IV probe row for 0BB production

Abstract

The utility model discloses an IV probe row for 0BB production, which comprises an installation frame and a circuit board, a front installation strip and a rear installation strip are arranged on the installation frame, front connecting seats are distributed on the front installation strip along the horizontal direction, rear connecting seats are distributed on the rear installation strip along the horizontal direction, and tension springs are fixed on the front connecting seats and the rear connecting seats. A gold wire is connected between the two tension springs corresponding front and back, the circuit board is fixed to the rear end of the mounting frame, and a wire is connected between the circuit board and the rear mounting strip. The IV probe row for 0BB production mainly acts on IV detection on an 0BB silicon wafer, can effectively detect broken wafers under the combined action of the IV probe row and a silver row, elastically contacts an auxiliary grid on the silicon wafer under the action of a tightened gold wire, is novel in structure, can adjust the position of the gold wire according to the position of the auxiliary grid, reduces cost and efficiency in production of the 0BB silicon wafer, and reduces the fragment rate at the same time.

Description

Technical Field

[0001] This utility model relates to the technical field of silicon wafer production, and in particular to an IV probe array for OBB production. Background Technology

[0002] Photovoltaic silicon wafers (hereinafter referred to as silicon wafers) are the core component of solar power generation systems and also the most valuable part. The function of silicon wafers is to convert solar energy into electrical energy, which is then stored in batteries or used directly as a power source. In existing silicon wafers, the front side has main grid lines. These main grid lines can block the surface of the solar cell, affecting the cell's absorption of light and thus its power generation efficiency. In newer silicon wafers, the main grid lines on the front side are eliminated, forming OBB silicon wafers. The quality of OBB silicon wafers needs to be inspected during the production process. Utility Model Content

[0003] One objective of this invention is to provide an IV probe array for 0BB production, which is used to detect broken wafers in 0BB silicon wafers to meet the needs of subsequent production.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] An IV probe array for OBB production includes a mounting frame and a circuit board. The mounting frame has a front mounting strip and a rear mounting strip. A front connector is distributed horizontally on the front mounting strip, and a rear connector is distributed horizontally on the rear mounting strip. Tension springs are fixed on the front and rear connectors, and gold wires connect the two corresponding tension springs. The circuit board is fixed to the rear end of the mounting frame, and a wire connects the circuit board to the rear mounting strip.

[0006] As a preferred technical solution, the front mounting strip is provided with a front guide groove in the horizontal direction, and the front connecting seat slides in the front guide groove; the rear mounting strip is provided with a rear guide groove in the horizontal direction, and the rear connecting seat slides in the rear guide groove.

[0007] As a preferred technical solution, locking blocks are installed on both sides of the rear end of the mounting frame, and locking bolts are provided on the rear mounting strip. The locking bolts pass through the rear mounting strip and are threaded onto the locking blocks.

[0008] As a preferred technical solution, frame mounting holes are provided on both sides of the mounting frame.

[0009] As a preferred technical solution, the front mounting strip has front locking holes on both sides, and front screws are installed in the front locking holes and locked onto the mounting frame. The rear mounting strip has rear locking holes on both sides, and rear screws are installed in the rear locking holes and locked onto the mounting frame.

[0010] The beneficial effects of this utility model are as follows: It provides an IV probe array for 0BB production. This IV probe array for 0BB production mainly functions in IV detection on 0BB silicon wafers. Working together with the silver array, it can effectively detect broken wafers. Under the action of the taut gold wire, it makes elastic contact with the auxiliary gate on the silicon wafer. The structure is novel and the position of the gold wire can be adjusted according to the position of the auxiliary gate. While reducing costs and increasing efficiency in the production of 0BB silicon wafers, it also reduces the breakage rate. Attached Figure Description

[0011] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0012] Figure 1 This is a schematic diagram of the first structure of an IV probe array for OBB production as described in the embodiment;

[0013] Figure 2 This is a schematic diagram of the second structure of an IV probe array for OBB production as described in the embodiment;

[0014] Figure 3 This is a bottom view of an IV probe array for OBB production as described in the embodiment;

[0015] Figure 4 This is a side view of an IV probe array for OBB production as described in the embodiment.

[0016] Figures 1 to 4 middle:

[0017] 1. Mounting frame; 2. Circuit board; 3. Front mounting strip; 4. Rear mounting strip; 5. Front connector; 6. Rear connector; 7. Tension spring; 8. Gold wire; 9. Wire; 10. Front guide groove; 11. Rear guide groove; 12. Locking block; 13. Locking bolt; 14. Frame mounting hole; 15. Front locking hole; 16. Rear locking hole. Detailed Implementation

[0018] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0019] like Figures 1 to 4As shown in this embodiment, an IV probe array for OBB production includes a mounting frame 1 and a circuit board 2. The mounting frame 1 is provided with a front mounting strip 3 and a rear mounting strip 4. A front connector 5 is distributed horizontally on the front mounting strip 3, and a rear connector 6 is distributed horizontally on the rear mounting strip 4. Tension springs 7 are fixed on the front connector 5 and the rear connector 6. A gold wire 8 connects the two corresponding tension springs 7. The circuit board 2 is fixed to the rear end of the mounting frame 1, and a wire 9 connects the circuit board 2 and the rear mounting strip 4.

[0020] The two ends of the gold wire 8 are fixed to the tension spring 7 of the front connecting seat 5 and the tension spring 7 of the rear connecting seat 6, respectively. The position and distance between the front mounting strip 3 and the rear mounting strip 4 are controlled so that the tension spring 7 pulls the gold wire 8 taut. The gold wire 8 can keep taut and contact the auxiliary gate of the OBB silicon wafer. The signal is transmitted from the gold wire 8 to the wire 9 for output, thereby performing wafer breakage detection.

[0021] A front guide groove 10 is provided horizontally on the front mounting strip 3, and the front connecting seat 5 slides in the front guide groove 10. A rear guide groove 11 is provided horizontally on the rear mounting strip 4, and the rear connecting seat 6 slides in the rear guide groove 11. The positions of each front connecting seat 5 in the front guide groove 10 can be adjusted horizontally, and the positions of each rear connecting seat 6 in the corresponding rear guide groove 11 are adjusted to correspond to the positions of the front connecting seats 5, so that the gold wire 8 between the corresponding front connecting seat 5 and the rear connecting seat 6 remains straight.

[0022] Locking blocks 12 are installed on both sides of the rear end of the mounting frame 1. Locking bolts 13 are provided on the rear mounting strip 4. The locking bolts 13 pass through the rear mounting strip 4 and are threaded onto the locking blocks 12. By turning the locking bolts 13, the position of the rear mounting strip 4 on the mounting frame 1 is controlled, thereby controlling the distance between the rear mounting strip 4 and the front mounting strip 3, so that the Shudie gold wire 8 can remain taut.

[0023] The mounting frame 1 has mounting holes 14 on both sides. The entire IV probe array can be installed into the testing equipment or mechanism through the mounting holes 14 to test the OBB silicon wafers before and after docking.

[0024] Front mounting strip 3 has front locking holes 15 on both sides, and front screws are installed in the front locking holes 15. The front screws lock onto the mounting frame 1. Rear mounting strip 4 has rear locking holes 16 on both sides, and rear screws are installed in the rear locking holes 16. The rear screws lock onto the mounting frame 1. After adjusting the corresponding positions between the rear mounting strip 4 and the front mounting strip 3, tighten the front screws and rear screws to fix the front mounting strip 3 and the rear mounting strip 4 onto the mounting frame 1 to maintain the stability of the structure.

[0025] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles applied thereto. Within the scope of the technology disclosed in this utility model, any variations or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of this utility model.

Claims

1. An IV probe array for OBB production, characterized in that, The device includes a mounting frame and a circuit board. The mounting frame is provided with a front mounting strip and a rear mounting strip. A front connector is distributed horizontally on the front mounting strip, and a rear connector is distributed horizontally on the rear mounting strip. Tension springs are fixed on the front connectors and the rear connectors. A gold wire connects the two corresponding tension springs. The circuit board is fixed to the rear end of the mounting frame, and a wire connects the circuit board to the rear mounting strip.

2. The IV probe array for OBB production according to claim 1, characterized in that, The front mounting strip has a horizontally arranged front guide groove, and the front connecting seat slides in the front guide groove. The rear mounting strip has a horizontally arranged rear guide groove, and the rear connecting seat slides in the rear guide groove.

3. An IV probe array for OBB production according to claim 1, characterized in that, Locking blocks are installed on both sides of the rear end of the mounting frame, and locking bolts are provided on the rear mounting strip. The locking bolts pass through the rear mounting strip and are threaded onto the locking blocks.

4. An IV probe array for OBB production according to claim 1, characterized in that, The mounting frame has mounting holes on both sides.

5. An IV probe array for OBB production according to claim 1, characterized in that, The front mounting strip has front locking holes on both sides, and front screws are installed in the front locking holes. The front screws are locked onto the mounting frame. The rear mounting strip has rear locking holes on both sides, and rear screws are installed in the rear locking holes. The rear screws are locked onto the mounting frame.

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