Temperature testing device and temperature testing system for circuit board

Abstract

The utility model provides a temperature testing device and a temperature testing system for a circuit board. The temperature testing device comprises a bearing base, a positioning base station, a temperature measuring module and an adjusting module. The positioning base station is used for placing a circuit board and is arranged on the bearing base; the temperature measuring module is arranged on the bearing base through an adjusting module, and the temperature measuring module is adjusted to be right above the circuit board through the adjusting module; wherein the temperature measurement module comprises a plurality of temperature probes which are arranged in a matrix. According to the utility model, the temperature of a plurality of circuit key devices can be measured simultaneously, so that the test efficiency is greatly improved; meanwhile, temperature detection is carried out in a non-contact mode, a temperature sensor does not need to be pasted manually, the detection efficiency is greatly improved, and meanwhile the risk of short circuit caused by falling of the temperature sensor is eradicated.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board temperature test technical field, concretely relates to a temperature testing device and temperature testing system for circuit board. BACKGROUND

[0002] Nowadays, the rapid development of new energy vehicles, high-power and high-efficiency automobile motor parts products are endless, like electronic water pump, electronic oil pump such as motor parts products applied in the thermal management system its temperature requirement is also higher and higher. In the process of circuit design of the controller, many electronic components work in the large current circuit, which means that the temperature of their own heat will be higher. The harsh environmental temperature and the self-heating of the components are an important test for the reliability of the controller; therefore, testing the performance of the key electronic components under extreme environmental temperature is crucial to ensure the reliability and stability of the product.

[0003] In order to avoid the working temperature of the key components of the controller exceeding the data manual or design range during the working process, resulting in the reduction or abnormality of the service life of the controller, it is necessary to measure whether the working temperature of each component in the PCBA (printed circuit board) is within the predetermined temperature range during the design and development process. At present, the commonly used test method in high-low temperature box and other test environments is to use temperature sensors, thermistors or thermocouples and other devices to monitor the temperature of the surface of the components. However, the existing method has the following defects:

[0004] Complicated operation: one or more temperature sensors need to be manually pasted on different control boards, and the environment needs to be manually carried, which increases the operation difficulty.

[0005] Reliability problem: the temperature sensor is easy to fall off in high temperature environment, which may cause short circuit risk.

[0006] Complexity: when testing multiple components, the wire harness is complex and difficult to organize, resulting in low test efficiency.

[0007] In summary, there is an urgent need for a temperature testing device and temperature testing system for circuit board to solve the problems existing in the prior art. Utility model content

[0008] The utility model aims at providing a temperature testing device and temperature testing system for circuit board, which aims to solve the deficiencies in measuring whether the working temperature of each component in the PCBA is within the predetermined temperature range by the existing method, and the specific technical scheme is as follows:

[0009] A temperature testing device for a circuit board, comprising a bearing base, a positioning base, a temperature measuring module and an adjusting module; the positioning base is used for placing the circuit board and is arranged on the bearing base; the temperature measuring module is arranged on the bearing base through the adjusting module, and the temperature measuring module is adjusted to the upper side of the circuit board through the adjusting module; wherein the temperature measuring module comprises a plurality of temperature probes arranged in a matrix.

[0010] Preferably, the positioning base and the bearing base are detachably connected, and the temperature measuring module and the adjusting module are detachably connected; the positioning base and the temperature measuring module are provided in multiple specifications.

[0011] Preferably, the positioning base is provided with a positioning cavity for placing a test product with a circuit board.

[0012] Preferably, the adjusting module comprises a Y-direction adjusting assembly and a Z-direction adjusting assembly, so that the temperature measuring module can move in translation in the Y and Z directions; or the adjusting module comprises a Y-direction adjusting assembly, a Z-direction adjusting assembly and an X-direction adjusting assembly, so that the temperature measuring module can move in translation in the X, Y and Z directions.

[0013] Preferably, the Z-direction adjusting assembly, the Y-direction adjusting assembly and the X-direction adjusting assembly each comprise a slide rod and a slide sleeve, and the slide sleeve is slidably arranged on the slide rod and is limited by a locking piece.

[0014] Preferably, the locking piece is a limiting bolt, the slide sleeve is provided with a threaded hole, and the slide rod is provided with a groove along the length direction of the slide rod; after the limiting bolt is screwed into the threaded hole, the end of the limiting bolt abuts against the bottom surface of the groove, so as to limit the slide sleeve on the slide rod.

[0015] Preferably, the bottom surface of the groove and the end surface of the limiting bolt abutting against the bottom surface of the groove are rough surfaces; or the end of the limiting bolt is sleeved with an anti-skid sleeve, the bottom surface of the groove is a rough surface, and the limiting bolt abuts against the bottom surface of the groove through the anti-skid sleeve.

[0016] Preferably, the Z-direction adjusting assembly, the Y-direction adjusting assembly and the X-direction adjusting assembly each comprise a driving piece, a slide rail and a slide table, the slide table is slidably arranged on the slide rail, and the driving piece is used for driving the slide table to slide on the slide rail.

[0017] The utility model also provides a temperature testing system for circuit board, including multichannel acquisition recording appearance and temperature testing device, temperature measuring module is connected with multichannel acquisition recording appearance through data line, and multichannel acquisition recording appearance is used for displaying and storing the temperature value of temperature measuring module measurement.

[0018] Preferably, the multi-channel acquisition recorder comprises an MCU and a signal amplification functional unit, an analog-digital conversion functional unit, an FIR filtering functional unit, a user interaction functional unit and a storage chip, all of which are electrically connected with the MCU.

[0019] The technical scheme of the utility model has the following beneficial effects:

[0020] In the temperature testing device, the temperature measurement module comprises a plurality of temperature probes arranged in a matrix, which can measure the temperature of a plurality of key circuit devices at the same time, greatly improving the testing efficiency; at the same time, the temperature measurement module can be flexibly adjusted in position through the adjusting module, and the temperature measurement module and the positioning base station are installed in a detachable manner, so that the temperature testing device can meet the testing requirements of products of different types with circuit boards; the temperature measurement module detects the temperature of the devices on the circuit board in a non-contact manner, without the need for manual pasting of temperature sensors, greatly improving the detection efficiency and eliminating the risk of short circuit caused by falling of the temperature sensor.

[0021] The temperature testing system can store and display the temperature of each device on the circuit board, and can exclude interference signals from the environment or other heat sources through signal amplification, analog-digital conversion, modulation, filtering and other processing, thereby ensuring the accuracy of measurement; wherein the temperature testing device and the multi-channel acquisition recorder are connected through a wire harness set, the multi-channel acquisition recorder is placed outside the high-temperature environment, thereby avoiding the influence of extreme temperature on the multi-channel acquisition recorder, and solving the problem of complex and difficult-to-organize wire harnesses in the prior art.

[0022] In addition to the purposes, features and advantages described above, the utility model has other purposes, features and advantages. The utility model will be further described in detail below with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0023] The drawings that form a part of this application are intended to provide a further understanding of the utility model, and the schematic embodiments of the utility model and the description thereof are intended to explain the utility model, and do not constitute an improper limitation on the utility model. In the drawings:

[0024] Figure 1 is a structural schematic view of the temperature testing device in embodiment 1;

[0025] Figure 2 is a sectional view between the slide rod and the slide sleeve in embodiment 1;

[0026] Figure 3 is a structural schematic view of the temperature testing system in embodiment 2;

[0027] Figure 4 is a frame diagram of the temperature testing system in embodiment 2;

[0028] 1, bearing base, 2, positioning base, 3, temperature measurement module, 4, Y direction adjustment assembly, 5, Z direction adjustment assembly, 6, multi-channel acquisition recorder, 7, sliding rod, 8, sliding sleeve, 9, limiting bolt, 10, groove, 11, anti-skid sleeve. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present application, the present application will be described more fully below, and the preferred embodiments of the present application are given. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the specification of the present application herein is only for the purpose of describing specific embodiments and is not intended to limit the present application.

[0031] Embodiment 1:

[0032] Referring to Figures 1-2 , the present embodiment provides a temperature testing device for circuit board, comprising a bearing base 1, a positioning base 2, a temperature measurement module 3 and an adjustment module; the positioning base 2 is used for placing the circuit board to be tested and is arranged on the bearing base 1; the temperature measurement module 3 is arranged on the bearing base 1 through the adjustment module, and the temperature measurement module 3 is adjusted to the upper side of the circuit board through the adjustment module; wherein the temperature measurement module 3 comprises a plurality of temperature probes arranged in matrix.

[0033] Specifically, the bearing base 1 is used to provide physical support for the entire temperature testing device, so that the temperature testing device can be stably placed on the experiment table, high temperature box or other working platform; when the bearing base 1 is designed, not only the supporting effect needs to be considered, but also the influence of temperature change in the testing process on the bearing base 1 itself needs to be considered.

[0034] Further, the positioning base 2 is provided with a positioning cavity, and the positioning cavity is used for placing the test product (such as electronic water pump, electronic oil pump, etc.) with circuit board, as shown in Figure 1 The positioning base 2 is used for bearing and positioning the test product, and provides a stable and safe support environment for the test product, so as to ensure that the test product can perform the test task stably without interference in the test process.

[0035] Preferably, the positioning base 2 and the bearing base 1 are detachably connected, and the temperature measurement module 3 and the adjusting module are detachably connected; the positioning base 2 and the temperature measurement module 3 are provided in multiple specifications, and by replacing the positioning base 2 and the temperature measurement module 3 of different specifications, the circuit board on different types of test products can be tested.

[0036] Specifically, the temperature measurement module includes a plurality of infrared temperature sensors arranged in a matrix, which can simultaneously measure the temperatures of a plurality of circuit key devices, greatly improving the test efficiency; according to the different circuit boards, a temperature measurement module 3 with a suitable resolution can be selected for temperature testing.

[0037] Preferably, the adjusting module is used to flexibly adjust the position of the temperature measurement module 3 to adapt to different types and different heights of test products. According to actual needs, the adjusting module can include a Y-direction adjusting assembly 4 and a Z-direction adjusting assembly 5 to enable the temperature measurement module 3 to move in the Y and Z directions; or the adjusting module can include a Y-direction adjusting assembly 4, a Z-direction adjusting assembly 5, and an X-direction adjusting assembly to enable the temperature measurement module 3 to move in the X, Y, and Z directions; further, the X, Y, and Z directions are perpendicular to each other.

[0038] Specifically, the structure of the Y-direction adjusting assembly 4, the Z-direction adjusting assembly 5, and the X-direction adjusting assembly can be designed according to actual conditions, and can adopt automatic adjustment or manual adjustment.

[0039] When the manual adjustment mode is adopted, the Z-direction adjusting assembly 5, the Y-direction adjusting assembly 4, and the X-direction adjusting assembly each include a sliding rod 7 and a sliding sleeve 8, the sliding sleeve 8 is slidably sleeved on the sliding rod 7 and is limited by a locking member. That is, the position of the sliding sleeve 8 on the sliding rod 7 is manually adjusted, and when the sliding sleeve 8 is adjusted to the target position, the sliding sleeve 8 is locked and limited by the locking member, so that relative movement between the sliding sleeve 8 and the sliding rod 7 is prevented.

[0040] Further, the locking member is a limiting bolt 9, the sliding sleeve 8 is provided with a threaded hole, and the sliding rod 7 is provided with a groove 10 along the length direction of the sliding rod 7; after the limiting bolt 9 is screwed into the threaded hole, the end of the limiting bolt 9 abuts against the bottom surface of the groove 10, so as to limit the sliding sleeve 8 on the sliding rod 7. Since the limiting bolt 9 is used to lock and limit by abutting against the sliding rod 7, if the groove 10 is not provided, the limiting bolt 9 will directly abut against the surface of the sliding rod 7, and the rigid contact between the limiting bolt 9 and the surface of the sliding rod 7 can damage the surface of the sliding rod 7, and cause unevenness, thereby affecting the free sliding of the sliding sleeve 8 on the sliding rod 7; after the groove 10 is provided, the end of the limiting bolt 9 rigidly contacts the bottom surface of the groove 10, and the surface of the sliding rod 7 matched with the sliding sleeve 8 is not damaged by the limiting bolt 9, so that the normal sliding cooperation between the sliding rod 7 and the sliding sleeve 8 is ensured.

[0041] Further, in order to prevent the limiting bolt 9 from sliding after abutting against the bottom surface of the groove, in the embodiment, the bottom surface of the groove 10 and the end surface of the limiting bolt 9 abutting against the bottom surface of the groove are both provided as rough surfaces, so as to increase the friction between the end surface of the limiting bolt and the bottom surface of the groove; the rough surface can be realized by sand blasting, wire drawing treatment and the like, and in the embodiment, the surface roughness of the rough surface is greater than or equal to Ra12.5, and more preferably, the surface roughness is greater than or equal to Ra25.

[0042] In addition, the way to prevent the limiting bolt from sliding after abutting against the bottom surface of the groove can also be that: the end of the limiting bolt 9 is sleeved with an anti-skid sleeve 11, the bottom surface of the groove 10 is a rough surface, and the limiting bolt 9 abuts against the bottom surface of the groove 10 through the anti-skid sleeve 11; the anti-skid sleeve 11 is made of a flexible material, the flexible material can be deformed under pressure, can tightly contact the bottom surface of the groove and generate a large friction, and at the same time, the deformation of the anti-skid sleeve 11 can also generate an elastic force on the limiting bolt 9, which can prevent the limiting bolt 9 from loosening due to self-rotation. Preferably, the flexible material can be silica gel or rubber and the like.

[0043] Preferably, in addition to the limiting bolt 9, the locking member can also use a latch, specifically: the sliding sleeve is provided with a positioning hole one, and the sliding rod is provided with a plurality of positioning holes two along the length direction of the sliding rod; after the positioning hole one is aligned with one of the positioning holes two on the sliding rod, the latch is used for locking; by aligning the positioning hole one with different positioning holes two and using the latch for locking, the position of the sliding sleeve on the sliding rod can be changed.

[0044] Specifically, the locking member of the sliding sleeve in the embodiment is a limiting bolt 9. Figure 1The adjusting module can realize the translation movement of the temperature measurement module 3 in Y and Z directions, that is, the adjusting module comprises a Y-direction adjusting assembly 4 and a Z-direction adjusting assembly 5, wherein the slide rod 7 in the Z-direction adjusting assembly is fixedly arranged on the bearing base 1, the slide rod 7 of the Y-direction adjusting assembly 4 is fixedly arranged on the slide sleeve 8 of the Z-direction adjusting assembly, and the temperature measurement module 3 is fixedly arranged on the slide sleeve 8 of the Y-direction adjusting assembly 4; further, the slide rod 7 of the Y-direction adjusting assembly 4 and the slide sleeve 8 of the Z-direction adjusting assembly can adopt an integrated design, that is, the slide sleeve 8 is arranged at the end of the slide rod 7 of the Y-direction adjusting assembly 4, and the slide sleeve 8 is directly sleeved on the slide rod of the Z-direction adjusting assembly.

[0045] Further, when the automatic adjusting mode is adopted, the Z-direction adjusting assembly 5, the Y-direction adjusting assembly 4 and the X-direction adjusting assembly all comprise a driving member, a slide rail and a slide table, the slide table is slidingly arranged on the slide rail, and the driving member is used to drive the slide table to slide on the slide rail. In the specific structural design, the X-direction adjusting assembly, the Z-direction adjusting assembly 5 and the Y-direction adjusting assembly 4 are arranged in a stacked manner, the slide rail of the adjusting assembly at the bottom layer is fixedly arranged on the bearing base 1, the slide rail of the adjusting assembly above is arranged on the slide table of the adjusting assembly below, and the temperature measurement module 3 is arranged on the slide table of the adjusting assembly at the top layer, so that the position adjustment of the temperature measurement module 3 in X, Y and Z directions can be realized. For example, the X-direction adjusting assembly, the Z-direction adjusting assembly 5 and the Y-direction adjusting assembly 4 are arranged in a stacked manner from bottom to top, the slide rail in the X-direction adjusting assembly is fixedly installed on the bearing base 1, the slide rail of the Z-direction adjusting assembly is fixedly arranged on the slide table of the X-direction adjusting assembly, the slide rail of the Y-direction adjusting assembly is fixedly arranged on the slide table of the Z-direction adjusting assembly, and the temperature measurement module 3 is fixedly arranged on the slide table of the Y-direction adjusting assembly.

[0046] Preferably, the driving member can be one of an oil cylinder, an air cylinder or an electric cylinder; at the same time, the driving member can also be a combination of a motor, a lead screw and a lead screw nut, or a combination of a motor, a gear and a rack. When the combination of the motor and the lead screw is adopted, the lead screw is arranged parallel to the slide rail, and the lead screw nut is installed on the slide table, the motor drives the rotation of the lead screw to drive the slide table to move along the slide rail; when the combination of the motor, the gear and the rack is adopted, the rack is arranged parallel to the slide rail, the motor is arranged on the slide table and the gear is arranged on the output end of the motor, after the gear and the rack are engaged, the motor can drive the slide table to move on the slide rail by forward and reverse rotation.

[0047] The temperature testing device in the embodiment has the advantages that: the temperature probe in the temperature measurement module can be adjusted according to the device layout of different circuit boards, ensuring that the testing requirements of various test products can be met, and the adaptability is high; the non-contact collection mode is adopted, the risk of short circuit caused by falling of the temperature sensor under high temperature is prevented, the safety of the testing process is improved, and the reliability is increased; the temperature measurement module can test multiple devices at the same time, the required testing time is reduced, and the testing efficiency is improved; the automatic monitoring system can be realized, the manual intervention is reduced, and the operation complexity is reduced; the performance of the key devices of the circuit under the extreme environmental temperature can be more accurately evaluated through centralized monitoring, and the accuracy is high.

[0048] Embodiment 2:

[0049] Referring to Figure 3 and Figure 4 , the embodiment provides a temperature testing system for a circuit board, which comprises a multi-channel collection recorder 6 and the temperature testing device of embodiment 1, the temperature measurement module 3 is connected with the multi-channel collection recorder 6 through a data line, and the multi-channel collection recorder 6 is used for displaying and storing the temperature value measured by the temperature measurement module 3.

[0050] Specifically, the temperature measurement module converts infrared radiation into an electric signal by using the principle of infrared radiation and the Stefan-Boltzmann law, and the multi-channel collection recorder is used for converting the electric signal of the temperature measurement module 3 into an actual temperature value and displaying and storing the temperature value.

[0051] Further, the Stefan-Boltzmann law is expressed as that the radiation power (P) of a black body (ideal radiator) is proportional to the fourth power of its absolute temperature (T):

[0052] P=εσT 4

[0053] wherein P is the radiation power, the unit is watt per square meter (W / m 2 ); ε is the emissivity of the object (0≤ε≤1), which represents the radiation ability of the object relative to the ideal black body; σ is the Stefan-Boltzmann constant, which is about 5.67×10-8 W / (m 2 ·K 4 ); and T is the absolute temperature of the object, the unit is Kelvin (K).

[0054] The Stefan-Boltzmann law shows that the infrared radiation intensity of the surface of an object increases significantly with the increase of the temperature.

[0055] Referring to Figure 4The multi-channel acquisition recorder 6 comprises an MCU (micro control unit) and a signal amplification functional unit, an analog-digital conversion functional unit, an FIR filtering functional unit, a user interaction functional unit and a storage chip, all of which are electrically connected with the MCU; wherein the working principle of the multi-channel acquisition recorder 6 is that the analog signal output by the temperature measurement module 3 (i.e. the infrared temperature sensor) is input to the signal amplification functional unit for amplification, the amplified analog signal is input to the analog-digital conversion functional unit for conversion into a digital signal, the digital signal is input to the FIR filtering functional unit for filtering processing and then delivered to the MCU, the temperature measurement result output by the MCU after modulation and secondary filtering processing is output to the user interaction functional unit for display; and the storage chip is used for storing the temperature measurement result output by the MCU.

[0056] The multi-channel acquisition recorder 6 of the present embodiment is further described in detail as follows:

[0057] Since the signal collected by the temperature measurement module 3 (i.e. the infrared temperature sensor) is usually a weak analog signal, it needs to be processed by the signal amplification functional unit for further analysis and processing, the signal amplification functional unit is used for amplifying the weak electric signal output by the temperature measurement module 3 to a range that can be processed; usually an operational amplifier (Op-Amp) or other component circuit is used to realize the amplification, and the amplified signal will have sufficient amplitude to facilitate subsequent signal acquisition and digital processing. Since the amplified signal is a continuous analog signal, it needs to be converted into a digital signal by the analog-digital conversion functional unit (i.e. the A / D converter), but the digital signal processed by the analog-digital conversion functional unit may contain noise or irregular fluctuations, thus it also needs to be processed by the FIR filtering functional unit for filtering processing; in order to ensure the smooth detection of temperature changes, the filtering processing is very important for the multi-channel acquisition recorder, the FIR filtering functional unit (finite impulse response filter) has linear phase characteristics, which can effectively remove low-frequency noise without changing the time-domain characteristics of the signal for smoothing processing to remove noise.

[0058] Meanwhile, in order to ensure that the temperature test system can still provide accurate measurement results under different environmental temperatures, the zero-point drift and gain drift of the temperature probe itself are usually corrected, specifically: the temperature compensation data under different environmental temperatures is preset in the algorithm of the temperature test system, and the temperature output by the MCU after modulation and secondary filtering needs to be added with the temperature compensation data before being displayed on the user interaction functional unit as the measurement temperature, so as to ensure the accuracy of the measurement.

[0059] Preferably, the signal amplification functional unit, the analog-digital conversion functional unit, the FIR filtering functional unit, the user interaction functional unit, the modulation algorithm and the secondary filtering algorithm configured in the MCU are all prior art, thus they are not described in detail in the present embodiment.

[0060] Preferably, the obtained temperature data is stored in a storage chip to ensure data lossless and facilitate subsequent review; meanwhile, the data in the storage chip can be copied and stored in a computer through a U disk, so as to better analyze the temperature of each device on the circuit board.

[0061] Preferably, the user can obtain the working temperature of each device to be detected on the circuit board through the user interaction function unit, and the graphical display is supported, so as to facilitate the user to quickly understand and operate.

[0062] In actual application, the temperature testing device is generally placed in a high-temperature environment to test the circuit board, and the multi-channel acquisition recorder 6 is placed outside the high-temperature environment. The temperature testing device and the multi-channel acquisition recorder are connected through a wire harness set to avoid the influence of extreme temperature on the multi-channel acquisition recorder 6. Preferably, the temperature testing range of the temperature testing device can be set to a temperature testing range of-40℃ to 150℃ to meet the needs of different application environments.

[0063] In the embodiment, the filter technology is used to select the required infrared radiation range for measurement, which helps to exclude interference signals from the environment or other heat sources, and ensures the accuracy of measurement. The modulation technology is used to further enhance the signal and reduce the noise. The modulation can be realized by changing the signal frequency or pulse mode received by the sensor, so as to improve the ratio of signal to noise, and improve the stability and accuracy of measurement.

[0064] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature testing device for circuit boards, characterized in that, It includes a support base (1), a positioning base (2), a temperature measurement module (3), and an adjustment module; the positioning base (2) is used to place the circuit board and is set on the support base (1); the temperature measurement module (3) is set on the support base (1) through the adjustment module, and the temperature measurement module (3) is adjusted to be directly above the circuit board through the adjustment module; wherein, the temperature measurement module (3) includes multiple temperature probes arranged in a matrix.

2. The temperature testing device for circuit boards according to claim 1, characterized in that, The positioning base (2) and the bearing base (1) are detachably connected, as are the temperature measuring module (3) and the adjustment module; the positioning base (2) and the temperature measuring module (3) are available in various specifications and models.

3. The temperature testing device for circuit boards according to claim 2, characterized in that, The positioning base (2) is provided with a positioning cavity, which is used to place the test product with the circuit board.

4. The temperature testing device for circuit boards according to claim 1, characterized in that, The adjustment module includes a Y-axis adjustment component (4) and a Z-axis adjustment component (5) to enable the temperature measurement module (3) to translate in the Y and Z directions; or, the adjustment module includes a Y-axis adjustment component (4), a Z-axis adjustment component (5) and an X-axis adjustment component to enable the temperature measurement module (3) to translate in the X, Y and Z directions.

5. The temperature testing device for circuit boards according to claim 4, characterized in that, The Z-axis adjustment component (5), Y-axis adjustment component (4) and X-axis adjustment component each include a slide rod (7) and a sliding sleeve (8). The sliding sleeve (8) is slidably sleeved on the slide rod (7) and limited by a locking member.

6. The temperature testing device for circuit boards according to claim 5, characterized in that, The locking component is a limiting bolt (9), the sliding sleeve (8) is provided with a threaded hole, and the sliding rod (7) is provided with a groove (10) along its own length direction; after the limiting bolt (9) is screwed into the threaded hole, its end abuts against the bottom surface of the groove (10) so as to realize that the sliding sleeve (8) is limited on the sliding rod (7).

7. The temperature testing device for circuit boards according to claim 6, characterized in that, The bottom surface of the groove (10) and the end face of the limiting bolt (9) pressing against the bottom surface of the groove are both rough surfaces; or, the end of the limiting bolt (9) is fitted with an anti-slip sleeve (11), the bottom surface of the groove (10) is a rough surface, and the limiting bolt (9) presses against the bottom surface of the groove (10) through the anti-slip sleeve (11).

8. The temperature testing device for circuit boards according to claim 4, characterized in that, The Z-axis adjustment component (5), Y-axis adjustment component (4) and X-axis adjustment component each include a drive component, a slide rail and a slide table. The slide table is slidably disposed on the slide rail, and the drive component is used to drive the slide table to slide on the slide rail.

9. A temperature testing system for circuit boards, characterized in that, The device includes a multi-channel data acquisition recorder (6) and a temperature testing device as described in any one of claims 1-8. The temperature measurement module (3) is connected to the multi-channel data acquisition recorder (6) via a data cable. The multi-channel data acquisition recorder (6) is used to display and store the temperature values ​​measured by the temperature measurement module (3).

10. The temperature testing system for a circuit board according to claim 9, characterized in that, The multi-channel acquisition recorder (6) includes an MCU and signal amplification function unit, analog-to-digital conversion function unit, FIR filtering function unit, user interaction function unit and storage chip, all of which are electrically connected to the MCU.

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