Bulk material chip mounter

Abstract

The utility model discloses a bulk material chip mounter, which relates to the technical field of chip mounters, and comprises a machine table, a chip mounter, a first material receiving station, a second material receiving station and a chip mounter, the moving structure is arranged on the machine table, the moving structure is provided with a mounting position, the moving structure can drive the mounting position to move in the first direction and the second direction, and the first direction and the second direction are arranged at a preset angle; and the mounting structure is arranged on the machine table, the mounting structure comprises a mounting head, and the mounting structure can mount the patch at the first material receiving position to the substrate at the mounting position through the mounting head. According to the technical scheme provided by the utility model, the problem that the conventional chip mounter is inconvenient for small-spacing chip mounting can be solved.

Description

Technical Field

[0001] This utility model relates to the field of chip mounter technology, and in particular to a bulk chip mounter. Background Technology

[0002] Pick and place machines are automated machines used in the electronics manufacturing industry to mount materials (surface mount components, SMDs) onto printed circuit boards (PCBs).

[0003] Existing pick-and-place machines typically have multiple placement heads that can pick up multiple materials at once and place them onto the PCB board. Since the multiple placement heads are fixed to the module, the distance between two placement heads is limited by the structure of the placement heads, which means that the spacing between two placed components cannot be minimized. In other words, it is not convenient for small-pitch placement. Utility Model Content

[0004] The main purpose of this invention is to propose a bulk material placement machine, which aims to solve the problem that existing placement machines are not convenient for small-pitch placement.

[0005] To achieve the above objectives, the bulk material placement machine proposed in this utility model includes:

[0006] The machine is equipped with a first receiving position, which is used to place the patch to be mounted.

[0007] The motion structure is disposed on the machine tool, and the motion structure has a mounting position. The motion structure can drive the mounting position to move along a first direction and a second direction, the first direction and the second direction being set at a preset angle; and

[0008] A mounting structure is provided on the machine tool. The mounting structure includes a mounting head, which enables the mounting structure to mount the patch from the first receiving position to the substrate located at the mounting position.

[0009] In one embodiment, the motion structure includes a first linear drive assembly, a second linear drive assembly, a transport assembly, and a limiting assembly. The transport assembly is mounted on the second linear drive assembly, the second linear drive assembly is mounted on the first linear drive assembly, and the mounting position is located on the transport assembly.

[0010] The first linear drive component can drive the second linear drive component to move along the first direction;

[0011] The second linear drive component can drive the transport component to move along the second direction;

[0012] The limiting component is mounted on the transport component, and the limiting component enables the substrate to remain stationary relative to the transport component.

[0013] In one embodiment, the mounting structure further includes a swing arm, a first driving member, a second driving member, and a first mounting bracket. The first driving member and the second driving member are both mounted on the first mounting bracket, the first mounting bracket is mounted on the machine base, and the mounting head is mounted on the swing arm. The first driving member is used to drive the swing arm to rise and fall, and the second driving member is used to drive the swing arm to swing.

[0014] And / or, the mounting head is configured as one;

[0015] And / or, the mounting structure can, through the mounting head, mount the patches from the first receiving position to the substrate located at the mounting position one by one.

[0016] In one embodiment, the feeding conveyor line includes a first mounting base and a first conveying assembly disposed on the first mounting base;

[0017] In one embodiment, the bulk chip mounter further includes a detection structure and a second receiving position. The second receiving position is used for placing the chip. The detection structure is capable of receiving the chip located at the second receiving position, detecting it, and transporting the chip to be mounted to the first receiving position.

[0018] In one embodiment, the detection structure includes a turret, a suction nozzle disposed on the turret, a correction position, a first detection position, a rotation position, a second detection position, and a discharge position arranged sequentially around the turret, wherein the first receiving position is disposed downstream of the discharge position;

[0019] The first detection bit is used to detect the polarity of the patch;

[0020] The second detection position is used for downward detection of the patch;

[0021] And / or, the bulk material placement machine further includes a buffer track, the first receiving position is located downstream of the buffer track and spaced apart from the buffer track, and the detection structure is capable of transporting the patch to be placed to the buffer track.

[0022] In one embodiment, the bulk chip mounter further includes a feeding structure for receiving the chip and conveying it to the second receiving position.

[0023] In one embodiment, the feeding structure includes a vibratory feeder and a direct vibratory feed channel, the direct vibratory feed channel being able to receive the patch at the outlet of the vibratory feeder and transport the patch to the second receiving position.

[0024] In one embodiment, the motion structure, mounting structure, detection structure, feeding structure, and first receiving position are configured as two sets and arranged symmetrically about the machine base.

[0025] In one embodiment, the bulk material placement machine further includes a feeding conveyor line and an output conveyor line disposed on the machine base. The feeding conveyor line is used to receive substrates input into the bulk material placement machine, and the output conveyor line is used to output substrates from the bulk material placement machine.

[0026] The motion structure is capable of receiving a substrate from the feed conveyor line and transporting it to the mounting position, as well as transporting the substrate located at the mounting position to the discharge conveyor line.

[0027] In one embodiment, the feeding conveyor line includes a first mounting base and a first conveying assembly disposed on the first mounting base;

[0028] The first conveying component is configured as a belt conveyor component;

[0029] And / or, the discharge conveyor line includes a second mounting base and a second conveying assembly disposed on the second mounting base;

[0030] The second conveying assembly is configured as a belt conveyor assembly;

[0031] And / or, the feeding conveyor line and the discharging conveyor line are arranged at intervals along a first direction, and the moving structure is located between the feeding conveyor line and the discharging conveyor line.

[0032] The technical solution of this utility model adopts a motion structure that can drive the mounting position to move along the first and second directions. When it is necessary to adjust the spacing between two adjacent patches, the mounting position can be moved by the motion structure, so that the mounting distance of the patches can be adjusted, thereby achieving small-pitch patch mounting and solving the technical problems existing in the prior art. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of a structure of an embodiment of the bulk material patching machine provided by this utility model;

[0035] Figure 2 for Figure 1 Top view;

[0036] Figure 3 for Figure 2 Enlarged view of part of the structure;

[0037] Figure 4 for Figure 1 A schematic diagram of the detection structure, feeding structure, and buffer track;

[0038] Figure 5 for Figure 1 Schematic diagram of the feed conveyor line, discharge conveyor line, and motion structure;

[0039] Figure 6 for Figure 5 Enlarged view of some of the structures in the image;

[0040] Figure 7 This is a schematic diagram of an embodiment of the mounting structure in the bulk material placement machine provided by this utility model.

[0041] Explanation of icon numbers:

[0042] 100. Machine base; 110. First receiving position;

[0043] 200. Feed conveyor line; 210. First mounting base; 220. First conveying assembly;

[0044] 300. Discharge conveyor line; 310. Second mounting base; 320. Second conveyor assembly;

[0045] 400. Motion structure; 410. Mounting position; 420. First linear drive assembly; 430. Second linear drive assembly; 440. Transport assembly;

[0046] 500, Mounting structure; 510, Mounting head; 520, Swing arm; 530, First drive component; 540, Second drive component; 550, First mounting bracket;

[0047] 600. Detection structure; 610. Turret; 620. Suction nozzle; 630. Correction position; 640. First detection position; 650. Rotation position; 660. Second detection position; 670. Discharge position;

[0048] 700, Second receiving position;

[0049] 800, cache track;

[0050] 900. Feeding structure; 910. Vibratory feeder; 920. Straight vibratory feed channel.

[0051] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0052] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0053] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0054] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0055] Pick and place machines are automated machines used in the electronics manufacturing industry to mount materials (surface mount components, SMDs) onto printed circuit boards (PCBs).

[0056] Existing pick-and-place machines typically have multiple placement heads that can pick up multiple materials at once and place them onto the PCB board. Since the multiple placement heads are fixed to the module, the distance between two placement heads is limited by the structure of the placement heads, which means that the spacing between two placed components cannot be minimized. In other words, it is not convenient for small-pitch placement.

[0057] This utility model proposes a bulk material patching machine.

[0058] Please see Figure 1 , Figure 2 In one embodiment of this utility model, the bulk material placement machine includes:

[0059] The machine tool 100 is provided with a first receiving position 110. The first receiving position 110 is used to place the patch to be mounted. It should be noted that the patch to be mounted is a fully functional patch. In some embodiments, the fully functional patch can be directly input into the machine tool 100 and placed on the first receiving position 110.

[0060] The motion structure 400 is disposed on the machine base 100. The motion structure 400 has a mounting position 410. The motion structure 400 can drive the mounting position 410 to move along a first direction and a second direction (see...). Figure 1 , Figure 2 It should be noted that the first direction and the second direction are horizontal, and the first direction and the second direction are set at a preset angle.

[0061] A mounting structure 500 is disposed on the machine tool 100. The mounting structure 500 includes a mounting head 510. The mounting structure 500 can mount the patch from the first receiving position 110 to the substrate located at the mounting position 410 through the mounting head 510. Further, in some embodiments, the mounting structure 500 also includes a driving member for driving the mounting head 510. The driving member can be a multi-axis robotic arm, and the mounting head 510 can be a suction nozzle 620. The driving member drives the mounting head 510 to move to the first receiving position 110, where the mounting head 510 picks up the patch. Then, the driving member drives the mounting head 510 to move to the mounting position 410, where the mounting head 510 mounts the patch at a preset position. Furthermore, this embodiment employs a motion structure 400, which can drive the mounting position 410 to move along the first and second directions. When it is necessary to adjust the spacing between two adjacent patches, the motion structure 400 can be used to move the mounting position 410, thereby adjusting the mounting distance of the patches and enabling small-pitch patch installation, thus solving the technical problems existing in the prior art.

[0062] Furthermore, in some embodiments, the mounting structure 500 can mount the patch from the first receiving position 110 to the substrate located at the mounting position 410 via the mounting head 510. By mounting the patches one by one onto the substrate, when one patch is mounted, the motion structure 400 moves the mounting position 410 to adjust the mounting position of the next patch, thereby enabling small-pitch patch mounting and solving the technical problems existing in the prior art.

[0063] It should be noted that in some embodiments, the mounting head 510 can be set to two or more. When there are two mounting heads 510, the two mounting heads 510 can simultaneously adsorb two patches, and the two patches are mounted one by one.

[0064] In one embodiment, reference Figure 2, Figure 5 , Figure 6 The motion structure 400 includes a first linear drive component 420, a second linear drive component 430, a transport component 440, and a limiting component. The transport component 440 is mounted on the second linear drive component 430, and the second linear drive component 430 is mounted on the first linear drive component 420. The mounting position 410 is located on the transport component 440. The first linear drive component 420 can drive the second linear drive component 430 to move along a first direction. The second linear drive component 430 can drive the transport component 440 to move along a second direction. Further, in some embodiments, the first linear drive component 420 is configured as a motor guide rail slider module, and the second linear drive component 430 is also configured as a motor guide rail slider module, wherein the motor can drive the slider to move on the guide rail. Further, the slider in the first linear drive component 420 can drive the guide rail in the second linear drive component 430 to move along the first direction, and the slider in the second linear drive component 430 can drive the transport component 440 to move along the second direction. Further, the transport assembly 440 is configured as a belt conveyor assembly, which includes a second mounting frame, a drive shaft, a driven shaft, and a belt. The drive shaft and driven shaft are mounted on the second mounting frame, and the belt connects the drive shaft and driven shaft. The belt is used to support the substrate, and rotation of the drive shaft can drive the belt to rotate, which in turn can move the substrate. It should be noted that the belt remains stationary during substrate mounting. Further, a limiting assembly is mounted on the transport assembly 440, which can keep the substrate stationary relative to the transport assembly. Further, in some embodiments, the limiting assembly can adopt the following structure, wherein the limiting assembly includes a linear motor drive assembly, which can drive a push plate to rise and fall, thereby lifting the substrate. Further, in some embodiments, the linear motor drive assembly can be replaced by a cylinder assembly. In some embodiments, a negative pressure suction hole can be provided on the push plate, which can then attract the substrate and confine it to the push plate. Further, when the transport assembly 440 is configured as a belt transport assembly, the limiting assembly is mounted on the second mounting frame, that is, the linear motor drive assembly is mounted on the second mounting frame. Furthermore, in some embodiments, the limiting component can also be a transport component. In this case, the transport component is configured as a belt conveyor component, and the belt conveyor component has the function of adjusting the width. When the substrate is located in the belt conveyor component, the belt conveyor component can reduce the transport distance and clamp the substrate through the belt conveyor component. That is, the transport distance of the belt conveyor component is narrowed so that the belt conveyor component can hold the substrate, thereby making the substrate stationary relative to the transport component.

[0065] Furthermore, in some embodiments, the limiting component includes a support column, which is mounted on the transport component, wherein the transport component is configured as a belt conveyor component. Specifically, the belt conveyor component has a lifting function. When the substrate is located on the belt conveyor component, the belt conveyor component can drive the substrate to descend. At this time, the support column can support the substrate, allowing the substrate to temporarily leave the belt conveyor component, thus keeping the substrate stationary relative to the transport component. Furthermore, in some embodiments, in order to enable the support column to better support the substrate, negative pressure suction holes can be provided on the surface of the support column that contacts the substrate, thereby better confining the substrate to the support column.

[0066] In one embodiment, reference Figure 7 The mounting structure 500 further includes a swing arm 520, a first drive member 530, a second drive member 540, and a first mounting bracket 550. The first drive member 530 and the second drive member 540 are both mounted on the first mounting bracket 550, which is mounted on the machine base 100. The mounting head 510 is mounted on the swing arm 520. The first drive member 530 drives the swing arm 520 to rise and fall, and the second drive member 540 drives the swing arm 520 to swing. Further, in a... In some embodiments, the mounting structure 500 further includes a transmission assembly, which may be a spline shaft and a spline sleeve. In this case, the first drive member 530 can drive the swing arm 520 to rise and fall via the transmission assembly, and the second drive member 540 can drive the swing arm 520 to rotate via the transmission assembly. Further, in some embodiments, the swing arm 520 can be mounted on the spline sleeve. In this case, the first drive member 530 is drivenly connected to the spline sleeve, allowing the spline sleeve to rotate relative to the first drive member 530. The second drive member 540 is drivenly connected to the spline shaft. Further, the first drive member 530 is configured as a lifting motor, and the second drive member 540 is configured as a rotating motor.

[0067] In one embodiment, reference Figure 7 The mounting head 510 is configured as a single unit, that is, the nozzle 620 is configured as a single unit. This simplifies the mounting structure 500 and reduces the load on the swing arm 520, allowing the swing arm 520 to rotate faster, thereby increasing the mounting speed.

[0068] In one embodiment, reference Figure 1 , Figure 2 , Figure 3The bulk component placement machine also includes a detection structure 600 and a second receiving position 700. The second receiving position 700 is used for placing components. The detection structure 600 can receive the components located at the second receiving position 700, detect them, and transport the components to be placed to the first receiving position 110. It should be noted that in this embodiment, the components input into the bulk component placement machine can be functional components or non-functional components. In this case, the detection structure 600 can screen out the non-functional components and transport the functional components to the first receiving position 110.

[0069] Furthermore, in some embodiments, reference is made to... Figure 4 The bulk chip mounter also includes a buffer track 800. The first receiving position 110 is located downstream of the buffer track 800 and is spaced apart from it. It should be noted that the distance between the first receiving position 110 and the buffer track 800 is small. When the chip moves along the buffer track 800, it can smoothly pass through this distance and enter the first receiving position 110. The detection structure 600 can transport the chip to be mounted to the buffer track 800. After the detection structure 600 transports the chip to be mounted to the buffer track 800, the chips buffered in the buffer track 800 are functional chips. It can be understood that when the detection structure 600 continuously detects multiple defective chips and filters them out, since the buffer track 800 has a large number of functional chips, the buffer track 800 can ensure that the first receiving position 110 continuously has functional chips, which facilitates the mounting structure 500 to mount the chips. Furthermore, in some embodiments, the buffer track 800 may be simply a channel. In this case, the channel is tilted, with the first receiving position 110 at a lower position and the detection structure 600 at a higher position. When the patch in the first receiving position 110 is removed, the patch in the buffer track 800 can move towards the first receiving position 110 due to the tilt of the channel, thereby replenishing the first receiving position 110. In some embodiments, the buffer track 800 may be horizontally placed. In this case, a vertical vibration structure is provided below the buffer track 800. Vibration causes the material to move along the buffer track 800. When the material in the first receiving position 110 is removed, the buffer track 800 can replenish the patch to the first receiving position 110. Since the first receiving position 110 and the buffer track 800 are spaced apart, the first receiving position 110 is not affected when the buffer track 800 vibrates to feed the material.

[0070] In one embodiment, reference Figure 3The detection structure 600 includes a turret 610, a suction nozzle 620 disposed on the turret 610, a correction position 630, a first detection position 640, a rotation position 650, a second detection position 660, and a ejection position 670 arranged sequentially around the turret 610. The first receiving position 110 is disposed downstream of the ejection position 670. The first detection position 640 is used for polarity detection of the patch. The second detection position 660 is used for downward-looking detection of the patch. Further, in some embodiments, the detection structure 600 also includes an automatic optical inspection system, a laser triangulation sensor, an X-ray inspection device, a programming verification interface, and other structures to perform polarity detection and downward-looking detection of the patch. The polarity detection is mainly to ensure that the circuit works correctly, and the downward-looking detection is mainly to detect whether the bottom pins and appearance of the patch are normal. Furthermore, in some embodiments, the detection structure 600 further includes a correction component and a rotation component, wherein the correction component is set corresponding to the correction position 630 and the rotation component is set corresponding to the rotation position 650. The correction component can correct the position of the patch so as to facilitate polarity detection of the patch. That is, the correction component can position the patch before polarity detection. The rotation component can rotate the patch, wherein the rotation component rotates the patch horizontally so that the patch enters the buffer track 800 in the correct state.

[0071] In one embodiment, reference Figure 1 , Figure 4 The bulk chip mounter further includes a feeding structure 900, which receives the chips and transports them to the second receiving position 700. In one embodiment, the feeding structure 900 includes a vibratory feeder 910 and a direct vibration channel 920. The direct vibration channel 920 receives the chips from the outlet of the vibratory feeder 910 and transports them to the second receiving position 700. It should be noted that the vibratory feeder 910 can store a certain amount of bulk chips and transport them to the direct vibration channel 920. Furthermore, in some embodiments, the vibrating conveyor belt can transport the patch to the second receiving position 700. At this time, the suction nozzle 620 in the detection component can remove the patch located in the second receiving position 700. Then, the turret 610 drives the suction nozzle 620 to rotate. At this time, the patch can be positioned, polarity detected, angle rotated, and downward-looking detected in sequence. The material with complete functions enters the buffer track 800, and the material with incomplete functions is thrown out. Furthermore, in some embodiments, the machine 100 is also provided with a waste frame for receiving waste. In some embodiments, the feeding structure 900 can also be a roll feeding method, wherein the roll contains multiple patches, and the multiple patches are sequentially fed into the second receiving position 700. The turret 610 in the detection structure 600 drives the suction nozzle 620 to remove the patches from the roll.

[0072] In one embodiment, reference Figure 1 , Figure 2 The motion structure 400, placement structure 500, detection structure 600, feeding structure 900, and first receiving position 110 are configured in two sets and symmetrically arranged about the machine base 100. This allows the bulk material placement machine to achieve higher efficiency during placement. In other words, when one swing arm 520 picks up material, the other swing arm 520 can perform the placement action; this alternation improves the placement efficiency of the bulk material placement machine.

[0073] In one embodiment, the bulk component placement machine further includes an infeed conveyor line 200 and an outfeed conveyor line 300, wherein the infeed conveyor line 200 and the outfeed conveyor line 300 are disposed on the machine base 100. The infeed conveyor line 200 is used to receive substrates input into the bulk component placement machine, and the outfeed conveyor line 300 is used to output substrates from the bulk component placement machine. It should be noted that the substrate enters the bulk component placement machine via the infeed conveyor line 200, the bulk component placement machine mounts the components onto the substrate, and after mounting is completed, the outfeed conveyor line 300 outputs the mounted substrate from the bulk component placement machine. Of course, in some embodiments, when the bulk component placement machine needs maintenance or other conditions, the outfeed conveyor line 300 can also output substrates without mounted components from the bulk component placement machine. Similarly, substrates that need to be reworked after mounting can also be re-input into the bulk component placement machine via the infeed conveyor line 200 for continued mounting processing.

[0074] The motion structure 400 is capable of receiving the substrate in the feed conveyor line 200 and transporting it to the mounting position 410, and transporting the substrate located at the mounting position 410 to the discharge conveyor line 300.

[0075] It is understood that in some embodiments, the feed conveyor line 200 and the discharge conveyor line 300 are arranged at intervals and along the first direction. In this case, the motion structure 400 is arranged between the feed conveyor line 200 and the discharge conveyor line 300. When the motion structure 400 drives the mounting position 410 to move along the first direction, the mounting position 410 can approach the feed conveyor line 200 or the discharge conveyor line 300, so that the motion structure 400 can receive the substrate in the feed conveyor line 200 and transport it to the mounting position 410, and transport the substrate located at the mounting position 410 to the discharge conveyor line 300.

[0076] In one embodiment, reference Figure 5 The feeding conveyor line 200 includes a first mounting base 210 and a first conveying component 220 disposed on the first mounting base 210; the first conveying component 220 is configured as a belt conveyor component, and further, the first conveying component 220 can refer to the above-mentioned belt conveyor component.

[0077] In one embodiment, reference Figure 5 The discharge conveyor line 300 includes a second mounting base 310 and a second conveying assembly 320 disposed on the second mounting base 310; the second conveying assembly 320 is configured as a belt conveyor assembly, and further, the second conveying assembly 320 can refer to the belt conveyor assembly described above.

[0078] In one embodiment, reference Figure 2 The feeding conveyor line 200 and the discharging conveyor line 300 are spaced apart along a first direction. The moving structure 400 is located between the feeding conveyor line 200 and the discharging conveyor line 300. When the moving structure 400 drives the mounting position 410 to move along the first direction, the mounting position 410 can approach the feeding conveyor line 200 or the discharging conveyor line 300. This allows the moving structure 400 to easily receive the substrate in the feeding conveyor line 200 and easily transport the substrate on the mounting position 410 to the discharging conveyor line 300.

[0079] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A bulk material placement machine, characterized in that, include: The machine is equipped with a first receiving position, which is used to place the patch to be mounted. A motion structure, disposed on the machine tool, is provided with a mounting position. The motion structure can drive the mounting position to move along a first direction and a second direction, the first direction and the second direction being set at a preset angle; and A mounting structure is provided on the machine tool. The mounting structure includes a mounting head, which enables the mounting structure to mount the patch from the first receiving position to the substrate located at the mounting position.

2. The bulk material placement machine as described in claim 1, characterized in that, The motion structure includes a first linear drive assembly, a second linear drive assembly, a transport assembly, and a limiting assembly. The transport assembly is mounted on the second linear drive assembly, the second linear drive assembly is mounted on the first linear drive assembly, and the mounting position is located on the transport assembly. The first linear drive component can drive the second linear drive component to move along the first direction; The second linear drive component can drive the transport component to move along the second direction; The limiting component is mounted on the transport component, and the limiting component enables the substrate to remain stationary relative to the transport component.

3. The bulk material placement machine as described in claim 1, characterized in that, The mounting structure further includes a swing arm, a first driving component, a second driving component, and a first mounting bracket. The first driving component and the second driving component are both mounted on the first mounting bracket. The first mounting bracket is mounted on the machine base. The mounting head is mounted on the swing arm. The first driving component is used to drive the swing arm to lift and lower, and the second driving component is used to drive the swing arm to swing. And / or, the mounting head is configured as one; And / or, the mounting structure can, through the mounting head, mount the patches from the first receiving position to the substrate located at the mounting position one by one.

4. The bulk material placement machine as described in claim 1, characterized in that, The bulk chip mounter also includes a detection structure and a second receiving position. The second receiving position is used for placing the chip. The detection structure can receive the chip located at the second receiving position, detect it, and transport the chip to be mounted to the first receiving position.

5. The bulk material placement machine as described in claim 4, characterized in that, The detection structure includes a turret, a suction nozzle disposed on the turret, a correction position, a first detection position, a rotation position, a second detection position, and a discharge position arranged sequentially around the turret, wherein the first receiving position is disposed downstream of the discharge position; The first detection bit is used to detect the polarity of the patch; The second detection position is used for downward detection of the patch; And / or, the bulk material placement machine further includes a buffer track, the first receiving position is located downstream of the buffer track and spaced apart from the buffer track, and the detection structure is capable of transporting the patch to be placed to the buffer track.

6. The bulk material placement machine as described in claim 4, characterized in that, The bulk chip mounter also includes a feeding structure for receiving the chip and conveying it to the second receiving position.

7. The bulk material placement machine as described in claim 6, characterized in that, The feeding structure includes a vibratory feeder and a direct vibratory feed channel. The direct vibratory feed channel can receive the patch at the outlet of the vibratory feeder and transport the patch to the second receiving position.

8. The bulk material placement machine as described in claim 6, characterized in that, The motion structure, mounting structure, detection structure, feeding structure, and first receiving position are configured in two groups and arranged symmetrically about the machine platform.

9. The bulk material placement machine as described in claim 1, characterized in that, The bulk material placement machine also includes a feeding conveyor line and an output conveyor line provided on the machine base. The feeding conveyor line is used to receive substrates input into the bulk material placement machine, and the output conveyor line is used to output substrates from the bulk material placement machine. The motion structure is capable of receiving a substrate from the feed conveyor line and transporting it to the mounting position, as well as transporting the substrate located at the mounting position to the discharge conveyor line.

10. The bulk material placement machine as described in claim 9, characterized in that, The feeding conveyor line includes a first mounting base and a first conveying component disposed on the first mounting base; The first conveying component is configured as a belt conveyor component; And / or, the discharge conveyor line includes a second mounting base and a second conveying assembly disposed on the second mounting base; The second conveying assembly is configured as a belt conveyor assembly; And / or, the feeding conveyor line and the discharging conveyor line are arranged at intervals along a first direction, and the moving structure is located between the feeding conveyor line and the discharging conveyor line.

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