Exposure system for etching PCB (Printed Circuit Board) by micro-nano LCD projection ray machine

Abstract

The utility model discloses an exposure system for etching a PCB (Printed Circuit Board) by a micro-nano LCD (Liquid Crystal Display) projection machine. The exposure system comprises a projection shell, a plurality of air cooling systems, a light source module and ultraviolet LEDs, wherein the air cooling systems are arranged on the shell and are used for internal heat dissipation; the light source module is positioned in a box body; the current of the LED lamp beads is correspondingly controlled through signal connection of a computer system, and high-uniformity projection parallel light etching light spots are achieved. A high-resolution LCD screen is adopted, an image needing to be etched is imaged through the LCD screen, high-resolution, high-light-intensity and high-uniformity etching light spots are projected through the imaging optical projection lens, the light spots are projected to an etched PCB, and the high-precision etching effect is achieved. The water-cooling heat dissipation assembly is adopted to be close to the high-light-intensity light source lamp panel for heat dissipation, the normal use temperature of an LED is ensured, the service life of the LED is prolonged, light attenuation caused by high temperature is more effectively controlled, and the high-precision etching exposure device is simple in structure, convenient to use and capable of achieving high-precision etching exposure of a complex circuit.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the microelectronic manufacturing technical field, concretely relates to a kind of exposure system of micro-nano LCD projection photo machine etching PCB board. BACKGROUND

[0002] DLP projection photoetching machine can be used for microelectronic manufacturing, but DLP cannot adjust spot uniformity, the resolution of the digital micro-mirror element of DLP is lower, and the resolution and high-uniformity area light source are very critical to etching precision, and the process of etching is after circuit plating is completed, circuit board is sent into outer layer etching line (stripping, etching, stripping tin section), and the main work is to completely remove plating resist (stripping section), and the copper to be etched is exposed in etching liquid (etching section).

[0003] Since the top of the circuit area is protected by tin, the circuit of the circuit area can be retained, and then the tin surface is stripped (stripping tin section), so that the surface circuit of the overall circuit board is presented. Typical stripping (stripping), etching (etching) and stripping tin (stripping) production line is commonly known as "SES Line" in the industry.

[0004] The traditional DLP projection photoetching machine cannot guarantee the spot uniformity due to its low resolution, which leads to its inability to etch complex and fine circuits with high precision.

[0005] Therefore, how to provide a micro-nano LCD projection etching PCB exposure system capable of efficiently and accurately etching circuits is a problem that those skilled in the art need to solve. INVENTION CONTENTS

[0006] Therefore, the utility model provides a kind of micro-nano LCD projection etching PCB exposure system, utilize the LCD screen of high resolution and high-uniformity light-emitting module, can improve the precision of PCB etching complex circuit.

[0007] In order to achieve the above purpose, the utility model adopts the following technical scheme: a kind of exposure system of micro-nano LCD projection photo machine etching PCB board, it includes:

[0008] The cabinet provides a mounting space and a mounting base for components, and a plurality of fan assemblies for exhausting heat from the inside of the cabinet are provided on the side wall of the cabinet, and a plurality of perforations are formed on the top wall of the cabinet.

[0009] The lens light source module is located inside the cabinet and has a plurality of UV LED lamp beads arranged thereon, and the plurality of UV LED lamp beads are electrically connected to the computer system outside and independently controlled in intensity.

[0010] The LCD screen module is located inside the housing and parallel to the lens light source module above it. The LCD screen module is electrically connected to the computer system.

[0011] A projection lens is fixed to the top wall of the housing corresponding to the perforation, and the top of the projection lens is used to place the PCB board to be etched.

[0012] A water-cooled heat dissipation component is installed close to the lens light source module and is used to reduce the temperature of the lens light source module.

[0013] The beneficial effects of this utility model are: it uses a high-resolution LCD screen module, the lens light source module adjusts the light uniformity during use, the lens light source module displays the image to be etched through the LCD screen module, and projects it onto the corresponding etched PCB board circuit through a high-precision optical projection lens. This product adjusts the intensity of the lamp beads in the lens light source module through a computer system to achieve a highly uniform projection surface light source, and works with the LCD screen to achieve a high-precision micro-nano etching circuit process.

[0014] Preferably, an air vent is provided on the side wall of the housing near the lens light source module.

[0015] The resulting technical effect is that, due to the high power of the lens light source module, it generates a lot of heat, thus raising the temperature inside the enclosure. The vents near the heat source help the air circulate inside the enclosure, achieving heat dissipation and ensuring the working environment of the lens light source module.

[0016] Preferably, the lens light source module includes a circuit board and multiple ultraviolet LED beads. The multiple ultraviolet LED beads are arranged in a matrix and mounted on the circuit board. The multiple LED beads are independently controlled by a computer system to achieve uniformity of the surface light spot adjustment of the lens light source module.

[0017] The resulting technical effect is that multiple ultraviolet LED beads are independently controlled, and the matrix-arranged ultraviolet LED beads are used to emit parallel light. The current of the corresponding LED beads is controlled by the computer system signal connection, so as to achieve highly uniform projection parallel light etching spot. The highly uniform surface spot is very critical to the etching accuracy.

[0018] Preferably, the water-cooled heat dissipation assembly includes a water-cooled heat dissipation plate, a coolant circulation pipeline, a power pump, heat dissipation fins, and a base. The water-cooled heat dissipation plate is installed at the bottom of the circuit board. The water-cooled heat dissipation plate has a heat exchange medium cavity inside. A coolant circulation pipeline is arranged in the heat exchange medium cavity corresponding to the water-cooled heat dissipation plate. The coolant circulation pipeline extends to the outside of the housing. A power pump and heat dissipation fins are installed on the outside of the housing and corresponding to the coolant circulation pipeline. The heat dissipation fins and power pump are fixed on the base. A cooling fan is installed on the base and on the side close to the heat dissipation fins.

[0019] The resulting technical effect is that the water-cooled heat dissipation plate at the bottom of the circuit board can effectively remove the heat generated by the lens light source module, further ensuring the operating environment of the lens light source module, thereby extending its service life and avoiding short-term damage caused by temperature.

[0020] Preferably, the LCD screen module is fixed on the bracket, and the bracket is fixedly connected to the inner side wall of the housing.

[0021] The resulting technical effect is that the LCD screen module needs a suitable bracket to fix its position inside the cabinet, thereby establishing the positional layout relationship between the LCD screen module and the lens light source module.

[0022] Preferably, the fan assembly and the outer side of the corresponding housing are provided with a fan dust cover.

[0023] The resulting technical effects are: the fan assembly can accelerate the airflow inside the enclosure, thereby effectively reducing the internal temperature of the enclosure. This product is a combined heat dissipation system, with multiple heat dissipation methods superimposed to ensure the normal operation of the high-power lens light source module. The fan dust cover can prevent external particles, impurities, and liquids from entering the fan, ensuring a clean operating environment for the motor and further reducing the possibility of external impurities entering the enclosure. Attached Figure Description

[0024] Figure 1 This invention relates to the structure of an exposure system for etching a micro / nano LCD projection optical engine PCB board. Figure 1 ;

[0025] Figure 2 This invention relates to the structure of an exposure system for etching a micro / nano LCD projection optical engine PCB board. Figure 2 ;

[0026] Figure 3 This is an exploded view of an exposure system for etching a micro-nano LCD projection optical engine PCB board according to the present invention.

[0027] Figure 4This is a schematic diagram of the water-cooled heat dissipation component of the exposure system for etching a micro-nano LCD projection optical engine PCB board according to the present invention.

[0028] Figure 5 This is a diagram showing the internal structure of the water-cooled heat sink of the exposure system for etching a micro-nano LCD projection optical engine PCB board according to this utility model.

[0029] 1. Cabinet, 2. Fan assembly, 21. Fan dust cover, 3. Perforation, 4. Lens light source module, 5. LCD screen module, 6. Projection lens, 7. PCB board, 8. Water cooling heat dissipation assembly, 81. Water cooling heat dissipation plate, 82. Coolant circulation pipeline, 83. Power pump, 84. Heat dissipation fins, 85. Base, 86. Cooling fan, 9. Air vent, 10. Bracket. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] See appendix to this utility model Figures 1 to 5 An exposure system for etching a PCB board using a micro-nano LCD projection optical engine, according to an embodiment of the present invention, includes:

[0032] Box 1 is actually composed of six cover plates: front, back, left, right, bottom and top. Box 1 provides the installation space and foundation for the components. Multiple fan assemblies 2 are provided on the side walls of box 1 for exhausting heat from inside the box. The fan assemblies 2 are not a single set, but multiple sets can be arranged. Perforations 3 are opened on the top cover plate of box 1.

[0033] Lens light source module 4 is a high-power light-emitting module located inside the housing 1 and equipped with multiple ultraviolet LED beads. The current of the multiple ultraviolet LED beads can be controlled independently, thereby controlling their intensity. They can also be divided into groups to control the current of each group of beads and change the intensity. The multiple ultraviolet LED beads in the lens light source module are connected to the external computer system electrical signals and used to control their intensity.

[0034] LCD screen module 5 is located inside the housing 1 and is positioned parallel to the lens light source module 4 above it. LCD screen module 5 is electrically connected to the computer system.

[0035] Projection lens 6, corresponding to the through hole 3, is fixed on the top wall of the housing 1. The top of the projection lens 6 is used to place the PCB board 7 to be etched.

[0036] Water-cooled heat dissipation component 8 is installed near the lens light source module 4 and is used to reduce the temperature of the lens light source module 4.

[0037] This product uses mini UV LEDs with honeycomb-shaped LED beads to emit parallel light. The image to be etched is displayed on an LCD screen module and projected onto the corresponding etched PCB circuit board through a high-precision optical projection lens.

[0038] In other embodiments, an air vent 9 is provided on the side wall of the housing 1 near the lens light source module 4. There is not one air vent 9, but multiple air vents arranged in a regional manner. It should be noted that the air vents are small in size to prevent external particles and impurities from entering.

[0039] In some other specific embodiments, the lens light source module 4 includes a circuit board and multiple ultraviolet LED beads. The multiple ultraviolet LED beads are patch-mounted on the circuit board, and the multiple LED beads are independently controlled by a computer system to achieve uniformity of the surface light spot adjustment of the lens light source module 4.

[0040] In some other embodiments, the water-cooled heat dissipation assembly 8 includes a water-cooled heat dissipation plate 81, a coolant circulation pipe 82, a power pump 83, heat dissipation fins 84, and a base 85. The water-cooled heat dissipation plate 81 is mounted on the bottom of the circuit board. The water-cooled heat dissipation plate 81 has a heat exchange medium cavity inside. The coolant circulation pipe 82 is arranged in the heat exchange medium cavity corresponding to the water-cooled heat dissipation plate 81. The coolant circulation pipe 82 extends to the outside of the housing 1. The power pump 83 and the heat dissipation fins 84 are mounted on the outside of the housing 1 and on the coolant circulation pipe 82. The heat dissipation fins 84 and the power pump 83 are fixed on the base 85. A cooling fan 86 is mounted on the base 85 and on the side close to the heat dissipation fins 84.

[0041] The power pump provides the circulating power for cooling heat. The coolant circulation process carries away the heat from the heat exchange medium chamber. The coolant exchanges heat with the outside air through the heat dissipation fins. The cooling fan accelerates the heat exchange process, thereby ensuring the heat dissipation and cooling effect of the water-cooled heat sink on the circuit board and preventing its temperature from being too high and affecting the service life of the lens light source module.

[0042] In some other embodiments, the LCD screen module 5 is fixed on the bracket 10, and the bracket 10 is fixedly connected to the inner side wall of the housing 1. The bracket is an LCD screen bracket used to stably fix the LCD screen above the lens light source module.

[0043] In some other specific embodiments, a fan dust cover 21 is provided on the outside of the fan assembly 2 and the corresponding housing 1. The fan dust cover prevents particulate impurities from entering the fan, ensuring a clean working environment for the motor and further preventing impurities from entering the housing.

[0044] This product features a multi-mode combined heat dissipation method, which can ensure a suitable working environment for the lens light source module and provide good dust protection.

[0045] It is important to emphasize that the projection housing provides the installation space and structure for the components. The housing's cavity design serves as a mounting base for the air-cooling system that dissipates heat from the etching projection optical engine cavity. A perforated mounting hole at the top of the housing houses the imaging optical lens. The ultraviolet matrix illumination parallel light source module is located inside the housing and contains multiple ultraviolet LEDs arranged in a matrix. Parallel light is achieved through illumination optics. The current to the LEDs is controlled via a computer system signal connection, resulting in a highly uniform projection parallel light etching spot. A high-resolution LCD screen is used to image the desired etching image. This image is then projected through the imaging optical projection lens, projecting a high-resolution, high-intensity, and highly uniform etching spot onto the PCB board, achieving a high-precision etching effect.

[0046] This product uses a water-cooled heat dissipation component to dissipate heat near the high-intensity light source lamp board, ensuring the normal operating temperature of the LED to improve LED lifespan and more effectively control light decay caused by high temperature. This utility model has a simple structure, is easy to use, and realizes high-precision etching and exposure of complex circuits.

[0047] The apparatus and methods disclosed in the embodiments are described simply because they correspond to the methods disclosed in the embodiments. For relevant details, please refer to the method section.

[0048] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An exposure system for etching a PCB board using a micro / nano LCD projection optical engine, characterized in that, include: The box (1) provides the installation space and foundation for the components. The side wall of the box (1) is provided with a plurality of fan assemblies (2) for exhausting heat inside the box. The top wall of the box (1) is provided with perforations (3). Lens light source module (4), the lens light source module (4) is located inside the housing (1) and multiple ultraviolet LED beads are arranged on it. The multiple ultraviolet LED beads are respectively connected to the external computer system electrical signals and the intensity of the beads is independently controlled. LCD screen module (5), the LCD screen module (5) is located inside the housing (1) and parallel to the lens light source module (4) above it, the LCD screen module (5) is electrically connected to the computer system; Projection lens (6), the projection lens (6) is fixed on the top wall of the housing (1) corresponding to the perforation (3), and the top of the projection lens (6) is used to place the PCB board (7) to be etched; A water-cooled heat dissipation component (8) is installed close to the lens light source module (4) and is used to reduce the temperature of the lens light source module (4).

2. The exposure system for etching a micro / nano LCD projection optical engine PCB board according to claim 1, characterized in that, An air vent (9) is provided on the side wall of the housing (1) near the lens light source module (4).

3. The exposure system for etching a micro / nano LCD projection optical engine PCB board according to claim 1, characterized in that, The lens light source module (4) includes a circuit board and multiple ultraviolet LED beads. The multiple ultraviolet LED beads are arranged in a matrix and mounted on the circuit board. The multiple LED beads are independently controlled by the computer system to achieve uniformity of the surface light spot adjustment of the lens light source module (4).

4. The exposure system for etching a micro / nano LCD projection optical engine PCB board according to claim 3, characterized in that, The water-cooled heat dissipation assembly (8) includes a water-cooled heat dissipation plate (81), a coolant circulation pipe (82), a power pump (83), heat dissipation fins (84), and a base (85). The water-cooled heat dissipation plate (81) is installed at the bottom of the circuit board. The water-cooled heat dissipation plate (81) has a heat exchange medium cavity inside. The coolant circulation pipe (82) is arranged in the heat exchange medium cavity corresponding to the water-cooled heat dissipation plate (81). The coolant circulation pipe (82) extends to the outside of the box (1). The power pump (83) and the heat dissipation fins (84) are installed on the outside of the box (1) and on the coolant circulation pipe (82). The heat dissipation fins (84) and the power pump (83) are fixed on the base (85). A cooling fan (86) is installed on the base (85) and on the side close to the heat dissipation fins (84).

5. The exposure system for etching a micro / nano LCD projection optical engine PCB board according to claim 3, characterized in that, The LCD screen module (5) is fixed on the bracket (10), and the bracket (10) is fixedly connected to the inner wall of the housing (1).

6. The exposure system for etching a micro / nano LCD projection optical engine PCB board according to claim 1, characterized in that, The fan assembly (2) and the outer side of the corresponding housing (1) are provided with a fan dust cover (21).

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