Elastic telescopic grinding brush
By designing an elastic telescopic polishing brush, the deformation problem caused by excessive contact between the polishing brush and the wafer is solved by utilizing the telescopic structure and magnetic attraction, thus improving the polishing effect and user experience.
Patent Information
- Application Number
- CN202520468066.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-03-18
AI Technical Summary
When existing polishing brushes are overly attached to the wafer, elastic deformation occurs at the surface contact points, affecting the polishing effect.
A flexible telescopic polishing brush is designed. By setting a telescopic mounting sleeve and telescopic structure on the outside of the rotating cylinder, and using the cooperation of a coil spring and a magnetic block, the brush sleeve is displaced away from the wafer after being attached to it, reducing deformation and ensuring the attachment effect. The magnetic attraction effect limits the angular displacement between the rotating cylinder and the mounting sleeve, thereby improving the polishing effect.
It effectively reduces the deformation of the brush sleeve, improves the polishing effect and user experience of the grinding brush, and ensures efficient polishing of the wafer.
Smart Images
Figure CN223834255U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of grinding brush technology, specifically to an elastic telescopic grinding brush. Background Technology
[0002] In the chemical mechanical polishing process, the wafer is mostly polished by a polishing brush. Under certain pressure and with the help of polishing fluid, the material is peeled off layer by layer from the wafer surface to achieve a highly planarized effect.
[0003] During the processing, in order to ensure the polishing effect of the polishing brush on the wafer, the polishing brush is made as close to the wafer as possible. However, excessive contact will cause elastic deformation at the contact point between the polishing brush surface and the wafer, which will cause the bumps on the polishing brush used for polishing to shift, thus affecting the polishing effect of the polishing brush.
[0004] Therefore, in order to solve the above problems, an elastic telescopic grinding brush is proposed. Utility Model Content
[0005] The purpose of this invention is to provide an elastic telescopic polishing brush to solve the problem mentioned in the background art where excessive contact causes elastic deformation at the contact point between the polishing brush surface and the wafer, which in turn causes displacement of the protrusions on the polishing brush used for polishing, thus affecting the polishing effect of the polishing brush.
[0006] To achieve the above objectives, this utility model provides the following technical solution: an elastic telescopic grinding brush, comprising: a rotating cylinder, an mounting sleeve installed on the outer side of the rotating cylinder, and a brush sleeve provided on the outer wall of the mounting sleeve;
[0007] The outer wall of the rotating cylinder is provided with a groove, and the inner wall of the mounting sleeve is provided with a cavity;
[0008] A telescopic structure is installed on the outer side of the rotating cylinder. The telescopic structure includes a coil spring, which is fixedly installed on the inner wall of the groove. A first magnetic block is provided on the outer wall of the rotating cylinder, and a second magnetic block is provided on the inner wall of the mounting sleeve.
[0009] Preferably, the cross-section of the rotating cylinder is H-shaped.
[0010] Preferably, the inner diameter of the mounting sleeve is larger than the outer diameter of the rotating cylinder.
[0011] Preferably, the cavity and the groove are aligned inside and out.
[0012] Preferably, one end of the coil spring is fixedly connected to the inner wall of the cavity.
[0013] Preferably, the first magnetic block and the second magnetic block are aligned and magnetically attracted to each other.
[0014] Compared with the prior art, the beneficial effects of this utility model are: by setting a retractable and movable mounting sleeve on the outside of the rotating cylinder, the brush sleeve can be moved away from the wafer after it is attached to the wafer, ensuring the attachment effect of the brush sleeve to the wafer, while reducing the deformation of the brush sleeve and improving the user experience of the brush sleeve.
[0015] This invention features a telescopic structure. When the rotating cylinder is brought close to the wafer, the surface of the brush sleeve adheres to the wafer. As the rotating cylinder continues to approach the wafer, the brush sleeve cannot move further due to its adherence to the wafer. Consequently, the rotating cylinder moves inside the brush sleeve, causing the axis of the rotating cylinder to shift from the axis of the brush sleeve. During this movement, the rotating cylinder causes the coil spring to elastically deform. The coil spring then acts on the brush sleeve, ensuring that the brush sleeve adheres to the wafer without deformation. This guarantees the polishing effect of the brush sleeve on the wafer. Simultaneously, the first magnetic block and the second magnetic block can magnetically attract each other, reducing the angular displacement between the rotating cylinder and the mounting sleeve when the rotating cylinder rotates and drives the brush sleeve to polish the wafer. This ensures the effective driving effect of the rotating cylinder on the brush sleeve and improves the wafer polishing experience. Attached Figure Description
[0016] Figure 1 This is a front view schematic diagram of the structure of this utility model;
[0017] Figure 2 This is an exploded view of the structure of this utility model;
[0018] Figure 3 This is a frontal sectional view of the structure of this utility model.
[0019] In the diagram: 1. Rotating cylinder; 11. Groove; 12. Mounting sleeve; 13. Cavity; 14. Brush sleeve; 2. Telescopic structure; 21. Coil spring; 22. First magnetic block; 23. Second magnetic block. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Please see Figures 1-3 An embodiment of an elastic telescopic grinding brush provided by this utility model:
[0022] The rotating cylinder 1, mounting sleeve 12, and brush sleeve 14 used in this application are products that can be purchased directly from the market. Their principles and connection methods are existing technologies well known to those skilled in the art, so they will not be described in detail here.
[0023] An elastic telescopic grinding brush includes: a rotating cylinder 1, an mounting sleeve 12 installed on the outer side of the rotating cylinder 1, and a brush sleeve 14 provided on the outer wall of the mounting sleeve 12;
[0024] A groove 11 is provided on the outer wall of the rotating cylinder 1, and a cavity 13 is provided on the inner wall of the mounting sleeve 12;
[0025] A telescopic structure 2 is installed on the outer side of the rotating cylinder 1. The telescopic structure 2 includes a coil spring 21, which is fixedly installed on the inner wall of the groove 11. A first magnetic block 22 is provided on the outer wall of the rotating cylinder 1, and a second magnetic block 23 is provided on the inner wall of the mounting sleeve 12. By providing a telescopic mounting sleeve 12 on the outer side of the rotating cylinder 1, the brush sleeve 14 can be moved away from the wafer after being attached to it, ensuring the attachment effect of the brush sleeve 14 to the wafer, while reducing the deformation of the brush sleeve 14 and improving the user experience of the brush sleeve 14.
[0026] Furthermore, the cross-section of the rotating cylinder 1 is H-shaped, and the mounting sleeve 12 can move on the outside of the rotating cylinder 1 without detaching from the outside of the rotating cylinder 1.
[0027] Furthermore, the inner diameter of the mounting sleeve 12 is larger than the outer diameter of the rotating cylinder 1, and the mounting sleeve 12 can move on the outside of the rotating cylinder 1, providing conditions for the deformation of the coil spring 21.
[0028] Furthermore, the concave cavity 13 is aligned with the groove 11 inside and out, and one end of the coil spring 21 inside the groove 11 can be aligned with the concave cavity 13.
[0029] Furthermore, one end of the coil spring 21 is fixedly connected to the inner wall of the cavity 13. When the mounting sleeve 12 approaches the wafer, the brush sleeve 14 can abut against the wafer to provide power and reduce the deformation of the brush sleeve 14, thus ensuring the polishing effect of the brush sleeve 14 on the wafer.
[0030] Furthermore, the first magnetic block 22 and the second magnetic block 23 are aligned and magnetically attracted to each other. The first magnetic block 22, together with the second magnetic block 23, can limit the angle of the brush sleeve 14 outside the rotating cylinder 1, ensuring the driving effect of the rotating cylinder 1 on the brush sleeve 14 and improving the polishing experience of the wafer.
[0031] Working principle: When the rotating cylinder 1 is brought close to the wafer, the surface of the brush sleeve 14 can adhere to the wafer. As the rotating cylinder 1 continues to approach the wafer, the brush sleeve 14 cannot move further because it adheres to the wafer. Therefore, the rotating cylinder 1 will move inside the brush sleeve 14, causing the axis of the rotating cylinder 1 to deviate from the axis of the brush sleeve 14. When the rotating cylinder 1 moves, it will drive the coil spring 21 to undergo elastic deformation. The coil spring 21 can react on the brush sleeve 14, so that the brush sleeve 14 adheres to the wafer without deformation, thereby ensuring the polishing effect of the brush sleeve 14 on the wafer. At the same time, the first magnetic block 22 can be magnetically attracted to the second magnetic block 23. When the rotating cylinder 1 rotates and drives the brush sleeve 14 to polish the wafer, it can reduce the angular displacement between the rotating cylinder 1 and the mounting sleeve 12, which can ensure the driving effect of the rotating cylinder 1 on the brush sleeve 14 and improve the polishing experience of the wafer.
[0032] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any way. Those skilled in the art can readily implement this utility model based on the accompanying drawings and the above description. However, any modifications, alterations, or equivalent variations made by those skilled in the art without departing from the scope of the utility model's technical solution, utilizing the disclosed technical content, are considered equivalent embodiments of this utility model. Furthermore, any equivalent changes, alterations, or variations made to the above embodiments based on the essential technology of this utility model are still within the protection scope of this utility model's technical solution.
Claims
1. A flexible telescopic grinding brush, comprising: A rotating cylinder (1) is provided with an installation sleeve (12) on its outer side, and a brush sleeve (14) is provided on the outer wall of the installation sleeve (12). Its features are: The outer wall of the rotating cylinder (1) is provided with a groove (11), and the inner wall of the mounting sleeve (12) is provided with a cavity (13). The outer side of the rotating cylinder (1) is equipped with a telescopic structure (2), which includes a coil spring (21). The coil spring (21) is fixedly installed on the inner wall of the groove (11). A first magnetic block (22) is provided on the outer wall of the rotating cylinder (1), and a second magnetic block (23) is provided on the inner wall of the mounting sleeve (12).
2. The elastic telescopic grinding brush according to claim 1, characterized in that: The cross-section of the rotating cylinder (1) is "H" shaped.
3. The elastic telescopic grinding brush according to claim 1, characterized in that: The inner diameter of the mounting sleeve (12) is larger than the outer diameter of the rotating cylinder (1).
4. The elastic telescopic grinding brush according to claim 1, characterized in that: The cavity (13) is aligned with the groove (11) inside and out.
5. The elastic telescopic grinding brush according to claim 1, characterized in that: One end of the coil spring (21) is fixedly connected to the inner wall of the cavity (13).
6. The elastic telescopic grinding brush according to claim 1, characterized in that: The first magnetic block (22) and the second magnetic block (23) are aligned and magnetically attracted to each other.