Leveling device for manufacturing ceramic substrate

Abstract

The utility model relates to a leveling device for ceramic substrate manufacturing, and belongs to the technical field of ceramic substrate manufacturing equipment. The driving part drives the movable plate and the pressing plate to press downwards, so that the ceramic substrate placed on the vacuum adsorption mechanism is leveled; the heating mechanism is arranged on one side of the pressing plate, the ceramic substrate can be heated in the leveling process, and the leveling effect is improved; the vacuum adsorption mechanism ensures that the ceramic substrate is stable and immovable in the leveling process. In addition, the device comprises a sliding rail serving as a guide mechanism, and stable movement of the adsorption table is guaranteed. According to the utility model, the leveling precision and the surface quality of the ceramic substrate can be effectively improved, the production efficiency is improved, and the labor cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate manufacturing equipment technology, and in particular to a leveling device for ceramic substrate manufacturing. Background Technology

[0002] In the manufacturing process of ceramic substrates, leveling is a critical step, which directly affects the flatness, surface quality, and subsequent processing performance of the ceramic substrate.

[0003] In related technologies, ceramic substrates are flattened using mechanical or physical means to eliminate surface irregularities, warping, or wavy defects. However, simply using physical or mechanical means may result in the presence of minor surface irregularities or wavy defects in the flattened ceramic substrate, failing to meet the flattening requirements.

[0004] Based on this, in order to solve the above problems, it is urgent to develop a leveling device for ceramic substrate manufacturing. Utility Model Content

[0005] In response to the shortcomings of the existing production technology, the applicant provides a leveling device for manufacturing ceramic substrates. This device only requires placing the ceramic substrate to be leveled on the adsorption mechanism, moving the adsorption mechanism into the leveling station, and using the heated pressure plate to press down, so that the ceramic substrate to be leveled is heated while being subjected to downward pressure, making it easier to meet the leveling requirements.

[0006] The technical solution adopted in this utility model is as follows: A leveling device for manufacturing ceramic substrates, comprising:

[0007] A driving component is mounted on a fixed assembly plate, the position of which is fixed.

[0008] A movable plate is connected to the output end of the drive component, and a pressure plate is provided at the bottom of the movable plate;

[0009] A heating mechanism is disposed on at least one side of the pressure plate and is used to heat the pressure plate;

[0010] A vacuum adsorption mechanism includes a starting station and a pressing station. After a ceramic substrate is placed at the starting station, it moves to the pressing station. The pressing plate is directly opposite the pressing station on the vacuum adsorption mechanism and is driven by the driving member to perform a pressing action so that the ceramic substrate is heated while being subjected to downward pressure.

[0011] A pressure-bearing platform is mounted on a frame, which provides support, and the vacuum adsorption mechanism is mounted on the pressure-bearing platform.

[0012] As a further improvement to the above technical solution:

[0013] Preferably, the vacuum adsorption mechanism includes a cylinder, the output end of which is connected to a slide plate to drive the slide plate to move on a slide rail, thereby moving the vacuum adsorption stage mounted on the slide plate between the starting position and the pressing position.

[0014] Preferably, the vacuum adsorption mechanism further includes a pressure bearing plate, which is disposed below the vacuum adsorption stage.

[0015] Preferably, the vacuum adsorption stage is provided with at least one adsorption hole, which is connected to the adsorption pipeline to provide adsorption force.

[0016] Preferably, limiting components are provided at both ends of the slide rail, one end being a starting limiting component that abuts against the starting limiting component when the vacuum adsorption stage is in the starting position; the other end being an ending limiting component that abuts against the ending limiting component when the vacuum adsorption stage is in the pressing position.

[0017] Preferably, the heating mechanism is disposed on the opposite side of the side of the pressure plate that contacts the ceramic substrate or is embedded in the pressure plate, so as to raise the temperature of the side of the pressure plate that contacts the ceramic substrate.

[0018] Preferably, the driving component is one of a cylinder, a hydraulic cylinder, or an electric push rod.

[0019] The beneficial effects of this utility model are as follows:

[0020] This utility model has a compact structure. By setting a heating mechanism on one side of the pressure plate, the ceramic substrate is heated while being subjected to downward pressure, making it easier to achieve a leveling effect and improving the leveling accuracy and surface quality.

[0021] This utility model also has the following advantages:

[0022] (1) The design of the vacuum adsorption mechanism of this utility model ensures the stability of the ceramic substrate during the leveling process, prevents the substrate from moving or deforming during the leveling process, and further improves the leveling effect.

[0023] (2) By setting up slide rails, slide plates and limiting parts, this utility model ensures the smooth movement and accurate positioning of the vacuum adsorption table, and ensures convenient loading at the starting position and accurate pressing position. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0025] Figure 2 This is a schematic diagram of the vacuum adsorption mechanism of this utility model.

[0026] The components include: 1. Drive unit; 2. Fixed assembly plate; 3. Movable plate; 4. Heating mechanism; 5. Pressure plate; 6. Vacuum adsorption mechanism; 7. Pressure platform; 8. Frame;

[0027] 601. Cylinder; 602. Lower pressure bearing plate; 603. Slide rail; 604. Slide plate; 605. Vacuum adsorption stage; 606. Adsorption hole; 607. Adsorption pipeline; 608. Starting limit component; 609. End limit component. Detailed Implementation

[0028] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0029] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0032] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0033] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0034] like Figure 1The figure shows a schematic diagram of the structure of a leveling device for manufacturing ceramic substrates according to an embodiment of the present invention; for ease of description, the figure only shows the structure related to the embodiment of the present invention.

[0035] In this embodiment, a leveling device for manufacturing ceramic substrates is provided, including a driving component 1, a fixed mounting plate 2, a movable plate 3, a heating mechanism 4, a pressure plate 5, a vacuum adsorption mechanism 6, a pressure bearing platform 7, and a frame 8.

[0036] In this embodiment, the driving component 1 is mounted on the fixed mounting plate 2, and the position of the fixed mounting plate 2 is fixed. The movable plate 3 is connected to the output end of the driving component 1, and the driving component 1 can drive the movable plate 3 to move up and down. A pressure plate 5 is provided at the bottom of the movable plate 3 to apply downward pressure to the ceramic substrate.

[0037] In this embodiment, the heating mechanism 4 is disposed on at least one side of the pressure plate 5. Preferably, the heating mechanism 4 can be disposed on the opposite side of the side of the pressure plate 5 that contacts the ceramic substrate, or embedded in the pressure plate 5. This can raise the temperature of the side of the pressure plate 5 that contacts the ceramic substrate and improve the leveling effect.

[0038] Please combine Figure 2 , Figure 2 A schematic diagram of the vacuum adsorption mechanism 6 of this invention is shown.

[0039] In this embodiment, the vacuum adsorption mechanism 6 includes a starting station and a pressing station, which is used to move the ceramic substrate to the pressing station for leveling after the ceramic substrate is placed at the starting station.

[0040] Furthermore, the vacuum adsorption mechanism 6 specifically includes a cylinder 601, a lower pressure bearing plate 602, a slide rail 603, a slide plate 604, a vacuum adsorption stage 605, at least one adsorption hole 606, an adsorption pipeline 607, a starting limiting member 608, and an end limiting member 609.

[0041] The output end of the cylinder 601 is connected to the slide plate 604, which can drive the slide plate 604 to move on the slide rail 603, thereby moving the vacuum adsorption stage 605 mounted on the slide plate 604 between the starting position and the pressing position.

[0042] The pressure bearing plate 602 is located below the vacuum adsorption stage 605 and is used to support the vacuum adsorption stage 605 and the ceramic substrate.

[0043] The vacuum adsorption stage 605 is provided with at least one adsorption hole 606, which is connected to the adsorption pipeline 607. The adsorption pipeline 607 provides adsorption force to firmly adsorb the ceramic substrate onto the vacuum adsorption stage 605.

[0044] Limiting elements, namely a starting limiter 608 and an ending limiter 609, are provided at both ends of the slide rail 603 to limit the movement range of the vacuum adsorption stage 605.

[0045] In this embodiment, the pressure platform 7 is mounted on the frame 8, which serves as a support, and the vacuum adsorption mechanism 6 is mounted on the pressure platform 7.

[0046] In actual operation, the ceramic substrate to be leveled is placed on the starting position of the vacuum adsorption mechanism 6, that is, the vacuum adsorption stage 605. Then, the cylinder 601 drives the slide plate 604 and the vacuum adsorption stage 605 to move on the slide rail 603 to the pressing position. At this time, the pressing plate 5 is facing the ceramic substrate on the vacuum adsorption stage 605.

[0047] The heating mechanism 4 is activated to heat the pressure plate 5. Then the driving component 1 is activated, which drives the movable plate 3 and the pressure plate 5 to press down, applying downward pressure to the ceramic substrate and leveling it.

[0048] After leveling is completed, the drive unit 1 retracts and drives the pressure plate 5 to rise. The cylinder 601 drives the slide plate 604 and the vacuum adsorption table 605 back to the starting position. The leveled ceramic substrate is then taken out, and the leveling operation of the next ceramic substrate can be carried out.

[0049] The present invention has a reasonable structure. The structural design of the vacuum adsorption mechanism 6 ensures the stability of the ceramic substrate during the leveling process, prevents the substrate from moving or deforming during the leveling process, and further improves the leveling effect. At the same time, a heating mechanism 4 is set on one side of the pressure plate 5, so that the ceramic substrate is heated while being subjected to downward pressure, making it easier to achieve the leveling effect and improving the leveling accuracy and surface quality.

[0050] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The embodiments described above merely illustrate the implementation of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A leveling device for manufacturing ceramic substrates, characterized in that, include: A driving component (1) is mounted on a fixed assembly plate (2), the position of which is fixed; The movable plate (3) is connected to the output end of the drive component (1), and a pressure plate (5) is provided at the bottom of the movable plate (3); A heating mechanism (4) is provided on at least one side of the pressure plate (5) for heating the pressure plate (5); The vacuum adsorption mechanism (6) includes a starting station and a pressing station, which is used to move to the pressing station after placing the ceramic substrate at the starting station. The pressing plate (5) is directly opposite the pressing station on the vacuum adsorption mechanism (6) and is driven by the driving member (1) to perform a pressing action so that the ceramic substrate is heated while being subjected to the downward pressure. A pressure platform (7) is set on a frame (8), which serves as a support, and a vacuum adsorption mechanism (6) is set on the pressure platform (7).

2. The leveling device for manufacturing ceramic substrates according to claim 1, characterized in that, The vacuum adsorption mechanism (6) includes a cylinder (601), the output end of which is connected to a slide plate (604) to drive the slide plate (604) to move on the slide rail (603), thereby moving the vacuum adsorption stage (605) mounted on the slide plate (604) between the starting position and the pressing position.

3. The leveling device for manufacturing ceramic substrates according to claim 2, characterized in that, The vacuum adsorption mechanism (6) further includes a pressure bearing plate (602), which is disposed below the vacuum adsorption stage (605).

4. The leveling apparatus for manufacturing ceramic substrates according to claim 2 or 3, characterized in that, The vacuum adsorption stage (605) is provided with at least one adsorption hole (606), which is connected to the adsorption pipeline (607) to provide adsorption force.

5. The leveling apparatus for manufacturing ceramic substrates according to claim 2, characterized in that, Limiting components are provided at both ends of the slide rail (603), one end being a starting limiting component (608), which abuts against the starting limiting component (608) when the vacuum adsorption stage (605) is in the starting position; the other end is an ending limiting component (609), which abuts against the ending limiting component (609) when the vacuum adsorption stage (605) is in the pressing position.

6. The leveling apparatus for manufacturing ceramic substrates according to claim 1, characterized in that, The heating mechanism (4) is disposed on the opposite side of the side of the pressure plate (5) that contacts the ceramic substrate or is embedded in the pressure plate (5) to raise the temperature of the side of the pressure plate (5) that contacts the ceramic substrate.

7. The leveling apparatus for manufacturing ceramic substrates according to claim 1, characterized in that, The driving component (1) is one of a cylinder, a hydraulic cylinder, or an electric push rod.

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