Vapor chamber element with three-dimensional structure

Abstract

A three-dimensional structure vapor chamber element comprises a lower cover plate and an upper cover plate, the lower cover plate is provided with a lower cover plate cavity and a lower cover plate groove cavity, the upper cover plate is provided with an upper cover plate groove corresponding to the lower cover plate groove cavity, and when the upper cover plate is coupled to the lower cover plate, the lower cover plate cavity and the lower cover plate groove cavity form a closed air cavity. Compared with the prior art, the vapor chamber element with the three-dimensional structure enables the vapor chamber element with the boss structure of the lower cover plate to meet the requirements that the vertical thermal resistance of a heat absorption area is reduced, the working fluid flows back quickly, and the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of bottom plate has the equalizing plate element of boss structure, especially refers to a kind of three-dimensional structure equalizing plate element, which has boss structure and can reduce the vertical thermal resistance value of heat absorption area, and can improve the two-phase flow circulation efficiency. BACKGROUND

[0002] The equalizing plate element is a two-dimensional two-phase flow circulation function element, with a plane upper cover plate and a plane lower cover plate. When the upper cover plate is coupled with the lower cover plate, a two-dimensional accommodation space is formed. The accommodation space is arranged with capillary structure and air duct as well as working fluid. The outer surface of the lower cover plate of the equalizing plate element is usually used to contact a wafer or heat source in the middle part.

[0003] In the actual application of wafer heat dissipation, the wafer is usually installed on a circuit substrate, and a stiffener is arranged around the wafer to protect the wafer and enhance the mechanical strength and stability of the circuit substrate. However, the height of the stiffener is usually about 3mm-5mm higher than the height of the wafer body. When a liquid cooling heat sink with an equalizing plate element needs to be installed on the wafer surface, the lower cover plate of the equalizing plate element and the wafer surface cannot be closely attached due to the height difference.

[0004] To make up for this height difference, please refer to Figure 1 , Figure 1 shows the prior art equalizing plate element E. As shown in Figure 1 , the lower cover plate 81 of the prior art equalizing plate element E is a boss structure with a groove 811, thereby filling the height difference and ensuring that the lower surface of the equalizing plate element E can be closely attached to the wafer surface to solve the problem of the height difference. Therefore, as shown in Figure 1 , the upper cover plate 82 structure of the prior art general equalizing plate element E is a flat plate, and the lower cover plate 81 is a special-shaped plate with a groove structure in the middle part.

[0005] The closed air cavity height of the general equalizing plate element is not more than 3mm, however, although the bottom plate boss of the above-mentioned prior art equalizing plate element E can solve the problem of height difference, the height difference further leads to the increase of the cavity height of the closed air cavity in the heat absorption area of the equalizing plate element by 3mm-5mm, and also leads to the uneven distribution of the air duct height of the closed air cavity for two-phase flow circulation in the equalizing plate element. As Figure 1As shown, the cavity height h1 of the wafer corresponding to the conventional VGP element E is much higher than the cavity height h2 of the periphery. Once the cavity height increases, the vertical thermal resistance of the VGP element E in the evaporator area also increases. In addition, since the vapor cavity in the VGP element E has different heights in the central and peripheral parts, it will further affect the circulation efficiency of the two-phase flow. At the same time, due to the high capillary height of the support column in the evaporator area, the return distance of the condensed working fluid in the capillary structure inside the upper cover plate is long, and the return speed is slow, which also reduces the phase change of the working fluid and the circulation efficiency of the two-phase flow.

[0006] The above-mentioned shortcomings caused by the lower cover plate are not obvious when the wafer power and power density are not high. However, with the rapid development of technology in recent years, high-performance wafers of artificial intelligence use higher power and power density specifications, such as wafer power exceeding 1,000W, power density exceeding 100W / cm 2 At this time, if the vertical thermal resistance value of the conventional VGP element increases slightly, the wafer temperature will increase a lot, which will cause the wafer to fail to meet the design requirements of heat dissipation.

[0007] Therefore, in order to solve this problem, the design of the conventional VGP element must be changed, and it is necessary to provide a VGP element that can simultaneously satisfy the bottom with a boss structure and reduce the vertical thermal resistance value of the evaporator area of the VGP element, the working fluid returns quickly, and the internal two-phase flow circulates smoothly. Invention content

[0008] Therefore, the purpose of the present application is to provide a three-dimensional structure VGP element which is simple in structure, convenient to operate, can overcome the defects of the prior art, reduce the vertical thermal resistance inside the cavity, improve the heat dissipation efficiency of the wafer and the heat sink, and can effectively meet the heat dissipation requirements of high-power and high-power density wafers.

[0009] To achieve the above-mentioned purpose, the present application discloses a three-dimensional structure VGP element, characterized in that it comprises:

[0010] a lower cover plate having a lower cover plate cavity and a lower cover plate groove cavity; and

[0011] an upper cover plate having an upper cover plate groove corresponding to the lower cover plate groove cavity, the upper cover plate being coupled to the lower cover plate, and the lower cover plate cavity and the lower cover plate groove cavity forming a closed air cavity.

[0012] Among them, the lower cover plate further comprises a lower cover plate groove, and the lower cover plate groove has a lower cover plate groove lower surface for contacting a heat source.

[0013] The upper cover plate further has an upper cover plate upper surface, and the fins are disposed on the upper cover plate upper surface.

[0014] The fins include a plurality of first fins and a plurality of second fins, the upper cover plate further has an upper cover plate recessed upper surface, the first fins are coupled to the upper cover plate recessed upper surface, the second fins are coupled to the upper cover plate upper surface, and the height of the first fins is greater than the height of the second fins.

[0015] The upper cover plate further has an upper cover plate upper surface, and the heat pipes are disposed on the upper cover plate upper surface.

[0016] Each heat pipe is a half-open heat pipe, the upper cover plate upper surface has a plurality of holes relative to the half-open heat pipes, and each half-open heat pipe is disposed in a corresponding hole.

[0017] Each heat pipe has a heat pipe cavity, and the heat pipe cavities and the sealed air cavity are mutually penetrated.

[0018] The heat pipes include a plurality of first heat pipes and a plurality of second heat pipes, the first heat pipes are coupled to the upper cover plate recessed upper surface, the second heat pipes are coupled to the upper cover plate upper surface, and the height of the first heat pipes is greater than the height of the second heat pipes.

[0019] The fins are spaced to form a plurality of micro flow channels, and the micro flow channels are used for a cooling liquid to flow through.

[0020] The fins are spaced to form a plurality of air flow channels, and the air flow channels are used for an air flow to flow through.

[0021] In summary, the three-dimensional structure vapor chamber element of the present application has a lower cover plate with a lower cover plate recess, and an upper cover plate with an upper cover plate recess, and the positions of the lower cover plate recess and the upper cover plate recess correspond to the position of the heat source. Compared with the prior art, the internal cavity height of the three-dimensional structure vapor chamber element of the present application is consistent, which reduces the vertical thermal resistance inside the cavity, thereby improving the heat dissipation efficiency of the wafer and the heat sink. Compared with the prior art, the three-dimensional structure vapor chamber element of the present application can effectively meet the heat dissipation needs of high-power and high-power density wafers. Furthermore, the three-dimensional structure vapor chamber element of the present application is suitable for the design of a single heat source wafer or multiple different power wafers, and provides multiple variations. In addition, the three-dimensional structure vapor chamber element of the present application can further set fins or heat pipes on the upper cover plate according to the use requirements. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A known vapor chamber element is shown.

[0023] Figure 2 An exploded view of a three-dimensional structure heat exchanger element according to a specific embodiment of the present invention is shown.

[0024] Figure 3 Showing according to Figure 2 A cross-sectional view of a three-dimensional heat exchanger element.

[0025] Figure 4 A cross-sectional view of a three-dimensional thermal equalizer element according to another specific embodiment of the present invention is shown.

[0026] Figure 5 A schematic diagram of a three-dimensional heat spreader element according to another specific embodiment of the present invention is shown.

[0027] Figure 6 A schematic diagram of a three-dimensional heat spreader element according to another specific embodiment of the present invention is shown.

[0028] Figure 7 Showing according to Figure 6 A cross-sectional view of a three-dimensional heat exchanger element. Detailed Implementation

[0029] To make the advantages, spirit, and features of this utility model easier and clearer to understand, detailed descriptions and discussions will follow with reference to specific embodiments and the accompanying drawings. It should be noted that these specific embodiments are merely representative examples of this utility model, and the specific methods, apparatus, conditions, materials, etc., exemplified are not intended to limit this utility model or the corresponding specific embodiments. Furthermore, the elements in the figures are only used to express their relative positions and are not drawn to scale; the step numbers in this utility model are only for distinguishing different steps and do not represent the order of the steps, as will be stated previously.

[0030] Please refer to the following: Figure 2 as well as Figure 3 , Figure 2 This diagram shows an exploded view of a three-dimensional heat spreader element 1 according to a specific embodiment of the present invention. Figure 3 Showing according to Figure 2 A cross-sectional view of the three-dimensional structure of the heat exchanger element 1. (See figure) Figure 2 as well as Figure 3 As shown, the three-dimensional heat spreader element 1 of this specific embodiment includes a lower cover plate 11 and an upper cover plate 12. The lower cover plate 11 has a lower cover plate cavity 111 and a lower cover plate recessed cavity 112. The upper cover plate 12 has an upper cover plate recess 122 corresponding to the lower cover plate recessed cavity 112. When the upper cover plate 12 is coupled to the lower cover plate 11, the lower cover plate cavity 111 and the lower cover plate recessed cavity 112 form a sealed air chamber 13.

[0031] In this specific embodiment, the lower cover plate 11 and the upper cover plate 12 can be manufactured using a Computer Numerical Control (CNC) machine, a punching press, or a mold. For example, after the metal sheet is stamped twice, a lower cover plate with two sets of grooves can be produced; or after the metal sheet is stamped once, and the stamping position corresponds to the position of the groove of the lower cover plate, an upper cover plate is formed to ensure that the structures of the upper cover plate and the lower cover plate are compatible. However, the method of manufacturing the upper cover plate and the lower cover plate is not limited to the above.

[0032] Next, in practice, a porous capillary structure (not shown in the figure) and multiple support columns 115 with porous capillary structures are first laid on the lower cover plate 11. When the upper cover plate 12 and the lower cover plate 11 are coupled, the support columns 115 are positioned between the lower cover plate cavity 111 and the lower cover plate groove cavity 112. Furthermore, the support columns 115 form a continuous capillary structure with the porous capillary structure on the lower surface of the upper cover plate 12 and the upper surface of the lower cover plate 11 (not shown in the figure). Then, the upper cover plate 12 and the lower cover plate 11 are tightly pressed together using the upper and lower fixtures and then high-temperature diffusion welding is performed. After joining, working fluid is injected between the upper cover plate 12 and the lower cover plate 11 and a vacuum is drawn. After vacuuming, the lower cover plate cavity 111 and the lower cover plate groove cavity 112 form a sealed air chamber 13. In practice, the working fluid can be water or a two-phase coolant, such as R134a.

[0033] In practical applications, the three-dimensional heat spreader element 1 of this invention can be used for air cooling, such as... Figure 3 As shown, the lower surface 114 of the lower cover plate groove 113 is used to contact the heat source 90 (i.e., the wafer). The lower surface 114 of the lower cover plate groove 113 serves as a heat absorption zone, preferentially absorbing the heat energy of the heat source 90. After absorbing the heat energy, the working fluid (not shown) in the sealed gas chamber 13 undergoes a phase change from liquid to gaseous. Then, when the gaseous working fluid moves to the upper cover plate 12, which serves as a condensation zone, the cooled working fluid undergoes another phase change back to liquid. Finally, it flows back to the heat absorption zone at the bottom along the porous capillary structure on the support column 115 and other porous capillary structures, thereby repeating the two-phase flow cycle.

[0034] Next, the three-dimensional structure heat exchanger element 1 of this utility model can also be applied to liquid cooling heat dissipation. In another embodiment, the three-dimensional structure heat exchanger element is further provided with a shell and has an inlet for inputting coolant. When the coolant flows in from the inlet, since the coolant temperature is low, the coolant will immediately exchange heat with the upper cover plate, so the temperature of the upper cover plate will also decrease. At this time, the cooled working fluid will undergo a phase change and become liquid working fluid again, thereby repeating the two-phase flow cycle and liquid cooling cycle.

[0035] It is worth noting that the lower cover plate 11 of the three-dimensional heat spreader element 1 of this utility model has a lower cover plate groove 113; the upper cover plate 12 has an upper cover plate groove 122, and the positions of the lower cover plate groove 113 and the upper cover plate groove 122 correspond to the positions of the heat source 90. Therefore, as Figure 3 As shown, the cavity height h3 in the three-dimensional vapor chamber element 1 is equal to the cavity height h4. Compared with conventional vapor chamber elements, the three-dimensional vapor chamber element 1 of this invention can not only effectively contact the heat source of the wafer, but also reduce the vertical thermal resistance, thereby improving the overall heat transfer efficiency.

[0036] Furthermore, for increasingly higher power chip specifications, in addition to specifications with a single heat source, there will also be designs with multiple chips of different power. This utility model further provides other embodiments. Please refer to... Figure 4 , Figure 4 This image shows a cross-sectional view of a three-dimensional heat spreader element 2 according to another specific embodiment of the present invention. Figure 4 As shown, two sets of heat sources 91 and 92 are provided at this time, and the lower cover plate 21 of the three-dimensional heat spreader element 2 in this specific embodiment is provided with two sets of lower cover plate grooves 213. The upper cover plate 22 also includes two sets of upper cover plate grooves 222 corresponding to the lower cover plate grooves 213 respectively. Other devices in this specific embodiment are substantially the same as those corresponding to the aforementioned specific embodiments, and therefore will not be described in detail here. In addition, in another embodiment, if two sets of heat sources are provided on the circuit board, and the size of the main heat source is larger than that of the secondary heat source, the size of the lower cover plate groove can also correspond to the size of the heat source. For example, if the first lower cover plate groove corresponds to the main heat source and the second lower cover plate groove corresponds to the secondary heat source, then the size of the first lower cover plate groove is larger than that of the second lower cover plate groove. Furthermore, the sizes of the first upper cover plate groove and the second upper cover plate groove are designed according to the sizes of the first lower cover plate groove and the second lower cover plate groove respectively. In practice, the number, size, and location of the grooves in the lower and upper cover plates are not limited by these restrictions and can be designed according to the actual size, quantity, and specifications of the heat source.

[0037] Furthermore, the three-dimensional heat dissipation plate element of this invention may include other components to further improve the overall heat dissipation performance and meet the heat dissipation requirements of different specifications. Please refer to [link / reference].Figure 5 , Figure 5 A schematic diagram of a three-dimensional heat spreader element 3 according to another specific embodiment of the present invention is shown. Figure 5 As shown, the three-dimensional heat spreader element 3 of this specific embodiment further includes a plurality of fins 34, and the upper cover plate 32 further has an upper cover plate surface 321, on which the fins 34 are disposed. The fins 34 include a plurality of first fins 341 and a plurality of second fins 342. The upper cover plate 32 further has an upper cover plate groove surface 323, where the first fins 341 are coupled to the upper cover plate groove surface 323, the second fins 342 are coupled to the upper cover plate surface 321, and the height of the first fins 341 is greater than the height of the second fins 342.

[0038] In practical applications, the three-dimensional vapor chamber element 3 of this specific embodiment can be used for both air cooling and liquid cooling. For example, when the three-dimensional vapor chamber element 3 is used for air cooling, the internal two-phase flow circulation can effectively and quickly conduct the heat energy generated by the heat source to the fins. The airflow can pass through the airflow channels between each fin, further accelerating heat exchange and improving heat dissipation efficiency. As another example, when the three-dimensional vapor chamber element 3 is used for liquid cooling, the fins are spaced to form multiple microchannels. These microchannels allow coolant to flow through, and the coolant undergoes efficient heat exchange with the fins as it flows through the microchannels, quickly carrying away heat and further improving heat dissipation performance to meet the needs of high-power or high-heat-density applications.

[0039] Next, please refer to the following: Figure 6 as well as Figure 7 , Figure 6 This diagram shows a schematic representation of a three-dimensional heat spreader element 4 according to another specific embodiment of the present invention. Figure 7 Showing according to Figure 6 A cross-sectional view of the three-dimensional structure of the heat exchanger element 4. (See attached image.) Figure 6 as well as Figure 7As shown, the three-dimensional heat spreader element 4 of this specific embodiment further includes multiple heat pipes 45, and the upper cover plate 42 further has an upper cover plate surface 421, on which the heat pipes 45 are disposed. Each heat pipe 45 is actually a semi-open heat pipe, i.e., one end is closed and the other end is open. The upper cover plate surface 421 has multiple holes, and each heat pipe 45 is disposed in a corresponding hole. After each heat pipe 45 is disposed in its corresponding hole and welded, the heat pipe cavity 452 of each heat pipe 45 will communicate with the sealed air cavity 43. Furthermore, the heat pipe 45 includes multiple first heat pipes 453 and multiple second heat pipes 454. The first heat pipes 453 are coupled to the upper cover plate groove surface 423, and the second heat pipes 454 are coupled to the upper cover plate surface, with the height of the first heat pipes 453 greater than the height of the second heat pipes 454. Furthermore, the three-dimensional heat spreader element 4 in this specific embodiment further includes fins 44, and the fins 44 are provided with holes corresponding to each heat pipe 45, so that the fins can be coupled to each heat pipe 45.

[0040] Furthermore, the three-dimensional vapor chamber element of this invention can be designed according to heat dissipation requirements. For example, in other embodiments, the three-dimensional vapor chamber element 2 may further include fins or heat pipes. The elements in this embodiment are generally the same as those in the aforementioned embodiments, and will not be described again here.

[0041] In summary, this invention provides a three-dimensional vapor chamber element, wherein the lower cover plate has a lower cover plate groove; the upper cover plate has an upper cover plate groove, and the positions of the lower cover plate groove and the upper cover plate groove correspond to the positions of the heat source. Compared with the prior art, the internal cavity height of the three-dimensional vapor chamber element of this invention is uniform, which reduces the vertical thermal resistance inside the cavity, thereby improving the heat dissipation efficiency of the chip and the heat sink. Compared with the prior art, the three-dimensional vapor chamber element of this invention can effectively meet the heat dissipation requirements of high-power and high-power-density chips. Furthermore, the three-dimensional vapor chamber element of this invention is suitable for the design of a single heat source chip or multiple chips with different power levels, providing a variety of configurations. In addition, the three-dimensional vapor chamber element of this invention can further incorporate fins or heat pipes on the upper cover plate according to usage requirements.

[0042] The detailed description of the preferred embodiments above is intended to more clearly illustrate the features and spirit of this utility model, and is not intended to limit the scope of this utility model by the preferred embodiments disclosed above. Rather, the aim is to cover various modifications and equivalent arrangements within the scope of the patent claims made by this utility model. Therefore, the scope of the patent claims made by this utility model should be interpreted in the broadest possible way based on the foregoing description, so as to cover all possible modifications and equivalent arrangements.

Claims

1. A three-dimensional heat spreader element, characterized in that... Includes: A cover plate having a cover plate cavity and a cover plate recess cavity; and An upper cover plate has an upper cover plate groove corresponding to the lower cover plate groove cavity. When the upper cover plate is coupled to the lower cover plate, the lower cover plate cavity and the lower cover plate groove cavity form a sealed air cavity.

2. The three-dimensional heat spreader element as described in claim 1, characterized in that, The lower cover plate further includes a lower cover plate recess having a lower surface for contacting a heat source.

3. The three-dimensional heat spreader element as described in claim 1, characterized in that, It also includes a plurality of fins, and the upper cover plate has an upper surface, on which the fins are disposed.

4. The three-dimensional heat spreader element as described in claim 3, characterized in that, The fins include a plurality of first fins and a plurality of second fins. The upper cover plate also has an upper surface of an upper cover plate groove. The first fins are coupled to the upper surface of the upper cover plate groove, the second fins are coupled to the upper surface of the upper cover plate, and the height of the first fins is greater than the height of the second fins.

5. The three-dimensional heat spreader element as described in claim 1, characterized in that, It also includes multiple heat pipes, and the upper cover plate has an upper surface on which the heat pipes are disposed.

6. The three-dimensional heat spreader element as described in claim 5, characterized in that, Each heat pipe is a half-open heat pipe, and the upper surface of the cover plate has a plurality of holes corresponding to the half-open heat pipes, with each half-open heat pipe disposed in a corresponding hole.

7. The three-dimensional heat spreader element as described in claim 6, characterized in that, Each heat pipe has a heat pipe cavity, which are interconnected with the sealed air cavity.

8. The three-dimensional heat spreader element as described in claim 5, characterized in that, The heat pipes include a plurality of first heat pipes and a plurality of second heat pipes, the first heat pipes being coupled to the upper surface of the groove in the upper cover plate, the second heat pipes being coupled to the upper surface of the upper cover plate, and the height of the first heat pipes being greater than the height of the second heat pipes.

9. The three-dimensional heat spreader element as described in claim 3, characterized in that, These fins are spaced apart to form multiple microchannels, and these microchannels are used to allow a coolant to flow through.

10. The three-dimensional heat spreader element as described in claim 3, characterized in that, These fins are spaced apart to form multiple airflow channels, and these airflow channels are used to allow airflow.

Images