Memory bank heat dissipation waistcoat

Abstract

The utility model provides a memory bank heat dissipation waistcoat which comprises a clamping groove formed by oppositely splicing a plate A and a plate B front and back, and an insertion opening is formed in the bottom of the clamping groove. Side ventilation seams are formed in the left side and the right side of the clamping groove, a top ventilation seam is formed in the top of the clamping groove, and a heat dissipation window is formed in the middle circuit area, right facing the memory bank, of the A plate. The waistcoat wraps the front side and the rear side of the memory bank through the plate A and the plate B, the human hand is prevented from making direct contact with the memory in the inserting and pulling process, heat of the memory bank is directly absorbed for heat exchange with air, and the heat dissipation efficiency of the memory bank is improved; ventilation seams are formed in the top and the two sides of the clamping groove in the waistcoat, so that airflow can conveniently penetrate through the clamping groove to take away heat of the memory bank. A heat dissipation window is formed for chips such as a PMIC in the middle of the memory bank, so that the thickness of the waistcoat can be reduced while heat dissipation is guaranteed; the heat conduction silica gel sheets are attached to the A plate and the B plate, memory particles can be protected, the heat conduction area between the waistcoat and the memory bank can be increased, and the memory bank is prevented from being separated from the waistcoat when the memory bank is pulled out.

Description

Technical Field

[0001] This utility model relates to the field of server accessory technology, specifically to a heatsink for a memory module. Background Technology

[0002] With continuous innovation in server technology, memory modules, as one of the core components of servers, have entered the DDR5 era. In servers, the capacity of a single memory module ranges from 16GB to 256GB. As the number of memory chips increases and the power of a single memory chip rises, their heat generation has become a concern for server manufacturers. Unlike desktop computers, even tower servers typically have at least four memory slots on the motherboard, and this dense arrangement makes heat dissipation for the memory modules even more difficult. Utility Model Content

[0003] To address the shortcomings of the prior art, this utility model proposes a heatsink for memory modules, which enhances the heat dissipation efficiency of memory modules and provides protection for insertion and removal of memory modules.

[0004] This utility model proposes a heat sink for memory modules, including a slot formed by assembling an A board and a B board in opposite directions, with an insertion port at the bottom of the slot;

[0005] The slot has side ventilation slits on the left and right sides and top ventilation slits on the top. The A board has a heat dissipation window facing the middle circuit area of ​​the memory module.

[0006] Preferably, thermally conductive silicone sheets are attached to the inner sides of both plates A and B near the clamping groove.

[0007] Preferably, the thermally conductive silicone pad is positioned directly opposite the memory chips on the memory module.

[0008] Preferably, a left pad is provided between the upper left corners of plates A and B, and is fixed by screws passing through the left pad;

[0009] A right pad is provided between the upper right corners of plates A and B, and is fixed by screws passing through the right pad.

[0010] Preferably, the left pad is composed of a first boss integrally connected to plate A and a second boss integrally connected to plate B, and the right pad is composed of a third boss integrally connected to plate A and a fourth boss integrally connected to plate B.

[0011] The first and third protrusions are provided with edging, and the second and fourth protrusions are provided with steps that are embedded in the edging.

[0012] Preferably, the bottom of the left pad is provided with a left pressure foot, and the bottom of the right pad is provided with a right pressure foot.

[0013] Preferably, the left side of the left pad extends downward to form a left stop edge, and the right side of the right pad extends downward to form a right stop edge;

[0014] There is a notch for the left pad between the left side and the left pressure foot, and there is a notch for the right pad between the right side and the right pressure foot.

[0015] Preferably, the upper left and upper right corners of the memory module heatsink are provided with chamfers suitable for pressing.

[0016] Preferably, heat dissipation grooves are provided on the outer sides of plates A and B.

[0017] The beneficial effects of this utility model include: the heatsink of the memory module covers the front and rear sides of the memory module with plates A and B, avoiding direct contact between the user's hands and the memory module during insertion and removal, and preventing direct contact with the memory chips to absorb heat and exchange heat with the air, thus improving the heat dissipation efficiency of the memory module; the top and sides of the slots inside the heatsink have ventilation slits, which facilitate airflow through the slots to remove heat from the memory module; heat dissipation windows are provided for chips such as the PMIC in the middle of the memory module, which can reduce the thickness of the heatsink while ensuring heat dissipation; thermally conductive silicone pads are attached to plates A and B, which can protect the memory chips, increase the heat conduction area between the heatsink and the memory module, and prevent the memory module from separating from the heatsink when it is removed. Attached Figure Description

[0018] The present invention will now be described in detail with reference to the embodiments and accompanying drawings, wherein:

[0019] Figure 1 This is a 3D view of the heatsink for the memory module of this utility model.

[0020] Figure 2 This is a structural diagram of the inner side of plate A of this utility model.

[0021] Figure 3 This is a structural diagram of the inner side of plate B of this utility model.

[0022] Figure 4 This is a schematic diagram of the server memory module structure.

[0023] Figure label:

[0024] 1-A plate, 11-First boss, 12-Third boss, 13-Side edge, 2-B plate, 21-Second boss, 22-Fourth boss, 23-Step, 3-Socket, 4-Side vent, 5-Top vent, 6-Heat dissipation window, 7-Thermal conductive silicone pad, 8-Left pad, 81-Left pressure foot, 82-Left guard edge, 83-Left pad notch, 9-Right pad, 91-Right pressure foot, 92-Right guard edge, 93-Right pad notch, 100-Central circuit area, 200-Heat dissipation groove, 300-Chamfer. Detailed Implementation

[0025] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0026] Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present invention, and does not imply that every embodiment of the present invention must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0027] The principle of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.

[0028] This utility model proposes a heat sink for a memory module, including a slot formed by assembling an A plate 1 and a B plate 2 in opposite directions. The bottom of the slot is provided with an insertion port 3. Side ventilation slots 4 are provided on the left and right sides of the slot, and top ventilation slots 5 are provided on the top of the slot. A heat dissipation window 6 is provided on the A plate 1 facing the middle circuit area 100 of the memory module.

[0029] During use, simply insert the memory module into the slot through connector 3 to complete the installation. After installation, the gold fingers are exposed outside connector 3. Most servers support hot-swapping, and their insertion and removal frequency is generally higher than that of desktop computers. The memory module heat spreader is covered by boards A1 and B2 on both sides of the memory module to prevent direct contact between the user's hands and the memory module during insertion and removal. Boards A1 and B2 are made of aluminum plates, allowing the heat spreader to directly contact the memory chips to absorb heat and exchange heat with the air, improving the heat dissipation efficiency of the memory module. Since there are ventilation slits on the top and sides of the slot, the heated air in the slot leaves through the top ventilation slit 5, and under the action of negative pressure, external air enters the slot through the side ventilation slits 4, forming air cooling channels in the gaps between the memory chips. To increase the heat dissipation area of ​​boards A1 and B2, heat dissipation grooves 200 are provided on the outer side of boards A1 and B2. In addition, heat dissipation grooves 200 can also increase the friction between the user's hands and the heat spreader when inserting and removing the memory module.

[0030] In mainstream server memory modules, the PMIC (Power Management Integrated Circuit), a purpose-specific integrated circuit mainly used for managing and controlling the power supply in electronic devices, the SPDhub (Serial Detection Hub), and some inductors are located in the upper middle area of ​​the circuit board. In this embodiment, this area is referred to as the central circuit area 100. The memory chips are located on the front and back sides of the circuit board on both sides of the central circuit area 100. The heat dissipation window 6 serves two purposes: firstly, the PMIC is generally thicker than the memory chips, and the PMIC protruding through the heat dissipation window 6 can reduce the thickness of the heat spreader, allowing for a larger heat dissipation distance between the memory modules on the server motherboard and ensuring airflow; secondly, the PMIC usually generates less heat than the memory chips, and the PMIC can directly exchange heat with the outside air through the heat dissipation window 6, without having to be attached to the A board 1 to passively absorb the heat conducted from the memory chips.

[0031] In this embodiment, thermally conductive silicone pads 7 are attached to the inner sides of plates A1 and B2 near the clamping grooves, directly facing the memory chips on the memory module. The memory chips need to handle a large number of data read and write operations, thus generating a significant amount of heat, which is the main source of heat for the memory module. The thermally conductive silicone pads 7 protect the memory chips, preventing plates A1 and B2 from scratching them during insertion and removal. Furthermore, when removing the memory, they ensure even force distribution between each memory chip and the heat spreader, preventing excessive force on a single memory chip that could loosen solder joints or cause the memory module to separate from the heat spreader during removal. One side of the thermally conductive silicone pad 7 is adhered to plate A1 or plate B2, while the other side presses against the memory chip and conducts heat to plates A1 and B2, increasing the heat dissipation area of ​​the memory chips.

[0032] In this embodiment, a left pad 8 is provided between the upper left corners of plate A1 and plate B2, and is fixed by screws passing through the left pad 8; a right pad 9 is provided between the upper right corners of plate A1 and plate B2, and is fixed by screws passing through the right pad 9. The left pad 8 is composed of a first boss 11 integrally connected to plate A1 and a second boss 21 integrally connected to plate B2, and the right pad 9 is composed of a third boss 12 integrally connected to plate A1 and a fourth boss 22 integrally connected to plate B2. The first boss 11 and the third boss 12 are provided with a surrounding edge 13, and the second boss 21 and the fourth boss 22 are provided with a step 23 embedded in the surrounding edge 13. The surrounding edge 13 and the step 23 can increase the structural stability of plate A1 and plate B2 after splicing.

[0033] In this embodiment, the bottom of the left pad 8 is provided with a left pressure foot 81, and the bottom of the right pad 9 is provided with a right pressure foot 91. The motherboard memory slots have latches at both ends. When installing a memory module with a heat spreader, regardless of where the hand presses on the top of the heat spreader, the pressure point of the memory module is always at the top left and right sides where it contacts the left and right pressure feet 81 and 91, ensuring that the gold fingers can smoothly enter the memory slot and connect with the latches.

[0034] In this embodiment, a left retaining edge 82 extends downward from the left side of the left pad 8, and a right retaining edge 92 extends downward from the right side of the right pad 9; a left pad notch 83 is provided between the left retaining edge 82 and the left pressure foot 81, and a right pad notch 93 is provided between the right retaining edge 92 and the right pressure foot 91. The memory module heatsink is suitable for server memory modules from various mainstream brands such as Samsung and Hynix. Due to the design of the left pad notch 83 and the right pad notch 93, the left pressure foot 81 and the right pressure foot 91 will not contact the top corners on the left and right sides of the memory module, avoiding damage to the circuit board at the corners of the memory module due to excessive force during memory installation.

[0035] In this embodiment, the upper left and upper right corners of the memory module heatsink are also provided with chamfers 300 degrees suitable for pressing.

[0036] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heatsink for a memory module, characterized in that, It includes a clamping groove formed by assembling A plate and B plate in opposite directions, and the bottom of the clamping groove is provided with an insertion port; The clamping groove has side ventilation slots on the left and right sides and a top ventilation slot on the top of the clamping groove. The A-plate has a heat dissipation window facing the middle circuit area of ​​the memory module.

2. The memory module heatsink as described in claim 1, characterized in that, Thermally conductive silicone sheets are attached to the inner sides of both plate A and plate B near the groove.

3. The memory module heatsink as described in claim 2, characterized in that, The thermally conductive silicone pad is positioned directly opposite the memory chips on the memory module.

4. The memory module heatsink as described in claim 3, characterized in that, A left pad is provided between the upper left corners of plate A and plate B, and is fixed by screws passing through the left pad; A right pad is provided between the upper right corners of plate A and plate B, and is fixed by screws passing through the right pad.

5. The memory module heatsink as described in claim 4, characterized in that, The left pad is composed of a first boss integrally connected to the A plate and a second boss integrally connected to the B plate, and the right pad is composed of a third boss integrally connected to the A plate and a fourth boss integrally connected to the B plate. The first boss and the third boss are provided with a surrounding edge, and the second boss and the fourth boss are provided with a step that is embedded in the surrounding edge.

6. The memory module heatsink as described in claim 5, characterized in that, The bottom of the left pad has a left pressure foot, and the bottom of the right pad has a right pressure foot.

7. The memory module heatsink as described in claim 6, characterized in that, The left side of the left pad extends downward to form a left stop edge, and the right side of the right pad extends downward to form a right stop edge. A left pad notch is provided between the left side and the left pressure foot, and a right pad notch is provided between the right side and the right pressure foot.

8. The memory module heatsink as described in claim 1, characterized in that, The memory module heatsink has chamfered corners at the upper left and upper right corners, which are suitable for pressing.

9. The memory module heatsink as described in claim 2, characterized in that, The outer sides of the A plate and the B plate are provided with heat dissipation grooves.

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