Multifunctional copper foil adhesive tape with heat dissipation structure

Abstract

The utility model belongs to the technical field of copper foil adhesive tapes, and particularly relates to a multifunctional copper foil adhesive tape with a heat dissipation structure, which comprises a multifunctional heat dissipation copper foil adhesive tape main body which comprises a copper foil base material layer, an insulating layer, a heat dissipation layer, heat dissipation holes, a heat conduction layer and a release paper layer, the top of the copper foil base material layer is in cemented connection with an insulating layer, the bottom of the copper foil base material layer is in cemented connection with a heat dissipation layer, heat dissipation holes are formed in the heat dissipation layer, the bottom of the heat dissipation layer is in cemented connection with a heat conduction layer, and the bottom of the heat conduction layer is in cemented connection with a release paper layer. The thickness of the copper foil base material layer ranges from 15 micrometers to 45 micrometers, and the copper foil base material layer and the insulating layer are of a hot-pressing bonding structure. The heat dissipation capability of the copper foil adhesive tape can be improved, the insulating property of the copper foil adhesive tape can be improved, and the multifunctionality of the copper foil adhesive tape can be realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to copper foil adhesive tape technical field, specifically a multifunctional copper foil adhesive tape with heat dissipation structure. BACKGROUND

[0002] Copper foil adhesive tape is a kind of metal adhesive tape, mainly applied to electromagnetic shielding, and is divided into two kinds of electric signal shielding and magnetic signal shielding, and electric signal shielding mainly relies on the excellent conductivity of copper itself, and magnetic shielding needs the glue surface conductive substance "nickel" of copper foil adhesive tape to achieve the effect of magnetic shielding, so it is widely used in mobile phones, notebook computers and other digital products.

[0003] In Chinese patent 202321576533.5, the utility model discloses a kind of high-thermal-conductivity heat-dissipation copper foil adhesive tape, including copper foil substrate layer, graphite layer is glued to set in the upper end surface of copper foil substrate layer, matte layer is glued to set in the upper end surface of graphite layer and heat-conducting acrylic adhesive layer is glued to set in the lower end surface of copper foil substrate layer. Advantage: heat-conducting acrylic adhesive layer has 0.0012K*m2) / W ultra-low thermal resistance, can quickly transmit the heat energy of screen center to copper foil. Copper foil substrate has 0.39×10^3J / (kg·℃) specific heat capacity and 400W / (m·K) ultra-high thermal conductivity, can quickly absorb heat and conduct to back. Graphite coating can enhance heat conduction and radiation heat through the special structure of graphite. Matte coating, further improve the surface appearance through the silicon powder in matte coating, improve the heat dissipation area, make the surface of graphite coating form honeycomb structure, enhance the radiation heat dissipation capacity.

[0004] The existing copper foil adhesive tape generates high heat when in use, which is mostly dissipated by itself after being conducted to the copper foil adhesive tape. Since the copper foil adhesive tape cannot handle it by itself, it will cause the temperature of the copper foil adhesive tape to be too high. At the same time, the copper foil adhesive tape has poor heat resistance, which will cause the copper foil adhesive tape to be damaged in high-temperature environment, affecting the performance of the copper foil adhesive tape. Moreover, the function of the copper foil adhesive tape is single, which cannot meet the current use requirements.

[0005] Therefore, a multifunctional copper foil adhesive tape with heat dissipation structure is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0006] To make up for the shortcomings of the prior art, the problem of high temperature of the copper foil adhesive tape is solved, the problem of poor heat resistance of the copper foil adhesive tape affecting the performance of the copper foil adhesive tape is solved, and the problem of single function of the copper foil adhesive tape is solved.

[0007] The utility model discloses a technical scheme that solves its technical problem is adopted: a kind of multifunctional copper foil adhesive tape with heat dissipation structure described in the utility model, including multifunctional heat dissipation copper foil adhesive tape main part, multifunctional heat dissipation copper foil adhesive tape main part, including copper foil substrate layer, insulating layer, heat dissipation layer, heat dissipation hole, heat conducting layer, release paper layer, the top of copper foil substrate layer is cemented with insulating layer, and the bottom of copper foil substrate layer is cemented with heat dissipation layer, and heat dissipation hole is arranged in the inside of heat dissipation layer, the bottom of heat dissipation layer is cemented with heat conducting layer, and the bottom of heat conducting layer is cemented with release paper layer.

[0008] Preferably, the thickness of the copper foil substrate layer is between fifteen microns and forty-five microns, and the copper foil substrate layer and the insulating layer are in a hot-press bonding structure.

[0009] Preferably, the insulating layer is made of epoxy resin material, and the thickness of the insulating layer is between ten microns and twenty microns.

[0010] Preferably, the heat dissipation layer is made of aluminum alloy material, and the thickness of the heat dissipation layer is between fifteen microns and forty microns.

[0011] Preferably, the heat dissipation holes are arranged at equal intervals in the inside of the heat dissipation layer, and the diameter of the heat dissipation holes is smaller than the thickness of the heat dissipation layer.

[0012] Preferably, the heat conducting layer is made of aluminum-copper alloy material, and the thickness of the heat conducting layer is between twelve microns and thirty-six microns.

[0013] Preferably, the release paper layer and the heat conducting layer constitute a detachable structure, and the thickness of the release paper layer is between five microns and twenty microns.

[0014] The utility model has the advantages that:

[0015] 1. The thickness of the copper foil substrate layer is between fifteen microns and forty-five microns, and the copper foil substrate layer and the insulating layer are in a hot-press bonding structure, so as to ensure the stability between the copper foil substrate layer and the insulating layer. The insulating layer is made of epoxy resin material, and the thickness of the insulating layer is between ten microns and twenty microns. The epoxy resin material has high insulation properties and can well protect the metal structure, which is beneficial to preventing the influence of electric current on the operation of internal electronic devices.

[0016] 2. The heat dissipation layer is made of aluminum alloy material, and the thickness of the heat dissipation layer is between fifteen microns and forty microns. The aluminum alloy material has good heat dissipation performance, which is beneficial to processing the heat generated by the device. The heat dissipation holes are arranged at equal intervals in the inside of the heat dissipation layer, and the diameter of the heat dissipation holes is smaller than the thickness of the heat dissipation layer. The heat dissipation holes are beneficial to assisting the heat dissipation of the heat dissipation layer and ensuring the efficiency of heat dissipation.

[0017] 3. The heat-conducting layer is made of aluminum-copper alloy material, and the thickness of the heat-conducting layer is between 12 microns and 36 microns. The aluminum-copper alloy is an alloy material composed of aluminum and copper, and has the advantages of high strength, light weight and good heat-conducting performance. The release paper layer and the heat-conducting layer form a detachable structure, and the thickness of the release paper layer is between 5 microns and 20 microns, so as to protect the unused copper foil adhesive tape and prolong the storage life of the copper foil adhesive tape. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 It is a cross-sectional structure schematic diagram of the whole of the present application;

[0020] Figure 2 It is a cross-sectional structure schematic diagram of the heat-dissipating layer of the present application;

[0021] Figure 3 It is a cross-sectional structure schematic diagram of the heat-conducting layer of the present application;

[0022] Figure 4 It is a cross-sectional structure schematic diagram of the copper foil base material layer of the present application;

[0023] Figure 5 It is a perspective structure schematic diagram of the whole of the present application from the front view;

[0024] Figure 6 It is a perspective structure schematic diagram of the whole of the present application from the top view.

[0025] In the figure: 1, multifunctional heat-dissipating copper foil adhesive tape main body; 101, copper foil base material layer; 102, insulation layer; 103, heat-dissipating layer; 104, heat-dissipating hole; 105, heat-conducting layer; 106, release paper layer. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0027] Embodiment one

[0028] Please refer toFigures 1 to 4 As shown, a multifunctional copper foil tape with a heat dissipation structure includes a multifunctional heat dissipation copper foil tape body 1. The multifunctional heat dissipation copper foil tape body 1 includes a copper foil substrate layer 101, an insulating layer 102, a heat dissipation layer 103, heat dissipation holes 104, a thermally conductive layer 105, and a release paper layer 106. The insulating layer 102 is bonded to the top of the copper foil substrate layer 101, and the heat dissipation layer 103 is bonded to the bottom of the copper foil substrate layer 101. Heat dissipation holes 104 are provided inside the heat dissipation layer 103, and the thermally conductive layer 105 is bonded to the bottom of the heat dissipation layer 103. The release paper layer 106 is bonded to the bottom of the thermally conductive layer 105.

[0029] Please see Figure 1 , Figure 4 As shown, a multifunctional copper foil tape with a heat dissipation structure has a copper foil substrate layer 101 with a thickness between 15 micrometers and 45 micrometers, and the copper foil substrate layer 101 and the insulating layer 102 are thermo-pressed together, which facilitates the stability between the copper foil substrate layer 101 and the insulating layer 102.

[0030] Please see Figure 1 , Figure 4 As shown, a multifunctional copper foil tape with a heat dissipation structure has an insulating layer 102 made of epoxy resin, and the thickness of the insulating layer 102 is between ten micrometers and twenty micrometers. The epoxy resin material has high insulation properties, which can effectively protect the metal structure and help prevent current from affecting the operation of internal electronic devices.

[0031] Please see Figures 1 to 4 As shown, a multifunctional copper foil tape with a heat dissipation structure is provided. The heat dissipation layer 103 is made of aluminum alloy and the thickness of the heat dissipation layer 103 is between 15 micrometers and 40 micrometers. The aluminum alloy material has good heat dissipation performance, which is beneficial for handling the heat generated by the device.

[0032] Please see Figures 1 to 4 As shown, a multifunctional copper foil tape with a heat dissipation structure has heat dissipation holes 104 that are equally spaced inside the heat dissipation layer 103, and the diameter of the heat dissipation holes 104 is smaller than the thickness of the heat dissipation layer 103. The heat dissipation holes 104 facilitate the heat dissipation of the heat dissipation layer 103 and ensure heat dissipation efficiency.

[0033] Please see Figure 1 , Figure 3 As shown, a multifunctional copper foil tape with a heat dissipation structure has a heat-conducting layer 105 made of aluminum-copper alloy, and the thickness of the heat-conducting layer 105 is between 12 micrometers and 36 micrometers. The aluminum-copper alloy is an alloy material composed of aluminum and copper, which has the advantages of high strength, light weight and good thermal conductivity.

[0034] Please see Figure 1 ,Figure 3 As shown, a multifunctional copper foil tape with a heat dissipation structure, the release paper layer 106 and the heat conducting layer 105 constitute a detachable structure, and the thickness of the release paper layer 106 is between five microns and twenty microns, which is convenient for protecting the unused copper foil tape and prolonging the storage life of the copper foil tape.

[0035] Working principle: first, tear the release paper layer 106, the inside of the release paper layer 106 is provided with a cutting line which divides the release paper layer 106 into two parts, which is convenient for removing the release paper layer 106, then install the multifunctional heat dissipation copper foil tape main body 1 in the appropriate position of the device, in the use process, the device generates heat, the heat is conducted to the heat conducting layer 105, the heat conducting layer 105 is made of aluminum copper alloy, the aluminum copper alloy is an alloy material composed of aluminum and copper, which has the advantages of high strength, light weight and good heat conductivity, can carry out the first step of heat dissipation of the heat generated by the device, the remaining heat is conducted to the heat dissipation layer 103, the heat dissipation layer 103 is made of aluminum alloy material, the aluminum alloy material has good heat dissipation performance, the inside of the heat dissipation layer 103 is provided with a heat dissipation hole 104, the heat dissipation hole 104 is designed as hollow, which can assist the heat dissipation layer 103 to dissipate heat, which is beneficial to improve the heat dissipation performance, the insulation layer 102 is made of epoxy resin material, the epoxy resin material has high insulation property, which can well protect the metal structure and prevent the current in the device from damaging the parts.

[0036] The basic principle, main characteristics and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application.

Claims

1. A multifunctional copper foil tape with a heat dissipation structure, characterized in that: The multifunctional heat dissipation copper foil tape body (1) includes a copper foil substrate layer (101), an insulating layer (102) is bonded to the top of the copper foil substrate layer (101), a heat dissipation layer (103) is bonded to the bottom of the copper foil substrate layer (101), and heat dissipation holes (104) are provided inside the heat dissipation layer (103). A thermally conductive layer (105) is bonded to the bottom of the heat dissipation layer (103), and a release paper layer (106) is bonded to the bottom of the thermally conductive layer (105).

2. The multifunctional copper foil tape with a heat dissipation structure according to claim 1, characterized in that: The thickness of the copper foil substrate layer (101) is between 15 micrometers and 45 micrometers, and the copper foil substrate layer (101) and the insulating layer (102) are in a thermo-pressed bonding structure.

3. The multifunctional copper foil tape with a heat dissipation structure according to claim 1, characterized in that: The insulating layer (102) is made of epoxy resin, and the thickness of the insulating layer (102) is between ten micrometers and twenty micrometers.

4. The multifunctional copper foil tape with a heat dissipation structure according to claim 1, characterized in that: The heat dissipation layer (103) is made of aluminum alloy, and the thickness of the heat dissipation layer (103) is between 15 micrometers and 40 micrometers.

5. The multifunctional copper foil tape with a heat dissipation structure according to claim 1, characterized in that: The heat dissipation holes (104) are evenly spaced inside the heat dissipation layer (103), and the diameter of the heat dissipation holes (104) is smaller than the thickness of the heat dissipation layer (103).

6. The multifunctional copper foil tape with a heat dissipation structure according to claim 1, characterized in that: The heat-conducting layer (105) is made of aluminum-copper alloy, and the thickness of the heat-conducting layer (105) is between twelve micrometers and thirty-six micrometers.

7. The multifunctional copper foil tape with a heat dissipation structure according to claim 1, characterized in that: The release paper layer (106) and the heat-conducting layer (105) form a detachable structure, and the thickness of the release paper layer (106) is between five micrometers and twenty micrometers.

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