Cabinet and liquid cooling system

Abstract

The utility model provides a cabinet and a liquid cooling system, the cabinet comprises a cabinet body, a server and a first filling member, the server is arranged in the cabinet body, both the cabinet body and the server are filled with a cooling liquid, and an inner cavity of the server comprises a heating area provided with a heating member and a non-heating area not provided with a heating member; the first filling piece is arranged on at least part of the non-heating area so as to occupy the filling space of the cooling liquid and guide the cooling liquid to the heating area. The first filling piece is arranged in at least part of the non-heating area and can occupy the filling space of the cooling liquid, so that when the cooling liquid circularly flows to dissipate heat of the heating pieces of the server, the flow of the cooling liquid flowing through the heating pieces located in the heating area can be increased, the convective heat exchange capacity of the heating pieces located in the heating area is improved, and the service life of the server is prolonged. Therefore, the heat dissipation effect of the heating element in the heating area is improved. In addition, the first filling piece occupying the cooling liquid filling space is arranged, the use amount of the cooling liquid is reduced, and therefore the immersion cost of the cooling liquid is reduced.

Description

Technical Field

[0001] This application relates to the field of liquid cooling system technology, specifically to a cabinet and a liquid cooling system. Background Technology

[0002] As the performance of electronic devices continues to improve, their heat dissipation requirements are also increasing. Liquid cooling technology, as a highly efficient heat dissipation method, has been widely used in the heat dissipation of high-performance electronic devices. However, in conventional liquid cooling structures, servers consist of a heat-generating zone containing heat-generating components and a non-heat-generating zone. Typically, the flow resistance of the coolant in the non-heat-generating zone is lower than that in the heat-generating zone. Therefore, most of the coolant flows through the low-resistance non-heat-generating zone, resulting in insufficient convective heat transfer in the heat-generating zone, and consequently, poor heat dissipation of the heat-generating components located there. Utility Model Content

[0003] In view of this, this application provides a server rack that at least solves the problem of poor heat dissipation of heat-generating components in the heat-generating area of ​​the server. This application also provides a liquid cooling system including the aforementioned server rack.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] A server rack, comprising:

[0006] Cabinet;

[0007] The server is housed in the cabinet, and both the cabinet and the server are filled with coolant. The server's internal cavity includes a heating area with heating elements and a non-heating area without heating elements.

[0008] A first filler is disposed at least partially in the non-heating area to occupy the filling space of the coolant and guide the coolant to the heating area.

[0009] By placing the first filler in at least a portion of the non-heating area, and by having the first filler occupy the filling space of the coolant, the flow rate of the coolant through the heat-generating components in the heat-generating area can be increased when the coolant circulates to dissipate heat from the heat-generating components of the server. This enhances the convective heat transfer capacity of the heat-generating components in the heat-generating area, thereby improving the heat dissipation effect of the heat-generating components in the heat-generating area.

[0010] Optionally, the cabinet may also include a second filler disposed between the cabinet and the server.

[0011] By adding a second filler, the gap between the cabinet and the server can be sealed, thereby reducing the flow of coolant between the cabinet and the server and improving the cooling efficiency of the coolant for the heat-generating components inside the server.

[0012] Optionally, a partition plate is provided between the server and the wall of the cabinet to divide the inner cavity of the cabinet into a first cavity and a second cavity, wherein the second cavity is a closed cavity in which coolant is not allowed to enter.

[0013] By setting a partition between the server and the cabinet wall to divide the internal cavity of the cabinet, a first cavity and a second cavity are formed. The partition can prevent the coolant in the first cavity from flowing through the partition to the second cavity, further reducing the amount of coolant flowing between the cabinet and the server, and further improving the cooling efficiency of the coolant on the heat-generating components located in the server.

[0014] Optionally, the first cavity is filled with a second filler.

[0015] Since it is impossible to guarantee that the first cavity is a sealed cavity, the coolant will flow into the first cavity. By placing the second filler in the first cavity, the flow of coolant outside the server in the first cavity can be reduced, thereby improving the cooling efficiency of the coolant on the heat-generating components located inside the server.

[0016] Optionally, multiple servers are provided, and the server rack includes:

[0017] Main inlet pipe;

[0018] Multiple branch inlet pipes are provided, with one end of each branch inlet pipe connected to the main inlet pipe, and the other end of all branch inlet pipes connected one-to-one to the server.

[0019] By setting up a main inlet pipe and branch inlet pipes to direct the coolant to different servers, the heat-generating components of different servers can be cooled, thus achieving the effect of coolant diversion.

[0020] Optionally, the branch inlet pipe includes a constant diameter section connected to the main inlet pipe, and a gradually expanding section with one end connected to the constant diameter section and the other end connected to the server.

[0021] By setting a constant diameter section, the coolant in the main inlet pipe is evenly distributed. By setting a gradually expanding section, the coolant flowing to the constant diameter section is evenly distributed to different parts of the server, thus ensuring that the coolant flows evenly to different parts of the server.

[0022] Optionally, the top of the cabinet has an outlet for coolant to flow out, and the bottom of the cabinet has an inlet for coolant to flow in, and the inlet is connected to the main inlet pipe.

[0023] By placing the coolant outlet at the top of the cabinet and the coolant inlet at the bottom, the coolant enters the lower part of the server from the bottom of the cabinet under pressure, then flows upward and exits from the outlet at the top of the cabinet. This improves the cooling efficiency of the coolant on the server's heat-generating components.

[0024] A liquid cooling system includes a heat dissipation device and a cabinet as described in any of the above claims.

[0025] The heat dissipation device is used to dissipate heat from the coolant flowing out of the cabinet outlet, and to allow the cooled coolant to flow back into the cabinet through the inlet.

[0026] Optionally, the heat dissipation device includes:

[0027] A connecting pipe, with its two ends connected to the liquid inlet of the cabinet and the liquid outlet of the cabinet, respectively;

[0028] A heat dissipation component is disposed on the connecting pipe for cooling the coolant flowing through the connecting pipe;

[0029] The pump is mounted on the connecting pipe.

[0030] By incorporating heat sinks to cool the coolant flowing out of the cabinet and by installing pumps to pressurize the coolant and make it flow through the server more quickly, the cooling efficiency of the coolant on the server is improved.

[0031] Optionally, the rack may also include:

[0032] Temperature sensing components are used to monitor the temperature of heat-generating components inside the server in real time.

[0033] The controller is communicatively connected to the temperature sensor, the heat dissipation assembly, and the pump, and can adjust the power of the heat dissipation assembly and / or the pump according to the temperature detected by the temperature sensor.

[0034] By setting up temperature sensors to monitor the temperature of heat-generating components within the server in real time, if the temperature of a heat-generating component is higher than the target temperature, the power of the heat dissipation components and / or pumps is increased to improve the cooling efficiency of the coolant; if the temperature of a heat-generating component is lower than the target temperature, the power of the heat dissipation components and / or pumps is reduced to decrease the cooling efficiency of the coolant. This configuration enables intelligent adjustment of the temperature of heat-generating components to keep them within the target range.

[0035] The cabinet provided in this application, by setting the first filling element in at least a part of the non-heating area, and the first filling element occupies the filling space of the coolant, can increase the flow of coolant through the heat-generating components in the heat-generating area when the coolant circulates to dissipate heat from the heat-generating components of the server, thereby improving the convective heat transfer capacity of the heat-generating components in the heat-generating area and thus improving the heat dissipation effect of the heat-generating components in the heat-generating area.

[0036] Furthermore, by incorporating a first filler component that occupies the coolant filling space, the space required for coolant flow is reduced. This decreases the total amount of coolant needed to circulate within the cabinet and server, thereby reducing coolant usage and lowering coolant immersion costs. Moreover, the reduced total coolant flow volume also reduces the driving pressure of the pump that drives the coolant flow. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the cabinet structure provided in this embodiment;

[0039] Figure 2 for Figure 1 Cross-sectional view at point AA;

[0040] Figure 3 for Figure 1 Cross-sectional view at point BB;

[0041] Figure 4 This is a cross-sectional view of the server;

[0042] Figure 5 This is a structural diagram of the server rack and heat dissipation system.

[0043] Figure 6 This is a schematic diagram of the temperature control structure.

[0044] Figures 1-6 middle:

[0045] 1-Server rack, 2-Heat dissipation device;

[0046] 11-Cabinet, 12-Server, 13-First filling component, 14-Second filling component, 15-Divider plate, 16-Main liquid inlet pipe, 17-Sub-liquid inlet pipe, 18-Liquid outlet, 19-Liquid inlet, 21-Connecting pipe, 22-Heat dissipation component, 23-Pump;

[0047] 111-First cavity, 112-Second cavity, 121-Heating element, 122-Heating area, 123-Non-heating area, 171-Equal diameter section, 172-Gradually expanding section, 221-Fan, 222-Heat dissipation channel. Detailed Implementation

[0048] This application provides a server rack. This application also provides a liquid cooling system including the aforementioned server rack.

[0049] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] like Figures 1-4 As shown, this application embodiment provides a cabinet 1, which can be various types of electronic devices capable of generating heat. The cabinet 1 mainly includes a cabinet body 11, a server 12, and a first filling component 13. The cabinet body 11 is the shell of the cabinet 1, providing an installation position for the server 12. Typically, the cabinet body 11 and the server 12 are detachably connected. The server 12 is disposed inside the cabinet body 11. Both the cabinet body 11 and the server 12 are filled with coolant. The internal cavity of the server 12 includes a heat-generating area 122 where a heat-generating component 121 is disposed and a non-heat-generating area 123 where no heat-generating component 121 is disposed. The heat-generating component 121 refers to a component capable of generating heat and requiring cooling. The server 12 includes a shell and a CPU located inside the shell. The heat-generating component 121 of the server 12 typically refers to the CPU, the corresponding heat-generating area 122 refers to the area where the CPU is disposed, and the non-heat-generating area 123 refers to the area where no CPU is disposed.

[0051] Specifically, the first filler 13 is disposed at least partially in the non-heating area 123 to occupy the filling space of the coolant and guide the coolant to the heating area 122. Thus, when the coolant flows through the server 12, because the non-heating area 123 is equipped with the first filler 13, compared to a solution without the first filler 13, more coolant can flow to the heating area 122 where the heating element 121 is located on the server 12, thereby enabling the coolant to efficiently cool the heating element 121. Furthermore, when the non-heating area 123 is not equipped with the first filler 13, the flow resistance of the coolant in the non-heating area 123 is lower, and more coolant flowing to the server 12 flows to the non-heating area 123 with lower flow resistance. This results in poor heat dissipation efficiency for the heating element 121 located in the heating area 122. Therefore, by providing the first filler 13 in the non-heating area 123, the coolant can be guided to the heating area 122, thereby improving the heat dissipation efficiency for the heating element 121. In other words, by setting the first filler 13, the flow resistance of the coolant in the non-heating area 123 can be increased or even prevented from flowing in the non-heating area 123, thereby greatly improving the heat dissipation efficiency of the coolant on the heat-generating component 121.

[0052] It should be noted that the first filling block can be a solid block or a hollow block, and the shape of the first filling block can be flexibly set according to the shape of the non-heating area 123.

[0053] Furthermore, the first filler 13 is disposed in all non-heating areas 123, so that all the coolant entering the server 12 flows to the heat-generating element 121 located in the heat-generating area 122, thereby further improving the cooling effect on the heat-generating element 121.

[0054] For example, the coolant can be a fluorinated fluid, such as Freon.

[0055] The cabinet 1 with the above-described structure, by placing the first filler 13 in at least a portion of the non-heating area 123, and by occupying the coolant filling space, increases the flow rate of coolant through the heat-generating components 121 in the heat-generating area 122 when the coolant circulates to dissipate heat from the heat-generating components 121 of the server 12. This enhances the convective heat transfer capacity of the heat-generating components 121 in the heat-generating area 122, thereby improving the heat dissipation effect of the heat-generating components 121 in the heat-generating area 122. Furthermore, by placing the first filler 13, which occupies the coolant filling space, the space for coolant flow is reduced, thereby reducing the total amount of coolant that needs to circulate within the cabinet 11 and the server 12, reducing coolant usage, and thus lowering coolant immersion costs. Further, because the total amount of coolant flowing is reduced, the driving pressure of the pump 23 that drives the coolant flow can be reduced.

[0056] In some embodiments, please refer to Figure 4 The rack 1 also includes a second filler 14 disposed between the rack 11 and the server 12. Normally, the server 12 is detachably connected to the rack 11 by bolts. Since a gap inevitably exists between the server 12 and the rack 11, and coolant flows within the rack 11, filling the gap between the server 12 and the rack 11 with the second filler 14, which occupies space previously used for coolant filling, reduces the amount of coolant flowing within the rack 11. This allows a larger proportion of coolant to be filled into the server 12, as the heat-generating components 121 within the server 12 are the primary heat source. This arrangement enables the coolant to cool the heat-generating components 121 of the server 12 more efficiently, thereby improving the cooling efficiency of the heat-generating components 121. Furthermore, reducing the total amount of coolant filling the rack 11 and the server 12 effectively reduces coolant usage, lowers the driving power of the pump 23 that drives the coolant flow, and saves energy.

[0057] In some embodiments, please refer to Figure 3A partition plate 15 is installed between the server 12 and the wall of the cabinet 11 to divide the inner cavity of the cabinet 11 into a first cavity 111 and a second cavity 112. The second cavity 112 is a closed cavity that prevents coolant from entering. Since the server 12 and the cabinet 11 are normally detachably connected by bolts, and both the cabinet 11 and the server 12 are filled with coolant, the coolant in the cabinet 11 and the server 12 cannot effectively cool the heat-generating component 121 of the server 12. By setting up the partition plate 15, the coolant in the first cavity 111 is prevented from flowing into the second cavity 112. This setting further reduces the amount of coolant remaining between the cabinet 11 and the server 12, further reduces the amount of coolant in the cabinet 11 and the server 12, thereby further improving the heat dissipation efficiency of the heat-generating component 121 and further reducing the driving power of the pump 23.

[0058] In some embodiments, please refer to Figure 3 The first cavity 111 is filled with a second filler 14. One of the first cavity 111 and the second cavity 112 needs to be provided with a coolant outlet 18. Taking the example of setting the outlet 18 on the first cavity 111, since the setting of the outlet 18 cannot guarantee that the first cavity 111 is a sealed cavity, the coolant will flow into the first cavity 111 during the process of flowing out of the outlet 18. By setting the second filler 14 in the first cavity 111, the flow rate of coolant in the first cavity 111 can be reduced, the proportion of coolant in the server 12 can be increased, thereby improving the cooling efficiency of the coolant on the heat-generating components 121 located in the server 12.

[0059] In some embodiments, please refer to Figure 2 and Figure 3 Multiple servers 12 are provided, and the cabinet 1 includes a main inlet pipe 16 and branch inlet pipes 17. The main inlet pipe 16 is connected to an inlet port 19 on the cabinet 11 to introduce coolant into the server 12. Multiple branch inlet pipes 17 are provided, with one end of each branch inlet pipe 17 connected to the main inlet pipe 16, and the other end of all branch inlet pipes 17 connected one-to-one with a server 12. That is, each branch inlet pipe 17 is paired with a server 12 to evenly distribute the coolant flowing from the main inlet pipe 16 to its corresponding server 12. By setting up the main inlet pipe 16 and branch inlet pipes 17 to direct the coolant to different servers 12, cooling the heat-generating components 121 of different servers 12 is achieved, thus realizing the effect of coolant distribution.

[0060] It should be noted that the diameter of the inlet pipe 17 is not limited here; the diameter of the inlet pipe 17 can be the same or different. For example, if the heat-generating components 121 of some servers 12 generate a large amount of heat, the diameter of the inlet pipe 17 connected to the server 12 with the large heat generation will be increased; if the heat-generating components 121 of some servers 12 generate a small amount of heat, the diameter of the inlet pipe 17 connected to the server 12 with the small heat generation will be decreased; of course, if the heat generation of the heat-generating components 121 of all servers 12 is the same, the diameter of all inlet pipes 17 can be set to be the same.

[0061] In some embodiments, please refer to Figure 3 The coolant inlet pipe 17 includes a constant-diameter section 171 connected to the main coolant inlet pipe 16, and a gradually expanding section 172 connected at one end to the constant-diameter section 171 and at the other end to the server 12. The coolant in the main coolant inlet pipe 16 flows through the constant-diameter section 171 to the gradually expanding section 172, and then from the gradually expanding section 172 to the corresponding server 12, thus achieving coolant distribution. The constant-diameter section 171 ensures uniform distribution of coolant within the main coolant inlet pipe 16, while the gradually expanding section 172 ensures that the coolant flowing to the constant-diameter section 171 flows evenly to different locations on the server 12. This ensures uniform coolant flow to different parts of the server 12, preventing uneven heat dissipation at different locations of the heat-generating components 121 and improving the uniformity of heat dissipation for the heat-generating components 121.

[0062] In addition, the liquid inlet pipe 17 can also be configured in other ways. For example, the liquid inlet pipe 17 may only include a constant diameter section 171 without a gradually expanding section 172, and the constant diameter section 171 may directly and evenly guide the coolant to various parts of the server 12; or the liquid inlet pipe 17 may only include a gradually expanding section 172 without a constant diameter section 171, and the gradually expanding section 172 may directly and evenly guide the coolant to different parts of the server 12.

[0063] In some embodiments, please refer to Figure 1 and Figure 2 The cabinet 11 has an outlet 18 at the top for coolant to flow out and an inlet 19 at the bottom for coolant to flow in, and the inlet 19 is connected to the main inlet pipe 16. By placing the outlet 18 at the top of the cabinet 11 and the inlet 19 at the bottom of the cabinet 11, the coolant enters the bottom of the server 12 from the bottom of the cabinet 11 under pressure, then flows upward and flows out from the outlet 18 at the top of the cabinet 11. This improves the cooling efficiency of the coolant on the heat-generating components 121 of the server 12.

[0064] In addition, the liquid outlet 18 and the liquid inlet 19 can also be set in other parts of the cabinet 11. For example, the liquid inlet 19 can be set at the top of the cabinet 11 and the liquid outlet 18 can be set at the bottom of the cabinet 11. This setting method is not shown in the figure.

[0065] Furthermore, in some embodiments, please refer to Figure 3 The partition plate 15 is located at the connection point between the liquid inlet pipe 17 and the server 12, meaning that the partition plate 15 is located at the bottom of the server 12. This arrangement facilitates the installation and setup of the partition plate 15 and also improves its sealing performance, preventing the coolant in the first chamber 111 from entering the second chamber 112 through the partition plate 15, thereby reducing the total amount of coolant in the cabinet 11.

[0066] Furthermore, the main inlet pipe 16 and the branch inlet pipe 17 are located in the second cavity 112. Due to the partition plate 15, no coolant is placed around the main inlet pipe 16 and the branch inlet pipe 17.

[0067] A liquid cooling system comprising a heat dissipation device 2 and any of the above-mentioned components in a cabinet 1. The beneficial effects of the liquid cooling system including the cabinet 1 are described above and will not be repeated here. The heat dissipation device 2 is used to dissipate heat from the coolant flowing out of the coolant outlet 18 of the cabinet 1, and to direct the cooled coolant through the inlet 19 into the cabinet body 11.

[0068] In some embodiments, please refer to Figure 5 The heat dissipation device 2 includes a connecting pipe 21, a heat dissipation component 22, and a pump 23. The two ends of the connecting pipe 21 are connected to the liquid inlet 19 and the liquid outlet 18 of the cabinet 11, respectively. The connecting pipe 21 allows the coolant to form a flow circulation, so that the coolant circulates to cool the server 12. The heat dissipation component 22 is disposed on the connecting pipe 21 and is used to cool the coolant flowing through the connecting pipe 21. An exemplary heat dissipation component 22 includes a fan 221 and a heat dissipation channel 222. The heat dissipation channel 222 can be a copper pipe with good heat exchange. The heat dissipation channel 222 is part of the connecting pipe 21. The fan 221 cools the coolant flowing in the heat dissipation channel 222 by blowing air into the heat dissipation channel 222. The pump 23 is disposed on the connecting pipe 21. The pump 23 pressurizes the coolant to make the coolant circulate within the cabinet 11 and the server 12. By setting up a heat dissipation component 22 to cool the coolant flowing out of the cabinet 11, and by setting up a pump 23 to pressurize the coolant so that the coolant flows through the server 12 more quickly, the cooling efficiency of the coolant on the server 12 is improved.

[0069] Furthermore, in the direction of coolant flow, pump 23 is positioned downstream of heat dissipation component 22, which improves the heat dissipation efficiency of heat dissipation component 22 on coolant, thereby improving the cooling efficiency of heat-generating component 121 in server 12.

[0070] In some embodiments, please refer to Figure 5 and Figure 6 The rack 1 also includes a temperature sensor and a controller. The temperature sensor (not shown) is used to monitor the temperature of the heat-generating component 121 inside the server 12 in real time. The controller (not shown) is communicatively connected to the temperature sensor, the heat dissipation assembly 22, and the pump 23, and can adjust the power of the heat dissipation assembly 22 and / or the pump 23 according to the temperature detected by the temperature sensor. By setting the temperature sensor to monitor the temperature of the heat-generating component 121 inside the server 12 in real time, if the temperature of the heat-generating component 121 is higher than the target temperature, the power of the heat dissipation assembly 22 and / or the pump 23 is increased to improve the cooling efficiency of the coolant; if the temperature of the heat-generating component 121 is lower than the target temperature, the power of the heat dissipation assembly and / or the pump 23 is reduced to decrease the cooling efficiency of the coolant. This setting enables intelligent adjustment of the temperature of the heat-generating component 121 to keep its temperature within the target range.

[0071] Specifically, taking the CPU as the heat-generating component 121, and using a CPU temperature rating of 85℃ as an example, the CPU failure rate increases after exceeding this temperature. The 85℃~105℃ range indicates a high CPU temperature requiring cooling; the 80℃~85℃ range indicates a normal CPU temperature; and the 55℃~80℃ range indicates a low CPU temperature requiring heating. When the temperature sensor detects a CPU operating under high load with a temperature within the 85℃~105℃ range, the controller increases the power of pump 23 to increase the coolant flow rate, and / or, the controller increases the power of fan 221 of the heat-generating component to further reduce the temperature of the coolant entering the cabinet 11, until the CPU temperature is within the 80℃~85℃ thermal equilibrium range and the adjustment stops; ensuring the CPU operates at a healthy temperature with the lowest possible flow rate. When the CPU temperature is between 55°C and 80°C under low load, the controller reduces the power of pump 23 to decrease the coolant flow rate, and / or the controller reduces the power of fan 221 of the heat-generating component to increase the temperature of the coolant entering the cabinet 11, until the CPU temperature is in the thermal equilibrium range of 80°C to 85°C and the flow rate adjustment stops, so as to ensure that the CPU is at a healthy operating temperature with the lowest flow rate.

[0072] This allows the CPU to operate within a critical temperature range, thus reducing the power consumption of pump 23 and / or heatsink 22, by adjusting the flow rate. Furthermore, this control logic enables fully automatic adjustment under different load conditions.

[0073] Based on the above-described configuration of this application, two sets of embodiments are provided, namely Embodiment 1 and Embodiment 2; and two sets of comparative examples are provided, namely Comparative Example 1 and Comparative Example 2. In Embodiment 1 and Comparative Example 1, the power of pump 23 is the same, that is, the flow rate of coolant is the same; in Embodiment 2 and Comparative Example 2, the power of pump 23 is adjusted to ensure that the CPU is at the same temperature.

[0074]

[0075] Table 1

[0076]

[0077] Table 2

[0078] Table 1 shows the experimental results when the power of pump 23 and the coolant flow rate are the same, and Table 2 shows the experimental results when the CPU is kept at the same temperature. Table 1 shows that when the power of pump 23 and the coolant flow rate are the same, the CPU temperature is lower in Example 1, indicating that the implementation method of this application provides better cooling for the CPU. Table 2 shows that when it is necessary to keep the CPU at the same temperature, the working efficiency of pump 23 is lower in Example 2, indicating that the implementation method of this application provides better cooling for the CPU.

[0079] This application improves overall coolant cooling efficiency and reduces heat dissipation energy consumption by reducing coolant usage, increasing coolant flow rate around the radiator, and intelligently adjusting the coolant supply flow rate according to CPU temperature. Specific technical effects are shown in Tables 1 and 2. Compared to conventional solutions, this embodiment achieves a 5.7°C reduction in CPU temperature and reduces static coolant usage by 134 liters; or, while maintaining the same CPU temperature, reduces the coolant supply flow rate by 6.5 liters / minute and the power of the circulation pump 23 by 0.23 kW.

[0080] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0081] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0082] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0083] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0084] It should be understood that the qualifiers “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0085] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A server rack, characterized in that, include: Cabinet; The server is housed in the cabinet, and both the cabinet and the server are filled with coolant. The server's internal cavity includes a heating area with heating elements and a non-heating area without heating elements. A first filler is disposed at least partially in the non-heating area to occupy the filling space of the coolant and guide the coolant to the heating area.

2. The cabinet according to claim 1, characterized in that, It also includes a second filler material disposed between the cabinet and the server.

3. The cabinet according to claim 1, characterized in that, A partition is provided between the server and the wall of the cabinet to divide the inner cavity of the cabinet into a first cavity and a second cavity, the second cavity being a closed cavity in which coolant is not allowed to enter.

4. The cabinet according to claim 3, characterized in that, The first cavity is filled with a second filler.

5. The cabinet according to claim 1 or 3, characterized in that, Multiple servers are provided, and the server rack includes: Main inlet pipe; Multiple branch inlet pipes are provided, with one end of each branch inlet pipe connected to the main inlet pipe, and the other end of all branch inlet pipes connected one-to-one to the server.

6. The cabinet according to claim 5, characterized in that, The branch inlet pipe includes a constant diameter section connected to the main inlet pipe, and a gradually expanding section with one end connected to the constant diameter section and the other end connected to the server.

7. The cabinet according to claim 5, characterized in that, The top of the cabinet has an outlet for coolant to flow out, and the bottom of the cabinet has an inlet for coolant to flow in, and the inlet is connected to the main inlet pipe.

8. A liquid cooling system, characterized in that, Includes a heat dissipation device and a cabinet as described in any one of claims 1-7.

9. The liquid cooling system according to claim 8, characterized in that, The heat dissipation device includes: A connecting pipe, with its two ends connected to the liquid inlet of the cabinet and the liquid outlet of the cabinet, respectively; A heat dissipation component is disposed on the connecting pipe for cooling the coolant flowing through the connecting pipe; The pump is mounted on the connecting pipe.

10. The liquid cooling system according to claim 9, characterized in that, Also includes: Temperature sensing components are used to monitor the temperature of heat-generating components inside the server in real time. The controller is communicatively connected to the temperature sensor, the heat dissipation assembly, and the pump, and can adjust the power of the heat dissipation assembly and / or the pump according to the temperature detected by the temperature sensor.

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