Replacement apparatus for semiconductor device

Abstract

The utility model relates to a replacement device of a semiconductor device. The replacement device comprises a power source; the distribution structure comprises a first oil pipe and at least two second oil pipes; and the at least two execution structures are arranged at intervals in the first direction, each execution structure comprises a hydraulic assembly, a first butt-joint plate and a second butt-joint plate, and the first butt-joint plates and the second butt-joint plates are connected with the hydraulic assemblies and are arranged at intervals in the second direction. According to the invention, the force application points can be well limited at the symmetrical positions of the two sides of the semiconductor device; and the distribution structure is combined to synchronously distribute the hydraulic oil, so that the expansionary forces acting on the two sides of the semiconductor device are synchronous and equal in magnitude. When the replacing device is used for replacing semiconductor devices in the commutation fields of IGCT, GTO and the like, the replacing device can effectively solve the problem that stress on the two sides of the semiconductor devices is not uniform due to the fact that force application points are not fixed and pressure is not synchronous.

Description

Technical Field

[0001] This application relates to the field of semiconductor device replacement technology, and in particular to a semiconductor device replacement apparatus. Background Technology

[0002] High-voltage direct current (HVDC) transmission technology boasts advantages such as high voltage levels, long transmission distances, and large transmission capacities, making it a key technological approach for achieving optimized cross-regional energy allocation and promoting the realization of dual-carbon goals. Traditional HVDC transmission systems widely employ grid-commutated converters based on semi-controlled thyristor devices. However, this technology inherently carries the risk of commutation failure; that is, when a fault occurs in the receiving-end grid, it can easily lead to transmission interruptions, threatening the safe and stable operation of the power grid.

[0003] To fundamentally solve the problem of commutation failure, the industry has begun to explore the use of power semiconductor devices with full controllability. Among them, the reverse-resistance integrated gate commutated thyristor combines the advantages of low on-state loss and large current capacity of thyristors with the active turn-off capability of insulated-gate bipolar transistors, making it an ideal choice for building next-generation flexible DC transmission systems.

[0004] Taking reverse-resistance IGCT devices as an example, their physical characteristics differ significantly from traditional thyristors, including greater weight, larger size, and more complex structure. This makes it difficult to apply traditional thyristor converter valve assembly and disassembly tools to IGCT series converter valves. Especially during replacement under incomplete depressurization conditions, traditional tools are prone to misalignment and uneven stress on the semiconductor device due to inconsistent application points and misalignment. This can easily damage the internal chip or gate cell of the semiconductor device. Utility Model Content

[0005] Therefore, it is necessary to provide a semiconductor device replacement device to address the problem that traditional disassembly and assembly tools are prone to misalignment and displacement of the pressing center line due to inconsistent force application points and inaccurate alignment, resulting in uneven force on semiconductor devices.

[0006] This application provides a semiconductor device replacement apparatus, the replacement apparatus comprising:

[0007] The power source is used to pump out the hydraulic oil;

[0008] The distribution structure includes a first oil pipe and at least two second oil pipes, wherein the inlet of the first oil pipe is connected to the output end of the power source, and the outlet of the first oil pipe is connected to the inlet of the second oil pipe.

[0009] At least two actuating structures are arranged at intervals along a first direction. Each actuating structure includes a hydraulic component, a first docking plate, and a second docking plate. The first docking plate and the second docking plate are respectively connected to the hydraulic component and are arranged at intervals along a second direction.

[0010] The hydraulic component is connected to the outlet of the second oil pipe and is configured to convert the pressure of the hydraulic oil into movement of the first docking plate and the second docking plate, so that the first docking plate and the second docking plate are relatively far apart in the second direction; the second direction intersects the first direction.

[0011] In one embodiment, one end of the first docking plate is connected to the hydraulic assembly, and the other end is provided with a first abutment portion;

[0012] One end of the second docking plate is connected to the hydraulic assembly, and the other end is provided with a second abutment portion; the first abutment portion and the second abutment portion are used to abut against the part to be separated.

[0013] In one embodiment, the first abutting portion is a first limiting groove formed on the side wall of the first mating plate, and the second abutting portion is a second limiting groove formed on the side wall of the second mating plate;

[0014] In the same execution structure, the first limiting groove and the second limiting groove are arranged opposite to each other along the second direction, and the first limiting groove and the second limiting groove are used to adapt and snap into the corresponding parts to be separated.

[0015] In one embodiment, the first limiting groove and the second limiting groove are elongated and extend along a third direction; wherein the third direction, the second direction and the first direction are perpendicular to each other.

[0016] In one embodiment, both ends of the first limiting groove and the second limiting groove along the extension direction are provided with limiting members.

[0017] In one embodiment, the limiting member is integrally formed with the first docking plate or the second docking plate;

[0018] Alternatively, the limiting member is a screw; the sidewalls of the first limiting groove and the second limiting groove are provided with a plurality of positioning holes, the plurality of positioning holes are arranged at intervals along the extension direction of the limiting groove, and the screw is used to fix and connect with the corresponding positioning hole to limit the part to be separated;

[0019] Alternatively, the limiting member includes a slider, which is slidably disposed in the first limiting groove or the second limiting groove, and the slider is provided with a fastening pin to fix the slider in a preset position.

[0020] In one embodiment, a scale mark is provided at the end of the first docking plate and / or the second docking plate near the limiting groove. The scale mark is configured to indicate that the part to be separated is centered in the first limiting groove or the second limiting groove along the third direction.

[0021] In one embodiment, the first docking plate has a first guide surface at the end away from the hydraulic component, and the first guide surface is smoothly connected to the first limiting groove.

[0022] The second docking plate has a second guide surface at the end away from the hydraulic component, and the second guide surface is smoothly connected to the second limiting groove.

[0023] In one embodiment, the replacement device includes two actuating structures, two first abutting portions of the two abutting structures abutting different sides of a component to be separated; and two second abutting portions of the two abutting structures abutting different sides of another component to be separated.

[0024] In one embodiment, the distribution structure further includes a three-way valve that connects the first oil pipe and two second oil pipes;

[0025] And / or, in the same execution structure, a return spring is provided between the first docking plate and the second docking plate;

[0026] And / or, the power source includes a hydraulic pump, which is equipped with a pressure relief knob.

[0027] The aforementioned semiconductor device replacement device, by setting at least two actuation structures spaced apart along a first direction, and each actuation structure having a first docking plate and a second docking plate relatively far apart in a second direction, allows the force application point to be better restricted to symmetrical positions on both sides of the semiconductor device. Combined with the synchronous distribution of hydraulic oil by the distribution structure, this ensures that the expansion forces acting on both sides of the semiconductor device are synchronous and equal in magnitude, effectively solving the problem of uneven force on the semiconductor device caused by inconsistent force application points and asynchronous pressure in related technologies. Furthermore, this embodiment integrates the power source, distribution structure, and actuation structure into a hydraulic system. Operators can complete the opening and resetting actions simply by pumping and depressurizing, simplifying operation and significantly reducing reliance on operator experience and skill, thus shortening replacement time. When using this replacement device to replace semiconductor devices in converter applications such as IGCT and GTO, the device effectively solves the problem of uneven force on both sides of the semiconductor device caused by inconsistent force application points and asynchronous pressure. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the replacement device provided according to some embodiments of this application applied to the component to be separated.

[0029] Figure 2 This is a schematic diagram of the structure of a replacement device provided according to some embodiments of this application.

[0030] Figure 3 This is a schematic diagram of the execution structure provided according to some embodiments of this application.

[0031] Icon labels:

[0032] 10. Semiconductor devices;

[0033] 20. Components to be separated;

[0034] 30. Power source; 31. Pressure relief knob;

[0035] 40. Distribution structure; 41. First oil pipe; 42. Second oil pipe; 43. Three-way valve;

[0036] 50. Actuating structure; 51. Hydraulic assembly; 52. First docking plate; 521. First abutting part; 522. Limiting element; 523. First guide surface; 53. Second docking plate;

[0037] First direction - X direction; Second direction - Y direction; Third direction - Z direction. Detailed Implementation

[0038] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0039] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0044] As mentioned in the background section, IGCT devices can weigh up to 1.9 times that of thyristors and are more than 3 times the size, with a more complex integrated gate drive unit structure. Traditional tools for removing and installing thyristors are primarily used in two scenarios: one involves using a bidirectional rotating screw to pry open the heatsink after complete depressurization to remove the semiconductor device; the other involves using a hydraulic device with wedges to pry open the heatsink in a partially depressurized state. While this method improves efficiency, in practice, the placement of the hydraulic device and wedges heavily relies on the operator's experience and skill. Inconsistent force application and misalignment can easily lead to deviations in the pressing centerline, resulting in uneven stress on the semiconductor device. This uneven stress can easily cause hidden or direct damage to the internal chip or gate unit of expensive and delicate IGCT devices, posing a significant reliability risk.

[0045] Based on the aforementioned problems, the semiconductor device replacement device provided in this application embodiment, by setting at least two execution structures spaced apart along a first direction, and each execution structure having a first docking plate and a second docking plate relatively far apart in a second direction, allows the force application point to be better restricted to symmetrical positions on both sides of the semiconductor device. Combined with the synchronous distribution of hydraulic oil by the distribution structure, this facilitates that the expansion forces acting on both sides of the semiconductor device are synchronous and equal in magnitude, effectively solving the problem of uneven force on the semiconductor device caused by inconsistent force application points and asynchronous pressure in related technologies. When using this replacement device to replace semiconductor devices in IGCT, GTO, and other converter applications, this replacement device can effectively solve the problem of uneven force on both sides of the semiconductor device caused by inconsistent force application points and asynchronous pressure. Furthermore, by integrating the power source, distribution structure, and execution structure into a hydraulic system, the operator can complete the opening and resetting actions by pumping and depressurizing, simplifying operation and significantly reducing reliance on operator experience and skill, thus shortening replacement time.

[0046] See Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the replacement device provided according to some embodiments of this application applied to the component to be separated. Figure 2This is a schematic diagram of a replacement device provided according to some embodiments of this application. One embodiment of this application provides a semiconductor device replacement device, wherein the semiconductor device can be an IGCT (Integrated Gate-Commutated Thyristor), a CTO (Gate Turn-Off Thyristor), a GTO (Gate Turn-Off Thyristor), a SITH (Static Induction Thyristor), etc. The component to be separated, 20, mentioned in the following embodiments is a heat sink. It should be understood that the IGCT and other power semiconductor devices 10 generate a large amount of heat during conduction and switching. To dissipate this heat in a timely manner, a heat sink is placed in contact with the metal plates of the upper and lower electrodes of the semiconductor device 10. Furthermore, an externally applied axial pressing force is used to tightly press the semiconductor device 10 and the heat sink together, thereby forming a path with extremely low thermal resistance and low on-resistance. Since releasing the pressure of the entire valve string would cause the entire valve string to loosen, potentially displacing all semiconductor devices 10, and making repositioning difficult, the optimal solution is to perform localized operation only on the fault point. That is, by prying open the two heat sinks adjacent to the faulty semiconductor device 10, a small separation space is created locally.

[0047] The replacement device for the semiconductor device 10 provided in this embodiment may include a power source 30, a distribution structure 40, and at least two execution structures 50.

[0048] Power source 30 is used to pump out hydraulic oil; distribution structure 40 includes a first oil pipe 41 and at least two second oil pipes 42, the inlet of the first oil pipe 41 is connected to the output end of power source 30, and the outlet of the first oil pipe 41 is connected to the inlet of the second oil pipe 42; at least two actuation structures 50 are arranged at intervals along a first direction (X direction), and the actuation structure 50 includes a hydraulic component 51, a first docking plate 52 and a second docking plate 53, the first docking plate 52 and the second docking plate 53 are respectively connected to the hydraulic component 51 and are arranged at intervals along a second direction (Y direction); wherein, the hydraulic component 51 is connected to the outlet of the second oil pipe 42, and the hydraulic component 51 is configured to convert the pressure of hydraulic oil into the movement of the first docking plate 52 and the second docking plate 53, so that the first docking plate 52 and the second docking plate 53 are relatively far apart in the second direction (Y direction); the second direction (Y direction) intersects the first direction (X direction).

[0049] It is understandable that the power source 30 mainly provides hydraulic power for this device. It can be a manual hydraulic pump or an electric hydraulic pump. Its internal components may include an oil tank, a pump body, and an operating handle, etc. For details, please refer to the relevant technical documentation. It will not be elaborated here.

[0050] In this embodiment, the distribution structure 40 can be understood as a hydraulic three-way valve 43, which has one inlet and two outlets. The inlet is connected to the output end of the power source 30 through a first oil pipe 41, and the two outlets are connected to the two actuators 50 through two second oil pipes 42 respectively. Of course, the distribution structure 40 in this example can also be a multi-valve distribution valve, such as a four-way valve, and is not limited here. In this embodiment, the hydraulic three-way valve 43 can synchronously and equally distribute the hydraulic oil provided by the power source 30 to the two second oil pipes 42, thereby ensuring that the two actuators 50 can operate synchronously.

[0051] The arrangement direction of the two execution structures 50 (i.e., the first direction (X direction)) corresponds to the extension direction of the opposite two sides of the heat sink, so as to facilitate operation from both sides of the faulty semiconductor device 10 (hereinafter, IGCT is used as an example).

[0052] In this embodiment, the hydraulic component 51 in the execution structure 50 serves as the core component for performing the action and may include components such as a cylinder and a piston. Furthermore, the cylinder may have two coaxial piston chambers with opposite opening directions, and the cylinder also has an oil inlet channel that connects to the outlet of the second oil pipe 42, thereby introducing hydraulic oil into the two piston chambers. The piston slides within the piston chamber, and the first mating plate 52 or the second mating plate 53 can be fixedly connected to the end of the piston using bolts or the like. The first mating plate 52 and the second mating plate 53 are arranged at intervals along the second direction (Y direction) (i.e., the direction in which the radiator is extended). For example, the first mating plate 52 and the second mating plate 53 are arranged parallel to each other. Of course, a return spring can be provided in the hydraulic component 51, or between the first mating plate 52 and the second mating plate 53, to allow the first mating plate 52 and the second mating plate 53 to reset after pressure relief.

[0053] In some examples, when no hydraulic oil is injected, the force of the return spring can bring the first docking plate 52 and the second docking plate 53 into an initial position close to each other.

[0054] When in operation, the power source 30 pumps out hydraulic oil, which enters the hydraulic three-way valve 43 via the first oil pipe 41 and is simultaneously distributed to the two second oil pipes 42. The hydraulic oil flows into the inlet channel of the hydraulic assembly 51 via the second oil pipes 42 and simultaneously enters the two piston chambers; the oil pressure pushes the piston to move, overcoming the spring force of the return spring, and moving along the second direction (Y direction). At the same time, the first docking plate 52 and the second docking plate 53 also move away from each other, until the expansion force is evenly applied to the ends of the radiators, opening up the two radiators and providing space for removing the faulty IGCT.

[0055] After the replacement is completed, the operating power source 30 is depressurized. After the oil pressure disappears, the elastic potential energy stored in the reset spring is released, so that the first docking plate 52 and the second docking plate 53 are reset to their initial positions for the next use.

[0056] In summary, the semiconductor device 10 replacement device provided in this application embodiment, by setting at least two execution structures 50 spaced apart along a first direction (X direction), and each execution structure 50 having a first docking plate 52 and a second docking plate 53 relatively far apart in a second direction (Y direction), allows the force application point to be better restricted to symmetrical positions on both sides of the semiconductor device 10; and combined with the synchronous distribution of hydraulic oil by the distribution structure 40, it is beneficial that the expansion force acting on both sides of the semiconductor device 10 is synchronous and equal in magnitude, effectively solving the problem of uneven force on the semiconductor device 10 caused by non-fixed force application points and asynchronous pressure in related technologies. When using this replacement device to replace semiconductor devices in IGCT, GTO and other converter fields, this replacement device can effectively solve the problem of uneven force on both sides of the semiconductor device caused by non-fixed force application points and asynchronous pressure.

[0057] In addition, this embodiment integrates the power source 30, the distribution structure 40 and the execution structure 50 into a hydraulic system. The operator can complete the opening and resetting actions by performing pumping and depressurization operations. The operation is simple and can greatly reduce the dependence on the operator's experience and proficiency, which helps to shorten the replacement time.

[0058] Below, we will combine the appendix Figure 1 -Appendix Figure 3 The specific structure of the replacement device for the semiconductor device 10 provided in the embodiments of this application will be described in detail.

[0059] like Figure 3 As shown, Figure 3 This is a schematic diagram of the execution structure provided according to some embodiments of this application. In some embodiments, one end of the first docking plate 52 is connected to the hydraulic component 51, and the other end is provided with a first abutting portion 521; one end of the second docking plate 53 is connected to the hydraulic component 51, and the other end is provided with a second abutting portion; the first abutting portion 521 and the second abutting portion are used to abut against the part 20 to be separated.

[0060] Specifically, in this embodiment, the first abutment portion 521 and the second abutment portion, as the parts that directly contact the heat sink to be separated and transmit pressure, can be grooves formed on the mating plate or large protrusions, so as to have more contact surface with the side (end edge) of the heat sink, which is beneficial to the stability and uniformity of force application during the process of driving adjacent heat sinks away. Of course, the surfaces of the first abutment portion 521 and the second abutment portion can also be hardened or have friction textures added to improve their durability and force transmission efficiency.

[0061] like Figure 3 As shown, in some embodiments, the first abutting part 521 is a first limiting groove formed on the side wall of the first docking plate 52, and the second abutting part is a second limiting groove formed on the side wall of the second docking plate 53; in the same execution structure 50, the first limiting groove and the second limiting groove are arranged opposite to each other along the second direction (Y direction), and the first limiting groove and the second limiting groove are used to adapt and snap onto the corresponding part to be separated 20.

[0062] Specifically, in this embodiment, the first and second limiting grooves are used to fit and engage with the edge of the radiator (e.g., the flange edge). In one example, the first and second limiting grooves are elongated and extend along a third direction (Z direction); wherein the third direction (Z direction), the second direction (Y direction), and the first direction (X direction) are perpendicular to each other.

[0063] For example, the first and second limiting grooves are designed as elongated strips that fit the long side of the heat sink, so as to precisely lock the flange of the heat sink from, for example, the upper and lower sides. This arrangement helps to ensure the uniqueness and fixation of the force application point, and can fundamentally solve the problem of press-fit center line offset caused by the uncertain placement of tools in related technologies.

[0064] like Figure 3 As shown, in some embodiments, both ends of the first limiting groove and the second limiting groove along the extension direction (i.e., the third direction (Z direction)) are provided with limiting members 522.

[0065] It is understandable that the purpose of providing limiting members 522 at both ends of the limiting groove in this embodiment is to ensure that the heat sink is better positioned in the center of the limiting groove, thereby facilitating the uniformity of force application. The limiting blocks can be configured as follows:

[0066] like Figure 3 As shown, in one example, the limiting member 522 is integrally formed with the first mating plate 52 or the second mating plate 53. Exemplarily, the limiting member 522 may be a machined protrusion.

[0067] In one example, the limiting member 522 is a screw; the sidewalls of the first limiting groove and the second limiting groove are provided with multiple positioning holes, which are spaced apart along the third direction (Z direction). The screw is used to fix and connect with the corresponding positioning hole to limit the separation of the part 20. For example, multiple positioning holes, i.e. threaded holes, can be opened on the mating plate where the limiting groove is located according to the size of the existing heat sink (usually the size of the standard specification). By screwing the screw into the positioning hole at different positions, the effective slot length can be adjusted to accommodate heat sinks of different widths.

[0068] In one example, the limiting member 522 includes a slider that is slidably disposed in a first limiting groove or a second limiting groove. The slider is provided with a fastening pin to fix the slider in a preset position. Exemplarily, the slider can slide within the limiting groove and be fixed in the preset position by a set screw, thereby achieving stepless adjustment.

[0069] The limiting members 522 at both ends of the limiting groove in this embodiment can effectively prevent the device from moving along the edge of the heat sink during operation, which helps to improve the stability and safety of operation. Moreover, by using adjustable limiting members 522, such as the aforementioned screws or sliders, a set of replacement devices can be adapted to various heat sinks of different sizes and specifications, greatly improving the versatility of the replacement device.

[0070] In some embodiments, a scale mark is provided at the end of the first docking plate 52 and / or the second docking plate 53 near the limiting groove. The scale mark is configured to indicate that the part to be separated 20 is centered in the first limiting groove or the second limiting groove along the third direction (Z direction).

[0071] For example, scale markings can be set in an area easily visible to the operator on the first or second mating part. Through the scale markings, the operator can quickly and intuitively ensure that the radiator is in the center position of the limiting groove along the third direction (Z direction), ensuring that the expansion force acts on the center line of the radiator, further optimizing the force distribution, and avoiding the bending moment that may be generated due to the radiator being biased to one side in the groove.

[0072] like Figure 3 As shown, in some embodiments, the first docking plate 52 has a first guide surface 523 at the end away from the hydraulic component 51, and the first guide surface 523 is smoothly connected to the first limiting groove; the second docking plate 53 has a second guide surface at the end away from the hydraulic component 51, and the second guide surface is smoothly connected to the second limiting groove.

[0073] Specifically, the design of the first guide surface 523 and the second guide surface facilitates the initial placement of the device, allowing the docking plate to easily slide into the correct position between the radiators, simplifying the positioning operation. This is especially beneficial in narrow spaces with limited visibility, improving the efficiency and success rate of installing the device, and preventing damage to the edges of the radiators from hard impacts.

[0074] like Figure 1 and Figure 2 As shown, in some embodiments, the replacement device includes two actuating structures 50, two first abutting portions 521 of the two abutting structures 50 abutting different sides of a component 20 to be separated; and two second abutting portions of the two abutting structures 50 abutting different sides of another component 20 to be separated.

[0075] Specifically, in this embodiment, the two execution structures 50 are symmetrically arranged on four sides of the faulty IGCT. This design can form a relatively stable structure, thereby balancing the various internal forces generated during the opening process and ensuring that the two heat sinks are separated in parallel along the center line, thereby minimizing any risk of deflection or torsion.

[0076] In some embodiments, the hydraulic assembly 51 includes a hydraulic cylinder and a piston; the hydraulic cylinder is in communication with the outlet of the second oil pipe 42; at least a portion of the piston is disposed in the hydraulic cylinder, and the piston is configured to move under the pressure of hydraulic oil; the piston is connected to a first mating plate 52 and a second mating plate 53. A more specific understanding of the structure of the hydraulic assembly 51 can be found in related technologies, and will not be elaborated further here.

[0077] like Figure 2 As shown, in some embodiments, the distribution structure 40 further includes a three-way valve 43, which connects the first oil pipe 41 and two second oil pipes 42. Exemplarily, the three-way valve 43 facilitates the synchronous and equal-pressure distribution of hydraulic oil to the two actuators 50.

[0078] In one example, a return spring is provided between the first docking plate 52 and the second docking plate 53 in the same execution structure 50. Exemplarily, the return spring can drive the first docking plate 52 and the second docking plate 53 to return to their initial positions after the device is depressurized, which facilitates the reliability of the device for repeated use and facilitates removal from the valve string.

[0079] like Figure 2 As shown, in one example, the power source 30 includes a hydraulic pump with a pressure relief knob 31.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A semiconductor device replacement device, characterized in that, The replacement device includes: Power source (30) for pumping out hydraulic oil; The distribution structure (40) includes a first oil pipe (41) and at least two second oil pipes (42), the inlet of the first oil pipe (41) is connected to the output end of the power source (30), and the outlet of the first oil pipe (41) is connected to the inlet of the second oil pipe (42). At least two actuating structures (50) are arranged at intervals along a first direction. Each actuating structure (50) includes a hydraulic assembly (51), a first docking plate (52), and a second docking plate (53). The first docking plate (52) and the second docking plate (53) are respectively connected to the hydraulic assembly (51) and are arranged at intervals along a second direction. The hydraulic component (51) is connected to the outlet of the second oil pipe (42). The hydraulic component (51) is configured to convert the pressure of the hydraulic oil into the movement of the first docking plate (52) and the second docking plate (53) so that the first docking plate (52) and the second docking plate (53) are relatively far apart in the second direction; the second direction intersects the first direction.

2. The semiconductor device replacement device according to claim 1, characterized in that, One end of the first docking plate (52) is connected to the hydraulic component (51), and the other end is provided with a first abutment part (521). One end of the second docking plate (53) is connected to the hydraulic assembly (51), and the other end is provided with a second abutment; the first abutment (521) and the second abutment are used to abut against the part to be separated (20).

3. The semiconductor device replacement apparatus according to claim 2, characterized in that, The first abutting part (521) is a first limiting groove formed on the side wall of the first docking plate (52), and the second abutting part is a second limiting groove formed on the side wall of the second docking plate (53); In the same execution structure (50), the first limiting groove and the second limiting groove are arranged opposite to each other along the second direction, and the first limiting groove and the second limiting groove are used to adapt to snap into the corresponding part to be separated (20).

4. The semiconductor device replacement apparatus according to claim 3, characterized in that, The first limiting groove and the second limiting groove are elongated and extend along a third direction; wherein the third direction, the second direction and the first direction are perpendicular to each other.

5. The semiconductor device replacement apparatus according to claim 3, characterized in that, Both ends of the first limiting groove and the second limiting groove along the extension direction are provided with limiting members (522).

6. The semiconductor device replacement apparatus according to claim 5, characterized in that, The limiting member (522) is integrally formed with the first docking plate (52) or the second docking plate (53); Alternatively, the limiting member (522) is a screw; the sidewalls of the first limiting groove and the second limiting groove are provided with a plurality of positioning holes, the plurality of positioning holes are arranged at intervals along the extension direction of the limiting groove, and the screw is used to fix and connect with the corresponding positioning hole to limit the part to be separated (20). Alternatively, the limiting member (522) may include a slider that is slidably disposed in the first limiting groove or the second limiting groove, and the slider may be provided with fastening pins to fix the slider in a preset position.

7. The semiconductor device replacement apparatus according to claim 4, characterized in that, A scale mark is provided at the end of the first docking plate (52) and / or the second docking plate (53) near the limiting groove. The scale mark is configured to indicate that the part to be separated (20) is centered in the first limiting groove or the second limiting groove along the third direction.

8. The semiconductor device replacement apparatus according to any one of claims 3-6, characterized in that, The first docking plate (52) has a first guide surface (523) at one end away from the hydraulic component (51), and the first guide surface (523) is smoothly connected to the first limiting groove; The second docking plate (53) has a second guide surface at one end away from the hydraulic component (51), and the second guide surface is smoothly connected to the second limiting groove.

9. The semiconductor device replacement apparatus according to any one of claims 2-6, characterized in that, The replacement device includes two actuating structures (50), two first abutting portions (521) of the two abutting structures (50) abutting different sides of a component (20) to be separated; and two second abutting portions of the two abutting structures (50) abutting different sides of another component (20) to be separated.

10. The semiconductor device replacement apparatus according to any one of claims 1-6, characterized in that, The distribution structure (40) also includes a three-way valve (43), which connects the first oil pipe (41) and two second oil pipes (42). And / or, in the same execution structure (50), a return spring is provided between the first docking plate (52) and the second docking plate (53); And / or, the power source (30) includes a hydraulic pump, which is equipped with a pressure relief knob (31).

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