Automatic substrate cleaning device and equipment

Abstract

An embodiment of the utility model discloses an automatic cleaning device and equipment for a substrate, which comprises a frame, a cleaning component, a conveying component and a driving mechanism, the driving mechanism is positioned on one side of the frame, the conveying component is positioned on the frame, the cleaning component is positioned above the conveying component, and the cleaning component is positioned above the conveying component. The conveying assembly is movably connected with the rack, the cleaning assembly is movably connected with the rack, the driving mechanism is connected with the conveying assembly, the driving mechanism drives the conveying assembly to convey a substrate to the cleaning assembly, and the cleaning assembly cleans the substrate. Compared with the prior art, the design of the cleaning assembly in the device enables pollutants to be treated, it is ensured that the substrate is not polluted in the glue sealing process, and therefore the packaging quality is improved. In addition, the production process is simplified through automatic operation of the device, the operation difficulty and the maintenance cost are reduced, and the device is suitable for large-scale production lines.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor memory chip packaging, especially to a substrate automatic cleaning device and equipment. BACKGROUND

[0002] To meet the demand of market large capacity memory chip particle, the existing semiconductor memory chip packaging is developing rapidly to multi-layer and ultra-thin direction, which requires the crystal pasting, wire welding and other processes to be produced and processed repeatedly before chip encapsulation. Even though the current production workshop is a thousand level dust-free workshop, but during the repeated production process in the above encapsulation process, it is still difficult to avoid the situation that dust, skin and other foreign matters fall on the substrate.

[0003] However, the existing encapsulation equipment has no cleaning structure for the substrate, only the internal airflow circulation cleaning function. Before encapsulation, the substrate materials are inverted and loaded into the encapsulation equipment together with the material box, during which the foreign matters fall on the back of the substrate, and then are sent to the mold cavity for encapsulation. The foreign matters are adhered to the surface of the mold after plastic encapsulation and are difficult to be found, which leads to the continuous appearance of substrate surface pits in subsequent plastic encapsulation, and often these pits cause serious conditions such as substrate internal circuit short circuit, open circuit and bottom chip cracking, resulting in product defects. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a substrate automatic cleaning device and equipment, which aims to solve the technical problem that the existing encapsulation equipment causes product defects after encapsulation due to pollutants falling on the substrate before encapsulation.

[0005] To solve the above technical problems, the utility model aims to realize the following technical scheme:

[0006] In the first aspect, the utility model provides a substrate automatic cleaning device, which comprises a rack, a cleaning assembly, a conveying assembly and a driving mechanism, the driving mechanism is located on one side of the rack, the conveying assembly is located on the rack, the cleaning assembly is located above the conveying assembly, the cleaning assembly is movably connected with the rack, the driving mechanism is connected with the conveying assembly, the driving mechanism drives the conveying assembly to transmit the substrate to the cleaning assembly, and the cleaning assembly cleans the substrate.

[0007] Further, the cleaning assembly is an ion fan, a blowing port is formed in the bottom of the ion fan, and the blowing port sprays high-pressure ion airflow on the substrate.

[0008] Further, the conveying assembly comprises a guide rail, a roller and a conveying belt, the guide rail is arranged on the rack, the roller is rotationally connected with the guide rail, the conveying belt is connected with the guide rail through the roller, and the driving mechanism drives the roller to drive the conveying belt to move on the guide rail.

[0009] Further, the substrate automatic cleaning device further comprises a dust collecting assembly, the dust collecting assembly is arranged above the rack and fixedly connected with the rack, and the dust collecting assembly absorbs the pollutants blown by the cleaning assembly.

[0010] Further, the dust collecting assembly is a dust collector, the dust collector is arranged on one side of the ion fan, and an air suction port is arranged below the dust collector.

[0011] Further, the air outlet is arranged on the side of the air suction port, so that the airflow path of the air outlet is directly guided to the air suction port.

[0012] Further, the ion fan is rotationally connected with the rack, and the air outlet is adjusted in angle through rotation of the ion fan.

[0013] Further, the ion fan is further provided with a wind speed adjusting assembly, and the wind speed adjusting assembly is used for adjusting the wind speed of the high-pressure ion airflow sprayed by the air outlet.

[0014] Further, the substrate automatic cleaning device further comprises a detection assembly, the detection assembly is fixedly connected with the rack, the detection assembly is arranged at an upstream position of the conveying assembly, and the detection assembly is used for detecting the presence and / or position of the substrate, so as to trigger the driving mechanism to start or adjust the transmission speed of the conveying assembly.

[0015] In the second aspect, the utility model also provides a substrate automatic cleaning equipment, including the substrate automatic cleaning device of any one of the above-embodiment.

[0016] Compared with the prior art, the cleaning assembly in the device can process the pollutants, ensure that the substrate is not contaminated during the gluing process, and improve the packaging quality. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0018] Figure 1 The structural schematic diagram of the substrate automatic cleaning device provided by the embodiment of the present application is shown in the figure.

[0019] Figure 2 The structural schematic diagram of the substrate automatic cleaning device provided by the embodiment of the present application is shown in the figure.

[0020] Reference signs:

[0021] 1, rack; 2, cleaning assembly; 21, air blowing port; 3, conveying assembly; 31, guide rail; 32, conveying belt; 4, dust collecting assembly; 41, air suction port. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0023] It should be understood that the terms "include" and "contain" as used in the specification and the appended claims indicate the presence of the described features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or collections thereof.

[0024] It should also be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0025] It should be further understood that the term "and / or" as used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0026] Please refer to Figures 1 to 2The utility model discloses a kind of substrate automatic cleaning devices, comprising: rack 1, cleaning component 2, conveying component 3 and driving mechanism (not shown in the figure), driving mechanism is located at the side of rack 1, conveying component 3 is located on rack 1, cleaning component 2 is located above conveying component 3, cleaning component 2 is movably connected with rack 1, driving mechanism is connected with conveying component 3, driving mechanism drives conveying component 3 and is transmitted to cleaning component 2 at substrate, cleaning component 2 carries out cleaning to substrate.

[0027] Specifically, rack 1 serves as the support structure of the entire device, and it needs to be designed stable, capable of bearing the weight of cleaning component 2, conveying component 3 and driving mechanism, and ensuring that these components can work stably after installation. Cleaning component 2 is located above conveying component 3 and is movably connected with rack 1. This means that cleaning component 2 can move or adjust relative to rack 1 to adapt to different sizes of substrates or perform more complex cleaning tasks. Conveying component 3 is installed on rack 1 and is responsible for transmitting substrates from the entrance of the device to cleaning component 2. Driving mechanism is located on one side of rack 1 and is connected with conveying component 3. It provides the necessary power to drive conveying component 3, enabling the substrate to be transmitted smoothly and continuously.

[0028] Working principle: when the substrate is placed at the entrance of conveying component 3, the driving mechanism starts and drives conveying component 3 to begin transmitting the substrate. As the substrate moves, it will be conveyed under cleaning component 2. At this time, cleaning component 2 starts to work and cleans the substrate. After cleaning is completed, the substrate continues to be transmitted by conveying component 3 to the exit of the device. This substrate automatic cleaning device realizes efficient and safe cleaning of the substrate through automation, flexibility and efficient cleaning methods, thereby improving the packaging quality of the product.

[0029] As shown in Figure 1 and Figure 2 , cleaning component 2 is an ion blower, and the bottom of the ion blower is provided with a blowing port 21 for spraying high-pressure ion airflow onto the substrate.

[0030] Specifically, in the present embodiment, the cleaning assembly 2 is specifically an ion blower, and in other embodiments, the cleaning assembly 2 can also be other cleaning devices, which are specifically selected according to actual conditions. The ion blower is a device capable of generating high-pressure ion airflow, which utilizes high-voltage electric field to ionize molecules or atoms in air to form positive and negative ions. These ions are blown to the substrate surface under the action of airflow, neutralize or adsorb static charges or contaminants on the substrate, thereby achieving the purpose of cleaning the substrate. The bottom of the ion blower is provided with a blowing port 21, which is the channel for outputting ion airflow. The design of the blowing port 21 needs to consider factors such as uniformity, speed and direction of airflow to ensure that the ion airflow can effectively cover the substrate surface and achieve the expected cleaning effect. The high-pressure ion airflow generated by the ion blower has high energy, which can quickly neutralize the static charge on the substrate surface and adsorb or blow away the contaminants. This cleaning method has the advantages of non-contact, high efficiency and environmental protection, and will not cause physical damage to the substrate or introduce new contaminants. The high-pressure ion airflow generated by the ion blower can quickly neutralize the static charge on the substrate surface and effectively remove contaminants such as dust, oil stains and fingerprints. This cleaning method is more efficient and thorough than traditional manual wiping or chemical cleaning.

[0031] As shown in Figure 1 , the conveying assembly 3 includes a guide rail 31, a roller (not shown in the figure) and a conveying belt 32. The guide rail 31 is located on the rack 1, the roller is rotationally connected with the guide rail 31, and the conveying belt 32 is connected with the guide rail 31 through the roller. The driving mechanism drives the roller to drive the conveying belt 32 to move on the guide rail 31.

[0032] Specifically, when the driving mechanism is started, it drives the roller to roll on the guide rail 31, thereby driving the conveying belt 32 to move. The substrate is placed at the starting position of the conveying belt 32, and as the conveying belt 32 moves, the substrate is smoothly transported to the cleaning assembly 2 for cleaning. In the present embodiment, the driving mechanism is an electric motor to ensure sufficient torque and speed control. In other embodiments, the driving mechanism can also be a reducer, a transmission belt or other components, which are specifically set according to actual conditions.

[0033] As shown in Figure 1 , the substrate automatic cleaning device further comprises a dust collecting assembly 4, which is located above the rack 1 and fixedly connected with the rack 1. The dust collecting assembly 4 absorbs the contaminants blown up by the cleaning assembly 2.

[0034] Specifically, the dust collection assembly 4 is located above the frame 1 and is securely connected to the frame 1 by bolts, welding, or other fixing methods. This design ensures that the dust collection assembly 4 can be stably suspended above the frame 1, facilitating the collection of contaminants blown up by the cleaning assembly 2. The main function of the dust collection assembly 4 is to effectively absorb and collect contaminants (such as dust, particles, static electricity residue, etc.) blown up by the ionized gas flow generated by the cleaning assembly 2 during the cleaning process. This is typically achieved through components such as suction ports, filters, or collection containers inside the dust collection assembly 4. The dust collection assembly 4 works in conjunction with the cleaning assembly 2 to achieve substrate cleaning. The cleaning assembly 2 removes contaminants from the substrate surface by spraying a high-pressure ionized gas flow, while the dust collection assembly 4 is responsible for absorbing and collecting these contaminants to prevent them from recontaminating the substrate or the working environment.

[0035] Furthermore, the dust collection assembly 4 contains one or more filters for filtering and separating airborne contaminants. These filters can be fiber filters, electrostatic filters, or high-efficiency particulate air (HEPA) filters, depending on the required filtration precision and the type of contaminants. The filtered air can be discharged through the exhaust port, while the contaminants are collected in the collection container of the dust collection assembly 4 for subsequent processing and cleaning.

[0036] like Figure 1 and Figure 2 As shown, the dust collection component 4 is a dust collector located on one side of the ion fan, and an air intake 41 is provided below the dust collector.

[0037] Specifically, the dust collector is designed to be located to one side of the ion fan. This layout ensures that the dust collector can efficiently capture contaminants blown up by the ion fan. An air intake 41 is located below the dust collector, which is a key component for collecting contaminants. The design of the air intake 41 takes into account factors such as airflow guidance, suction power, and filtration efficiency to ensure maximum capture of contaminants blown up by the ion fan.

[0038] like Figure 2 As shown, the air outlet 21 is positioned on the side facing the air inlet 41 so that the airflow path of the air outlet 21 is directly guided to the air inlet 41.

[0039] Specifically, the air outlet 21 of the ion blower is designed to face the suction port 41 of the dust collector. This layout ensures that the high-pressure ion airflow generated by the ion blower can directly blow pollutants towards the suction port 41, thereby maximizing the collection efficiency of pollutants. The orientation of the air outlet 21 towards the suction port 41 allows the ion airflow to form a clear airflow path after being blown out, directly guiding it to the suction port 41. This airflow guidance design helps reduce airflow diffusion and loss, improving the dust collector's dust collection efficiency.

[0040] In another embodiment, such as Figure 1 and Figure 2 As shown, the ion fan is rotatably connected to the frame 1, and the air outlet 21 is adjusted in angle by the rotation of the ion fan.

[0041] Specifically, the ion blower is designed to connect to the frame 1 via a rotating connector (such as a bearing, hinge, or rotating bracket). This rotating connection allows the ion blower to rotate relative to the frame 1 within a certain range, thereby adjusting the angle of its air outlet 21. This rotating connection not only provides flexibility but also allows the user to adjust the angle of the air outlet 21 according to actual needs; the range and precision of the angle adjustment depend on the design of the rotating connection and the user's specific requirements. The rotating connection between the ion blower and the frame 1, along with the angle adjustment function of the air outlet 21, enables the ion blower to flexibly adjust its airflow direction according to different substrate sizes, shapes, and cleaning requirements. This design enhances the collaborative working capability between the ion blower and the dust collector, improving the adaptability and flexibility of the entire cleaning system.

[0042] In one available embodiment, the ion blower is further provided with a wind speed regulating component (not shown in the figure) for regulating the wind speed of the high-pressure ion flow ejected from the air outlet 21.

[0043] Specifically, the airflow speed adjustment component is designed to be located in the control section of the ion blower or near the air outlet 21. This component includes knobs, sliders, electronic controllers, etc., for manually or automatically adjusting the airflow speed of the high-pressure ion airflow. The airflow speed adjustment component achieves precise control of the high-pressure ion airflow speed by changing the fan speed inside the ion blower, the size or shape of the airflow channel, or adjusting the power supply voltage. This adjustment mechanism provides a variety of airflow speeds, from low to high, to suit different cleaning needs.

[0044] In one available embodiment, the automatic substrate cleaning device further includes a detection component (not shown) fixedly connected to the frame 1 and located upstream of the conveying component 3. The detection component is used to detect the presence and / or position of the substrate to trigger the drive mechanism to start or adjust the transmission speed of the conveying component 3.

[0045] Specifically, in this embodiment, the main function of the detection component is to detect the presence of the substrate. This is achieved through photoelectric sensors, proximity sensors, weight sensors, etc., which can sense the arrival of the substrate and emit signals. The detection component is connected to the drive mechanism and is used to trigger the start of the drive mechanism or adjust the transmission speed of the conveying component 3. When the detection component detects the substrate, it sends a signal to the control system, which then activates the drive mechanism, causing the conveying component 3 to begin moving or adjust its speed to meet the transmission requirements of the substrate.

[0046] This utility model also provides an automatic substrate cleaning device, including the automatic substrate cleaning apparatus as described in the above embodiments.

[0047] Specifically, the automated substrate cleaning equipment employs a modular design to ensure coordinated operation and high efficiency among its components. The conveying component 3 transports the substrate from the input to the cleaning area, while the ion fan and dust collector clean contaminants from the substrate surface. The detection component detects the presence and position of the substrate to trigger corresponding actions. Integrating an advanced cleaning component 2 and an adaptive control system, this equipment efficiently cleans contaminants from the substrate surface, contributing to improved overall production line efficiency and reduced cleaning time and energy consumption.

[0048] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An automatic substrate cleaning device, characterized in that, include: The system includes a rack, a cleaning component, a conveying component, and a drive mechanism. The drive mechanism is located on one side of the rack, the conveying component is located on the rack, the cleaning component is located above the conveying component, the cleaning component is movably connected to the rack, and the drive mechanism is connected to the conveying component. The drive mechanism drives the conveying component to transport the substrate to the cleaning component, and the cleaning component cleans the substrate.

2. The automatic substrate cleaning device according to claim 1, characterized in that, The cleaning component is an ion fan with an air outlet at the bottom, which sprays a high-pressure ion gas stream onto the substrate.

3. The automatic substrate cleaning device according to claim 1, characterized in that, The conveying assembly includes a guide rail, rollers, and a conveyor belt. The guide rail is located on the frame, the rollers are rotatably connected to the guide rail, the conveyor belt is connected to the guide rail through the rollers, and the driving mechanism drives the rollers to drive the conveyor belt on the guide rail.

4. The automatic substrate cleaning device according to claim 2, characterized in that, It also includes a dust collection assembly located above and fixedly connected to the frame, which absorbs contaminants blown up by the cleaning assembly.

5. The automatic substrate cleaning device according to claim 4, characterized in that, The dust collection component is a dust collector, which is located on one side of the ion fan, and an air intake is provided below the dust collector.

6. The automatic substrate cleaning device according to claim 5, characterized in that, The air inlet is positioned to face the air inlet so that the airflow path of the air inlet is directly directed to the air inlet.

7. The automatic substrate cleaning device according to claim 5, characterized in that, The ion fan is rotatably connected to the frame, and the angle of the air outlet is adjusted by the rotation of the ion fan.

8. The automatic substrate cleaning device according to claim 2, characterized in that, The ion fan is also equipped with a wind speed adjustment component, which is used to adjust the wind speed of the high-pressure ion airflow ejected from the air outlet.

9. The automatic substrate cleaning device according to claim 1, characterized in that, It also includes a detection component, which is fixedly connected to the frame and located upstream of the conveying component. The detection component is used to detect the presence and / or position of the substrate in order to trigger the drive mechanism to start or adjust the transmission speed of the conveying component.

10. An automatic substrate cleaning device, characterized in that, Includes the automatic substrate cleaning device as described in any one of claims 1-9.

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