanometer 8 and the field lens 9. During use, the heat-absorbing end of the semiconductor cooling chip 703 in the support frame 702 continuously absorbs the heat from the laser 6 through the heat dissipation hole 701. The absorbed heat is discharged from the heat-releasing end of the semiconductor cooling chip 703 and finally transported to the outside through the cooling fan 704, thereby cooling the laser 6 and improving the heat dissipation efficiency and quality.

[0028] The above are merely further embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope disclosed by this utility model, based on the technical solution and concept of this utility model, shall fall within the protection scope of this utility model.

Claims

1. A laser marking machine with efficient heat dissipation, characterized in that: The system includes a machine base (1), a control panel (2) installed on one side of the top of the machine base (1), a workbench (3) provided on one side of the control panel (2), a frame (4) fixed on one side of the top of the workbench (3), an adjustment component (5) provided inside the frame (4), a laser (6) installed on the adjustment component (5), a heat dissipation component (7) provided at the top of the laser (6), the heat dissipation component (7) including a heat dissipation hole (701) opened at the top of the laser (6), a support frame (702) provided outside the heat dissipation hole (701), a plurality of semiconductor cooling chips (703) are installed equidistantly inside the support frame (702), and a cooling fan (704) is fixed at the top of the support frame (702).

2. The laser marking machine with high-efficiency heat dissipation according to claim 1, characterized in that: The heat-absorbing end of the semiconductor cooling chip (703) faces the heat dissipation hole (701), and the heat-releasing end of the semiconductor cooling chip (703) faces the heat dissipation fan (704).

3. The laser marking machine with high-efficiency heat dissipation according to claim 1, characterized in that: The adjustment assembly (5) includes an adjustment screw (501) rotatably connected to the frame (4), a guide rod (502) is provided on the outside of the adjustment screw (501), and a handwheel (505) is installed at the top of the adjustment screw (501).

4. The laser marking machine with high-efficiency heat dissipation according to claim 3, characterized in that: Both the adjusting screw (501) and the guide rod (502) are provided with sliding seats (503) on their outer sides.

5. The laser marking machine with high-efficiency heat dissipation according to claim 4, characterized in that: A support plate (504) is fixed to the outside of the sliding seat (503), and the laser (6) is fixed on the support plate (504).

6. The laser marking machine with high-efficiency heat dissipation according to claim 1, characterized in that: A galvanometer (8) is mounted on one side of the laser (6), and a field lens (9) is connected to the bottom of the galvanometer (8).

7. The laser marking machine with high-efficiency heat dissipation according to claim 1, characterized in that: The laser (6) has a connecting line (10) installed on its back end, and one end of the connecting line (10) is connected to the host (11).

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