Circuit substrate multilayer circuit anti-short circuit structure
By setting trenches on the circuit board to prevent conductive ink from spreading to adjacent lines, the problem of short circuits in multi-layer circuits is solved, achieving a low-cost short-circuit protection effect.
Patent Information
- Application Number
- CN202423193227.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2034-12-24
AI Technical Summary
When fabricating multilayer circuits on circuit boards using existing technologies, short circuits are easily caused by issues with line width and the fluidity of conductive ink, which is especially difficult to resolve in the case of multilayer inks.
A trench is set between adjacent conductive lines. The conductive ink spreads to the trench and extends along the sidewall of the trench. It stops at the edge of the trench by surface tension, preventing short circuits. Only the protective ink process needs to be adjusted.
It effectively prevents short circuits in multi-layer circuits, is low-cost, and requires no additional processes; it can be achieved simply by adjusting the protective ink process.
Smart Images
Figure CN223829499U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board printing technology, and in particular to a multi-layer circuit anti-short circuit structure for circuit boards. Background Technology
[0002] When creating conductive circuit patterns on circuit boards using printing methods, limitations often exist in the width and spacing of the lines. Firstly, printing precise lines often requires increasing the mesh count of the stencil; however, a higher mesh count means less ink can be applied, resulting in thinner printed lines that are insufficient for adequate conductivity. Secondly, the fluidity of the conductive ink can cause the lines to widen. When two lines are very close together, they can easily short-circuit.
[0003] The above situation is even more difficult to solve when using multi-layer inks. Utility Model Content
[0004] The technical problem to be solved by this utility model is: in order to solve the technical problems in the prior art, this utility model provides a multi-layer circuit short-circuit protection structure for circuit boards.
[0005] The technical solution adopted by this utility model to solve its technical problem is: a multi-layer circuit anti-short circuit structure for circuit substrate, including a circuit substrate, a semi-cured sheet is provided on the circuit substrate, a copper foil is provided on the semi-cured sheet, a protective ink is also provided on the semi-cured sheet, a plurality of conductive lines are provided on the protective ink, and grooves are formed on the protective ink, the grooves being located between adjacent conductive circuits.
[0006] This invention relates to a multilayer circuit board structure for preventing short circuits. By setting trenches between adjacent conductive lines, when the conductive ink of the conductive lines spreads to the trenches, the conductive ink will expand along the sidewalls of the trenches, or even stop at the edge of the trenches due to surface tension, thereby preventing short circuits. Moreover, this method does not require additional processes; only the process of the protective ink needs to be adjusted, resulting in lower costs.
[0007] Furthermore, the thickness of the protective ink is 10-30 micrometers.
[0008] Furthermore, the width of the trench is 50-300 micrometers.
[0009] Furthermore, the depth of the trench is 10-30 micrometers.
[0010] Furthermore, the thickness of the copper foil is 5-20 micrometers.
[0011] Furthermore, the trench is located at the edge of the circuit board.
[0012] The beneficial effects of this utility model are:
[0013] By setting trenches between adjacent conductive lines, when the conductive ink of the conductive lines spreads to the trench, the conductive ink will expand along the sidewall of the trench, and may even stop at the edge of the trench due to surface tension, thus preventing short circuits. Moreover, this method does not require additional processes, only adjustments to the process of the protective ink, resulting in lower costs. Attached Figure Description
[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0015] Figure 1 This is a schematic diagram illustrating the overall structure of the multi-layer circuit anti-short-circuit structure of the circuit board in this utility model.
[0016] In the diagram: 1. Circuit board; 2. Prepreg; 3. Copper foil; 4. Protective ink; 5. Conductive circuit; 6. Trench. Detailed Implementation
[0017] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.
[0018] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0019] This utility model discloses a multi-layer circuit anti-short-circuit structure for circuit boards.
[0020] Reference Figure 1 A multilayer circuit short-circuit protection structure for a circuit board includes a circuit board 1, a prepreg 2 on the circuit board 1, a copper foil 3 on the prepreg 2, a protective ink 4 on the prepreg 2, a plurality of conductive lines 5 on the protective ink 4, and grooves 6 formed on the protective ink 4, with the grooves 6 located between adjacent conductive circuits. By setting the grooves 6 between adjacent conductive lines 5, when the conductive ink of the conductive lines 5 spreads to the grooves 6, the conductive ink will expand along the sidewalls of the grooves 6, and may even stop at the edge of the grooves 6 due to surface tension, thereby preventing short circuits. Moreover, this method does not require additional processes; only the process of the protective ink 4 needs to be adjusted, resulting in low cost.
[0021] Furthermore, the thickness of the protective ink 4 is 10-30 micrometers.
[0022] Furthermore, the width of the groove 6 is 50-300 micrometers.
[0023] Furthermore, the depth of the trench 6 is 10-30 micrometers.
[0024] Furthermore, the thickness of the copper foil 3 is 5-20 micrometers.
[0025] Furthermore, the trench 6 is located at the edge of the circuit board 1, which can prevent the ink from extending toward the edge of the circuit board 1, thereby preventing the ink from extending along the sidewall of the circuit board 1 and causing a short circuit with other layers of circuits.
[0026] Working principle: By setting a groove 6 between adjacent conductive lines 5, when the conductive ink of the conductive line 5 spreads to the groove 6, the conductive ink will expand along the side wall of the groove 6, and may even stop at the edge of the groove 6 due to surface tension, thereby preventing short circuits. Moreover, this method does not require additional processes, only the process of the protective ink 4 needs to be adjusted, which is low cost.
[0027] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A multi-layer circuit short-circuit protection structure for a circuit board substrate, characterized in that, The circuit board includes a circuit board (1), a prepreg (2) is provided on the circuit board (1), a copper foil (3) is provided on the prepreg (2), a protective ink (4) is also provided on the prepreg (2), a plurality of conductive lines (5) are provided on the protective ink (4), and a groove (6) is formed on the protective ink (4), the groove (6) being located between adjacent conductive circuits.
2. The multilayer circuit short-circuit protection structure for circuit boards according to claim 1, characterized in that, The thickness of the protective ink (4) is 10-30 micrometers.
3. The multi-layer circuit short-circuit protection structure for circuit boards according to claim 1, characterized in that, The width of the groove (6) is 50-300 micrometers.
4. The multi-layer circuit short-circuit protection structure for circuit boards according to claim 3, characterized in that, The depth of the trench (6) is 10-30 micrometers.
5. The multi-layer circuit short-circuit protection structure for circuit boards as described in claim 3, characterized in that, The thickness of the copper foil (3) is 5-20 micrometers.
6. The multi-layer circuit short-circuit protection structure for circuit boards as described in claim 5, characterized in that, The groove (6) is located at the edge of the circuit board (1).