Chip heat dissipation device

Abstract

The utility model discloses a chip heat dissipation device which is used for conducting heat dissipation on a chip installed on a circuit board, the chip heat dissipation device comprises a support, a cooling liquid box, a heat conduction piece, a driving piece and a spraying mechanism, and the support is fixed to the side, connected with the chip, of the circuit board; the cooling liquid tank is arranged on one side, deviating from the chip, of the bracket; the heat conduction piece is arranged right above the chip; the driving piece is arranged between the support and the heat conduction piece, the driving piece is fixed to the side, facing the chip, of the support, and the output end of the driving piece is connected with the heat conduction piece; the spraying mechanism is arranged between the cooling liquid box and the heat conduction piece, and the spraying mechanism sprays cooling liquid in the cooling liquid box to the side, away from the chip, of the heat conduction piece. According to the utility model, the problem that the heat dissipation efficiency is low when the conventional chip heat dissipation device is used for heat dissipation of a chip of large-scale equipment can be solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a chip heat dissipation device. Background Technology

[0002] A chip is a general term for semiconductor components. They are widely used in numerous small devices such as automobiles and computers, as well as in large devices such as servers and workstations, enabling complex and diverse data processing. Chips typically generate a significant amount of heat during operation, requiring heat dissipation devices to cool them. In small devices, chips are generally cooled by fans, which is sufficient to meet the cooling needs due to the small size of the chips. However, for chips in large devices, fans are insufficient for efficiently dissipating heat, resulting in low heat dissipation efficiency and a reduced chip lifespan. Utility Model Content

[0003] The main purpose of this application is to provide a chip heat dissipation device, which aims to solve the problem of low heat dissipation efficiency of existing chip heat dissipation devices when dissipating heat from chips in large equipment.

[0004] To achieve the above objectives, this application provides a chip heat dissipation device for dissipating heat from a chip mounted on a circuit board. The device includes: a support, a coolant tank, a heat-conducting component, a driving component, and a spraying mechanism. The support is fixed to the side of the circuit board connected to the chip. The coolant tank is disposed on the side of the support facing away from the chip. The heat-conducting component is disposed directly above the chip. The driving component is disposed between the support and the heat-conducting component, and is fixed to the side of the support facing the chip; the output end of the driving component is connected to the heat-conducting component. The spraying mechanism is disposed between the coolant tank and the heat-conducting component, and sprays coolant from the coolant tank onto the side of the heat-conducting component facing away from the chip.

[0005] Optionally, the support includes: two upright plates and a top plate, wherein the two upright plates are fixed to the side of the circuit board connected to the chip, and the two upright plates are located on both sides of the chip; the top plate is connected to the end of the two upright plates away from the circuit board; wherein the coolant tank is connected to the side of the top plate away from the chip, the spray mechanism passes through the top plate and communicates with the coolant tank, and the drive component is fixed to the side of the top plate facing the chip.

[0006] Optionally, the heat-conducting component includes a heat-conducting plate and multiple baffles, wherein the heat-conducting plate is connected to the output end of the driving component and the heat-conducting plate is connected to the spraying mechanism to enable the spraying mechanism to spray normally; the multiple baffles are all disposed on the side of the heat-conducting plate away from the chip, and the multiple baffles are all located on the outer periphery of the heat-conducting plate.

[0007] Optionally, there are two coolant tanks and two sets of spraying mechanisms, with each set of spraying mechanisms corresponding to one of the two coolant tanks; each coolant tank is provided with an injection port.

[0008] Optionally, the spraying mechanism includes: two liquid storage tanks, two push rod mechanisms, a spray pipe, and multiple spray heads, wherein the two liquid storage tanks are connected to the corresponding coolant tanks via pipes; one end of each of the two push rod mechanisms is fixed to the heat-conducting component, and the other end is slidably fitted into the corresponding liquid storage tank; the spray pipe is connected between and communicates with the two liquid storage tanks; the multiple spray heads are evenly arranged on the spray pipe, and the liquid outlet ends of the multiple spray heads all face the heat-conducting component.

[0009] Optionally, the push rod mechanism includes a push rod and a mating plate, wherein one end of the push rod is fixed to the heat-conducting component; the mating plate is connected to the other end of the push rod, and the mating plate is slidably engaged with the liquid storage tank.

[0010] Optionally, the chip heat dissipation device further includes: two sets of air blowers, wherein the two sets of air blowers are respectively disposed on both sides of the length direction of the heat-conducting component, and the air blowers are used to dry the coolant on the surface of the heat-conducting component.

[0011] Optionally, the blower mechanism includes: a connecting part, a rotating engagement part, a rotating shaft, a gear, a fan, and a rack, wherein the connecting part is connected to one side of the heat-conducting element; the rotating engagement part is fixed to the bracket; the rotating shaft passes through the rotating engagement part and rotates in engagement with the rotating engagement part; the gear is fixed to one end of the rotating shaft facing the heat-conducting element; the fan is fixed to the end of the rotating shaft facing the heat-conducting element, and there is a gap between the fan and the gear; the rack is vertically fixed to the connecting part, and the rack meshes with the gear.

[0012] Optionally, the chip heat dissipation device further includes a dust removal mechanism, wherein the dust removal mechanism is movably mounted on the rotating shaft, and the dust removal mechanism is used to clean the dust on the circuit board.

[0013] Optionally, the dust removal mechanism includes: a slider, a connecting rod, a brush mounting part, and a brush, wherein the slider is threadedly engaged with the rotating shaft; one end of the connecting rod is fixed to the slider; the brush mounting part is connected to the other end of the connecting rod; the brush is connected to the side of the brush mounting part facing the circuit board; wherein the end of the rotating shaft away from the heat-conducting component is rotatably connected to the bracket.

[0014] This application discloses a chip heat dissipation device. When dissipating heat from a chip connected to a circuit board, a driving component first activates, causing a heat-conducting component to move upwards. Coolant from the coolant tank enters a spraying mechanism through a pipe. The spraying mechanism then sprays coolant onto the upper surface of the heat-conducting component. Under the action of the driving component, the heat-conducting component moves downwards until it contacts the upper surface of the chip. The driving component then stops driving the heat-conducting component downwards. At this point, the chip transfers its own temperature to the heat-conducting component, completing heat exchange and effectively reducing the chip's temperature, thus completing heat dissipation. After the heat-conducting component has been in contact with the chip for a period of time, it moves upwards again under the drive of the driving component, and the spraying mechanism continues to spray coolant onto the upper surface of the heat-conducting component to contact the chip, completing heat dissipation. This efficiently dissipates the chip's heat and extends its lifespan. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a chip heat dissipation device provided in an embodiment of this application;

[0016] Figure 2 for Figure 1 A structural diagram from another perspective;

[0017] Figure 3 for Figure 1 Enlarged view of part A;

[0018] Figure 4 for Figure 1 Cross-sectional view of the middle storage tank.

[0019] In the diagram, 1. Circuit board; 2. Chip; 3. Bracket; 301. Vertical plate; 302. Top plate; 4. Coolant tank; 5. Heat-conducting component; 501. Heat-conducting plate; 502. Baffle; 6. Drive component; 7. Spraying mechanism; 701. Liquid storage tank; 702. Push rod mechanism; 703. Spray pipe; 704. Spray head; 705. Push rod; 706. Mating plate; 8. Liquid injection port; 9. Air blower mechanism; 901. Connecting part; 902. Rotating mating part; 903. Rotating shaft; 904. Gear; 905. Fan; 906. Rack; 10. Dust removal mechanism; 1001. Slider; 1002. Connecting rod; 1003. Brush mounting part; 1004. Brush.

[0020] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0025] Please see Figure 1 , Figure 2This application provides a chip heat dissipation device for dissipating heat from a chip 2 mounted on a circuit board 1. The chip heat dissipation device may include: a bracket 3, a coolant tank 4, a heat-conducting component 5, a driving component 6, and a spraying mechanism 7. The bracket 3 is fixed to the side of the circuit board 1 connected to the chip 2; the coolant tank 4 is disposed on the side of the bracket 3 away from the chip 2; the heat-conducting component 5 is disposed directly above the chip 2; the driving component 6 is disposed between the bracket 3 and the heat-conducting component 5, and is fixed to the side of the bracket 3 facing the chip 2, with its output end connected to the heat-conducting component 5; the spraying mechanism 7 is disposed between the coolant tank 4 and the heat-conducting component 5, and sprays the coolant in the coolant tank 4 onto the side of the heat-conducting component 5 away from the chip 2.

[0026] In this embodiment, the heat-conducting component 5 is a heat-conducting plate; the driving component 6 is an electric push rod. When dissipating heat from the chip 2 connected to the circuit board 1, the driving component 6 first activates, causing the heat-conducting component 5 to move upwards. Coolant in the coolant tank 4 enters the spray mechanism 7 through pipes. The spray mechanism 7 then sprays coolant onto the upper surface of the heat-conducting component 5. Under the action of the driving component 6, the heat-conducting component 5 moves downwards until it contacts the upper surface of the chip 2. The driving component 6 then stops driving the heat-conducting component 5 downwards. At this point, the chip 2 transfers its own temperature to the heat-conducting component 5, thus completing heat exchange and effectively reducing the temperature of the chip 2, thereby completing heat dissipation. After the heat-conducting component 5 has been in contact with the chip 2 for a period of time, it moves upwards again under the drive of the driving component 6. The spray mechanism 7 continues to spray coolant onto the upper surface of the heat-conducting component 5 to contact the chip 2, completing heat dissipation for the chip 2. This efficiently dissipates the heat from the chip 2 and extends its service life.

[0027] It should be noted that the chip heat dissipation device involved in this application is only for dissipating heat from horizontally positioned chips.

[0028] Please see Figure 2 The bracket 3 may include two upright plates 301 and a top plate 302. The two upright plates 301 are fixed to the side of the circuit board 1 connected to the chip 2, and the two upright plates 301 are located on both sides of the chip 2. The top plate 302 is connected to the end of the two upright plates 301 away from the circuit board 1. The coolant tank 4 is connected to the side of the top plate 302 away from the chip 2. The spray mechanism 7 passes through the top plate 302 and communicates with the coolant tank 4. The drive unit 6 is fixed to the side of the top plate 302 facing the chip 2.

[0029] Specifically, the two upright plates 301 are used to connect to the top plate 302, which is used to connect with the coolant tank 4, the spray mechanism 7, and the drive unit 6. In some embodiments, the two upright plates 301 can be soldered to the circuit board 1, but care should be taken not to interfere with the installation of other components on the circuit board 1 or to damage the structure of the circuit board 1.

[0030] Please continue reading. Figure 2 The heat-conducting component 5 may include a heat-conducting plate 501 and multiple baffles 502. The heat-conducting plate 501 is connected to the output end of the driving component 6 and is also connected to the spraying mechanism 7 so that the spraying mechanism 7 can spray normally. The multiple baffles 502 are all disposed on the side of the heat-conducting plate 501 away from the chip 2 and are all located on the outer periphery of the heat-conducting plate 501.

[0031] The heat-conducting component 5 is configured as a heat-conducting plate 501 and multiple baffles 502 connected to the outer periphery of the heat-conducting plate 501. When the spraying mechanism 7 sprays, the coolant sprayed on the heat-conducting plate 501 will not flow out of the heat-conducting plate 501, but will be blocked by the multiple baffles 502, so that the coolant is always on the heat-conducting plate 501, so as to dissipate heat from the chip 2.

[0032] Please see Figure 1 , Figure 2 There are two coolant tanks 4 and two sets of spraying mechanisms 7, with each set of spraying mechanisms 7 corresponding to one of the two coolant tanks 4; each coolant tank 4 is equipped with a liquid injection port 8.

[0033] This embodiment is a preferred embodiment of the present application. Two coolant tanks 4 are provided, and two sets of spraying mechanisms 7 are provided. Each set of spraying mechanisms 7 corresponds to one coolant tank 4, allowing them to operate independently and ensuring that the coolant is evenly sprayed onto the upper surface of the heat-conducting component 5. Each coolant tank 4 is provided with a filling port 8 to facilitate replenishment of the coolant within the tank 4.

[0034] Please see Figure 1 The spraying mechanism 7 may include: two liquid storage tanks 701, two push rod mechanisms 702, a spray pipe 703, and multiple spray heads 704. The two liquid storage tanks 701 are connected to the corresponding coolant tanks 4 through pipes. One end of each of the two push rod mechanisms 702 is fixed to the heat-conducting component 5, and the other end is slidably fitted into the corresponding liquid storage tank 701. The spray pipe 703 is connected between the two liquid storage tanks 701 and communicates with the two liquid storage tanks 701. The multiple spray heads 704 are evenly arranged on the spray pipe 703, and the liquid outlet ends of the multiple spray heads 704 all face the heat-conducting component 5.

[0035] It should be noted that each liquid storage tank 701 is equipped with a one-way valve on the pipe connecting it to the coolant tank 4, so as to ensure that the coolant can only flow from the coolant tank 4 to the liquid storage tank 701, thereby ensuring the normal operation of the spraying mechanism 7.

[0036] In this embodiment, when spraying the heat-conducting component 5, the driving component 6 drives the heat-conducting component 5 to move upward. Since one end of each of the two push rod mechanisms 702 is fixed to the heat-conducting component 5, the push rod mechanisms 702 move upward. During the upward movement of the push rod mechanisms 702, the coolant in the storage tank 701 flows into the spray pipe 703 under pressure and is sprayed from the multiple spray nozzles 704 onto the upper surface of the heat-conducting component 5 to achieve heat dissipation for the chip 2. Using coolant to dissipate heat from the chip 2 is highly efficient and reliable.

[0037] Please see Figure 4 The push rod mechanism 702 may include a push rod 705 and a mating plate 706, wherein one end of the push rod 705 is fixed to the heat-conducting component 5; the mating plate 706 is connected to the other end of the push rod 705, and the mating plate 706 is slidably mated with the liquid storage tank 701.

[0038] Specifically, the push rod mechanism 702 is configured as a push rod 705 and a mating disc 706, resulting in a simple overall structure that is easy to manufacture. It is important to ensure that while the mating disc 706 slides within the reservoir 701, coolant does not leak from the reservoir 701. For example, the mating disc 706 can be made of rubber, connected to the push rod 705, and with an interference fit between the mating disc 706 and the reservoir 701.

[0039] Please see Figure 1 The chip heat dissipation device may also include two sets of blower mechanisms 9, wherein the two sets of blower mechanisms 9 are respectively arranged on both sides of the heat-conducting component 5 along its length, and the blower mechanisms 9 are used to dry the coolant on the surface of the heat-conducting component 5.

[0040] Among them, by setting two sets of blower mechanisms 9, the two sets of blower mechanisms 9 will also operate during the up and down movement of the heat-conducting component 5. The main purpose is to dry the coolant on the surface of the heat-conducting component 5. After the coolant on the surface of the heat-conducting component 5 vaporizes, it carries away a lot of heat, which is beneficial to the heat dissipation of the chip 2.

[0041] Please see Figure 1 , Figure 3The blower mechanism 9 may include: a connecting part 901, a rotating engagement part 902, a rotating shaft 903, a gear 904, a fan 905, and a rack 906. The connecting part 901 is connected to one side of the heat-conducting member 5; the rotating engagement part 902 is fixed to the bracket 3; the rotating shaft 903 passes through the rotating engagement part 902 and rotates with the rotating engagement part 902; the gear 904 is fixed to the end of the rotating shaft 903 facing the heat-conducting member 5; the fan 905 is fixed to the end of the rotating shaft 903 facing the heat-conducting member 5, and there is a gap between the fan 905 and the gear 904; the rack 906 is vertically fixed to the connecting part 901, and the rack 906 meshes with the gear 904.

[0042] In this embodiment, when the heat-conducting component 5 moves up and down, the rack 906 connected to one side of the heat-conducting component 5 also moves up and down with the heat-conducting component 5 (the top plate 302 will not interfere with the movement of the rack 906). The up and down movement of the rack 906 drives the gear 904 meshing with it to start rotating. The rotation of the gear 904 drives the rotating shaft 903 to rotate. The rotation of the rotating shaft 903 drives the fan 905 to rotate. The rotation of the fan 905 can dry the coolant on the heat-conducting component 5, so that the heat-conducting component 5 can be cooled quickly to facilitate heat dissipation of the chip 2.

[0043] Please see Figure 2 The chip heat dissipation device may also include a dust removal mechanism 10, wherein the dust removal mechanism 10 is movably mounted on the rotating shaft 903, and the dust removal mechanism 10 is used to clean the dust on the circuit board 1.

[0044] By adding a dust removal mechanism 10, the dust on the circuit board 1 can be easily cleaned during the up-and-down movement of the heat-conducting component 5, thus preventing dust accumulation on the circuit board 1.

[0045] Please see Figure 1 The dust removal mechanism 10 may include: a slider 1001, a connecting rod 1002, a brush mounting part 1003, and a brush 1004. The slider 1001 is threadedly engaged with the rotating shaft 903. One end of the connecting rod 1002 is fixed to the slider 1001. The brush mounting part 1003 is connected to the other end of the connecting rod 1002. The brush 1004 is connected to the side of the brush mounting part 1003 facing the circuit board 1. The end of the rotating shaft 903 away from the heat-conducting component 5 is rotatably connected to the bracket 3.

[0046] In this embodiment, when the heat-conducting component 5 moves up and down, the rotating shaft 903 starts to rotate. Since the slider 1001 is threadedly engaged with the rotating shaft 903, the slider 1001 moves back and forth on the rotating shaft 903 during the rotation of the rotating shaft 903, thereby driving the connecting rod 1002 to move back and forth along the axial direction of the rotating shaft 903. Consequently, the brush mounting part 1003 also moves back and forth. The final result is that the brush 1004 sweeps back and forth on the circuit board 1, thereby removing the dust on the circuit board 1.

[0047] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A chip heat dissipation device for dissipating heat from a chip (2) mounted on a circuit board (1), characterized in that, include: A bracket (3) is fixed to the side of the circuit board (1) that connects to the chip (2); A coolant tank (4) is disposed on the side of the bracket (3) away from the chip (2); A heat-conducting component (5) is disposed directly above the chip (2); A driving component (6) is disposed between the bracket (3) and the heat-conducting component (5), and the driving component (6) is fixed to the side of the bracket (3) facing the chip (2), and the output end of the driving component (6) is connected to the heat-conducting component (5); A spraying mechanism (7) is disposed between the coolant tank (4) and the heat-conducting component (5). The spraying mechanism (7) sprays the coolant in the coolant tank (4) onto the side of the heat-conducting component (5) away from the chip (2).

2. The chip heat dissipation device according to claim 1, characterized in that, The support (3) includes: Two upright plates (301) are fixed to one side of the circuit board (1) connected to the chip (2), and the two upright plates (301) are located on both sides of the chip (2); The top plate (302) is connected to the end of the two upright plates (301) away from the circuit board (1); The coolant tank (4) is connected to the top plate (302) on the side away from the chip (2), the spray mechanism (7) passes through the top plate (302) and communicates with the coolant tank (4), and the drive unit (6) is fixed to the top plate (302) on the side facing the chip (2).

3. The chip heat dissipation device according to claim 1, characterized in that, The heat-conducting component (5) includes: A heat-conducting plate (501) is connected to the output end of the driving component (6), and the heat-conducting plate (501) is connected to the spraying mechanism (7) so that the spraying mechanism (7) sprays normally; Multiple baffles (502) are disposed on the side of the heat-conducting plate (501) away from the chip (2), and the multiple baffles (502) are located on the outer periphery of the heat-conducting plate (501).

4. The chip heat dissipation device according to claim 1, characterized in that, There are two coolant tanks (4) and two sets of spraying mechanisms (7), with each set of spraying mechanisms (7) corresponding to one of the two coolant tanks (4). Each of the coolant tanks (4) is provided with a filling port (8).

5. The chip heat dissipation device according to claim 4, characterized in that, The spraying mechanism (7) includes: Both storage tanks (701) are connected to the corresponding coolant tanks (4) via pipes; Two push rod mechanisms (702) are fixed at one end to the heat-conducting component (5) and slidably fitted at the other end into the corresponding liquid storage tank (701); A spray pipe (703) is connected between the two liquid storage tanks (701) and communicates with the two liquid storage tanks (701); Multiple spray heads (704) are evenly arranged on the spray pipe (703), and the liquid outlet ends of the multiple spray heads (704) are all facing the heat-conducting component (5).

6. The chip heat dissipation device according to claim 5, characterized in that, The push rod mechanism (702) includes: Push rod (705), one end of which is fixed to the heat-conducting component (5); The mating disc (706) is connected to the other end of the push rod (705), and the mating disc (706) is slidably mated with the liquid storage tank (701).

7. The chip heat dissipation device according to claim 1, characterized in that, The chip heat dissipation device also includes: Two sets of blower mechanisms (9) are respectively arranged on both sides of the length direction of the heat-conducting component (5). The blower mechanisms (9) are used to dry the coolant on the surface of the heat-conducting component (5).

8. The chip heat dissipation device according to claim 7, characterized in that, The blower mechanism (9) includes: A connecting part (901) is connected to one side of the heat-conducting component (5); The rotating fitting part (902) is fixed on the bracket (3); A rotating shaft (903) passes through the rotating engagement part (902) and is rotatably engaged with the rotating engagement part (902); Gear (904) is fixed to one end of the rotating shaft (903) facing the heat conductor (5); A fan (905) is fixed to the end of the rotating shaft (903) facing the heat conductor (5), and there is a gap between the fan (905) and the gear (904); A rack (906) is vertically fixed to the connecting part (901), and the rack (906) meshes with the gear (904).

9. The chip heat dissipation device according to claim 8, characterized in that, The chip heat dissipation device also includes: A dust removal mechanism (10) is movably mounted on the rotating shaft (903) and is used to clean the dust on the circuit board (1).

10. The chip heat dissipation device according to claim 9, characterized in that, The dust removal mechanism (10) includes: The slider (1001) is threadedly engaged with the rotating shaft (903); The connecting rod (1002) is fixed at one end to the slider (1001); The brush mounting part (1003) is connected to the other end of the connecting rod (1002); A brush (1004) is connected to the side of the brush mounting part (1003) facing the circuit board (1); The end of the rotating shaft (903) away from the heat-conducting component (5) is rotatably connected to the bracket (3).

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