Flip chip cleaning device and cleaning equipment
By designing a flip chip cleaning device and utilizing the water inlet and outlet structure, the problem of residual flux on the bottom bumps of flip chips and water stains on the substrate surface was solved, achieving a more thorough cleaning effect and higher cleaning efficiency.
Patent Information
- Application Number
- CN202423241105.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-26
AI Technical Summary
In advanced packaging technology, flux residue on the bottom bumps of flip chips is difficult to clean, and water stains are easily left on the substrate surface, affecting the cleaning quality.
Design a flip chip cleaning device, including a cleaning base and a peripheral wall. A slot is provided for substrate positioning. The peripheral wall is provided with a water inlet hole to fully clean the bottom bumps of the flip chip. The bottom wall is provided with a drain hole to quickly discharge the cleaning solution. It can be used in conjunction with a water washing machine to achieve thorough cleaning.
It improves the cleaning effect of the bottom bumps of flip chips, reduces residual water stains on the substrate surface, and improves cleaning quality and efficiency.
Smart Images
Figure CN223832967U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor cleaning equipment technology, and in particular to a flip chip cleaning device and cleaning equipment. Background Technology
[0002] Advanced packaging technologies, such as 2.5D or 3D packaging, integrate multiple flip chips with different functions onto a single substrate. The large number of flip chip bumps on the substrate, and the smaller the gaps between the bottom bumps, pose significant challenges to cleaning residual flux from the bottom bumps after flipping the chips. Additionally, water washing of the packaged products can leave water stains on the substrate surface. Utility Model Content
[0003] The purpose of this invention is to provide a flip chip cleaning device and cleaning equipment, which is beneficial for thoroughly cleaning flux and other residues on the bottom bumps of flip chips, and can reduce residual cleaning liquid on the substrate surface, thereby improving the cleaning quality.
[0004] In a first aspect, this utility model provides a flip chip cleaning device for cleaning the solder joints between a flip chip and a substrate; the flip chip cleaning device includes:
[0005] A cleaning base, the cleaning base including a bottom wall and a peripheral side wall connected to the bottom wall;
[0006] The peripheral sidewall is provided with a slot for placing the substrate; wherein, a flip chip is mounted on the side of the substrate away from the bottom wall;
[0007] The bottom wall is provided with drainage holes;
[0008] The peripheral sidewall is provided with a first water inlet hole, which is located on the side of the slot away from the bottom wall.
[0009] In an optional embodiment, the bottom wall is provided with a plurality of drainage holes, which are evenly distributed on the bottom wall.
[0010] In an optional embodiment, a preset gap exists between the drain hole and the slot in the extending direction of the peripheral sidewall.
[0011] In an optional embodiment, the first water inlet hole penetrates the peripheral sidewall in the thickness direction.
[0012] In an optional embodiment, the bottom wall and the peripheral sidewall together form an accommodating cavity; the peripheral sidewall has a protrusion at one end away from the bottom wall, and the protrusion extends toward the side closer to the accommodating cavity.
[0013] In an optional embodiment, the protrusion is provided with a second water inlet.
[0014] In an optional embodiment, the second water inlet hole penetrates the protrusion in the thickness direction of the peripheral sidewall.
[0015] In an alternative embodiment, in the extending direction of the peripheral sidewall, the surface of the protrusion away from the bottom wall is higher than the surface of the flip chip away from the bottom wall.
[0016] Secondly, this utility model provides a cleaning device, including a washing machine and a flip chip cleaning device as described in any of the foregoing embodiments, wherein the flip chip is in a cleaning state and the flip chip cleaning device is disposed in the washing machine.
[0017] In an optional embodiment, a mesh bag is also included, in which the flip-chip cleaning device is disposed.
[0018] The flip chip cleaning device and cleaning equipment provided in this embodiment of the utility model have the following advantages:
[0019] The flip chip cleaning device provided in this embodiment features a slot on the peripheral wall of the cleaning base to hold and limit the substrate, making it easy to operate, reliable in structure, and less prone to shaking during cleaning. A first water inlet hole on the peripheral wall allows cleaning fluid to fully enter the bumps on the bottom of the flip chip, rinsing away residual flux and other contaminants, resulting in a more thorough cleaning and improved cleaning effect. A drain hole on the bottom wall allows for timely drainage of cleaning fluid, reducing residual cleaning fluid or water stains on the substrate surface.
[0020] The cleaning equipment provided in this embodiment includes a water washing machine and the above-mentioned flip chip cleaning device, which provides thorough cleaning, high cleaning efficiency, and helps to improve cleaning quality. Attached Figure Description
[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0022] Figure 1 A schematic diagram illustrating the application scenario of the flip chip cleaning device provided in this embodiment of the utility model;
[0023] Figure 2 A schematic diagram of the flip chip cleaning apparatus provided in an embodiment of this utility model;
[0024] Figure 3 This is a structural schematic diagram of the flip chip cleaning device provided in an embodiment of the present invention from another perspective.
[0025] Icons: 110-Cleaning base; 111-Bottom wall; 112-Drain hole; 113-Side wall; 114-Card slot; 115-First water inlet hole; 116-Protrusion; 117-Second water inlet hole; 118-Accommodation cavity; 200-Flip chip; 210-Bump; 300-Substrate. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0030] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0031] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0032] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0033] After the flip chip is soldered to the substrate, flux residue remains on the bottom bumps of the flip chip. Subsequent processes require cleaning to remove this flux and other residues. This invention provides a flip chip cleaning device for cleaning the solder joints between the flip chip and the substrate, primarily removing residual flux and other contaminants.
[0034] Combination Figures 1 to 3 The flip chip cleaning device includes a cleaning base 110, which includes a bottom wall 111 and a peripheral sidewall 113 connected to the bottom wall 111. A slot 114 is provided on the peripheral sidewall 113 for placing a substrate 300; wherein a flip chip 200 is mounted on the side of the substrate 300 away from the bottom wall 111. A drain hole 112 is provided on the bottom wall 111. A first water inlet hole 115 is provided on the peripheral sidewall 113, located on the side of the slot 114 away from the bottom wall 111. The slot 114 on the peripheral sidewall 113 of the cleaning base 110 is used to place the substrate 300 and limit its position, making operation convenient, the structure reliable, and preventing shaking during the cleaning process. By providing a first water inlet hole 115 on the peripheral sidewall 113, the cleaning fluid can fully enter the bump 210 at the bottom of the flip chip 200, rinsing away residual flux and other contaminants on the bottom bump 210, resulting in a more thorough cleaning and improved cleaning effect. Furthermore, a drain hole 112 is provided on the bottom wall 111 to promptly drain the cleaning fluid, reducing residual cleaning fluid or water stains on the surface of the substrate 300.
[0035] The bottom wall 111 is provided with multiple drainage holes 112, which are evenly distributed on the bottom wall 111. This can accelerate the drainage of cleaning fluid or water, which helps to reduce water stains on the surface of the substrate 300. It can be understood that this is mainly used to reduce water stains on the side of the substrate 300 away from the flip chip 200.
[0036] Optionally, a preset gap is provided between the drain hole 112 and the slot 114 in the extending direction of the peripheral sidewall 113. This arrangement allows the substrate 300 to be held within the slot 114. The preset gap between the drain hole 112 and the slot 114, i.e., between the drain hole 112 and the substrate 300, allows for rapid drainage of liquid after cleaning, reducing water residue on the back of the substrate 300. This preset gap can be flexibly set according to actual conditions, such as 2mm, 3mm, 5mm, 8mm, 10mm, etc., and is not specifically limited here.
[0037] Optionally, the first water inlet 115 penetrates the peripheral sidewall 113 in the thickness direction. This arrangement facilitates the entry of cleaning fluid into the bump 210 at the bottom of the flip chip 200, thereby cleaning the flux and other substances at the bump 210 and improving the cleaning quality.
[0038] It is understood that there can be multiple first water inlets 115, arranged circumferentially along the peripheral sidewall 113, allowing water to enter from various directions to the bump 210 at the bottom of the flip chip 200 for more thorough and complete cleaning. The size and shape of the first water inlets 115 can be flexibly arranged according to actual conditions, and no specific limitation is made here.
[0039] Optionally, the bottom wall 111 and the peripheral sidewall 113 together form an accommodating cavity 118. The substrate 300 and the flip chip 200 are located within this accommodating cavity 118. The substrate 300 is positioned within the slot 114 for limiting its location. A protrusion 116 is provided at the end of the peripheral sidewall 113 away from the bottom wall 111, extending towards the side closest to the accommodating cavity 118. The protrusion 116 protects the surface of the flip chip 200. During the cleaning process, a mesh bag presses against the surface of the flip chip 200, causing it to move. Without the protrusion 116, the mesh bag would directly press against the surface of the flip chip 200, easily scratching the chip surface during movement. In this embodiment, the protrusion 116 ensures that the mesh bag contacts the protrusion 116, reducing the risk of the flip chip 200 surface being scratched by the mesh bag.
[0040] The protrusion 116 can be an annular protrusion 116, that is, a continuous ring is arranged along the circumference of the peripheral sidewall 113. Alternatively, in some embodiments, there can be multiple protrusions 116, which are spaced apart along the circumference of the peripheral sidewall 113, and each protrusion 116 is arc-shaped. The extension length of the protrusion 116 into the accommodating cavity 118 can be flexibly set according to the actual situation, and is not specifically limited here.
[0041] Optionally, the protrusion 116 is provided with a second water inlet 117. The second water inlet 117 penetrates the protrusion 116 in the thickness direction of the peripheral sidewall 113. The provision of the second water inlet 117 can increase the liquid inlet volume and improve the liquid inlet speed, thereby facilitating thorough cleaning of the bumps 210 on the bottom of the flip chip 200 and improving cleaning efficiency and quality.
[0042] Optionally, in the extending direction of the peripheral sidewall 113, the surface of the protrusion 116 away from the bottom wall 111 is higher than the surface of the flip chip 200 away from the bottom wall 111. This arrangement can better prevent the mesh bag from scratching the chip surface and provide better protection for the flip chip 200.
[0043] This utility model embodiment also provides a cleaning device, including a water washing machine and the aforementioned flip chip cleaning device. When the flip chip 200 is in the cleaning state, the flip chip cleaning device is disposed in the water washing machine.
[0044] Optionally, the cleaning equipment also includes a mesh bag in which the flip chip cleaning device is housed. This arrangement facilitates the movement of the flip chip cleaning device within the washing machine to rinse away flux and other materials from the bottom bumps 210 of the chip, and also facilitates the placement and removal of the flip chip cleaning device from the washing machine.
[0045] In summary, the flip chip cleaning apparatus and cleaning equipment provided in this embodiment of the present invention have the following beneficial effects, including:
[0046] The flip chip cleaning apparatus provided in this embodiment of the invention features a slot 114 on the peripheral sidewall 113 of the cleaning base 110 to hold the substrate 300 and limit its position. This design is convenient to operate, has a reliable structure, and prevents the substrate from shaking during cleaning. A first water inlet hole 115 on the peripheral sidewall 113 allows the cleaning fluid to fully enter the bumps 210 at the bottom of the flip chip 200, rinsing away residual flux and other contaminants, resulting in a more thorough cleaning and improved cleaning effect. A drain hole 112 on the bottom wall 111 allows for timely drainage of the cleaning fluid, reducing residual cleaning fluid or water stains on the surface of the substrate 300.
[0047] The cleaning equipment provided in this embodiment includes a water washing machine and the above-mentioned flip chip cleaning device, which provides thorough cleaning, high cleaning efficiency, and helps to improve cleaning quality.
[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.
Claims
1. A flip chip cleaning apparatus for cleaning the solder joints between flip chips and a substrate; characterized in that, The flip chip cleaning device includes: A cleaning base, the cleaning base including a bottom wall and a peripheral side wall connected to the bottom wall; The peripheral sidewall is provided with a slot for placing the substrate; wherein, a flip chip is mounted on the side of the substrate away from the bottom wall; The bottom wall is provided with drainage holes; The peripheral sidewall is provided with a first water inlet hole, which is located on the side of the slot away from the bottom wall.
2. The flip chip cleaning apparatus according to claim 1, characterized in that, The bottom wall is provided with a plurality of drainage holes, which are evenly distributed on the bottom wall.
3. The flip chip cleaning apparatus according to claim 1, characterized in that, In the extending direction of the peripheral sidewall, there is a preset gap between the drain hole and the slot.
4. The flip chip cleaning apparatus according to claim 1, characterized in that, The first water inlet hole penetrates the peripheral sidewall in the thickness direction.
5. The flip chip cleaning apparatus according to claim 1, characterized in that, The bottom wall and the peripheral sidewall together form an accommodating cavity; the peripheral sidewall has a protrusion at the end away from the bottom wall, and the protrusion extends toward the side close to the accommodating cavity.
6. The flip chip cleaning apparatus according to claim 5, characterized in that, The protrusion is provided with a second water inlet.
7. The flip chip cleaning apparatus according to claim 6, characterized in that, The second water inlet hole penetrates the protrusion in the thickness direction of the peripheral sidewall.
8. The flip chip cleaning apparatus according to claim 5, characterized in that, In the extending direction of the peripheral sidewall, the surface of the protrusion away from the bottom wall is higher than the surface of the flip chip away from the bottom wall.
9. A cleaning device, characterized in that, The device includes a washing machine and a flip chip cleaning apparatus according to any one of claims 1 to 8, wherein the flip chip is in a cleaning state and the flip chip cleaning apparatus is disposed in the washing machine.
10. The cleaning equipment according to claim 9, characterized in that, It also includes a mesh bag, in which the flip-chip cleaning device is disposed.