Shielding and buffering conductive adhesive tape
By introducing a reinforced conductive sponge layer with a porous foam structure and dry conductive adhesive into the conductive tape, the problems of powdering and poor rebound effect of conductive sponge tape are solved, and better buffering and shielding performance is achieved.
Patent Information
- Application Number
- CN202520120741.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing conductive sponge tapes are prone to powdering, causing the conductive sponge to stick to the conductive adhesive and resulting in poor rebound performance.
A reinforced conductive sponge layer with a porous foam structure is combined with dry conductive adhesive and non-dry conductive adhesive, and coated with conductive ink to form a composite structure of wear-resistant layer, conductive substrate foil layer and release protective material.
It improves the product's cushioning and shielding capabilities, reduces pulverization, enhances rebound effect, and lowers the risk of contamination.
Smart Images
Figure CN223837343U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electromagnetic shielding technology, specifically to a shielding buffer conductive tape. Background Technology
[0002] Sponge tape is made of PU foam as the base material, coated with solvent (or hot melt) pressure-sensitive adhesive on one or both sides, and then covered with easy-to-peel release paper. It has strong adhesion, good aging resistance, excellent sealing and elasticity, and is suitable for bonding rough surfaces and fixing light and small materials. It is widely used in automotive decoration, shock absorption, heat insulation, item hanging, insulation and heat preservation in electrical refrigeration engineering, nameplates, nameplates, wallpaper and other fixing and bonding applications.
[0003] Existing conductive sponge tapes are made by laminating conductive fabric with self-adhesive on both sides, with conductive sponge on one side. These products only provide conductive shielding, but the conductive sponge is prone to powdering, making them inconvenient for production and use. Alternatively, conductive sponge and the intermediate conductive substrate can be bonded with conductive self-adhesive. This structure is prone to the conductive sponge sticking to the conductive self-adhesive after external compression, resulting in poor rebound performance. Utility Model Content
[0004] (a) Technical problems to be solved
[0005] To address the shortcomings of existing technologies, this utility model provides a shielding and buffering conductive tape, which solves the problem of conductive sponge sticking to conductive adhesive and resulting in poor rebound effect.
[0006] (II) Technical Solution
[0007] To achieve the above objectives, this utility model provides the following technical solution: a shielding and buffering conductive tape, comprising a wear-resistant layer, a reinforced conductive sponge layer, a conductive substrate foil layer, and a release protection material disposed from top to bottom on the conductive tape body. The reinforced conductive sponge layer is a porous foamed sponge layer. An ink layer is coated on the surface of the reinforced conductive sponge layer. A dry conductive adhesive is fixedly bonded between the reinforced conductive sponge layer and the conductive substrate foil layer. A non-drying conductive adhesive is fixedly bonded between the conductive substrate foil layer and the release protection material.
[0008] Preferably, the wear-resistant layer is made of nylon.
[0009] Preferably, the material of the dry conductive adhesive is a dry-bonded adhesive compounded conductive powder, and the particle size of the conductive powder is 0.1-100um.
[0010] Preferably, the conductive substrate foil layer is made of roll material.
[0011] Preferably, the non-drying conductive adhesive is made of metal conductive powder, and the particle size of the conductive powder is 0.1-100um.
[0012] Preferably, the release protective material is a PET film with a thickness of 0.02-0.05 mm.
[0013] (III) Beneficial Effects
[0014] This invention provides a shielding and cushioning conductive tape. It has the following beneficial effects:
[0015] This reinforced conductive sponge layer serves as a metal shield, cushioning and shock absorber, and external contact point. Due to its porous foam structure, the product has excellent cushioning against external impacts. The conductive ink immersion treatment gives the structure both excellent shielding and isolation properties and prevents powdering, resulting in better processability, no powder shedding, and reduced pollution. At the same time, the product has better resilience during use. Attached Figure Description
[0016] Figure 1 This is a front view schematic diagram of the conductive tape of this utility model;
[0017] Figure 2 This is a side view of the conductive tape structure of this utility model;
[0018] Figure 3 This is a schematic diagram of the dissected structure of the conductive tape of this utility model.
[0019] In the diagram: 1. Reinforced conductive sponge layer; 2. Wear-resistant layer; 3. Conductive substrate foil layer; 4. Release protection material; 5. Dry conductive adhesive; 6. Non-drying conductive adhesive. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Please see Figure 1-3This utility model provides a technical solution: a shielding and cushioning conductive tape, comprising a conductive tape body 7 with a wear-resistant layer 2, a reinforced conductive sponge layer 1, a conductive substrate foil layer 3, and a release liner 4 arranged from top to bottom. The reinforced conductive sponge layer 1 has a porous foamed sponge layer structure, and its surface is coated with an ink layer. A dry conductive adhesive 5 is fixedly bonded between the reinforced conductive sponge layer 1 and the conductive substrate foil layer 3, and a non-drying conductive adhesive 6 is fixedly bonded between the conductive substrate foil layer 3 and the release liner 4. This reinforced conductive sponge layer 1 functions as a metal shield, cushioning and shock absorption, and provides external contact. Due to its porous foamed structure, the product has excellent cushioning capabilities against external impacts. The conductive ink impregnation treatment gives the structure both excellent shielding and isolation properties and resistance to powdering, resulting in better processability, no powder shedding, and reduced pollution. Simultaneously, the product exhibits better resilience during use.
[0022] Please see Figure 1-3 This utility model provides a technical solution: the wear-resistant layer 2 is made of nylon. This wear-resistant layer 2, being made of nylon, is wear-resistant and has a long service life.
[0023] Please see Figure 1-3 This utility model provides a technical solution: the dry conductive adhesive 5 is made of dry-bonding adhesive compounded with conductive powder, and the particle size of the conductive powder is 0.1-100um. The dry conductive adhesive 5 serves to bond the conductive substrate foil layer 3 and the reinforced conductive sponge layer 1, and has both bonding and conductive functions. Because a curable dry material is used as the connecting layer, the product has excellent rebound effect and will not have a compression-adhesive effect.
[0024] Please see Figure 1-3 This utility model provides a technical solution: the conductive substrate foil layer 3 is made of roll material. The conductive substrate foil layer 3 acts as a support for the entire material and has excellent conductive shielding function.
[0025] Please see Figure 1-3 This utility model provides a technical solution: the non-drying conductive adhesive 6 is made of metallic conductive powder, and the particle size of the conductive powder is 0.1-100um. The non-drying conductive adhesive serves as the outer adhesive layer of the entire material, bonding the entire material and the object being adhered to, thus providing adhesion and conductivity, ensuring the usability of the entire material.
[0026] Please see Figure 1-3This utility model provides a technical solution: the release protective material 4 is made of PET film with a thickness of 0.02-0.05mm. The release protective material 4 protects the non-drying conductive adhesive 6 before use, preventing the adhesive surface from aging, getting dirty, or contaminated, and preventing moisture, other solvents, and oil from damaging the adhesive layer. It is removed before use, and then the entire material is adhered.
[0027] During the process, first, a reinforced conductive sponge layer 1 is made. High-resilience TPU and EVE foam are vacuum-plated + water-plated or completely vacuum-plated to form a conductive sponge, which is then soaked in conductive ink, extruded, and dried. Next, a dry conductive single-sided adhesive with a conductive foil as the substrate is made. The dry conductive adhesive 5 is directly coated onto the conductive foil and a release liner 4 is attached; or the release liner 4 is coated with dry conductive adhesive and transferred to the conductive foil. The release liner 4 is removed, and the reinforced conductive sponge layer 1 is hot-rolled and pressed together, thus bonding the reinforced conductive sponge layer 1 and the conductive substrate foil layer 3 together to form a conductive connection. Finally, a non-drying conductive adhesive 6 is made. The non-drying conductive adhesive 6 is directly coated onto the conductive foil (the side without the reinforced conductive sponge layer 1) and a release liner is attached; or the release liner 4 is coated with non-drying conductive adhesive 6 and transferred to the conductive foil (the side without the reinforced conductive sponge layer 1).
[0028] In summary, this shielding and buffering conductive tape, through its structure of 1. a reinforced conductive sponge layer; 2. a wear-resistant layer; 3. a conductive substrate foil layer; 4. a release protection material; 5. a dry conductive adhesive; and 6. a non-drying conductive adhesive, solves the problem of conductive sponge sticking to conductive non-drying adhesive and resulting in poor rebound performance.
[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A shielding and cushioning conductive tape, comprising a conductive tape body (7) with a wear-resistant layer (2), a reinforced conductive sponge layer (1), a conductive substrate foil layer (3), and a release protective material (4) arranged from top to bottom, characterized in that: The structure of the reinforced conductive sponge layer (1) is a porous foamed sponge layer. The surface of the reinforced conductive sponge layer (1) is coated with an ink layer. Dry conductive adhesive (5) is fixedly bonded between the reinforced conductive sponge layer (1) and the conductive substrate foil layer (3). Non-drying conductive adhesive (6) is fixedly bonded between the conductive substrate foil layer (3) and the release protective material (4).
2. The shielding and buffering conductive tape according to claim 1, characterized in that: The wear-resistant layer (2) is made of nylon.
3. The shielding and buffering conductive tape according to claim 1, characterized in that: The dry conductive adhesive (5) is made of dry-bonded adhesive compounded conductive powder, and the particle size of the conductive powder is 0.1-100um.
4. The shielding and buffering conductive tape according to claim 1, characterized in that: The conductive substrate foil layer (3) is made of roll material.
5. The shielding and buffering conductive tape according to claim 1, characterized in that: The non-drying conductive adhesive (6) is made of metal conductive powder, and the particle size of the conductive powder is 0.1-100um.
6. The shielding and buffering conductive tape according to claim 1, characterized in that: The release protective material (4) is made of PET film with a thickness of 0.02-0.05 mm.