Single-board heat dissipation structure and testing machine
By using a first heat sink and a second heat sink to clamp the single board in the testing machine, and equipping it with a water-cooled plate in contact with the heat sink, the problem of poor heat dissipation of the single board in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202520006671.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2035-01-02
AI Technical Summary
In the existing test machine, the heat dissipation effect of the two-layer single board is not good, and it cannot dissipate heat quickly.
The single board is sandwiched between a first heat sink and a second heat sink, and a water-cooled plate is provided to directly or indirectly contact the heat sink to enhance heat dissipation efficiency.
It improves the heat dissipation effect of the single board, can quickly dissipate heat, and is suitable for multi-layer single board structures.
Smart Images
Figure CN223829659U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a single-board heat dissipation structure and testing machine. Background Technology
[0002] In existing testing machines, for cases with two-layer boards, the heat dissipation method is usually to stack the two boards and use a heat sink for heat dissipation. However, the above method, which relies on a heat sink, results in poor heat dissipation for the boards and cannot quickly dissipate the heat from the boards.
[0003] Therefore, how to provide a single-board heat dissipation structure and testing machine with better heat dissipation effect is one of the technical problems that need to be solved by those skilled in the art. Utility Model Content
[0004] The purpose of this utility model is to provide a single-board heat dissipation structure that can improve the heat dissipation effect of the single board, and to provide a testing machine that includes the above-mentioned single-board heat dissipation structure.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] In a first aspect, this utility model provides a single-board heat dissipation structure, including a first heat dissipation block, a first single board, a second heat dissipation block, and a water-cooled plate;
[0007] The first single board is sandwiched between the first heat sink and the second heat sink;
[0008] Wherein, the water-cooled plate is located between the first heat sink and the second heat sink, and both sides of the water-cooled plate are connected to the first heat sink and the second heat sink respectively; or, the water-cooled plate is located on the side of the first heat sink away from the first single board and is connected to the first heat sink, and a portion of the second heat sink is connected to the first heat sink.
[0009] Furthermore, when the water-cooled plate is located between the first heat sink and the second heat sink:
[0010] The single-board heat dissipation structure also includes a second single board and a third single board;
[0011] The second single board is located on the side of the first heat sink away from the first single board and is in contact with the first heat sink. The third single board is located on the side of the second heat sink away from the first single board and is in contact with the second heat sink.
[0012] Furthermore, when the water-cooled plate is located between the first heat sink and the second heat sink:
[0013] In the arrangement direction of the first heat sink, the first single plate, and the second heat sink, the water-cooled plate is staggered with the first heat sink and the second heat sink on both sides.
[0014] Furthermore, when the water-cooled plate is located on the side of the first heat sink away from the first single board:
[0015] The single-board heat dissipation structure further includes a third heat dissipation block, a fourth single board, and a fourth heat dissipation block. The fourth single board is sandwiched between the third heat dissipation block and the fourth heat dissipation block, and a portion of the third heat dissipation block is in contact with the fourth heat dissipation block.
[0016] The water-cooled plate is located on the side of the third heat sink away from the fourth single plate. One side of the water-cooled plate is connected to the third heat sink, and the other side is connected to the first heat sink.
[0017] Furthermore, in the arrangement direction of the first heat sink, the first single board, and the second heat sink, the first heat sink and the third heat sink are disposed opposite each other on both sides of the water-cooled plate.
[0018] Furthermore, the single-board heat dissipation structure also includes a first buckle plate and a second buckle plate. The first buckle plate is located on the side of the first heat dissipation block opposite to the first single board and is electrically connected to the first single board. The second buckle plate is located on the side of the third heat dissipation block opposite to the fourth single board and is electrically connected to the fourth single board.
[0019] Furthermore, the water-cooled plate has through holes for accommodating the first buckle plate and the second buckle plate.
[0020] Furthermore, the first heat sink and the second heat sink are fastened together, and a first heat-conducting layer is provided between the first heat sink and the second heat sink;
[0021] And / or, the third heat sink and the fourth heat sink are fastened together, and a second heat-conducting layer is provided between the third heat sink and the fourth heat sink.
[0022] Furthermore, a third heat-conducting layer is provided between the water-cooled plate and the first heat sink and / or between the water-cooled plate and the third heat sink.
[0023] Secondly, this utility model also provides a testing machine, including the single-board heat dissipation structure described in the above solution.
[0024] The single-board heat dissipation structure and testing function provided by this utility model can produce the following beneficial effects:
[0025] The single-board heat dissipation structure provided in the first aspect of this utility model includes a first heat dissipation block and a second heat dissipation block, with the first single board sandwiched between the first heat dissipation block and the second heat dissipation block. The two heat dissipation blocks can dissipate heat to both sides of the first single board respectively. At the same time, the water-cooled plate can directly contact both the first heat dissipation block and the second heat dissipation block to further improve the heat dissipation efficiency. Alternatively, the water-cooled plate can directly contact the first heat dissipation block while indirectly conducting heat to the second heat dissipation block through the first heat dissipation block to improve the heat dissipation efficiency, thereby improving the heat dissipation effect of the single board.
[0026] The testing machine provided in the second aspect of this utility model has the single-board heat dissipation structure provided in the first aspect of this utility model, and thus has all the beneficial effects of the single-board heat dissipation structure provided in the first aspect of this utility model. Attached Figure Description
[0027] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0028] Figure 1 This is a three-dimensional structural diagram of a single-board heat dissipation structure provided in Embodiment 1 of this utility model;
[0029] Figure 2 This is a top view of a single-board heat dissipation structure provided in Embodiment 1 of this utility model;
[0030] Figure 3 for Figure 2 A-A cross-sectional view;
[0031] Figure 4 for Figure 3 A magnified view of part B;
[0032] Figure 5 This is a three-dimensional structural diagram of a single-board heat dissipation structure provided in Embodiment 2 of this utility model;
[0033] Figure 6 This is a top view of a single-board heat dissipation structure provided in Embodiment 2 of this utility model;
[0034] Figure 7 for Figure 6 D-D cross-sectional view;
[0035] Figure 8 for Figure 7 A magnified view of a portion at point E;
[0036] Figure 9 This is a three-dimensional structural diagram of a partial structure of a single-board heat dissipation structure provided in Embodiment 2 of this utility model;
[0037] Figure 10 for Figure 5 A magnified view of part C.
[0038] Icons: 1 - First heat sink; 2 - First single board; 3 - Second heat sink; 4 - Water cooling plate; 41 - Through hole; 42 - Contact end; 5 - Second single board; 6 - Third single board; 7 - Third heat sink; 8 - Fourth single board; 9 - Fourth heat sink; 10 - First mounting plate; 011 - Second mounting plate. Detailed Implementation
[0039] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0040] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0041] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0042] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.
[0043] The first aspect of this utility model provides a single-board heat dissipation structure, such as... Figures 1 to 8As shown, the device includes a first heat sink 1, a first single-plate 2, a second heat sink 3, and a water-cooled plate 4; the first single-plate 2 is sandwiched between the first heat sink 1 and the second heat sink 3. The water-cooled plate 4 is located between the first heat sink 1 and the second heat sink 3, and both sides of the water-cooled plate 4 are connected to the first heat sink 1 and the second heat sink 3, respectively; alternatively, the water-cooled plate 4 is located on the side of the first heat sink 1 away from the first single-plate 2 and is connected to the first heat sink 1, and a portion of the second heat sink 3 is connected to the first heat sink 1.
[0044] In the single-board heat dissipation structure provided in the above embodiment, at least a first heat dissipation block 1, a second heat dissipation block 3, and a water-cooled plate 4 are configured. The first single board 2 is sandwiched between the first heat dissipation block 1 and the second heat dissipation block 3. The two heat dissipation blocks can dissipate heat from both sides of the first single board 2 respectively, which is more comprehensive than using a single heat dissipation block for heat dissipation. In addition, the heat dissipation efficiency is improved by the water-cooled plate 4 contacting the first heat dissipation block 1 and by the water-cooled plate 4 directly or indirectly contacting the second heat dissipation block 3. Specifically, the water-cooled plate 4 can be disposed between the first heat sink 1 and the second heat sink 3, and the water-cooled plate 4 can directly contact the first heat sink 1 and the second heat sink 3 to facilitate heat conduction; or, the water-cooled plate 4 can be disposed on the side of the first heat sink 1 away from the first single board 2, and the second heat sink 3 can be disposed on the side of the first single board 2 away from the first heat sink 1, and the first heat sink 1 and the second heat sink 3 can be in at least partial contact. With this arrangement, the water-cooled plate 4 and the second heat sink 3 can directly conduct heat dissipation, and indirectly conduct heat dissipation through the first heat sink 1 to the second heat sink 3, thereby improving the heat dissipation efficiency of the first single board 2.
[0045] Depending on the location of the water-cooled plate 4, the above-mentioned single-board heat dissipation structure can be divided into the following two embodiments.
[0046] Example 1
[0047] In this first embodiment, as Figures 1 to 4 As shown, the water-cooled plate 4 is located between the first heat sink 1 and the second heat sink 3, and both sides of the water-cooled plate 4 are in contact with the first heat sink 1 and the second heat sink 3 respectively.
[0048] In an optional implementation of this first embodiment, such as Figure 4 As shown, the single-board heat dissipation structure also includes a second single board 5 and a third single board 6; the second single board 5 is located on the side of the first heat dissipation block 1 away from the first single board 2 and is in contact with the first heat dissipation block 1, and the third single board 6 is located on the side of the second heat dissipation block 3 away from the first single board 2 and is in contact with the second heat dissipation block 3.
[0049] In the above embodiment, the first heat sink 1 can not only dissipate heat from the first single board 2, but also from the second single board 5. Similarly, the second heat sink 3 can not only dissipate heat from the first single board 2, but also from the third single board 6. The first heat sink 1 and the second heat sink 3 are in contact with the water-cooled plate 4, thereby removing the heat from the first single board 2, the second single board 5 and the third single board 6 through the water-cooled plate 4.
[0050] The above implementation can solve the problem of rapid heat dissipation when three single boards are stacked. Since the second single board 5, the first single board 2 and the third single board 6 are stacked from top to bottom, the heat will be more concentrated in the middle first single board 2. The upper and lower sides of the first single board 2 are in contact with the first heat sink 1 and the second heat sink 3 respectively, which can quickly dissipate the heat of the first single board 2. Since the first heat sink 1 and the second heat sink 3 are both in contact with the water cooling plate 4, it can ensure that all three single boards have a good heat dissipation effect.
[0051] The first heat sink 1 may have a recessed clearance groove on the side facing the first single board 2 and / or the side facing the second single board 5, and the second heat sink 3 may have a recessed clearance groove on the side facing the first single board 2 and / or the side facing the third single board 6. The clearance groove can avoid protruding components on the single board, avoid interference between the heat sink and the single board, and at the same time ensure the contact area between the two.
[0052] In an optional embodiment of this first embodiment, the water-cooled plate 4 is staggered with the first heat sink 1 and the second heat sink 3 on both sides in the arrangement direction of the first heat sink 1, the first single plate 2 and the second heat sink 3.
[0053] Reference Figure 3 and Figure 4 As shown, the first heat sink 1, the first single plate 2, and the second heat sink 3 are concentrated at the left end of the single plate heat dissipation structure. The contact end 42 of the left end of the water-cooled plate 4 extends between the right end of the first heat sink 1 and the right end of the second heat sink 3 and makes contact with them. The middle part and the right end of the water-cooled plate 4 extend out of the first heat sink 1 and the second heat sink 3 and extend for a certain length. The above embodiment is applicable to situations where there is sufficient space to place the water-cooled plate 4.
[0054] Example 2
[0055] In this second embodiment, as Figures 1 to 4 As shown, the water-cooled plate 4 is located on the side of the first heat sink 1 away from the first single plate 2 and is in contact with the first heat sink 1.
[0056] In an optional implementation of this second embodiment, such as Figure 8As shown, the single-board heat dissipation structure also includes a third heat dissipation block 7, a fourth single board 8 and a fourth heat dissipation block 9. The fourth single board 8 is sandwiched between the third heat dissipation block 7 and the fourth heat dissipation block 9, and a portion of the third heat dissipation block 7 is in contact with the fourth heat dissipation block 9. The water-cooled plate 4 is also located on the side of the third heat dissipation block 7 away from the fourth single board 8. One side of the water-cooled plate 4 is in contact with the third heat dissipation block 7, and the other side is in contact with the first heat dissipation block 1.
[0057] The above implementation method can solve the problem of rapid heat dissipation when two single boards are stacked, such as Figure 8 As shown, the top surface of the fourth single-board 8 can dissipate heat through the fourth heat sink 9, and the bottom surface can dissipate heat through the third heat sink 7. The top surface of the first single-board 2 can dissipate heat through the first heat sink 1, and the bottom surface can dissipate heat through the second heat sink 3. That is to say, both single boards can dissipate heat through the two heat sinks. At the same time, both the third heat sink 7 and the first heat sink 1 can contact the water-cooled plate 4. The water-cooled plate 4 can further dissipate the heat from the third heat sink 7 and the first heat sink 1, thus accelerating the heat dissipation of the first single board 2 and the fourth single board 8.
[0058] The first heat sink 1 can be configured as one, or as two, three, or more. Its quantity and area are related to the heat dissipation area required by the first single board 2. Similarly, the second heat sink 3, the third heat sink 7, and the fourth heat sink 9 can also be configured as one, or as two, three, or more.
[0059] like Figure 6 As shown, the first heat sink 1 is configured as two, and the second heat sink 3, the third heat sink 7 and the fourth heat sink 9 can also be configured as two.
[0060] The first heat sink 1, the second heat sink 3, the third heat sink 7, and the fourth heat sink 9 may be provided with a hollow structure for the connector to pass through.
[0061] In an optional embodiment of this second embodiment, in the arrangement direction of the first heat sink 1, the first single plate 2 and the second heat sink 3, the first heat sink 1 and the third heat sink 7 on both sides are arranged opposite to each other on both sides of the water-cooled plate 4.
[0062] In the above embodiments, since the first heat sink 1 and the third heat sink 7 are arranged opposite to each other on both sides of the water-cooled plate 4, the water-cooled plate 4 will not occupy a large amount of additional space compared with the first embodiment. Therefore, it is suitable for situations where there is not enough space to place the water-cooled plate 4. At the same time, it increases the contact area between the water-cooled plate 4 and the first heat sink 1, as well as the contact area between the water-cooled plate 4 and the third heat sink 7.
[0063] In an optional implementation of this second embodiment, such as Figure 8As shown, the single-board heat dissipation structure also includes a first buckle plate 10 and a second buckle plate 011. The first buckle plate 10 is located on the side of the first heat dissipation block 1 away from the first single board 2 and is electrically connected to the first single board 2. The second buckle plate 011 is located on the side of the third heat dissipation block 7 away from the fourth single board 8 and is electrically connected to the fourth single board 8.
[0064] Specifically, multiple capacitors are provided on both the first buckle plate 10 and the second buckle plate 011.
[0065] To facilitate the installation of the first buckle plate 10 and the second buckle plate 011, in an optional embodiment of this second embodiment, such as... Figure 9 As shown, the water-cooled plate 4 has through holes 41 for accommodating the first buckle plate 10 and the second buckle plate 011. The through holes 41 can provide accommodating space for the first buckle plate 10 and the second buckle plate 011, effectively reducing the thickness of the single-plate heat dissipation structure.
[0066] Specifically, the first mounting plate 10 can be connected to the second heat sink 3 by screws or other connectors. The connectors can pass through the first mounting plate 10, the first heat sink 1, and the first single plate 2 and be locked onto the second heat sink 3. The second mounting plate 011 can be connected to the fourth heat sink 9 by screws or other connectors. The connectors can pass through the second mounting plate 011, the third heat sink 7, and the fourth single plate 8 and be locked onto the fourth heat sink 9.
[0067] In an optional implementation of this second embodiment, such as Figure 10 As shown, the first heat sink 1 and the second heat sink 3 are fastened together to clamp the first single board 2 in the middle; the third heat sink 7 and the fourth heat sink 9 are fastened together to clamp the fourth single board 8 in the middle.
[0068] The above method makes it easier to fix the position of the first heat sink 1 relative to the second heat sink 3 and the position of the third heat sink 7 relative to the fourth heat sink 9.
[0069] Specifically, the first heat sink 1 and the second heat sink 3 can be connected by screws or other connectors, and the third heat sink 7 and the fourth heat sink 9 can be connected by screws or other connectors.
[0070] In an optional embodiment of this second embodiment, a first thermally conductive layer is provided between the first heat sink 1 and the second heat sink 3, and / or a second thermally conductive layer is provided between the third heat sink 7 and the fourth heat sink 9. The first and second thermally conductive layers can be made of silicone grease.
[0071] The first and second heat-conducting layers can fill the gap between two adjacent heat dissipation blocks, thereby enhancing the heat conduction between them.
[0072] In an optional embodiment of this second embodiment, a third heat-conducting layer is provided between the water-cooled plate 4 and the first heat sink 1 and / or between the water-cooled plate 4 and the third heat sink 7.
[0073] Similarly, the third thermal conductive layer can also be made of silicone grease. The third thermal conductive layer can fill the gaps between the water-cooled plate 4 and the first heat sink 1, and between the water-cooled plate 4 and the third heat sink 7, thereby enhancing the heat conduction between the water-cooled plate 4 and the heat sink.
[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A single-board heat dissipation structure, characterized in that, It includes a first heat sink (1), a first single board (2), a second heat sink (3), and a water-cooled plate (4); The first single board (2) is sandwiched between the first heat sink (1) and the second heat sink (3); Wherein, the water-cooled plate (4) is located between the first heat sink (1) and the second heat sink (3), and the two sides of the water-cooled plate (4) are respectively connected to the first heat sink (1) and the second heat sink (3); or, the water-cooled plate (4) is located on the side of the first heat sink (1) away from the first single plate (2) and is connected to the first heat sink (1), and a part of the second heat sink (3) is connected to the first heat sink (1).
2. The single-board heat dissipation structure according to claim 1, characterized in that, When the water-cooled plate (4) is located between the first heat sink (1) and the second heat sink (3): The single-board heat dissipation structure also includes a second single board (5) and a third single board (6); The second single board (5) is located on the side of the first heat sink (1) away from the first single board (2) and is in contact with the first heat sink (1). The third single board (6) is located on the side of the second heat sink (3) away from the first single board (2) and is in contact with the second heat sink (3).
3. The single-board heat dissipation structure according to claim 1, characterized in that, When the water-cooled plate (4) is located between the first heat sink (1) and the second heat sink (3): In the arrangement direction of the first heat sink (1), the first single plate (2) and the second heat sink (3), the water-cooled plate (4) is staggered with the first heat sink (1) and the second heat sink (3) on both sides.
4. The single-board heat dissipation structure according to claim 1, characterized in that, When the water-cooled plate (4) is located on the side of the first heat sink (1) away from the first single plate (2): The single-board heat dissipation structure also includes a third heat dissipation block (7), a fourth single board (8) and a fourth heat dissipation block (9). The fourth single board (8) is sandwiched between the third heat dissipation block (7) and the fourth heat dissipation block (9), and a portion of the third heat dissipation block (7) is in contact with the fourth heat dissipation block (9). The water-cooled plate (4) is located on the side of the third heat sink (7) away from the fourth single plate (8). One side of the water-cooled plate (4) is connected to the third heat sink (7), and the other side is connected to the first heat sink (1).
5. The single-board heat dissipation structure according to claim 4, characterized in that, In the arrangement direction of the first heat sink (1), the first single plate (2) and the second heat sink (3), the first heat sink (1) and the third heat sink (7) are arranged opposite to each other on both sides of the water-cooled plate (4).
6. The single-board heat dissipation structure according to claim 5, characterized in that, The single-board heat dissipation structure further includes a first buckle plate (10) and a second buckle plate (011). The first buckle plate (10) is located on the side of the first heat dissipation block (1) away from the first single board (2) and is electrically connected to the first single board (2). The second buckle plate (011) is located on the side of the third heat dissipation block (7) away from the fourth single board (8) and is electrically connected to the fourth single board (8).
7. The single-board heat dissipation structure according to claim 6, characterized in that, The water-cooled plate (4) has through holes (41) for accommodating the first buckle plate (10) and the second buckle plate (011).
8. The single-board heat dissipation structure according to claim 4, characterized in that, The first heat sink (1) and the second heat sink (3) are fastened together, and a first heat-conducting layer is provided between the first heat sink (1) and the second heat sink (3); And / or, the third heat sink (7) and the fourth heat sink (9) are fastened together, and a second heat-conducting layer is provided between the third heat sink (7) and the fourth heat sink (9).
9. The single-board heat dissipation structure according to claim 4, characterized in that, A third heat-conducting layer is provided between the water-cooled plate (4) and the first heat dissipation block (1) and / or between the water-cooled plate (4) and the third heat dissipation block (7).
10. A testing machine, characterized in that, Includes the single-board heat dissipation structure as described in any one of claims 1-9.