Seed crystal taking device

Abstract

The seed crystal sheet taking device comprises a graphite plate and a plurality of graphite blocks, and the graphite plate and the plurality of graphite blocks are used for being placed on a working platform; the graphite plate comprises a main body and a plurality of seed crystal accommodating parts, the plurality of seed crystal accommodating parts are separated from one another, each seed crystal accommodating part is provided with an inner cavity, one end, deviating from the main body, of each inner cavity is opened, one end, adjacent to the main body, of each inner cavity is closed by the surface of the main body, and an observation hole is formed in one side, facing an operator, of each seed crystal accommodating part; each seed crystal accommodating part is used for accommodating the whole corresponding seed crystal in an inner cavity of the seed crystal accommodating part, is propped against the corresponding surface of the main body and is used for being cut by a cutting tool when the seed crystal is cut and taken; each graphite block is used for extending into the corresponding seed crystal accommodating part after the whole corresponding seed crystal is accommodated in the inner cavity of the corresponding seed crystal accommodating part and pressing against one end, deviating from the main body, of the corresponding seed crystal in the left-right direction; and each seed crystal accommodating part and the corresponding graphite block are used for preventing the cut seed crystal sheets from being washed away by flushing water during seed crystal cutting and sheet taking.

Description

Technical Field

[0001] This disclosure relates to the field of crystal growth, and more specifically to a seed crystal wafer extraction device. Background Technology

[0002] The purity and dislocation density of the seed crystal's lead end affect the purity and dislocation density of the pulled single crystal. Therefore, it is necessary to take samples from each seed crystal lead end to test its purity and dislocation density.

[0003] like Figure 1 As shown, the seed crystal 300 is processed into a long strip, and wafers are taken from the corresponding lead end of the strip. In the traditional method, wafers are taken one by one from the lead end of the long strip placed on the work platform using a cutting tool 400 (e.g., a wire cutting tool). During the cutting process, cooling water is used to rinse the cutting part and the cutting tool 400.

[0004] This traditional method of removing films is inefficient. Furthermore, the removed films are easily washed away by the cooling water. Utility Model Content

[0005] In view of the problems existing in the background art, one object of this disclosure is to provide a seed crystal wafer picking device that can simultaneously pick up wafers from the lead ends of multiple seed crystals and improve the wafer picking efficiency.

[0006] Another object of this disclosure is to provide a seed crystal wafer removal device that can prevent the wafer removed during the cutting process from being washed away by the cooling water.

[0007] Therefore, a seed crystal wafer picking device is provided, comprising a graphite plate and a plurality of graphite blocks, the graphite plate and the plurality of graphite blocks being placed on a work platform; the graphite plate includes a main body and a plurality of seed crystal receiving portions, the plurality of seed crystal receiving portions protruding outward from the main body in the left-right direction and spaced apart from each other in the front-back direction, each seed crystal receiving portion having an inner cavity with a constant cross-section extending in the left-right direction and similar to the constant cross-section of the seed crystal to be received, the inner cavity opening at one end away from the main body and being closed by the surface of the main body at one end adjacent to the main body, each seed crystal receiving portion having a through-flow in the front-back direction and extending in the left-right direction on the side facing the operator in the front-back direction. An observation hole with an opening at one end away from the main body is used by the operator to determine the position of the end of the seed crystal away from the main body and the position for cutting and wafering the seed crystal; each seed crystal receiving part is used to house the corresponding seed crystal entirely within its inner cavity and abut against the corresponding surface of the main body, and is used to be cut together with the cutting tool during seed crystal cutting and wafering; each graphite block is used to extend into the corresponding seed crystal receiving part after the corresponding seed crystal is entirely housed in the inner cavity of the corresponding seed crystal receiving part and press against the end of the corresponding seed crystal away from the main body in the left and right direction; each seed crystal receiving part and the corresponding graphite block are used to prevent the seed crystal wafers cut off during seed crystal cutting and wafering from being washed away by the water flushing during seed crystal cutting and wafering.

[0008] The beneficial effects of this disclosure are as follows.

[0009] In the seed crystal wafer picking device according to the present disclosure, by setting multiple seed crystal receiving parts, it is possible to pick up the wafers from the lead ends of multiple seed crystals at the same time, thereby improving the wafer picking efficiency.

[0010] In the seed crystal wafer taking device according to the present disclosure, by the cooperation of each seed crystal receiving part and the corresponding graphite block, it is possible to prevent the wafer taken out by the seed crystal lead end from being washed away by the cooling water during the cutting process.

[0011] In the seed crystal wafer removal device according to the present disclosure, by cooperating with each seed crystal receiving part and the corresponding graphite block, and by having each seed crystal receiving part be cut together by the cutting tool during seed crystal cutting and wafer removal, the impact of the water flow impact during seed crystal cutting and wafer removal is reduced, and the swaying of the wafer (i.e., the seed wafer) in the front-back direction and left-right direction is reduced. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the traditional seed crystal wafer removal method, showing one wafer that has been removed.

[0013] Figure 2 This is a perspective view of the seed crystal taking device according to the present disclosure, wherein the seed crystal is in a state of not entering the seed crystal receiving part, and the top block and cutting tool are not shown.

[0014] Figure 3 This is a perspective view of the seed crystal taking device according to the present disclosure, wherein the seed crystal is in the state of entering the seed crystal receiving part, and the top block and the cutting tool are shown.

[0015] Figure 4 This is an enlarged 3D view of the graphite block in the seed crystal extraction device.

[0016] Figure 5 This is an enlarged three-dimensional view of the seed crystal receiving section of the seed crystal taking device.

[0017] Figure 6 yes Figure 5 The left view as seen from the left.

[0018] The reference numerals in the attached figures are explained below.

[0019] 100 Seed Crystal Extraction Device 211 Slide Rail

[0020] 1 graphite plate 22 handles

[0021] 11 main body 3 top blocks

[0022] 12 Seed Crystal Containment Unit 200 Working Platform

[0023] 121 inner cavity 300 seed crystal

[0024] 122 observation hole 400 cutting tool

[0025] 123 Slide D1 Left and right directions

[0026] 2 graphite blocks D2 front and back directions

[0027] 21 blocks D3 (top and bottom directions) Detailed Implementation

[0028] The accompanying drawings illustrate embodiments of this disclosure, and it will be understood that the disclosed embodiments are merely examples of this disclosure, which can be implemented in various forms. Therefore, the specific details disclosed herein should not be construed as limiting, but are intended only as the basis for the claims and as an illustrative basis to teach those skilled in the art how to implement this disclosure in various ways.

[0029] Reference Figures 2 to 6 The seed crystal extraction device 100 according to this disclosure includes a graphite plate 1 and a plurality of graphite blocks 2.

[0030] A graphite plate 1 and multiple graphite blocks 2 are placed on a work platform 200. The graphite plate 1 includes a main body 11 and multiple seed crystal receiving portions 12. The multiple seed crystal receiving portions 12 protrude outward from the main body 11 in the left-right direction D1 and are spaced apart from each other in the front-back direction D2. Each seed crystal receiving portion 12 has an inner cavity 121 extending in the left-right direction D1 with a constant cross-section similar to the constant cross-section of the seed crystal 300 to be received. The inner cavity 121 is open at one end away from the main body 11 and closed by the surface of the main body 11 at one end adjacent to the main body 11. Each seed crystal receiving portion 12 has an observation hole 122 on the operator-facing side in the front-back direction D2, extending in the left-right direction D1 and open at one end away from the main body 11. The observation hole 122 is used by the operator to determine the position of the end of the seed crystal 300 away from the main body 11 and the position of the seed crystal 300 for cutting and wafering. Each seed crystal receiving portion 12 is used to house the corresponding seed crystal 300 entirely within its inner cavity 121 and abut against the corresponding surface of the main body 11, and is used to be cut together with the cutting tool 400 during the cutting and wafer removal process of the seed crystal 300. Each graphite block 2 is used to extend into the corresponding seed crystal receiving portion 12 after the corresponding seed crystal 300 is entirely housed within the inner cavity 121 of the corresponding seed crystal receiving portion 12, and press against the end of the corresponding seed crystal 300 away from the main body 11 in the left-right direction D1. Each seed crystal receiving portion 12 and the corresponding graphite block 2 are used to prevent the seed crystal wafers cut off during the cutting and wafer removal process of the seed crystal 300 from being washed away by the flushing water (i.e., cooling water) during the cutting and wafer removal process of the seed crystal 300.

[0031] In the seed crystal wafer picking device 100 according to the present disclosure, by providing multiple seed crystal receiving sections 12, it is possible to simultaneously pick up the wafers from the lead ends of multiple seed crystals 300, thereby improving the wafer picking efficiency.

[0032] In the seed crystal wafer taking device 100 according to the present disclosure, by the cooperation of each seed crystal receiving part 12 and the corresponding graphite block 2, it is possible to prevent the wafer taken out by the seed crystal 300 during wafer taking from the crystal leading end from being washed away by the cooling water during the cutting process.

[0033] In the seed crystal wafer taking device 100 according to the present disclosure, by cooperating with each seed crystal receiving part 12 and the corresponding graphite block 2, and by having each seed crystal receiving part 12 be cut together by the cutting tool 400 when the seed crystal 300 is being cut and taken, the impact of the water flow impact during the cutting and taking of the seed crystal 300 is reduced, and the shaking of the wafer (i.e., the seed wafer) in the front-back direction D2 and the left-right direction D1 is reduced.

[0034] In the seed crystal taking device 100 according to the present disclosure, the observation hole 122 can also be used to observe the progress of the cutting tool 400 cutting and taking the wafer and whether the seed crystal 300 together with the seed crystal receiving part 12 has been cut off.

[0035] For example, the main body 11 of the graphite plate 1 is detachably fixed to the work platform 200. Figures 1 to 4 As shown, the main body 11 of the graphite plate 1 can be, but is not limited to, rectangular.

[0036] To facilitate the entry and exit of graphite block 2 into and out of seed crystal receiving section 12, refer to Figures 2 to 6 In one example, each seed crystal receiving part 12 also has a pair of sliding grooves 123, which are respectively provided on the two opposite walls of the inner cavity 121 in the front-back direction D2, starting from the end of the inner cavity 121 facing away from the main body 11 in the left-right direction D1, and positioned higher than the observation hole 122 in the up-down direction D3; each graphite block 2 has a block 21, which is used to extend into the corresponding seed crystal receiving part 12 after the corresponding seed crystal 300 is completely received in the inner cavity 121 of the corresponding seed crystal receiving part 12 and press against the end of the corresponding seed crystal 300 facing away from the main body 11 in the left-right direction D1; the block 21 is provided with a pair of sliding rails 211, which are provided on the two opposite sides of the block 21 in the front-back direction D2, starting from the end of the block 21 facing the seed crystal receiving part 12, and the pair of sliding rails 211 are used to slide and engage with the pair of sliding grooves 123 of the corresponding seed crystal receiving part 12.

[0037] like Figure 4 As shown, in one example, the cross-section of the block 21 of the graphite block 2 is constant and set to be the same as the cross-section of the seed crystal 300.

[0038] In one example, the seed crystal 300 has a constant cross-sectional dimension of 15mm × 15mm square along the left-right direction D1, and the thickness of the cut slice of the seed crystal 300 is 2mm; the cross-sectional dimension of the inner cavity 121 of each seed crystal receiving part 12 of the graphite plate 1 is 15.1mm × 15.1mm square; the cross-sectional dimension of the block 21 of the graphite block 2, excluding the slide rail 211, is 15mm × 15mm square; the observation hole 122 is 5mm high from the bottom of the inner cavity 121; the center line of the pair of slide grooves 123 of each seed crystal receiving part 12 is located at a height of 10mm from the bottom of the inner cavity 121.

[0039] like Figure 2 , Figure 3 as well as Figure 5 As shown, the end of the observation hole 122 near the main body 11 is spaced apart from the main body 11, thereby increasing the structural strength of the seed crystal receiving part 12.

[0040] like Figures 2 to 4 As shown, the graphite block 2 also has a handle 22, which is connected to the block body 21 and is used by the operator to push or pull. Specifically, the handle 22 is a T-shaped shape rotated 90 degrees.

[0041] Reference Figure 2 In one example, the seed crystal wafer taking device 100 further includes a top abutment block 3. The top abutment block 3 is used to press all the graphite blocks 2 against the end of the corresponding seed crystal 300 away from the main body 11, and then push all the graphite blocks 2 against each other from the side away from the graphite plate 1 in the left-right direction D1. In this way, during operation, the operator only needs to push the top abutment block 3 with one hand to push all the graphite blocks 2 against the side away from the graphite plate 1, which improves the work efficiency.

[0042] Several exemplary embodiments have been described in detail above, but this document is not intended to limit itself to the explicitly disclosed combinations. Therefore, unless otherwise stated, the various features disclosed herein can be combined to form several other combinations, which are not shown for simplicity.

Claims

1. A seed crystal wafer extraction device, characterized in that, The seed crystal wafer taking device (100) includes a graphite plate (1) and a plurality of graphite blocks (2), which are used to place on the work platform (200); The graphite plate (1) includes a main body (11) and multiple seed crystal receiving parts (12). Multiple seed crystal receiving portions (12) protrude outward from the main body (11) in the left-right direction (D1) and are spaced apart from each other in the front-back direction (D2). Each seed crystal receiving portion (12) has an inner cavity (121) extending in the left-right direction (D1) with a constant cross-section similar to the constant cross-section of the seed crystal (300) to be received. The inner cavity (121) is open at one end away from the main body (11) and closed by the surface of the main body (11) at one end adjacent to the main body (11). Each seed crystal receiving part (12) has an observation hole (122) on the side facing the operator in the front-back direction (D2), which runs through in the front-back direction (D2), extends in the left-right direction (D1), and opens at the end opposite to the main body (11). The observation hole (122) is used for the operator to determine the position of the end of the seed crystal (300) opposite to the main body (11) and the position of the seed crystal (300) for cutting and taking off pieces. Each seed crystal receiving part (12) is used to house the corresponding seed crystal (300) entirely within its inner cavity (121) and abut against the corresponding surface of the main body (11) and to be cut together by the cutting tool (400) when the seed crystal (300) is cut and taken out; Each graphite block (2) is used to extend into the corresponding seed crystal receiving part (121) after the corresponding seed crystal (300) is completely housed in the inner cavity (121) of the corresponding seed crystal receiving part (12) and press against the end of the corresponding seed crystal (300) away from the main body (11) in the left-right direction (D1); Each seed crystal receiving part (12) and the corresponding graphite block (2) are used to prevent the seed crystal wafers cut off during the cutting and wafer removal process from being washed away by the water during the cutting and wafer removal process.

2. The seed crystal wafer extraction device according to claim 1, characterized in that, The main body (11) of the graphite plate (1) is used to be detachably fixed to the work platform (200).

3. The seed crystal wafer extraction device according to claim 1, characterized in that, The main body (11) of the graphite plate (1) is rectangular.

4. The seed crystal wafer extraction device according to claim 1, characterized in that, Each seed crystal receiving part (12) also has a pair of grooves (123), which are respectively provided on the two opposite walls of the inner cavity (121) in the front-back direction (D2), starting from the end of the inner cavity (121) in the left-right direction (D1) away from the main body (11), and in the up-down direction (D3) at a position higher than the observation hole (122); Each graphite block (2) has a block (21), which is used to extend into the corresponding seed crystal receiving part (121) after the corresponding seed crystal (300) is completely housed in the inner cavity (121) of the corresponding seed crystal receiving part (12) and press against the end of the corresponding seed crystal (300) away from the main body (11) in the left-right direction (D1). The block (21) is provided with a pair of slide rails (211), which are located on the two sides opposite to each other in the front-rear direction (D2) of the block (21) and start from the end of the block (21) facing the seed crystal receiving part (12). The pair of slide rails (211) are used to slide and engage with a pair of slide grooves (123) of the corresponding seed crystal receiving part (12).

5. The seed crystal wafer extraction device according to claim 4, characterized in that, The cross-section of the block (21) of the graphite block (2) is constant and set to be the same as the cross-section of the seed crystal (300).

6. The seed crystal wafer extraction device according to claim 4, characterized in that, The seed crystal (300) has a constant cross-sectional area of ​​15mm × 15mm in the left-right direction (D1), and the thickness of the cut slice of the seed crystal (300) is 2mm. The cross-sectional dimensions of the inner cavity (121) of each seed crystal receiving part (12) of the graphite plate (1) are square with dimensions of 15.1mm × 15.1mm; The cross-sectional dimensions of the graphite block (2) (21) after deducting the slide rail (211) are 15mm × 15mm square; The observation hole (122) is 5 mm high from the bottom of the inner cavity (121); The centerline of a pair of grooves (123) in each seed crystal receiving part (12) is located at a height of 10 mm from the bottom of the inner cavity (121).

7. The seed crystal wafer extraction device according to claim 1, characterized in that, The end of the observation hole (122) near the main body (11) is spaced apart from the main body (11).

8. The seed crystal wafer extraction device according to claim 4, characterized in that, The graphite block (2) also has a handle (22) which is connected to the block (21) and is used by the operator to push or pull.

9. The seed crystal wafer extracting device according to claim 8, characterized in that, The handle (22) is the shape of a T-shaped object rotated 90 degrees.

10. The seed crystal wafer extracting device according to claim 1, characterized in that, The seed crystal taking device (100) also includes a top block (3), which is used to press all graphite blocks (2) against the end of the corresponding seed crystal (300) away from the main body (11) and then press all graphite blocks (2) against the side of the graphite plate (1) away from the graphite plate (1) in the left-right direction (D1).

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