Gluing platform and gluing equipment

Abstract

The utility model discloses a gluing platform and gluing equipment, and relates to the technical field of semiconductor equipment. The gluing platform comprises a first mold and a second mold, the first mold comprises a mounting base, a lifting shaft and a rotating disc, the lifting shaft and the rotating disc are arranged on the mounting base, the rotating disc is coaxially arranged on the outer side of the lifting shaft, the second mold comprises a placing platform, a connecting hole and a chuck, the connecting hole and the chuck are arranged on the placing platform, and the chuck is coaxially arranged on the outer side of the connecting hole; wherein the first mold and the second mold are oppositely arranged, the lifting shaft is fixedly mounted in the connecting hole, a to-be-coated wafer is placed on the placing platform, and the lifting shaft rotates relative to the mounting base so as to drive the to-be-coated wafer to synchronously rotate through the placing platform; the lifting shaft descends or ascends, the first mold and the second mold are close to or far away from each other, and the turntable is clamped with or separated from the chuck, so that the rotating radius of the wafer to be coated is adjusted. The gluing platform solves the problem that residual glue exists on the edge of a wafer due to the action of centrifugal force in the photoresist spin-coating process in the prior art.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a coating platform and coating equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, photoresist spin coating is an important step in the photolithography process. It is usually carried out by spin coating. The coating process uses the centrifugal force during rotation to make the photoresist move to the periphery of the workpiece, and finally form a photoresist layer with uniform thickness.

[0003] In the traditional photoresist spin coating process, when the photoresist is applied to the wafer surface and rotated to achieve uniform coating, the photoresist is thrown to the edge of the wafer due to centrifugal force, resulting in photoresist residue on the wafer edge. This adversely affects subsequent wafer-based photolithography and other processes. Therefore, it is urgent to solve this problem to improve the coating quality. Utility Model Content

[0004] The purpose of this application is to provide a photoresist coating platform and coating equipment to solve the problem of residual photoresist at the wafer edge due to centrifugal force during the spin coating process in the prior art.

[0005] The embodiments of this application are implemented as follows:

[0006] A first aspect of this application provides a photoresist coating platform, including a first mold and a second mold. The first mold includes a mounting base, a lifting shaft and a turntable disposed on the mounting base, the turntable being coaxially disposed outside the lifting shaft. The second mold includes a placement platform, a connecting hole and a chuck disposed on the placement platform, the chuck being coaxially disposed outside the connecting hole. The first mold and the second mold are arranged opposite to each other. The lifting shaft is fixedly installed in the connecting hole. A wafer to be coated is placed on the placement platform. The lifting shaft rotates relative to the mounting base to drive the wafer to be coated to rotate synchronously via the placement platform. The lifting shaft lowers or raises, the first mold moves closer to or further away from the second mold, and the turntable engages or disengages with the chuck to adjust the rotation radius of the wafer to be coated. This photoresist coating platform solves the problem of residual photoresist at the wafer edge due to centrifugal force during the spin coating process in the prior art.

[0007] In one possible implementation, the turntable is provided with a first locking part, and the chuck is provided with a second locking part corresponding to the first locking part. The first locking part and the second locking part are locked together, so that the turntable and the chuck are locked together.

[0008] In one possible implementation, the number of the first snap-fit ​​portion and the number of the second snap-fit ​​portion are equal.

[0009] In one possible implementation, there are multiple first locking parts, which are evenly distributed along the circumference of the turntable; there are also multiple second locking parts, which are evenly distributed along the circumference of the chuck.

[0010] In one possible implementation, the first latching portion is a protrusion, and the second latching portion is a groove corresponding to the protrusion; or, the first latching portion is a groove, and the second latching portion is a protrusion corresponding to the groove.

[0011] In one possible implementation, the number of turntables is equal to the number of chucks, and the diameter and height of the turntables are equal to the diameter and height of the chucks.

[0012] In one possible implementation, there are multiple turntables, and the multiple turntables are arranged sequentially along the radial and axial directions of the lifting shaft; there are multiple chucks, and the multiple chucks are arranged sequentially along the radial and axial directions of the connecting hole.

[0013] In one possible implementation, the distance between two adjacent turntables is equal, and the distance between two adjacent chucks is equal.

[0014] In one possible implementation, a bushing is provided on the mounting base, and the lifting shaft is rotatably mounted on the mounting base via the bushing.

[0015] A second aspect of this application provides a photoresist coating apparatus, including the aforementioned coating platform. This coating platform solves the problem in the prior art where residual photoresist remains at the wafer edge due to centrifugal force during the spin coating process.

[0016] The beneficial effects of the embodiments of this application include:

[0017] The coating platform includes a first mold and a second mold. The first mold includes a mounting base, a lifting shaft and a turntable mounted on the mounting base, with the turntable coaxially positioned outside the lifting shaft. The second mold includes a placement platform, a connecting hole and a chuck mounted on the placement platform, with the chuck coaxially positioned outside the connecting hole. The first and second molds are positioned opposite each other. The lifting shaft is fixedly mounted in the connecting hole. The wafer to be coated is placed on the placement platform, and the lifting shaft rotates relative to the mounting base to drive the wafer to rotate synchronously via the placement platform. Lowering or raising the lifting shaft moves the first and second molds closer or further apart, and the turntable engages or disengages with the chuck to adjust the rotation radius of the wafer to be coated. The coating platform provided in this application, by adjusting the height of the lifting shaft, allows the turntable to engage or disengage with the chuck, thereby changing the rotation radius of the wafer to be coated. According to the centripetal force formula F = mw... 2 With a fixed rotational speed w, reducing the rotation radius r increases the required centripetal force F, thus more effectively confining the photoresist and preventing it from being flung to the wafer edge under centrifugal force. This reduces residual photoresist, improves the quality and precision of photoresist spin coating, and facilitates subsequent photolithography processes. Simultaneously, the engagement or disengagement of the turntable and chuck is controlled by raising and lowering the lifting shaft, thereby adjusting the rotation radius of the wafer to be coated. The operation is relatively simple and convenient. Operators can flexibly adjust the rotation radius according to actual coating needs and photoresist characteristics to achieve optimal coating results, making it suitable for different types and viscosities of photoresist and wafers of different sizes. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is one of the structural schematic diagrams of the adhesive application platform provided in the embodiments of this application;

[0020] Figure 2 This is a second schematic diagram of the structure of the adhesive application platform provided in the embodiments of this application;

[0021] Figure 3 A schematic diagram of the structure of the first mold provided in the embodiments of this application;

[0022] Figure 4 A schematic diagram of the structure of the second mold provided in an embodiment of this application.

[0023] Icons: 100-Glue application platform; 10-First mold; 11-Mounting base; 12-Lifting shaft; 13-Turntable; 131-First snap-fit ​​part; 13A-First turntable; 13B-Second turntable; 14-Shaft sleeve; 20-Second mold; 21-Placement platform; 22-Connecting hole; 23-Chuck; 231-Second snap-fit ​​part; 23A-First chuck; 23B-Second chuck. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0029] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] Please refer to the reference. Figures 1 to 4 This application provides a coating platform 100, including a first mold 10 and a second mold 20. The first mold 10 includes a mounting base 11, a lifting shaft 12 and a turntable 13 disposed on the mounting base 11, with the turntable 13 coaxially disposed on the outside of the lifting shaft 12. The second mold 20 includes a placement platform 21, a connecting hole 22 and a chuck 23 disposed on the placement platform 21, with the chuck 23 coaxially disposed on the outside of the connecting hole 22. The first mold 10 and the second mold 20 are arranged opposite to each other. The lifting shaft 12 is fixedly installed in the connecting hole 22. The wafer to be coated is placed on the placement platform 21, and the lifting shaft 12 rotates relative to the mounting base 11 to drive the wafer to be coated to rotate synchronously through the placement platform 21. The lifting shaft 12 is lowered or raised, the first mold 10 and the second mold 20 are brought closer or farther apart, and the turntable 13 is engaged or disengaged from the chuck 23 to adjust the rotation radius of the wafer to be coated. This photoresist coating platform 100 solves the problem of residual photoresist at the wafer edge due to centrifugal force during the spin coating process in existing technologies.

[0031] It should be noted that, as Figure 1 and Figure 2 As shown, the adhesive application platform 100 includes a first mold 10 and a second mold 20, wherein, as Figure 3 As shown, in the first mold 10, the mounting base 11 serves as the support for the entire adhesive application platform 100, providing a stable mounting foundation for other components. The lifting shaft 12 is rotatably mounted on the mounting base 11, allowing the lifting shaft 12 to rotate relative to the mounting base 11. The turntable 13 is fixedly mounted on the mounting base 11, and the turntable 13 is coaxially arranged with the lifting shaft 12, surrounding the outside of the lifting shaft 12. Figure 4 As shown, in the second mold 20, the placement platform 21 is used to place the wafer to be coated. The connection hole 22 and the chuck 23 are fixedly disposed on the placement platform 21. The chuck 23 is coaxially arranged with the connection hole 22 and surrounds the outside of the connection hole 22.

[0032] like Figure 1 and Figure 2As shown, during operation, the first mold 10 and the second mold 20 are first arranged opposite each other, with the mounting base 11 of the first mold 10 facing downwards and the placement platform 21 of the second mold 20 facing upwards. The lifting shaft 12 is inserted and fixed in the connecting hole 22. After the wafer to be coated is placed on the placement platform 21, the lifting shaft 12 is started to rotate relative to the mounting base 11. Since the lifting shaft 12 and the placement platform 21 are connected through the connecting hole 22, the placement platform 21 will rotate synchronously with the rotation of the lifting shaft 12, thereby driving the wafer to be coated to rotate together. At this time, the photoresist spin coating operation can be performed. During the spin coating process, by controlling the lifting of the lifting shaft 12, the distance between the first mold 10 and the second mold 20 can be changed. When the lifting shaft 12 is lowered, the first mold 10 and the second mold 20 are closer, and the turntable 13 and the chuck 23 can be engaged. When the lifting shaft 12 is raised, the first mold 10 and the second mold 20 are further apart, and the turntable 13 and the chuck 23 can be separated, thereby realizing the adjustment of the rotation radius of the wafer to be coated.

[0033] In existing photoresist spin coating processes, centrifugal force causes the photoresist to move towards the wafer edge, resulting in residual photoresist. The coating platform 100 provided in this application, by adjusting the height of the lifting shaft 12, allows the turntable 13 to engage or disengage from the chuck 23, thereby changing the rotation radius of the wafer to be coated. According to the centripetal force formula F = mw... 2 With a fixed rotational speed w, reducing the rotation radius r increases the required centripetal force F, thus more effectively confining the photoresist and preventing it from being flung to the wafer edge under centrifugal force. This reduces residual photoresist, improves the quality and precision of photoresist spin coating, and facilitates subsequent photolithography processes. Simultaneously, the lifting shaft 12 controls the engagement or disengagement of the turntable 13 and chuck 23, thereby adjusting the rotation radius of the wafer to be coated. The operation is relatively simple and convenient; operators can flexibly adjust the rotation radius according to actual coating requirements and photoresist characteristics to achieve optimal coating results. This makes it suitable for different types and viscosities of photoresist and wafers of different sizes.

[0034] As one possible implementation method, such as Figure 1 and Figure 2 As shown, the turntable 13 is provided with a first locking part 131, and the chuck 23 is provided with a second locking part 231 corresponding to the first locking part 131. The first locking part 131 and the second locking part 231 are locked together, so that the turntable 13 and the chuck 23 are locked together.

[0035] It should be noted that, as Figure 3 As shown, a first latching part 131 is provided on the turntable 13, such as Figure 4As shown, a second engaging part 231 is provided on the chuck 23 corresponding to the first engaging part 131. In this way, when it is necessary to engage the turntable 13 and the chuck 23, by engaging the first engaging part 131 and the second engaging part 231 together, the turntable 13 and the chuck 23 can be stably connected, making the turntable 13 and the chuck 23 form a whole, thereby changing the connection state and related mechanical properties (such as the rotation radius) of the entire rotating system, and thus adjusting the rotation radius of the wafer to be coated.

[0036] In one possible implementation, the number of first engaging portions 131 and the number of second engaging portions 231 are equal. This means that the components for engaging with each other on the turntable 13 and the chuck 23 are in one-to-one correspondence. For example, such as Figure 3 and Figure 4 As shown, in this embodiment, the turntable 13 is provided with four first latching parts 131, and the chuck 23 is provided with four matching second latching parts 231. During the latching process, each first latching part 131 can accurately engage with the corresponding second latching part 231, so that the centrifugal force generated by the wafer rotation can be evenly distributed at each latching position, and the entire connection structure will not skew or wobble during rotation.

[0037] As one possible implementation method, such as Figure 3 As shown, there are multiple first locking portions 131, which are evenly distributed along the circumference of the turntable 13; correspondingly, as... Figure 4 As shown, there are multiple second locking parts 231, and the multiple second locking parts 231 are evenly distributed along the circumference of the chuck 23.

[0038] It should be noted that, as Figure 3 As shown, the turntable 13 is provided with a plurality of first engaging portions 131, and these first engaging portions 131 are evenly distributed along the circumference of the turntable 13; as Figure 4 As shown, the chuck 23 is provided with a plurality of second latching portions 231, and these second latching portions 231 are evenly distributed along the circumference of the chuck 23. When the turntable 13 and the chuck 23 are latched, each first latching portion 131 can accurately find its corresponding second latching portion 231, improving the stability and reliability of the connection structure. Since the first latching portions 131 and the second latching portions 231 are evenly distributed along the circumference, the centrifugal force generated by the wafer rotation can be evenly distributed to each latching position.

[0039] In the connection design of the turntable 13 and chuck 23 of the adhesive application platform 100, a concave-convex mating snap-fit ​​method is adopted. As one possible implementation method, such as... Figure 1As shown, in this embodiment, the first latching portion 131 is a protrusion and the second latching portion 231 is a groove corresponding to the protrusion; or, in other embodiments, the first latching portion 131 is a groove and the second latching portion 231 is a protrusion corresponding to the groove.

[0040] It should be noted that when the protrusions and grooves engage, they form a tight fit. During the operation of the coating platform 100, especially when the wafer rotates at high speed and generates significant centrifugal force, this interlocking structure effectively prevents relative displacement between the turntable 13 and the chuck 23, thereby ensuring the stability of the coating process.

[0041] As one possible implementation method, such as Figure 3 and Figure 4 As shown, the number of turntables 13 is equal to the number of chucks 23, and the diameter and height of the turntables 13 are equal to the diameter and height of the chucks 23. This means that there is a one-to-one correspondence between the turntables 13 and the chucks 23, and the overall shape and size of the turntables 13 and the chucks 23 are consistent.

[0042] As one possible implementation method, such as Figure 3 As shown, there are multiple turntables 13, and these multiple turntables 13 are arranged sequentially along the radial and axial directions of the lifting shaft 12; correspondingly, as... Figure 4 As shown, there are multiple chucks 23, and the multiple chucks 23 are arranged sequentially along the radial and axial directions of the connecting hole 22.

[0043] For example, such as Figure 3 As shown, in this embodiment, the mounting base 11 is provided with two turntables 13, which are the first turntable 13A and the second turntable 13B respectively, arranged radially from the inside to the outside along the lifting shaft 12; Figure 4 As shown, the placement platform 21 is provided with two chucks 23, which are the first chuck 23A and the second chuck 23B respectively, arranged radially from the inside to the outside along the connection hole 22.

[0044] After the spin coating process reaches a certain stage, the first deceleration begins, lowering the height of the lifting shaft 12. During this process, the first chuck 23A in the second mold 20 engages with the first turntable 13A in the first mold 10, thereby changing the structure of the entire rotating system and causing the rotation radius to change. Subsequently, a second deceleration can be performed, lowering the height of the lifting shaft 12 again. During this process, the second chuck 23B in the second mold 20 engages with the second turntable 13B in the first mold 10, thereby changing the rotation radius again.

[0045] As one possible implementation method, such as Figure 3 and Figure 4As shown, the spacing between two adjacent turntables 13 is equal, and the spacing between two adjacent chucks 23 is equal. During the coating process, the centrifugal force and other forces generated by the wafer rotation are transmitted to the entire coating platform 100 structure through the turntables 13 and chucks 23. When the spacing between adjacent turntables 13 and chucks 23 is equal, these forces can be more evenly distributed across the entire coating platform 100.

[0046] As one possible implementation method, such as Figure 1 As shown, a bushing 14 is provided on the mounting base 11, and the lifting shaft 12 is rotatably mounted on the mounting base 11 through the bushing 14, so that the lifting shaft 12 can rotate flexibly on the mounting base 11 and maintain a relatively stable position during the rotation.

[0047] This application also provides an adhesive application apparatus, including the adhesive application platform 100 described above. Since the structure and beneficial effects of the adhesive application platform 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0048] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0049] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A glue-applying platform, characterized in that, The first mold includes a first mold and a second mold. The first mold includes a mounting base, a lifting shaft and a turntable disposed on the mounting base, and the turntable is coaxially disposed on the outside of the lifting shaft. The second mold includes a placement platform, a connecting hole and a chuck disposed on the placement platform, and the chuck is coaxially disposed on the outside of the connecting hole. The first mold and the second mold are arranged opposite to each other, the lifting shaft is fixedly installed in the connecting hole, the wafer to be coated is placed on the placement platform, and the lifting shaft rotates relative to the mounting base so as to drive the wafer to be coated to rotate synchronously through the placement platform; The lifting shaft is lowered or raised, the first mold and the second mold are brought closer or further apart, and the turntable is engaged or disengaged from the chuck to adjust the rotation radius of the wafer to be coated.

2. The adhesive application platform according to claim 1, characterized in that, The turntable is provided with a first locking part, and the chuck is provided with a second locking part corresponding to the first locking part. The first locking part and the second locking part are locked together, so that the turntable and the chuck are locked together.

3. The adhesive application platform according to claim 2, characterized in that, The number of the first latching parts is equal to the number of the second latching parts.

4. The adhesive application platform according to claim 3, characterized in that, The number of first locking parts is multiple, and the multiple first locking parts are evenly distributed along the circumference of the turntable; the number of second locking parts is multiple, and the multiple second locking parts are evenly distributed along the circumference of the chuck.

5. The adhesive application platform according to any one of claims 2 to 4, characterized in that, The first latching part is a protrusion, and the second latching part is a groove corresponding to the protrusion; or, the first latching part is a groove, and the second latching part is a protrusion corresponding to the groove.

6. The adhesive application platform according to claim 1, characterized in that, The number of turntables is equal to the number of chucks, and the diameter and height of the turntables are equal to the diameter and height of the chucks.

7. The adhesive application platform according to claim 6, characterized in that, The number of turntables is multiple, and the multiple turntables are arranged sequentially along the radial and axial directions of the lifting shaft; the number of chucks is multiple, and the multiple chucks are arranged sequentially along the radial and axial directions of the connecting hole.

8. The adhesive application platform according to claim 7, characterized in that, The distance between two adjacent turntables is equal, and the distance between two adjacent chucks is equal.

9. The adhesive application platform according to claim 1, characterized in that, A bushing is provided on the mounting base, and the lifting shaft is rotatably mounted on the mounting base through the bushing.

10. An adhesive coating device, characterized in that, Includes the adhesive application platform as described in any one of claims 1 to 9.

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