Plate carrying device and PCB (printed circuit board) processing equipment

Abstract

The utility model discloses a plate carrying device and PCB (printed circuit board) processing equipment, and relates to the technical field of PCB processing equipment. The board carrying device comprises a board moving mechanism and a board positioning mechanism, the board moving mechanism is used for moving a to-be-machined PCB to the board positioning mechanism, the board positioning mechanism is used for positioning the to-be-machined PCB, and the board moving mechanism is further used for horizontally moving the positioned to-be-machined PCB to a machining position of the machining device. When the board carrying device is used for feeding, the board positioning mechanism can reposition the PCB to be processed in the board carrying process, so that the position of the PCB fed to the processing position of the processing device by the board moving mechanism is more accurate, and the probability of meeting the precision requirement of PCB processing is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to PCB board PCB processing equipment technical field especially relates to a plate material handling device and PCB processing equipment. BACKGROUND

[0002] PCB board (printed circuit board) is one of the most important components in electronic equipment, is widely used in communication, computer, aerospace, household appliances and other fields. With the continuous progress of science and technology and the rapid development of electronic industry, the demand of PCB board is also increasing.

[0003] In the PCB board manufacturing process, one of the important links is drilling holes in the PCB board by the processing device. The existing PCB board feeding to the processing device is to use a linear module to feed the PCB board to the processing device by a feeding suction cup. However, since the precision requirement of PCB board drilling is high, this feeding method cannot meet the precision requirement of PCB board drilling. Therefore, it is necessary to design a plate material handling device capable of improving the feeding precision of PCB board. SUMMARY

[0004] The technical problem to be solved by the utility model is to provide a plate material handling device and PCB processing equipment for the low feeding precision of the existing PCB board.

[0005] To solve the above problems, on the one hand, the utility model embodiment provides a plate material handling device, the plate material handling device includes plate material moving mechanism and plate material positioning mechanism, the plate material moving mechanism is used for moving the PCB board to be processed to the plate material positioning mechanism, the plate material positioning mechanism is used for positioning the PCB board to be processed, and the plate material moving mechanism is also used for translating the positioned PCB board to be processed to the processing position of the PCB processing equipment.

[0006] As a further improvement of the above technical solution:

[0007] Optionally, the plate material positioning mechanism includes a positioning base frame, a driving assembly, a bearing tray and a material adjusting assembly, the driving assembly, the bearing tray and the material adjusting assembly are all installed on the positioning base frame, the driving assembly is used for driving the bearing tray to rotate around the vertical direction to adjust the angle of the PCB board to be processed placed on the bearing tray, and the material adjusting assembly is used for adjusting the position of the PCB board to be processed placed on the bearing tray.

[0008] Optionally, the material adjusting assembly includes a shaping driving piece and a material adjusting baffle, the material adjusting baffle is installed on the shaping driving piece, and the shaping driving piece can drive the material adjusting baffle to move to adjust the position of the PCB board to be processed placed on the bearing tray.

[0009] Optionally, the positioning base frame is provided with a shaping guide rail, and the shaping baffle is slidably installed on the shaping guide rail.

[0010] Optionally, the plate moving mechanism comprises a support base frame, a horizontal moving assembly, a vertical moving assembly and a grabbing assembly, the horizontal moving assembly is installed on the support base frame, the vertical moving assembly is installed on the horizontal moving assembly, and the grabbing assembly is installed on the vertical moving assembly, the horizontal moving assembly is configured to drive the grabbing assembly and the vertical moving assembly to move in a first direction, the vertical moving assembly is configured to drive the grabbing assembly to move vertically, and the grabbing assembly is configured to grab the PCB board, wherein the first direction intersects with the vertical direction.

[0011] Optionally, the plate carrying device further comprises a taking mechanism, the taking mechanism is configured to take the PCB board from the unloading position of the film cutting line and buffer, and the plate moving mechanism is configured to move the PCB board buffered by the taking mechanism to the plate positioning mechanism.

[0012] Optionally, the taking mechanism comprises a taking base frame, a taking assembly and a buffering assembly, the taking assembly and the buffering assembly are both installed on the taking base frame, the taking assembly is configured to take the PCB board from the unloading position of the previous process, and the buffering assembly is configured to buffer the PCB board taken by the taking assembly.

[0013] Optionally, the taking assembly comprises a first horizontal moving member and a grabbing member, the first horizontal moving member is installed on the taking base frame, and the grabbing member is installed on the first horizontal moving member, the first horizontal moving member is configured to drive the grabbing member to extend to the unloading position of the film cutting line, and the grabbing member is configured to grab the PCB board located at the unloading position of the previous process.

[0014] Optionally, the grabbing member comprises a grabbing disc and a suction disc member, the grabbing disc is installed on the first horizontal moving member, and the suction disc member is configured to adsorb the PCB board.

[0015] Optionally, the grabbing member further comprises a shaking member, the suction disc member is installed on the grabbing disc through the shaking member, and the shaking member is configured to shake off the excess PCB board grabbed by the suction disc member.

[0016] Optionally, the shaking member comprises a telescopic driving member, a hinged seat and a connecting rod, the telescopic driving member and the hinged seat are both installed on the grabbing disc, the connecting rod is rotatably hinged to the hinged seat on a first axis, the first axis intersects with the vertical direction, a first end of the connecting rod is hinged to the telescopic driving member, the suction disc member is vertically guided and installed on the hinged seat, a second end of the connecting rod is hinged to the suction disc member, and the telescopic driving member is configured to drive the suction disc member to shake up and down relative to the hinged seat.

[0017] Optionally, the material taking base is provided with a transverse guide groove, and the grabbing disc is provided with a transverse guide rail which is guided and matched with the transverse guide rail.

[0018] Optionally, the buffer assembly comprises a second transverse moving member, a vertical moving member and a buffer tray, the second transverse moving member is installed on the material taking base, the vertical moving member is installed on the second transverse moving member, and the buffer tray is installed on the vertical moving member, the buffer tray buffers the PCB board, the second transverse moving member is used to drive the buffer tray to move to a feeding position of the plate moving mechanism, and the vertical moving member is used to drive the buffer tray to receive the PCB board taken by the material taking assembly.

[0019] Optionally, the material taking base is provided with a transverse guide groove, and the grabbing disc is provided with a transverse guide rail which is guided and matched with the transverse guide rail.

[0020] Optionally, the plate carrying device further comprises a discharging mechanism, and the plate moving mechanism is further used to move the processed PCB board to the discharging mechanism.

[0021] Optionally, the discharging mechanism comprises a discharging base, a discharging bracket and a lifting assembly, the lifting assembly is installed on the discharging base, and the discharging bracket is installed on the lifting assembly, and the discharging bracket is used to stack and place the processed PCB board.

[0022] Optionally, the lifting assembly comprises a rotating driving member, a screw rod and a threaded sleeve, one of the rotating driving member and the threaded sleeve is installed on the discharging base, and the other is installed on the discharging bracket, the screw rod is threadedly matched with the threaded sleeve, and the rotating driving member can drive the screw rod to rotate.

[0023] Optionally, the discharging base is installed with a vertical guide rod, and the discharging bracket is installed with a vertical guide sleeve which is guided and matched with the vertical guide rod.

[0024] In another aspect, the utility model provides a kind of PCB processing equipment, and the PCB processing equipment includes processing device and the plate carrying device as described above, and the processing device can process the PCB board fed to processing position.

[0025] As further improvement of the above technical solution:

[0026] Optionally, the processing device is processing device.

[0027] Compared with the prior art, the plate carrying device and the PCB processing equipment have at least the following beneficial effects: during use, first, the plate moving mechanism moves the to-be-processed PCB plate to the plate positioning mechanism, then the plate positioning mechanism positions the to-be-processed PCB plate, and finally the plate moving mechanism moves the positioned to-be-processed PCB plate to the processing position of the processing device. During the plate carrying process, the plate positioning mechanism can reposition the to-be-processed PCB plate, so that the position of the to-be-processed PCB plate fed to the processing position of the PCB processing equipment by the plate moving mechanism is more accurate, and the probability of meeting the accuracy requirement of PCB plate processing is improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained according to these drawings without creative labor.

[0029] Figure 1 is a structural schematic view of the plate positioning mechanism of the plate carrying device provided in an embodiment of the present application;

[0030] Figure 2 is a structural schematic view of the plate positioning mechanism of the plate carrying device provided in an embodiment of the present application;

[0031] Figure 3 is a structural schematic view of the plate positioning mechanism of the plate carrying device provided in an embodiment of the present application;

[0032] Figure 4 is a structural schematic view of the plate positioning mechanism of the plate carrying device provided in an embodiment of the present application;

[0033] Figure 5 is an enlarged view of the A area in Figure 4

[0034] Figure 6 is a structural schematic view of the plate positioning mechanism of the plate carrying device provided in an embodiment of the present application.

[0035] The reference signs in the specification are as follows:

[0036] ​100 - sheet material handling device, 110 - sheet material moving mechanism, 111 - support base, 112 - lateral moving assembly, 113 - vertical moving assembly, 114 - grabbing assembly, 120 - sheet material positioning mechanism, 121 - positioning base, 122 - driving assembly, 123 - carrying tray, 124 - shaping driving piece, 125 - material shaping baffle, 126 - shaping guide rail, 130 - material taking mechanism, 131 - material taking base, 132 - first lateral moving piece, 133 - grabbing disc, 134 - suction disc piece, 135 - telescopic driving piece, 136 - hinged seat, 137 - connecting rod, 138 - lateral guide slot, 139 - lateral guide rail, 140 - second lateral moving piece, 141 - vertical moving piece, 142 - buffer tray, 143 - lateral guide sleeve, 144 - lateral guide rod, 150 - material discharging mechanism, 151 - material discharging base, 152 - material discharging bracket, 153 - rotating driving piece, 154 - screw rod, 155 - threaded sleeve, 156 - vertical guide sleeve, 157 - vertical guide rod, 200 - processing device. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical schemes and beneficial effects solved by the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and not to limit the utility model.

[0038] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0039] In the description of the utility model, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0040] Please refer to Figure 1The utility model embodiment provides a kind of sheet material handling device 100, the sheet material handling device 100 includes sheet material moving mechanism 110 and sheet material positioning mechanism 120, sheet material moving mechanism 110 is used to move the PCB plate to be processed to sheet material positioning mechanism 120, sheet material positioning mechanism 120 is used to position the PCB plate to be processed, sheet material moving mechanism 110 is also used to move the PCB plate to be processed after positioning to the processing position of processing device 200.

[0041] When using the sheet material handling device 100 to load, first, the sheet material moving mechanism 110 moves the PCB plate to be processed to the sheet material positioning mechanism 120, then the sheet material positioning mechanism 120 positions the PCB plate to be processed, and finally the sheet material moving mechanism 110 moves the positioned PCB plate to be processed to the processing position of the processing device 200. Because the sheet material positioning mechanism 120 can reposition the PCB plate to be processed during the sheet material handling process, the sheet material moving mechanism 110 loads the PCB plate to the processing position of the processing device 200 more accurately, improving the probability of meeting the precision requirements of PCB plate processing.

[0042] The sheet material handling device 100 provided by the utility model embodiment, in particular, please refer to Figure 2 The sheet material positioning mechanism 120 includes a positioning base frame 121, a driving assembly 122, a carrying tray 123, and a material aligning assembly. The driving assembly 122, the carrying tray 123, and the material aligning assembly are all installed on the positioning base frame 121. The driving assembly 122 is used to drive the carrying tray 123 to rotate around the vertical direction to adjust the angle of the PCB plate to be processed placed on the carrying tray 123. The material aligning assembly is used to adjust the position of the PCB plate placed on the carrying tray 123. The sheet material moving mechanism 110 moves the PCB plate to be processed onto the carrying tray 123. The placement angle of the PCB plate is detected by a state detection mechanism (such as a vision camera). According to the placement angle of the PCB plate detected by the state detection mechanism, the driving assembly 122 drives the carrying tray 123 to rotate around the vertical direction to adjust the placement angle of the PCB plate. Then the material aligning assembly positions the PCB plate placed on the carrying tray 123. At this time, the PCB plate is at a predetermined angle and position. When the sheet material moving mechanism 110 moves the positioned PCB plate to be processed to the processing position of the processing device 200, the placement position of the PCB plate is more accurate, thereby improving the quality of drilling and enhancing the yield rate of PCB plate drilling.

[0043] In a specific embodiment, please refer to Figure 2The shaping assembly includes a shaping driving member 124 and a shaping baffle 125, the shaping baffle 125 is installed on the shaping driving member 124, and the shaping driving member 124 can drive the shaping baffle 125 to move to position the PCB to be processed placed on the bearing tray 123. After the driving assembly 122 drives the bearing tray 123 to rotate around the vertical direction to adjust the placing angle of the PCB, the shaping driving member 124 drives the shaping baffle 125 to move to adjust the position of the PCB to be processed placed on the bearing tray 123. In the embodiment, the front and back (X direction) and left and right (Y direction) of the bearing tray 123 in the horizontal plane are each provided with a shaping assembly. The positioning base frame 121 is provided with a shaping guide rail 126, and the shaping baffle 125 is slidingly installed on the shaping guide rail 126. The shaping guide rail 126 can ensure the moving direction of the shaping baffle 125, so that the shaping baffle 125 always moves in one direction.

[0044] The plate carrying device 100 provided by the embodiment of the utility model, specifically, please refer to Figure 3 The plate moving mechanism 110 includes a supporting base frame 111, a horizontal moving assembly 112, a vertical moving assembly 113 and a grabbing assembly 114, the horizontal moving assembly 112 is installed on the supporting base frame 111, the vertical moving assembly 113 is installed on the horizontal moving assembly 112, the grabbing assembly 114 is installed on the vertical moving assembly 113, the horizontal moving assembly 112 is used to drive the grabbing assembly 114 and the vertical moving assembly 113 to move in a first direction, the vertical moving assembly 113 is used to drive the grabbing assembly 114 to move vertically, and the grabbing assembly 114 is used to grab the PCB. Wherein the first direction intersects with the vertical direction, and in the embodiment, the first direction is the horizontal direction.

[0045] When using the plate carrying device 100 to load, first, the horizontal moving assembly 112 drives the grabbing assembly 114 to move horizontally to a material taking position, the vertical moving assembly 113 drives the grabbing assembly 114 to move vertically downward to a position where the grabbing assembly 114 can grab the PCB to be processed, the grabbing assembly 114 grabs the PCB to be processed, the vertical moving assembly 113 drives the grabbing assembly 114 to move vertically upward, then the horizontal moving assembly 112 drives the grabbing assembly 114 to move horizontally to a positioning position, the vertical moving assembly 113 drives the grabbing assembly 114 to move vertically downward to a position where the grabbing assembly 114 can place the grabbed PCB to be processed on the bearing tray 123, after the plate positioning mechanism 120 positions the PCB to be processed, the grabbing assembly 114 again grabs the PCB to be processed, and moves horizontally to a loading position by the horizontal moving assembly 112, and drives the grabbing assembly 114 to move vertically downward to a position where the grabbing assembly 114 can place the grabbed PCB to be processed on the processing position of the processing device 200.

[0046] The sheet metal handling device 100 provided in this embodiment of the utility model, further details can be found in the following documents. Figure 1 The board material handling device 100 also includes a picking mechanism 130, which is used to pick up PCB boards from the cutting line and buffer them. The board material moving mechanism 110 is used to move the PCB boards buffered by the picking mechanism 130 to the board material positioning mechanism 120. During loading, the picking mechanism 130 first picks up the PCB boards from the cutting line and buffers them, and then the board material moving mechanism 110 moves the PCB boards buffered by the picking mechanism 130 to the board material positioning mechanism 120.

[0047] For details, please refer to the relevant documents. Figure 4 The material handling mechanism 130 includes a material handling base 131, a material handling component, and a buffer component. Both the material handling component and the buffer component are mounted on the material handling base 131. The material handling component is used to pick up PCB boards from the cutting line position, and the buffer component is used to buffer the PCB boards picked up by the material handling component. During material handling, the material handling component first picks up the PCB board from the cutting line position, then the buffer component buffers the PCB board picked up by the material handling component, and finally the board moving mechanism 110 moves the PCB board to be processed buffered by the material handling mechanism 130 to the board positioning mechanism 120.

[0048] In a specific embodiment, please refer to the following. Figure 4 The material handling assembly includes a first lateral moving member 132 and a gripping member. The first lateral moving member 132 is mounted on the material handling base 131, and the gripping member is mounted on the first lateral moving member 132. The first lateral moving member 132 is used to drive the gripping member to extend to the cutting line position below the film cutting line. The gripping member is used to grip the PCB board located at the cutting line position below the film cutting line. During material handling, the first lateral moving member 132 drives the gripping member to extend out of the material handling base 131 to the cutting line position below the film cutting line. Then, the gripping member grips the PCB board located at the cutting line position below the film cutting line. Finally, the first lateral moving member 132 drives the gripping member to retract to the material handling base 131, so that the gripped PCB board can be placed on the buffer assembly.

[0049] In this embodiment, please refer to the following for details. Figure 4 The gripping components include a gripping disk 133 and a suction cup 134. The gripping disk 133 is mounted on the first lateral moving component 132, and the suction cup 134 is used to pick up PCB boards. The suction cup 134 is mounted on the gripping disk 133 via a shaking component, which is used to shake off excess PCB boards picked up by the suction cup 134. Since multi-layer PCB boards are stacked below the cutting line, when the suction cup 134 picks up a PCB board located below the cutting line, it may pick up multiple layers of PCB boards simultaneously. Therefore, after the suction cup 134 picks up a PCB board, the shaking component can shake off the excess PCB boards picked up by the suction cup 134.

[0050] For details, please refer to the relevant documents.Figure 5 The shaking component includes a telescopic drive 135, a hinge base 136, and a connecting rod 137. Both the telescopic drive 135 and the hinge base 136 are mounted on the gripping disk 133. The connecting rod 137 is hinged to the hinge base 136 in a horizontal direction. The first end of the connecting rod 137 is hinged to the telescopic drive 135. The suction cup 134 is vertically guided and mounted on the hinge base 136. The second end of the connecting rod 137 is hinged to the suction cup 134. The telescopic drive 135 extends and retracts, driving the suction cup 134 to shake up and down relative to the hinge base 136. By extending and retracting the telescopic drive 135 to drive the suction cup 134 to shake up and down relative to the hinge base 136, excess PCB boards gripped by the suction cup 134 can be shaken off, ensuring that the suction cup 134 can only pick up one PCB board at a time.

[0051] In a specific embodiment, please refer to the following. Figure 4 The buffer assembly includes a second horizontal moving part 140, a vertical moving part 141, and a buffer tray 142. The second horizontal moving part 140 is mounted on the picking base 131, the vertical moving part 141 is mounted on the second horizontal moving part 140, and the buffer tray 142 is mounted on the vertical moving part 141. The buffer tray 142 buffers and holds PCB boards. The second horizontal moving part 140 is used to drive the buffer tray 142 to move to the loading position of the board moving mechanism 110, and the vertical moving part 141 is used to drive the buffer tray 142 to receive the PCB boards picked up by the picking assembly. After the first lateral moving member 132 drives the gripper to retract to the material picking base 131, the second lateral moving member 140 drives the buffer tray 142 to move directly below the gripper. At the same time, the vertical moving member 141 drives the buffer tray 142 to rise so that the buffer tray 142 can receive the PCB board gripped by the gripper. After the PCB board gripped by the gripper is placed on the buffer tray 142, the vertical moving member 141 drives the buffer tray 142 to fall. The second lateral moving member 140 drives the buffer tray 142 to move to the loading position of the board moving mechanism 110. Finally, the board moving mechanism 110 moves the PCB board to be processed buffered by the picking mechanism 130 to the board positioning mechanism 120.

[0052] In a specific embodiment, please refer to the following. Figure 4 The material-grabbing base frame 131 is provided with a transverse guide groove 138, and the gripping disc 133 is provided with a transverse guide rail 139, with the transverse guide rail 139 engaging with the transverse guide rail 139. The material-grabbing base frame 131 is provided with a transverse guide rod 144, and the vertical moving part 141 is provided with a transverse guide sleeve 143, with the transverse guide sleeve 143 engaging with the transverse guide rod 144. The engaging of the transverse guide rail 139 with the transverse guide rail 139 can improve the stability and consistency of the movement of the gripping disc 133; the engaging of the transverse guide sleeve 143 with the transverse guide rod 144 can improve the stability and consistency of the movement of the vertical moving part 141.

[0053] The sheet metal handling device 100 provided in this embodiment of the utility model, further details can be found in the following documents. Figure 1 The board material handling device 100 also includes a blanking mechanism 150, and the board material moving mechanism 110 is also used to move the drilled PCB board to the blanking mechanism 150. After the processing device 200 performs drilling operation on the PCB board located at the processing position, the board material moving mechanism 110 moves the drilled PCB board to the blanking mechanism 150 so as to load the next PCB board.

[0054] For details, please refer to the relevant documents. Figure 6 The unloading mechanism 150 includes an unloading base frame 151, an unloading bracket 152, and a lifting assembly. The lifting assembly is mounted on the unloading base frame 151, and the unloading bracket 152 is mounted on the lifting assembly. The unloading bracket 152 is used to stack and place the drilled PCB boards. When the board moving mechanism 110 moves the drilled PCB board onto the unloading bracket 152, the lifting assembly drives the unloading bracket 152 to descend by the height of one PCB board, so that the board moving mechanism 110 unloads at the same height each time.

[0055] In this embodiment, please refer to the following for details. Figure 6 The lifting assembly includes a rotary drive 153, a lead screw 154, and a threaded sleeve 155. One of the rotary drive 153 and the threaded sleeve 155 is mounted on the unloading base 151, and the other is mounted on the unloading bracket 152. The lead screw 154 and the threaded sleeve 155 are threaded together, and the rotary drive 153 can drive the lead screw 154 to rotate. The unloading base 151 is equipped with a vertical guide rod 157, and the unloading bracket 152 is equipped with a vertical guide sleeve 156, which guides and engages with the vertical guide rod 157. This guiding engagement improves the smoothness and consistency of the movement of the unloading bracket 152.

[0056] In addition, another embodiment of this utility model provides a PCB processing equipment, which includes a processing device and a board material handling device 100 as provided in any of the above embodiments. The processing device is capable of processing PCB boards that have been loaded to the processing position. The specific structure of the board material handling device 100 is the same as described in the above embodiments. Since this PCB processing equipment adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0057] In this embodiment, the processing device is a drilling machine, which can drill holes in the PCB board that has been fed to the processing position.

[0058] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A sheet metal handling device, characterized in that, The board material handling device includes a board material moving mechanism and a board material positioning mechanism. The board material moving mechanism is used to move the PCB board to be processed to the board material positioning mechanism. The board material positioning mechanism is used to position the PCB board to be processed. The board material moving mechanism is also used to translate the positioned PCB board to be processed to the processing position of the PCB processing equipment.

2. The sheet metal handling device according to claim 1, characterized in that, The board positioning mechanism includes a positioning base frame, a drive assembly, a support tray, and a material straightening assembly. The drive assembly, the support tray, and the material straightening assembly are all mounted on the positioning base frame. The drive assembly is used to drive the support tray to rotate in the vertical direction to adjust the angle of the PCB board to be processed placed on the support tray. The material straightening assembly is used to adjust the position of the PCB board to be processed placed on the support tray.

3. The sheet metal handling device according to claim 2, characterized in that, The forming assembly includes a forming drive and a forming baffle. The forming baffle is mounted on the forming drive, and the forming drive can drive the forming baffle to move to adjust the position of the PCB board to be processed placed on the carrier tray.

4. The sheet metal handling device according to claim 3, characterized in that, The positioning base frame is equipped with a shaping guide rail, and the material forming baffle is slidably installed on the shaping guide rail.

5. The sheet metal handling device according to claim 1, characterized in that, The board moving mechanism includes a support base, a horizontal moving component, a vertical moving component, and a gripping component. The horizontal moving component is mounted on the support base, the vertical moving component is mounted on the horizontal moving component, and the gripping component is mounted on the vertical moving component. The horizontal moving component drives the gripping component and the vertical moving component to move along a first direction, the vertical moving component drives the gripping component to move vertically, and the gripping component grips the PCB board, wherein the first direction intersects with the vertical direction.

6. The sheet metal handling device according to claim 1, characterized in that, The board material handling device further includes a material picking mechanism, which is used to pick up PCB boards from the cutting line and buffer them, and the board material moving mechanism is used to move the PCB boards buffered by the material picking mechanism to the board material positioning mechanism.

7. The sheet metal handling device according to claim 6, characterized in that, The material handling mechanism includes a material handling base frame, a material handling component, and a buffer component. The material handling component and the buffer component are both installed on the material handling base frame. The material handling component is used to pick up PCB boards from the unloading position of the previous process, and the buffer component is used to buffer the PCB boards picked up by the material handling component.

8. The sheet metal handling device according to claim 7, characterized in that, The material handling assembly includes a first lateral moving member and a gripping member. The first lateral moving member is mounted on the material handling base frame, and the gripping member is mounted on the first lateral moving member. The first lateral moving member is used to drive the gripping member to extend to the cutting line feed position, and the gripping member is used to grip the PCB board located at the feed position of the previous process.

9. The sheet metal handling device according to claim 8, characterized in that, The gripping component includes a gripping disk and a suction cup component. The gripping disk is installed on the first lateral moving component, and the suction cup component is used to adsorb the PCB board.

10. The sheet metal handling device according to claim 9, characterized in that, The gripping component also includes a shaking component, and the suction cup component is mounted on the gripping disk via the shaking component. The shaking component is used to shake off excess PCB boards gripped by the suction cup component.

11. The sheet metal handling device according to claim 10, characterized in that, The shaking component includes a telescopic drive, a hinge base, and a connecting rod. The telescopic drive and the hinge base are both mounted on the gripping disk. The connecting rod is rotatably hinged to the hinge base around a first axis, which intersects the vertical direction. The first end of the connecting rod is hinged to the telescopic drive. The suction cup is vertically guided and mounted on the hinge base. The second end of the connecting rod is hinged to the suction cup. The telescopic drive can extend and retract to drive the suction cup to shake up and down relative to the hinge base.

12. The sheet metal handling device according to claim 9, characterized in that, The material handling base frame is provided with a transverse guide groove, and the gripping disc is provided with a transverse guide rail, with the transverse guide rail and the transverse guide rail engaging in a guiding cooperation.

13. The sheet metal handling device according to claim 7, characterized in that, The buffer assembly includes a second lateral moving component, a vertical moving component, and a buffer tray. The second lateral moving component is mounted on the material picking base frame, the vertical moving component is mounted on the second lateral moving component, and the buffer tray is mounted on the vertical moving component. The buffer tray buffers PCB boards. The second lateral moving component is used to drive the buffer tray to the loading position of the board moving mechanism, and the vertical moving component is used to drive the buffer tray to receive the PCB boards picked up by the material picking assembly.

14. The sheet metal handling device according to claim 13, characterized in that, The material handling frame is provided with a horizontal guide rod, and the vertical moving part is provided with a horizontal guide sleeve, which is guided and engaged with the horizontal guide rod.

15. The sheet metal handling device according to claim 1, characterized in that, The board material handling device also includes a feeding mechanism, and the board material moving mechanism is further used to move the processed PCB board to the feeding mechanism.

16. The sheet metal handling device according to claim 15, characterized in that, The unloading mechanism includes an unloading base frame, an unloading bracket, and a lifting assembly. The lifting assembly is installed on the unloading base frame, and the unloading bracket is installed on the lifting assembly. The unloading bracket is used to stack and place the processed PCB boards.

17. The sheet metal handling device according to claim 16, characterized in that, The lifting assembly includes a rotary drive, a lead screw, and a threaded sleeve. One of the rotary drive and the threaded sleeve is mounted on the unloading base frame, and the other is mounted on the unloading bracket. The lead screw and the threaded sleeve are threadedly engaged, and the rotary drive can drive the lead screw to rotate.

18. The sheet metal handling device according to claim 16, characterized in that, The material feeding base is equipped with a vertical guide rod, and the material feeding bracket is equipped with a vertical guide sleeve. The vertical guide sleeve and the vertical guide rod are guided and engaged.

19. A PCB processing equipment, characterized in that, The PCB processing equipment includes a processing device and a board material handling device as described in any one of claims 1 to 18, wherein the processing device is capable of processing PCB boards that have been loaded to the processing position.

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