Flexible graphene cooling fin

Abstract

The utility model discloses a flexible graphene cooling fin, which comprises a graphene film layer, a heat conduction enhancement layer, a flexible substrate layer, an electric insulation layer, a bonding layer, a heat diffusion layer and a protection layer, and micropores are formed in the top end of the graphene film layer. According to the utility model, through the design of a composite structure, high-efficiency heat dissipation is ensured, and flexibility, electrical insulation, structural stability and durability of a material are considered, firstly, the graphene film layer has ultrahigh thermal conductivity, heat generated by an electronic component can be rapidly transmitted, and heat dissipation performance is ensured; the heat conduction enhancement layer and the heat diffusion layer further improve the conduction and diffusion capability of heat, local accumulation of heat is avoided, the uniform heat dissipation effect of the cooling fin is ensured, the flexible substrate layer ensures the advantages of the cooling fin in the aspects of flexibility and adaptability, and the cooling fin is suitable for various electronic elements in bent or irregular shapes.

Description

Technical Field

[0001] This utility model relates to the field of graphene heat dissipation technology, and in particular to a flexible graphene heat sink. Background Technology

[0002] With the continuous development of electronic technology, especially the widespread application of high-power electronic components such as integrated circuits (ICs), microprocessors (CPUs), and graphics processing units (GPUs), the heat dissipation problem of electronic devices has become increasingly prominent.

[0003] With the increase in power density, traditional heat dissipation methods (such as air cooling and liquid cooling) face many challenges, especially in space-constrained devices that require high heat dissipation efficiency and long-term stability. To effectively solve this problem, the selection of heat dissipation materials and the design of heat dissipation structures become particularly important. Graphene, as a material with extremely high thermal conductivity, has become an ideal candidate material for solving efficient heat dissipation due to its excellent thermal conductivity. However, the application of graphene is limited by its low mechanical strength and fragility, which limits the application scenarios of graphene. To address this, we propose a flexible graphene heat sink. Utility Model Content

[0004] The purpose of this invention is to provide a flexible graphene heat sink to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a flexible graphene heat sink, comprising a graphene thin film layer, a thermally conductive enhancement layer, a flexible substrate layer, an electrically insulating layer, an adhesive layer, a heat diffusion layer, and a protective layer. The thermally conductive enhancement layer is disposed at the bottom end of the graphene thin film layer, the flexible substrate layer is disposed at the bottom end of the thermally conductive enhancement layer, the electrically insulating layer is disposed at the bottom end of the flexible substrate layer, the adhesive layer is disposed at the bottom end of the electrically insulating layer, the heat diffusion layer is disposed at the bottom end of the adhesive layer, and the protective layer is disposed at the bottom end of the heat diffusion layer. Micropores are distributed throughout the top end of the graphene thin film layer.

[0006] Preferably, the graphene film layer is made of single-layer graphene, and the thickness of the graphene film layer is 0.1 micrometers to 10 micrometers.

[0007] Preferably, the thermally conductive reinforcement layer is made of nano-carbon plate, and the thickness of the thermally conductive reinforcement layer is 0.1 mm to 1 mm.

[0008] Preferably, the flexible substrate is made of polytetrafluoroethylene, and the thickness of the flexible substrate is 5 micrometers to 50 micrometers.

[0009] Preferably, the material of the electrical insulating layer is polyamide, and the thickness of the electrical insulating layer is 1 micrometer to 20 micrometers.

[0010] Preferably, the adhesive layer is made of epoxy resin and the thickness of the adhesive layer is 0.05 mm to 1 mm.

[0011] Preferably, the heat diffusion layer is made of thermally conductive ceramic, and the thickness of the heat diffusion layer is 0.5 mm to 5 mm.

[0012] Preferably, the protective layer is made of fluoride and has a thickness of 0.01 mm to 0.1 mm.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] This invention, through a composite structure design, ensures efficient heat dissipation while also considering the flexibility, electrical insulation, structural stability, and durability of the materials. Firstly, the graphene film layer possesses extremely high thermal conductivity, enabling rapid heat transfer from electronic components and ensuring excellent heat dissipation performance. Secondly, the thermally conductive enhancement layer and heat diffusion layer further enhance heat conduction and diffusion, preventing localized heat accumulation and ensuring uniform heat dissipation. The flexible substrate layer ensures the heat sink's flexibility and adaptability, making it suitable for various curved or irregularly shaped electronic components. The electrical insulation layer effectively prevents electrical short circuits between the heat sink and circuit components, ensuring the safety of electronic equipment. Furthermore, the adhesive layer ensures a stable bond between the various layers, preventing layer separation due to high temperatures or mechanical stress. Finally, the protective layer provides corrosion and wear resistance, extending the heat sink's lifespan. This composite structure design enables the heat sink to exhibit superior heat dissipation, flexibility, adaptability, and long-term stability in high-power electronic devices, meeting the increasingly stringent requirements of current electronic products for thermal management. Attached Figure Description

[0015] Figure 1 This is a front cross-sectional view of the present invention.

[0016] In the figure: 101, graphene film layer; 102, thermally conductive enhancement layer; 103, flexible substrate layer; 104, electrical insulation layer; 105, adhesive layer; 106, thermal diffusion layer; 107, protective layer; 201, micropores. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] This utility model provides, for example Figure 1 The flexible graphene heat sink shown includes a graphene film layer 101, a thermally conductive enhancement layer 102, a flexible substrate layer 103, an electrically insulating layer 104, an adhesive layer 105, a heat diffusion layer 106, and a protective layer 107. The thermally conductive enhancement layer 102 is disposed at the bottom end of the graphene film layer 101, the flexible substrate layer 103 is disposed at the bottom end of the thermally conductive enhancement layer 102, the electrically insulating layer 104 is disposed at the bottom end of the flexible substrate layer 103, the adhesive layer 105 is disposed at the bottom end of the electrically insulating layer 104, the heat diffusion layer 106 is disposed at the bottom end of the adhesive layer 105, and the protective layer 107 is disposed at the bottom end of the heat diffusion layer 106. The top end of the graphene film layer 101 is covered with micropores 201. Through the design of the composite structure, while ensuring efficient heat dissipation, the flexibility, electrical insulation, structural stability, and durability of the material are also taken into account. First, the graphene film layer 101 has ultra-high thermal conductivity, which can quickly transfer the heat generated by electronic components. To ensure heat dissipation performance, the thermally conductive enhancement layer 102 and the heat diffusion layer 106 further enhance the heat conduction and diffusion capabilities, preventing heat accumulation in localized areas and ensuring uniform heat dissipation of the heat sink. The flexible base layer 103 ensures the heat sink's advantages in flexibility and adaptability, making it suitable for various curved or irregularly shaped electronic components. The electrical insulation layer 104 effectively prevents electrical short circuits between the heat sink and circuit components, ensuring the safety of electronic equipment. In addition, the adhesive layer 105 ensures a stable bond between the various layers, avoiding the problem of interlayer separation caused by high temperature or mechanical stress. Finally, the protective layer 107 provides corrosion-resistant and wear-resistant protection for the heat sink, extending its service life. Through this composite structure design, the heat sink exhibits excellent heat dissipation performance, flexible adaptability, and long-term stability in high-power electronic devices, meeting the increasingly stringent requirements of current electronic products in terms of thermal management.

[0019] The graphene film layer 101 is made of single-layer graphene with a thickness of 0.1 micrometers to 10 micrometers. Graphene is a material with extremely high thermal conductivity, reaching 5000 W / m·K, which is much higher than that of metal materials. Single-layer graphene can achieve excellent thermal conductivity, which helps to quickly transfer the heat generated inside the device to the surface of the heat sink. At the same time, the micropores 201 increase the contact area of ​​the graphene film layer 101, making the heat dissipation effect of the graphene film layer 101 better.

[0020] The thermal conductivity enhancement layer 102 is made of nano-carbon plate and has a thickness of 0.1 mm to 1 mm. At the nanoscale, the carbon plate has excellent heat dissipation effect, thereby improving the heat dissipation effect of the heat sink. The thermal conductivity enhancement layer 102 enhances the heat transfer capability of the heat sink, especially in high-power electronic devices that require efficient heat dissipation, and can effectively reduce the operating temperature.

[0021] The flexible substrate 103 is made of polytetrafluoroethylene (PTFE) and has a thickness of 5-50 micrometers. PTFE is a polymer material with excellent flexibility, good chemical stability, high temperature resistance and low friction. The flexible substrate 103 provides the necessary flexibility for the heat sink, enabling it to adapt to various bending and deformation requirements, and is especially suitable for heat dissipation of curved electronic devices such as wearable devices.

[0022] The electrical insulation layer 104 is made of polyamide and has a thickness of 1 micrometer to 20 micrometers. Polyamide has certain electrical insulation properties and can withstand high temperature environments. The electrical insulation layer 104 effectively isolates the electrical contact between the heat sink and electronic components, ensuring the safe use of the heat sink in high voltage and complex circuit environments and avoiding electrical short circuits.

[0023] The adhesive layer 105 is made of epoxy resin and has a thickness of 0.05 mm to 1 mm. The adhesive layer 105 ensures the stability and integrity of the multi-layer structure, prevents the materials of each layer from delaminating under high temperature or mechanical stress, and maintains the durability and effective heat dissipation capacity of the heat sink.

[0024] The heat diffusion layer 106 is made of thermally conductive ceramic and has a thickness of 0.5 mm to 5 mm. By optimizing the heat diffusion performance of the heat sink, the heat diffusion layer 106 avoids local overheating, enabling the entire heat sink to effectively disperse the heat from electronic components and improve the heat dissipation effect.

[0025] The protective layer 107 is made of fluoride and has a thickness of 0.01 mm to 0.1 mm. The fluoride coating has excellent chemical stability, high temperature resistance and corrosion resistance, making it particularly suitable for protection in high temperature and humid environments. The protective layer 107 can effectively prevent the surface of the heat sink from failing due to oxidation, corrosion and wear during long-term use, extend the service life of the heat sink and ensure that it maintains high-efficiency heat dissipation performance for a long time.

[0026] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flexible graphene heat sink, characterized in that, The system comprises a graphene film layer (101), a thermally conductive enhancement layer (102), a flexible substrate layer (103), an electrically insulating layer (104), an adhesive layer (105), a thermally diffusing layer (106), and a protective layer (107). The thermally conductive enhancement layer (102) is disposed at the bottom end of the graphene film layer (101), the flexible substrate layer (103) is disposed at the bottom end of the thermally conductive enhancement layer (102), the electrically insulating layer (104) is disposed at the bottom end of the flexible substrate layer (103), the adhesive layer (105) is disposed at the bottom end of the electrically insulating layer (104), the thermally diffusing layer (106) is disposed at the bottom end of the adhesive layer (105), and the protective layer (107) is disposed at the bottom end of the thermally diffusing layer (106). Micropores (201) are distributed throughout the top end of the graphene film layer (101).

2. The flexible graphene heat sink according to claim 1, characterized in that, The graphene film layer (101) is made of single-layer graphene, and the thickness of the graphene film layer (101) is 0.1 micrometers to 10 micrometers.

3. The flexible graphene heat sink according to claim 1, characterized in that, The thermally conductive enhancement layer (102) is made of nano-carbon plate, and the thickness of the thermally conductive enhancement layer (102) is 0.1 mm to 1 mm.

4. A flexible graphene heat sink according to claim 1, characterized in that, The flexible substrate (103) is made of polytetrafluoroethylene and has a thickness of 5 micrometers to 50 micrometers.

5. A flexible graphene heat sink according to claim 1, characterized in that, The electrical insulating layer (104) is made of polyamide, and the thickness of the electrical insulating layer (104) is 1 micrometer to 20 micrometers.

6. A flexible graphene heat sink according to claim 1, characterized in that, The adhesive layer (105) is made of epoxy resin and has a thickness of 0.05 mm to 1 mm.

7. A flexible graphene heat sink according to claim 1, characterized in that, The heat diffusion layer (106) is made of thermally conductive ceramic, and the thickness of the heat diffusion layer (106) is 0.5 mm to 5 mm.

8. A flexible graphene heat sink according to claim 1, characterized in that, The protective layer (107) is made of fluoride and has a thickness of 0.01 mm to 0.1 mm.

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