Slow lifting rinse tank and slow lifting device

Abstract

The utility model relates to a slow lifting cleaning tank and a slow lifting device. The slow-lifting rinse tank comprises a tank body, a pull rod and a pull rod, wherein the tank body is provided with a rinse cavity for containing rinse liquid; the conveying assembly comprises a heat pipe, a cold pipe and a mixing pipe, one end of the mixing pipe is connected with the heat pipe and the cold pipe, so that hot cleaning liquid conveyed by the heat pipe and cold cleaning liquid conveyed by the cold pipe are mixed into mixed cleaning liquid in the mixing pipe, and the other end of the mixing pipe is communicated with the cleaning cavity; and the mixed cleaning liquid in the mixing pipe flows into the cleaning cavity along the mixing pipe. Thus, the hot cleaning liquid and the cold cleaning liquid are mixed and then injected into the cleaning cavity of the tank body, and compared with the mode that the hot cleaning liquid and the cold cleaning liquid are injected separately in the prior art, the phenomenon that the temperature difference between the area close to the injection position of the cold cleaning liquid and the area close to the injection position of the hot cleaning liquid in the cleaning cavity is large is avoided; therefore, the temperature of the cleaning liquid in the cleaning cavity of the tank body is more uniform, and the water removal effect on the silicon wafer is improved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic equipment technology, specifically to a slow-lift cleaning tank and a slow-lift device. Background Technology

[0002] In the fabrication of solar cells, silicon wafers need to be washed with water to remove impurities from their surface, and then dried for the next process. Current technology involves placing the silicon wafers in a slow-lifting tank for cleaning, followed by a robotic arm to slowly lift them to remove surface moisture, thus saving subsequent drying time. To ensure effective dehydration, precise control of the water temperature within the slow-lifting tank is necessary.

[0003] Generally, water temperature is controlled by adjusting the amount of cold and hot water injected into the slow-lifting tank. For example, if the water temperature is too high, the amount of hot water injected is reduced and the amount of cold water injected is increased; if the water temperature is too high or too low, the amount of hot water injected is increased and the amount of cold water injected is decreased. However, the water temperature near the hot water inlet in the slow-lifting tank is higher (generally more than 5°C higher), while the water temperature near the cold water inlet is lower (generally less than 5°C lower), thus forming "yin-yang water" in the tank, resulting in poor water removal effect on the silicon wafers. Utility Model Content

[0004] Therefore, it is necessary to provide a slow-lift cleaning tank and slow-lift device that can improve the uniformity of water temperature in the slow-lifting tank, avoid the occurrence of "mixed water", and thus improve the dehydration effect on silicon wafers.

[0005] A slow-lift cleaning tank, comprising:

[0006] The tank body has a cleaning chamber for holding the cleaning solution; and

[0007] The delivery assembly includes a heat pipe, a cold pipe, and a mixing pipe. One end of the mixing pipe is connected to the heat pipe and the cold pipe so that the hot cleaning fluid delivered by the heat pipe and the cold cleaning fluid delivered by the cold pipe are mixed in the mixing pipe to form a mixed cleaning fluid. The other end of the mixing pipe is connected to the cleaning chamber so that the mixed cleaning fluid in the mixing pipe flows into the cleaning chamber along the mixing pipe.

[0008] In some embodiments, the conveying assembly further includes a screw rod rotatably mounted within the mixing tube.

[0009] In some embodiments, the conveying assembly further includes a rotary drive that is driven to the auger.

[0010] In some embodiments, the delivery assembly further includes an input pipe, and the tank also has a mounting hole communicating with the cleaning chamber. The input pipe passes through the mounting hole and includes a first section located outside the tank and a second section located inside the cleaning chamber. The first section is connected to one end of the mixing pipe opposite to the hot pipe and the cold pipe.

[0011] In some embodiments, the delivery assembly further includes a branch pipe unit located within the cleaning chamber and connected to the second section;

[0012] The branch pipe unit has multiple outlets for discharging the mixed cleaning solution.

[0013] In some embodiments, the branch unit is configured as a plurality of units.

[0014] In some embodiments, of the plurality of branch units, a portion is located on one side of the second segment, and the remaining portion is located on the other side of the second segment.

[0015] In some embodiments, the branch units located on one side of the second segment and the branch units located on the other side of the second segment are arranged symmetrically relative to the second segment.

[0016] In some embodiments, the branch unit includes a connecting branch and an annular branch. One end of the connecting branch is connected to the second section, and the other end of the connecting branch is connected to the annular branch. The annular branch has a plurality of liquid outlets, which are arranged sequentially at intervals along the extension direction of the annular branch.

[0017] A slow-lifting device includes a slow-lifting mechanism and a slow-lifting cleaning tank as described in any of the above embodiments, wherein the slow-lifting mechanism is used to lift out silicon wafers from the cleaning chamber.

[0018] In actual use, the aforementioned slow-lift cleaning tank and slow-lift device first place the silicon wafer to be cleaned into the cleaning chamber and clean it using the cleaning fluid within the chamber. After cleaning, the slow-lift mechanism lifts the silicon wafer from the cleaning chamber, causing it to be removed at a certain speed, thereby achieving thermal dehydration of the silicon wafer and preventing water droplets from remaining on its surface. During this process, the hot and cold cleaning fluids are mixed by a conveying component and then injected into the cleaning chamber to ensure that the temperature of the cleaning fluid within the chamber remains stable (e.g., around 43°C). If the temperature of the cleaning fluid in the chamber is too high, the flow rate of the hot cleaning fluid delivered by the heat pipe is reduced, while the flow rate of the cold cleaning fluid delivered by the cold pipe is increased; conversely, if the temperature of the cleaning fluid in the chamber is too low, the flow rate of the hot cleaning fluid delivered by the heat pipe is increased, while the flow rate of the cold cleaning fluid delivered by the cold pipe is decreased.

[0019] In this way, the hot cleaning fluid and the cold cleaning fluid are mixed and then injected into the cleaning chamber of the tank. Compared with the existing technology that uses hot cleaning fluid and cold cleaning fluid to be injected separately, this avoids the phenomenon of large temperature difference between the area near the cold cleaning fluid injection point and the area near the hot cleaning fluid injection point in the cleaning chamber. This makes the temperature of the cleaning fluid in the cleaning chamber of the tank more uniform, which is beneficial to improving the water removal effect on the silicon wafer. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the slow-lift cleaning tank in one embodiment of this application;

[0021] Figure 2 for Figure 1 A schematic diagram of the screw rod of the conveying assembly of the slow-lift cleaning tank shown;

[0022] Figure 3 for Figure 1 The diagram shows a top view of the slow-lift cleaning tank. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0024] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0029] This application provides a slow-lifting device, including a slow-lifting mechanism and a slow-lifting cleaning tank. The slow-lifting cleaning tank is used to hold cleaning fluid, and the silicon wafers to be cleaned are cleaned in the slow-lifting cleaning tank. After cleaning, the slow-lifting mechanism lifts the silicon wafers in the slow-lifting cleaning tank, causing the silicon wafers to be pulled out of the slow-lifting cleaning tank at a certain speed. This achieves two purposes: firstly, it removes residual cleaning fluid from the surface of the silicon wafers; secondly, it thermally dehydrates the silicon wafers, preventing water droplets from remaining on the surface of the silicon wafers.

[0030] Please see Figure 1In an embodiment of this application, the slow-lift cleaning tank includes a tank body 10 and a conveying assembly 20. The tank body 10 has a cleaning chamber 13 for holding cleaning fluid A. The silicon wafer to be cleaned is placed in the cleaning chamber 13 and cleaned using the cleaning fluid A in the cleaning chamber 13. The conveying assembly 20 includes a heat pipe 21, a cold pipe 22, and a mixing pipe 23. The heat pipe 21 is used to convey a hot cleaning fluid at a higher temperature, and the cold pipe 22 is used to convey a cold cleaning fluid at a lower temperature. One end of the mixing pipe 23 is connected to the heat pipe 21 and the cold pipe 22, so that the hot cleaning fluid conveyed by the heat pipe 21 and the cold cleaning fluid conveyed by the cold pipe 22 are mixed in the mixing pipe 23 to form a mixed cleaning fluid. The other end of the mixing pipe 23 is connected to the cleaning chamber 13, so that the mixed cleaning fluid in the mixing pipe 23 flows into the cleaning chamber 13 along the mixing pipe 23.

[0031] In actual use, the aforementioned slow-lift cleaning tank first places the silicon wafer to be cleaned into the cleaning chamber 13 and cleans it using the cleaning solution within the chamber 13. After cleaning, the slow-lift mechanism lifts the silicon wafer from the cleaning chamber 13, causing it to be removed from the chamber at a certain speed, thereby achieving thermal dehydration of the silicon wafer and preventing water droplets from remaining on its surface. During this process, the hot cleaning solution and the cold cleaning solution are mixed by the conveying component 20 and then injected into the cleaning chamber 13 to ensure that the temperature of the cleaning solution in the cleaning chamber 13 remains stable (e.g., around 43°C). If the temperature of the cleaning solution A in the cleaning chamber 13 is too high, the flow rate of the hot cleaning solution delivered by the heat pipe 21 is reduced, while the flow rate of the cold cleaning solution delivered by the cold pipe 22 is increased; conversely, if the temperature of the cleaning solution A in the cleaning chamber 13 is too low, the flow rate of the hot cleaning solution delivered by the heat pipe 21 is increased, while the flow rate of the cold cleaning solution delivered by the cold pipe 22 is decreased.

[0032] In this way, the hot cleaning fluid and the cold cleaning fluid are mixed and then injected into the cleaning chamber 13 of the tank 10. Compared with the existing technology of injecting hot cleaning fluid and cold cleaning fluid separately, this avoids the phenomenon of large temperature difference between the area near the cold cleaning fluid injection position and the area near the hot cleaning fluid injection position in the cleaning chamber 13. This makes the temperature of the cleaning fluid A in the cleaning chamber 13 of the tank 10 more uniform, which is beneficial to improving the water removal effect on the silicon wafer.

[0033] It should be noted that the cleaning solution can be water, or any other solution capable of cleaning; there are no limitations on this. The aforementioned hot cleaning solution refers to a cleaning solution with a temperature higher than that of the cleaning solution in the cleaning chamber; the specific value can be set according to specific process requirements and is not limited here. The aforementioned cold cleaning solution refers to a cleaning solution with a temperature lower than that of the cleaning solution in the cleaning chamber; the specific value can be set according to specific process requirements and is not limited here.

[0034] Specifically, in this embodiment, a first regulating valve 211 is installed on the heat pipe 21 to control the flow rate of the heat pipe 21. A second regulating valve 221 is installed on the cold pipe 22 to control the flow rate of the cold pipe 22. Thus, the flow rate of the heat pipe 21 can be increased or decreased by the first regulating valve 211, and the flow rate of the cold pipe 22 can be increased or decreased by the second regulating valve 221, thereby achieving precise regulation of the temperature of the cleaning fluid A in the cleaning chamber 13. It should be noted that the first regulating valve 211 and the second regulating valve 221 can be manual valves, allowing for manual adjustment. Alternatively, the first regulating valve 211 and the second regulating valve 221 can be automatic valves (e.g., solenoid valves or pneumatic valves) for automatic adjustment; no special limitation is made here.

[0035] Furthermore, a first flow meter 213 is installed on the heat pipe 21 to detect the flow rate of the heat pipe 21 in real time. A second flow meter 223 is also installed on the heat pipe 21 to detect the flow rate of the cold pipe 22 in real time. Thus, the flow rate of the heat pipe 21 can be adjusted using the first regulating valve 211 based on the detection result of the first flow meter 213, and similarly, the flow rate of the cold pipe 22 can be adjusted using the second regulating valve 221 based on the detection result of the second flow meter 223.

[0036] In the embodiments of this application, the conveying assembly 20 further includes a screw rod 24, which is rotatably mounted inside the mixing tube 23. Thus, the hot cleaning fluid conveyed in the hot pipe 21 and the cleaning fluid conveyed in the cold pipe 22 enter the mixing tube 23, causing the screw rod 24 to rotate around its own axis under the impact of the hot and cold cleaning fluids. This stirs the cold and hot cleaning fluids, ensuring uniform mixing and further improving the temperature uniformity of the cleaning fluid in the cleaning chamber 13 of the tank 10.

[0037] It should be noted that the two ends of the screw rod 24 can be installed in the mixing tube 23 through bearings. Of course, other installation methods can also be used, as long as the screw rod 24 can rotate around its own axis under the drive of the mixed cleaning liquid. No limitation is made here.

[0038] It should also be noted that the screw 24 is not limited to rotating under the influence of the mixed cleaning fluid. In other embodiments, a power source can be configured to achieve active rotation. Specifically, the conveying assembly 20 also includes a rotary drive component, which is drivenly connected to the screw 24, enabling the rotary drive component to drive the screw 24 to rotate around its own axis, thereby stirring the mixed cleaning fluid flowing through the mixing pipe 23 and further improving the mixing uniformity of the cold and hot cleaning fluids. Optionally, the rotary drive component can be an electric motor.

[0039] Furthermore, the rotary drive is arranged outside the mixing tube 23. The output shaft of the rotary drive passes through one end of the mixing tube 23 and is fixedly connected to one end of the helical rod 24 inside the mixing tube 23, thereby transmitting the rotational motion of the output shaft of the rotary drive to the helical rod 24. It should be noted that the position where the output shaft of the rotary drive enters the mixing tube 23 can be sealed using a seal to prevent leakage of the mixed cleaning fluid from this point. The seal between the output shaft of the rotary drive and the mixing tube 23 can adopt relatively mature existing technologies, which are not limited here.

[0040] Understandably, please see Figure 2 As shown, the spiral rod 24 includes a main rod 241 and spiral blades 243 connected to the outer circumferential surface of the main rod 241. The two ends of the main rod 241 are rotatably mounted in the mixing tube 23, and the mixing cleaning liquid flowing through the mixing tube 23 is more evenly mixed under the stirring action of the spiral blades 243.

[0041] Please see Figure 3 As shown in the embodiments of this application, the conveying assembly 20 further includes an input pipe 25, and the tank 10 also has a mounting hole 15 communicating with the cleaning chamber 13. The input pipe 25 passes through the mounting hole 15 on the tank 10 and includes a first section 251 located outside the tank 10 and a second section 253 located inside the cleaning chamber 13. The first section 251 of the input pipe 25 is connected to the end of the mixing pipe 23 away from the hot pipe 21 and the cold pipe 22, so that the hot cleaning fluid conveyed by the hot pipe 21 and the cold cleaning fluid conveyed by the cold pipe 22 enter the mixing pipe 23 for mixing. The mixed cleaning fluid in the mixing pipe 23 then enters the second section 253 through the first section 251 of the input pipe 25, and the mixed cleaning fluid in the second section 253 then flows out into the cleaning chamber 13 of the tank 10.

[0042] Furthermore, the delivery assembly 20 also includes a branch pipe unit 26, which is located within the cleaning chamber 13 and connected to the second section 253 of the input pipe 25. This branch pipe unit 26 has multiple outlets for discharging the mixed cleaning solution. Thus, the mixed cleaning solution in the second section 253 of the input pipe 25 enters the cleaning chamber 13 of the tank 10 through each outlet. Utilizing multiple outlets to inject the mixed cleaning solution into the cleaning chamber 13 further improves the temperature uniformity of the cleaning solution A within the cleaning chamber 13.

[0043] It should be noted that the number of branch pipe units 26 is not limited to one. In some other embodiments, the number of branch pipe units 26 can also be multiple. All multiple branch pipe units 26 are connected to the second section 253 of the input pipe 25, thereby using more outlets to inject the mixed cleaning fluid into the cleaning chamber 13, which is beneficial to further improve the temperature uniformity of the cleaning fluid in the cleaning chamber 13.

[0044] Specifically, in this embodiment, there are multiple branch pipe units 26. Among each branch pipe unit 26, some branch pipe units 26 are arranged on one side of the second section 253 of the input pipe 25, and the remaining branch pipe units 26 are arranged on the other side of the second section 253 of the input pipe 25. That is to say, branch pipe units 26 are arranged on both opposite sides of the second section 253 of the input pipe 25, so that liquid outlets are arranged in various areas within the cleaning chamber 13, which is beneficial to further improve the temperature uniformity of the cleaning liquid A within the cleaning chamber 13 of the tank 10.

[0045] Preferably, the branch pipe units 26 located on one side of the second section 253 of the input pipe 25 and the branch pipe units 26 located on the other side of the second section 253 of the input pipe 25 are arranged symmetrically with respect to the second section 253. In this way, the liquid outlets are more evenly distributed in the cleaning chamber 13, which is beneficial to further improve the temperature uniformity of the cleaning liquid A in the cleaning chamber 13.

[0046] Specifically Figure 3 In the illustrated embodiment, two branch pipe units 26 are arranged on each side of the second segment 253 of the input pipe 25. The two branch pipe units 26 on the same side of the second segment 253 are symmetrically arranged with the two branch pipe units 26 on the other side of the second segment 253. Of course, in other embodiments, the number of branch pipe units 26 can also be two, six, eight, etc., which can be set according to the size and specifications of the cleaning chamber 13, and is not limited here.

[0047] In the embodiments of this application, the branch pipe unit 26 includes a connecting branch pipe 261 and an annular branch pipe 263. One end of the connecting branch pipe 261 is connected to the second section 253, and the other end of the connecting branch pipe 261 is connected to the annular branch pipe 263. The annular branch pipe 263 has multiple liquid outlets, which are arranged sequentially and at intervals along the extension direction of the annular branch pipe 263. Thus, the mixed cleaning fluid in the second section 253 of the input pipe 25 enters the annular branch pipe 263 through the connecting branch pipe 261, and is then output to the cleaning chamber 13 through the various liquid outlets on the annular branch pipe 263. Preferably, the liquid outlets are evenly spaced on the annular branch pipe 263, which helps to further improve the temperature uniformity of the cleaning fluid A in the cleaning chamber 13.

[0048] Furthermore, the branch pipe unit 26 includes at least two connecting branch pipes 261. Each connecting branch pipe 261 is spaced apart along the length of the second section 253 of the input pipe 25 and is connected between the second section 253 of the input pipe 25 and the annular branch pipe 263. This allows the mixed cleaning fluid in the second section 253 of the input pipe 25 to simultaneously enter the annular branch pipe 263 through each connecting branch pipe 261, and then simultaneously flow out from each outlet into the cleaning chamber 13. This makes the flow rate of each outlet more consistent, which is beneficial to further improve the temperature uniformity of the cleaning fluid A in the cleaning chamber 13.

[0049] Furthermore, the annular branch pipe 263 includes multiple peripheral branch pipes, which are connected end to end to form a ring. The shape formed by the various peripheral branch pipes can be rectangular, square, circular, elliptical, etc., and is not limited here. One end of the connecting branch pipe 261 is connected to the second segment 253, and the other end of the connecting branch pipe 261 is connected to the peripheral branch pipe closest to the second segment 253.

[0050] The branch pipe unit 26 also includes a central branch pipe 264 located inside the annular branch pipe 263. One end of the central branch pipe 264 is connected to the outermost branch pipe connection closest to the second segment 253 among all the outer branch pipes, and the other end of the central branch pipe 264 is connected to the outermost branch pipe connection furthest from the second segment 253 among all the outer branch pipes. Thus, the central branch pipe 264 allows the mixed cleaning fluid entering the annular branch pipe 263 to fill the entire annular branch pipe 263 more quickly, resulting in more uniform flow rates at each outlet and further improving the temperature uniformity of the cleaning fluid A within the cleaning chamber 13.

[0051] Furthermore, the space between the central branch pipe 264 and the two connecting branch pipes 261 is opposite, that is, the central branch pipe 264 is not opposite to the two connecting branch pipes 261 but is staggered, so as to prevent the mixed cleaning fluid in the connecting branch pipes 261 from directly entering the central branch pipe 264.

[0052] It should be noted that multiple liquid outlets can also be opened at intervals along the length of the middle branch pipe 264, so that the liquid outlets are more evenly distributed in the cleaning chamber 13, which is conducive to further improving the temperature uniformity of the cleaning fluid A in the cleaning chamber 13.

[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A slow-lift cleaning tank, characterized in that, include: The tank (10) has a cleaning chamber (13) for holding cleaning fluid; and The delivery assembly (20) includes a heat pipe (21), a cold pipe (22), and a mixing pipe (23). One end of the mixing pipe (23) is connected to the heat pipe (21) and the cold pipe (22) so that the hot cleaning fluid delivered by the heat pipe (21) and the cold cleaning fluid delivered by the cold pipe (22) are mixed in the mixing pipe (23) to form a mixed cleaning fluid. The other end of the mixing pipe (23) is connected to the cleaning chamber (13) so that the mixed cleaning fluid in the mixing pipe (23) flows into the cleaning chamber (13) along the mixing pipe (23).

2. The slow-lift cleaning tank according to claim 1, characterized in that, The conveying assembly (20) also includes a screw rod (24) which is rotatably mounted inside the mixing tube (23).

3. The slow-lift cleaning tank according to claim 2, characterized in that, The conveying assembly (20) also includes a rotary drive, which is drivenly connected to the screw rod (24).

4. The slow-lift cleaning tank according to claim 1, characterized in that, The conveying assembly (20) further includes an input pipe (25), and the tank (10) also has a mounting hole (15) communicating with the cleaning chamber (13). The input pipe (25) passes through the mounting hole (15) and includes a first section (251) located outside the tank (10) and a second section (253) located inside the cleaning chamber (13). The first section (251) is connected to one end of the mixing pipe (23) away from the heat pipe (21) and the cold pipe (22).

5. The slow-lift cleaning tank according to claim 4, characterized in that, The conveying assembly (20) further includes a branch pipe unit (26), which is located inside the cleaning chamber (13) and connected to the second section (253); The branch pipe unit (26) has multiple outlets for discharging the mixed cleaning solution.

6. The slow-lift cleaning tank according to claim 5, characterized in that, The branch pipe unit (26) is configured as multiple.

7. The slow-lift cleaning tank according to claim 6, characterized in that, Of the plurality of said branch units (26), some are located on one side of the second segment (253), and the remaining parts are located on the other side of the second segment (253).

8. The slow-lift cleaning tank according to claim 7, characterized in that, The branch pipe units (26) located on one side of the second segment (253) and the branch pipe units (26) located on the other side of the second segment (253) are arranged symmetrically with respect to the second segment (253).

9. The slow-lift cleaning tank according to claim 5, characterized in that, The branch pipe unit (26) includes a connecting branch pipe (261) and an annular branch pipe (263). One end of the connecting branch pipe (261) is connected to the second section (253), and the other end of the connecting branch pipe (261) is connected to the annular branch pipe (263). The annular branch pipe (263) has multiple liquid outlets, which are arranged sequentially at intervals along the extension direction of the annular branch pipe (263).

10. A slow lifting device, characterized in that, Includes a slow lifting mechanism and a slow lifting cleaning tank as described in any one of claims 1 to 9, wherein the slow lifting mechanism is used to lift out the silicon wafer from the cleaning chamber (13).

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