Shockproof transport cart in semiconductor production

By designing a shockproof transport trolley with a flexible structure and omnidirectional wheels, the vibration problem in semiconductor transportation is solved, achieving low-cost shockproof and visual protection. It is suitable for small and medium-sized production lines and has dustproof function.

CN223835611UActive Publication Date: 2026-01-27WUXI TONGZHI MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202520384473.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-05
Publication Date
2026-01-27
Estimated Expiration
2035-03-05

AI Technical Summary

Technical Problem

Existing semiconductor transport trolleys cannot effectively prevent product vibration during transportation, especially wire misalignment and poor contact defects in the wire bonding process. They also lack shock resistance, making them unsuitable for small and medium-sized production lines and costly.

Method used

A shockproof transport trolley was designed, comprising a vehicle body, an upper box, and bottom wheels. It adopts an elastic structure and omnidirectional wheels, filters vibrations through lateral spring assemblies and bottom spring assemblies, the vehicle body adopts a rod structure, the box is made of transparent material to make it visible and prevent collisions, and is equipped with omnidirectional wheels with braking and shock absorption functions.

Benefits of technology

It achieves low-cost shock resistance, is suitable for general factory ground transportation, the box can be adjusted according to the product volume and quantity, the transparent box allows visibility to prevent collisions, has a dustproof effect, and is suitable for small and medium-sized production lines.

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Abstract

The utility model relates to a shockproof transport cart in semiconductor production, which comprises a cart body, and the cart body is provided with an upper box body through an elastic structure; the upper portion of the vehicle body is an upper installation cavity, an upper box body is installed in the upper installation cavity through an elastic structure, and the lower portion of the vehicle body is a lower containing bin. The elastic structure is composed of a lateral spring assembly and a bottom spring assembly. The side surface of the upper box body is connected with the inner end of the lateral spring, and the outer end of the spring is connected with the inner wall of the upper mounting cavity; the bottom spring assembly comprises a supporting spring which abuts against the upper box body and the bottom of the upper mounting cavity. The utility model can be realized at low cost, and can be used for transporting products with shockproof requirements in general factories; according to the shockproof design principle, the box bodies can be designed into different sizes according to different volumes, quantities and weights of products, and shockproof transport carts of different styles can be manufactured after the buffers are configured and adjusted.
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Description

Technical Field

[0001] This utility model belongs to the field of semiconductor equipment technology and relates to a shockproof transport trolley used in semiconductor production. Background Technology

[0002] With the development of semiconductors, integration is becoming increasingly higher. In the back-end packaging and testing process, the number of wires in the wire bonding process is large, the wire diameter is thin, and the wire gap is small. When transporting the product to the packaging process, vibration can easily cause the wires to tilt or touch, resulting in defects.

[0003] Currently advanced overhead crane systems (OHT) can transport materials without vibration, but they are costly and not suitable for small and medium-sized production lines.

[0004] Currently available shockproof transport trolleys rely on shockproof wheels installed at the bottom for shock absorption. However, the springs inside the wheels can only filter out a portion of the vertical vibrations. The front, back, left, and right vibrations caused by bumps cannot be avoided, resulting in insufficient shock absorption and an inability to protect the reliability of the welding lines on the products inside the trolley. Summary of the Invention

[0005] The purpose of this invention is to provide a shockproof transport trolley for semiconductor manufacturing, which can solve the above-mentioned problems and allows for visualization when placing products to prevent collisions.

[0006] According to the technical solution provided by this utility model: a shockproof transport trolley for semiconductor production includes a vehicle body, in which an upper box is mounted via an elastic structure; the upper part of the vehicle body is an upper mounting cavity, in which the upper box is mounted via an elastic structure; the lower part of the vehicle body is a lower storage compartment; and wheels are mounted on the bottom of the vehicle body; the elastic structure consists of a lateral spring assembly and a bottom spring assembly; the lateral spring assembly includes a lateral spring, with the inner end of the lateral spring connected to the side of the upper box and the outer end of the spring connected to the inner wall of the upper mounting cavity; the bottom spring assembly includes a support spring, which abuts against the bottom of the upper box and the upper mounting cavity.

[0007] As a further improvement of this utility model, the vehicle body is made of rods, and the upper mounting cavity is also constructed from rods.

[0008] As a further improvement of this utility model, the upper box has a rectangular structure, and the eight corners of the upper box are respectively connected to the inner end of the spring through the lifting ring, and the outer end of the spring is connected to the inner wall of the upper mounting cavity through the lifting ring.

[0009] As a further improvement of this utility model, a slider is slidably provided in the inner wall of the upper mounting cavity. The slider is connected to the outer end of the spring through a lifting ring, and the slider is fixed by a support bolt.

[0010] As a further improvement of this utility model, a guide rod is vertically installed at the bottom of the upper box, and a support spring is sleeved on the outer periphery of the guide rod.

[0011] As a further improvement of this utility model, a limiting cylinder is provided at the bottom of the upper mounting cavity, and the support spring is located in the limiting cylinder.

[0012] As a further improvement of this utility model, the upper box is made of transparent material.

[0013] As a further improvement of this utility model, the wheels are universal wheels with braking and shock absorption functions.

[0014] As a further improvement of this utility model, a box door is provided on the upper box body.

[0015] As a further improvement to this utility model, a shock-absorbing pad is laid at the bottom of the upper box.

[0016] The positive and progressive effects of this application are as follows:

[0017] ①This utility model can be implemented at low cost and is suitable for transporting products that require shock resistance in general factory environments.

[0018] ②According to the anti-vibration design principle of this invention, the box body can be designed in different sizes according to the different volumes, quantities and weights of the products, and different styles of anti-vibration transport trolleys can be made after configuring and adjusting the buffer.

[0019] ③ The box of this utility model is made of transparent material, which allows the product to be seen when placed in it and can prevent collisions; it also has a dustproof function. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model.

[0021] Figure 2 This is a side view of the present invention. Detailed Implementation

[0022] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0024] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this utility model described herein. Furthermore, terms such as "comprising" and "having" mean that in addition to those already listed in "comprising" and "having," other unlisted contents may also be included; for example, a process, method, system, product, or device may include a series of steps or units, not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices.

[0025] Due to the angle of the drawing, some parts may not be drawn, but their positions and connections can be understood from the text descriptions.

[0026] like Figure 1 As shown, this utility model is a shockproof transport trolley used in semiconductor production, including a vehicle body 2, and a box 5 is installed on the vehicle body 2 through an elastic structure.

[0027] The upper part of the vehicle body 2 is the upper mounting cavity, in which the upper box 5 is installed via an elastic structure. The lower part of the vehicle body 2 is the lower storage compartment 8, and wheels 9 are installed at the bottom of the vehicle body 2. The vehicle body 2 is made of rods, and the upper mounting cavity is also constructed from rods.

[0028] The elastic structure consists of a lateral spring assembly and a bottom spring assembly. The lateral spring assembly includes a lateral spring 3, with the inner end of the lateral spring 3 connected to the side of the upper housing 5, and the outer end of the spring 3 connected to the inner wall of the upper mounting cavity.

[0029] In this embodiment, the upper housing 5 has a rectangular structure, and the eight corners of the upper housing 5 are respectively connected to the inner end of the spring 3 through lifting rings, and the outer end of the spring 3 is connected to the inner wall of the upper mounting cavity through lifting rings.

[0030] To adjust the elastic force, a slider is slidably installed in the inner wall of the upper mounting cavity. The slider is connected to the outer end of the spring 3 through a lifting ring and is fixed by a support bolt.

[0031] The bottom spring assembly includes a support spring 7, which abuts against the bottom of the upper housing 5 and the upper mounting cavity. To prevent the support spring 7 from detaching from the upper housing 5, a guide rod is vertically installed at the bottom of the upper housing 5, and the support spring 7 is sleeved on the outer periphery of the guide rod. To limit the lateral movement of the upper housing 5, a limiting sleeve 1 is provided at the bottom of the upper mounting cavity, and the support spring 7 is located in the limiting sleeve 1.

[0032] The upper housing 5 is made of transparent material, allowing observation of the semiconductors placed inside.

[0033] Wheel 9 is a universal wheel with braking and shock absorption functions.

[0034] like Figure 2 As shown, the upper box 5 is equipped with a box door 4.

[0035] To improve the protection of the upper housing 5, a shock-absorbing pad 6 is laid at the bottom of the upper housing 5.

[0036] The working process of this utility model is as follows:

[0037] Mobile empty trolley: The operator pushes the trolley body 2 to the product position according to their height and habits, and locks the wheels 9.

[0038] Loading products: Open the box door 4 and manually place the product into the upper box 5. Visual inspection can prevent product collisions. Close the box door 4. The product is in a shockproof protection state with the side spring assembly, bottom spring assembly, and shockproof pad 6. The closed box can prevent dust. At the same time, the lower storage compartment 8 can be used to put product turnover clamps.

[0039] Mobile load trolley: The operator releases the wheels 9 and pushes the trolley body 2. Without adjusting the direction of the transport trolley, it is pushed toward the destination. During the journey, the wheels 9 filter the vertical vibrations generated by the ground, and the lateral spring assembly and the bottom spring assembly filter the remaining vertical vibrations and the vibrations in the front, back and sides.

[0040] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A shockproof transport trolley for semiconductor manufacturing, comprising a vehicle body (2), characterized in that, The vehicle body (2) is fitted with an upper box (5) via an elastic structure; the upper part of the vehicle body (2) is an upper mounting cavity, in which the upper box (5) is fitted with an elastic structure; the lower part of the vehicle body (2) is a lower storage compartment (8); and wheels (9) are fitted at the bottom of the vehicle body (2); the elastic structure consists of a lateral spring assembly and a bottom spring assembly; the lateral spring assembly includes a lateral spring (3), the side of the upper box (5) is connected to the inner end of the lateral spring (3), and the outer end of the spring (3) is connected to the inner wall of the upper mounting cavity; the bottom spring assembly includes a support spring (7), which abuts against the upper box (5) and the bottom of the upper mounting cavity.

2. The shockproof transport trolley for semiconductor manufacturing as described in claim 1, characterized in that, The vehicle body (2) is made of rods, and the upper mounting cavity is also constructed from rods.

3. The shockproof transport trolley for semiconductor manufacturing as described in claim 1, characterized in that, The upper box (5) has a rectangular structure. The eight corners of the upper box (5) are connected to the inner end of the spring (3) through the lifting rings, and the outer end of the spring (3) is connected to the inner wall of the upper mounting cavity through the lifting rings.

4. The shockproof transport trolley for semiconductor manufacturing as described in claim 1, characterized in that, A slider is slidably installed in the inner wall of the upper mounting cavity. The slider is connected to the outer end of the spring (3) through a lifting ring. The slider is fixed by a support bolt.

5. The shockproof transport trolley for semiconductor manufacturing as described in claim 1, characterized in that, A guide rod is vertically installed at the bottom of the upper box (5), and a support spring (7) is sleeved on the outer periphery of the guide rod.

6. The shockproof transport trolley for semiconductor manufacturing as described in claim 5, characterized in that, A limiting cylinder (1) is provided at the bottom of the upper mounting cavity, and the supporting spring (7) is located in the limiting cylinder (1).

7. The shockproof transport trolley for semiconductor manufacturing as described in claim 1, characterized in that, The upper box (5) is made of transparent material.

8. The shockproof transport trolley for semiconductor manufacturing as described in claim 1, characterized in that, The wheels (9) are universal wheels with braking and shock absorption functions.

9. The shockproof transport trolley for semiconductor manufacturing as described in claim 1, characterized in that, The upper box (5) is equipped with a box door (4).

10. The shockproof transport trolley for semiconductor manufacturing as described in claim 1, characterized in that, The bottom of the upper box (5) is covered with a shock-absorbing pad (6).