Mask plate assembly and deposition equipment

Abstract

The utility model relates to a mask plate assembly and deposition equipment. The mask plate assembly comprises a mask plate, the mask plate comprises a frame body and a mask body, an opening is defined by the frame body, and the mask body is located in the opening and divides the opening into a first sub-opening and a second sub-opening; the first shielding piece and the second shielding piece are detachably assembled with the mask plate; the mask plate assembly is configured as follows: in a first working state, the first shielding piece is assembled on one side of the mask plate and covers the first sub-opening, so that the mask plate assembly exposes the second sub-opening; and in the second working state, the second shielding piece is assembled on one side of the mask plate and covers the second sub-opening, so that the mask plate assembly exposes the first sub-opening. Therefore, according to the mask plate assembly and the deposition equipment provided by the invention, the solar cell can be prevented from being damaged.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to mask assemblies and deposition equipment. Background Technology

[0002] Solar cells, also known as photovoltaic cells, are semiconductor devices that directly convert sunlight into electrical energy. Because they are green and environmentally friendly products that do not cause pollution, and because solar energy is a renewable resource, solar cells are a new type of battery with broad development prospects.

[0003] In related technologies, heterojunction back contact (HBC) batteries place the metal electrode on the back side of the battery, so that the light-facing side of the battery is not blocked by the metal electrode, thus increasing the light absorption area. However, the above-mentioned HBC batteries are easily damaged during the manufacturing process. Utility Model Content

[0004] Therefore, it is necessary to provide a mask assembly and deposition equipment that can avoid damaging the solar cell.

[0005] In a first aspect, embodiments of this application provide a mask assembly, comprising:

[0006] A mask plate includes a frame and a mask body. The frame is arranged to form an opening, and the mask body is located in the opening and divides the opening into a first sub-opening and a second sub-opening.

[0007] The first and second shielding components are detachably assembled with the mask plate;

[0008] The mask assembly is configured such that: in a first operating state, a first blocking member is assembled on one side of the mask to cover a first sub-opening, thereby exposing a second sub-opening to the mask assembly; and in a second operating state, a second blocking member is assembled on one side of the mask to cover a second sub-opening, thereby exposing the first sub-opening to the mask assembly.

[0009] The mask assembly provided in this application embodiment, in a first operating state, has a first shielding member assembled on one side of the mask, covering a first sub-opening, thereby exposing a second sub-opening; in a second operating state, a second shielding member is assembled on one side of the mask, covering the second sub-opening, thereby exposing the first sub-opening. The mask assembly prevents the first shielding member from contacting the semiconductor substrate, avoiding wear on the film layer (e.g., passivation layer) on the semiconductor substrate during assembly / disassembly and alignment, thus improving the conversion efficiency of the solar cell. Furthermore, the mask assembly prevents the second shielding member from contacting the semiconductor substrate, avoiding wear on the film layer (e.g., passivation layer) on the semiconductor substrate during assembly / disassembly and alignment, thereby improving the conversion efficiency of the solar cell.

[0010] In one embodiment, the mask body includes a plurality of first mask body portions and a plurality of second mask body portions arranged along a first direction.

[0011] A second mask body is disposed between any two adjacent first mask body parts, and a first mask body is disposed between any two adjacent second mask body parts. The first mask body part is connected to one end of the second mask body part along the second direction, and the first direction and the second direction intersect.

[0012] In one embodiment, the second mask body portion includes a first sub-portion and two second sub-portions arranged along a first direction. The two second sub-portions are located on one side of the first sub-portion along a second direction and are connected to the first sub-portion. In adjacent first mask body portions and second mask body portions, the first mask body portion is connected to the end of the second sub-portion away from the first sub-portion.

[0013] In one embodiment, the first sub-opening includes a first sub-opening portion and a plurality of second sub-opening portions, the plurality of second sub-opening portions being arranged along a first direction and extending along a second direction, the plurality of second sub-opening portions being located on one side of the first sub-opening portion along the second direction, and all being connected to the first sub-opening portion.

[0014] In one embodiment, the second sub-opening includes a third sub-opening portion and a plurality of fourth sub-opening portions, the plurality of fourth sub-opening portions being arranged along a first direction and extending along a second direction, the plurality of fourth sub-opening portions being located on one side of the third sub-opening portion along the second direction, and all being connected to the third sub-opening portion.

[0015] The first sub-opening and the third sub-opening are located at the two ends of the opening along the second direction, and a fourth sub-opening is provided between any two adjacent second sub-openings, and a second sub-opening is provided between any two adjacent fourth sub-openings.

[0016] In one embodiment, the first shielding member includes a first shielding portion and a plurality of second shielding portions, the plurality of second shielding portions being arranged at intervals along a first direction and extending along a second direction, the plurality of second shielding portions being located on one side of the first shielding portion along the second direction, and all being connected to the first shielding portion.

[0017] Multiple second blocking parts are correspondingly arranged with multiple second sub-opening parts; in the first working state, the first blocking part covers the first sub-opening part, and the second blocking part covers the corresponding second sub-opening part.

[0018] In one embodiment, the second shielding member includes a third shielding portion and a plurality of fourth shielding portions, the plurality of fourth shielding portions being arranged at intervals along a first direction and extending along a second direction, the plurality of fourth shielding portions being located on one side of the third shielding portion along the second direction, and all being connected to the third shielding portion.

[0019] Multiple fourth blocking parts are correspondingly provided with multiple fourth sub-opening parts; in the second working state, the third blocking part covers the third sub-opening part, and the fourth blocking part covers the corresponding fourth sub-opening part.

[0020] In one embodiment, the mask assembly includes a first limiting member disposed on one side of the frame and located on the side of the opening along the second direction. The first limiting member has a first limiting hole that extends through the first limiting member along the second direction. The first blocking member includes a first blocking portion and a plurality of second blocking portions.

[0021] In the first working state, part of the first blocking part is inserted into the first limiting hole.

[0022] In one embodiment, the first shielding portion includes a plurality of first sub-shielding portions and a plurality of second sub-shielding portions arranged along a first direction, wherein a second sub-shielding portion is disposed between any two adjacent first sub-shielding portions, and a first sub-shielding portion is disposed between any two adjacent second sub-shielding portions, and the dimension of the second sub-shielding portion along the thickness direction of the mask plate is greater than the dimension of the first sub-shielding portion along the thickness direction of the mask plate.

[0023] Multiple second sub-blocking parts are provided corresponding to each other, and the second sub-blocking parts are connected to their respective second blocking parts.

[0024] In one embodiment, the first limiting hole includes a plurality of first sub-limiting holes and a plurality of second sub-limiting holes arranged and connected along a first direction, wherein a second sub-limiting hole is disposed between any two adjacent first sub-limiting holes, and a first sub-limiting hole is disposed between any two adjacent second sub-limiting holes; the dimension of the first sub-limiting hole along the thickness direction of the mask plate is smaller than the dimension of the second sub-limiting hole along the thickness direction of the mask plate and the dimension of the second sub-blocking portion along the thickness direction of the mask plate.

[0025] Multiple first sub-limiting holes are correspondingly provided with multiple first sub-blocking parts, and multiple second sub-limiting holes are correspondingly provided with multiple second sub-blocking parts;

[0026] In the first working state, the first sub-blocking part is inserted into the corresponding first sub-limiting hole, and the second sub-blocking part is inserted into the corresponding second sub-limiting hole.

[0027] In one embodiment, the mask assembly includes a second limiting member disposed on one side of the frame along the thickness direction and on the other side of the opening along the second direction. The second limiting member has a second limiting hole that extends through the second limiting member along the second direction. The second blocking member includes a third blocking portion and a plurality of fourth blocking portions.

[0028] In the second working state, part of the third blocking part is inserted into the second limiting hole.

[0029] In one embodiment, the third shielding portion includes a plurality of third sub-shielding portions and a plurality of fourth sub-shielding portions arranged along the first direction. A fourth sub-shielding portion is disposed between any two adjacent third sub-shielding portions, and a third sub-shielding portion is disposed between any two adjacent fourth sub-shielding portions. The dimension of the fourth sub-shielding portion along the thickness direction of the mask plate is greater than the dimension of the third sub-shielding portion along the thickness direction of the mask plate.

[0030] Multiple fourth sub-blocking parts are provided corresponding to each other, and the fourth sub-blocking parts are connected to their respective fourth blocking parts.

[0031] In one embodiment, the second limiting hole includes a plurality of third sub-limiting holes and a plurality of fourth sub-limiting holes arranged along a first direction. A fourth sub-limiting hole is disposed between any two adjacent third sub-limiting holes, and a third sub-limiting hole is disposed between any two adjacent fourth sub-limiting holes. The dimension of the third sub-limiting hole along the thickness direction of the mask plate is smaller than the dimension of the fourth sub-limiting hole along the thickness direction of the mask plate and the dimension of the fourth sub-blocking portion along the thickness direction of the mask plate. The plurality of third sub-limiting holes are correspondingly disposed with the plurality of third sub-blocking portions, and the plurality of fourth sub-limiting holes are correspondingly disposed with the plurality of fourth sub-blocking portions.

[0032] In the second working state, the third sub-blocking part is inserted into the corresponding third sub-limiting hole, and the fourth sub-blocking part is inserted into the corresponding fourth sub-limiting hole.

[0033] In one embodiment, the side of the first shielding portion facing away from the second shielding portion is the first surface, and the side of the third shielding portion facing away from the fourth shielding portion is the second surface, and at least one of the first surface and the second surface includes a mounting surface.

[0034] An operating component is provided on the mounting surface. The operating component includes a first operating part and a second operating part connected together. The first operating part is connected to the mounting surface, and the second operating part is located at the end of the first operating part away from the mounting surface and extends away from the first operating part along the thickness direction of the mask plate.

[0035] In one embodiment, the actuating element is a magnet.

[0036] In one embodiment, at least one of the first limiting member and the second limiting member is a ferromagnetic solid member.

[0037] In one embodiment, the mask plate has a support surface on one side along the thickness direction;

[0038] In the first operating state, the first shielding member is in contact with the support surface; and / or, in the second operating state, the second shielding member is in contact with the support surface.

[0039] In one embodiment, the mask body includes a first sidewall facing a first sub-opening and a second sidewall facing a second sub-opening. The orthographic projection of the first sidewall onto the reference plane is a first orthographic projection, and the orthographic projection of the second sidewall onto the reference plane is a second orthographic projection. The reference plane is perpendicular to the thickness direction of the mask plate.

[0040] In the first working state, the first shielding member includes a third sidewall facing the second sub-opening. The orthographic projection of the third sidewall on the reference plane is a third orthographic projection. The third orthographic projection is located between the first orthographic projection and the second orthographic projection, and the distance between the third orthographic projection and the first orthographic projection is in the range of 3μm-8μm.

[0041] And / or, in the second operating state, the second shielding member includes a fourth sidewall facing the first sub-opening, the orthographic projection of the fourth sidewall on the reference plane is a fourth orthographic projection, the fourth orthographic projection is located between the first orthographic projection and the second orthographic projection, and the distance between the fourth orthographic projection and the second orthographic projection is in the range of 3μm-8μm.

[0042] In a second aspect, embodiments of this application provide a deposition apparatus, including the mask assembly described in the first aspect above. Attached Figure Description

[0043] Figure 1 A top view of the mask plate, the first limiting member, and the second limiting member provided in the embodiments of this application.

[0044] Figure 2 A side view of the mask plate, the first limiting member, and the second limiting member provided in the embodiments of this application.

[0045] Figure 3 This is a top view of the mask assembly provided in the embodiments of this application in its first working state.

[0046] Figure 4A top view of the first shielding member and the operating member provided in the embodiments of this application.

[0047] Figure 5 This is a top view of the mask assembly provided in the embodiments of this application in its second working state.

[0048] Figure 6 A top view of the second shielding member and the operating member provided in the embodiments of this application.

[0049] Figure 7 This is a top view showing the first and second shielding components in an assembled state, as provided in the embodiments of this application.

[0050] Figure 8 A cross-sectional view of the frame and the first limiting member provided in the embodiments of this application.

[0051] Figure 9 A cross-sectional view of the frame, the first limiting member, and the first blocking member provided in the embodiments of this application.

[0052] Figure 10 A cross-sectional view of the frame and the second limiting member provided in the embodiments of this application.

[0053] Figure 11 A cross-sectional view of the frame, the second limiting member, and the second blocking member provided in the embodiments of this application.

[0054] Explanation of reference numerals in the attached figures:

[0055] 10. Mask assembly; 100. First shielding member; 110. First shielding part; 111. First sub-shielding part; 112. Second sub-shielding part; 120. Second shielding part; 133. Third sidewall; 141. First surface; 200. Second shielding member; 230. Third shielding part; 233. Third sub-shielding part; 234. Fourth sub-shielding part; 240. Fourth shielding part; 254. Fourth sidewall; 262. Second surface; 300. Mask; 310. Frame; 311. First inner wall; 312. Second inner wall; 320. Mask body; 321. First mask body part; 322. Second mask body part Body; 3221, First sub-part; 3222, Second sub-part; 330, Opening; 331, First sub-opening; 3311, First sub-opening portion; 3312, Second sub-opening portion; 332, Second sub-opening; 3323, Third sub-opening portion; 3324, Fourth sub-opening portion; 341, First sidewall; 342, Second sidewall; 410, First limiting member; 411, First limiting hole; 4111, First sub-limiting hole; 4112, Second sub-limiting hole; 420, Second limiting member; 422, Second limiting hole; 4223, Third sub-limiting hole; 4224, Fourth sub-limiting hole; 430, Operating member. Detailed Implementation

[0056] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0057] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0058] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0059] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0060] In related technologies, an HBC cell may include an N-type region and a P-type region. The HBC cell may include a semiconductor substrate and an N-type doped layer and a P-type doped layer disposed on the semiconductor substrate. A first mask may be used to block the N-type region and expose the P-type region to deposit a P-type doped layer in a deposition apparatus. Then, the first mask may be replaced with a second mask, which may be used to block the P-type region and expose the N-type region to deposit an N-type doped layer in a deposition apparatus.

[0061] However, when replacing the second mask, it is necessary to re-align the second mask and the semiconductor substrate. During the replacement and alignment process, the second mask is prone to friction with the surface of the semiconductor substrate, which can easily damage the film layer (e.g., passivation layer) on the semiconductor substrate, thereby reducing the photoelectric conversion efficiency of the HBC cell.

[0062] To address the aforementioned issues, embodiments of this application provide a mask assembly and deposition equipment that can prevent damage to solar cells.

[0063] The following will combine Figures 1-11 The mask assembly 10 and deposition equipment provided in the embodiments of this application will be described.

[0064] This application provides a mask assembly 10, which can be used for a target component, including a solar cell or other target components. This application uses a solar cell as an example for illustration.

[0065] In some embodiments, the solar cell may include an HBC cell. The HBC cell may include a first region and a second region, one of which may be an N-type region and the other a P-type region. The HBC cell may include a semiconductor substrate and a first doped layer and a second doped layer disposed on the semiconductor substrate, the first doped layer being located in the first region and the second doped layer being located in the second region. The first and second doped layers have opposite doping types, one of which is an N-type doped layer and the other is a P-type doped layer, the N-type doped layer being located in the N-type region and the P-type doped layer being located in the P-type region.

[0066] For example, the first region and the second region can be arranged in an interdigitated pattern.

[0067] For example, an HBC cell may include an isolation region located between a first region and a second region to separate the first region and the second region, thereby isolating the first doped layer and the second doped layer, preventing leakage caused by contact between the first doped layer and the second doped layer, and avoiding a decrease in solar cell efficiency.

[0068] The mask assembly 10 can be used for patterning a first doped layer, a second type doped layer, or other film layers. For example, during the fabrication of a first type doped layer, a semiconductor substrate is placed on one side of the mask assembly 10 in the thickness direction, and the mask assembly 10 blocks a second region while exposing a first region to deposit a first doped layer in the first region. During the fabrication of a second type doped layer, a semiconductor substrate is placed on one side of the mask assembly 10 in the thickness direction, and the mask assembly 10 blocks a first region while exposing a second region to deposit a second doped layer in the second region.

[0069] In related technologies, the first and second doped layers can be prepared by multiple mask exposures and developments. However, mask exposure technology is complex, with long production lines and cumbersome processes, requiring high-quality equipment and materials, and resulting in low yields and difficulty in mass production. In this embodiment, a mask assembly 10 is used to block the first (or second) region and expose the second (or first) region to deposit the desired film layer in the exposed region, achieving patterning of the desired film layer. Compared to related technologies, this embodiment uses a mask assembly 10 for patterning, which is simple and efficient, has lower requirements for equipment and materials, achieves higher yields, and is easy to mass-produce, thus reducing the manufacturing cost of solar cells.

[0070] See Figure 1 and Figure 2 The mask assembly 10 includes a mask 300, which includes a frame 310 and a mask body 320. The frame 310 forms an opening 330, and the mask body 320 is located in the opening 330, dividing the opening 330 into a first sub-opening 331 and a second sub-opening 332. The first sub-opening 331 and the second sub-opening 332 are arranged along a direction perpendicular to the thickness of the mask 300. When the mask assembly 10 is in operation for patterning solar cells, the mask body 320 and the isolation area of ​​the solar cell coincide along the thickness direction of the mask 300.

[0071] See Figure 1 and Figure 2 The mask 300 may have a first direction A, a second direction B, and a third direction C, all of which are different. The first direction A and the second direction B can be any two different directions perpendicular to the thickness direction of the mask 300, and the third direction C can be parallel to the thickness direction of the mask 300. For example, the first direction A, the second direction B, and the third direction C can be perpendicular to each other. Exemplarily, the first direction A can be the width direction of the mask 300, the second direction B can be the length direction of the mask 300, and the third direction C can be the thickness direction of the mask 300. The length, width, and thickness in the embodiments of this application are merely for descriptive convenience and do not imply any limitation on the dimensions. For example, the width can be greater than, equal to, or less than the length.

[0072] See Figure 3 and Figure 5The mask assembly 10 may include a first shielding member 100 and a second shielding member 200, both of which are detachably assembled with the mask 300. The mask 300 has a support surface on one side along its thickness direction. This support surface can be used to face the first shielding member 100 when it is assembled with the mask 300 (i.e., in the first operating state), for example, to support the first shielding member 100. Additionally, the support surface can be used to face the second shielding member 200 when it is assembled with the mask 300 (i.e., in the second operating state), for example, to support the second shielding member 200. The other side of the mask 300 along its thickness direction can face the semiconductor substrate.

[0073] For example, the first sub-opening 331 may correspond to the first region, and the second sub-opening 332 may correspond to the second region. When the mask assembly 10 is in the first working state or the second working state, the semiconductor substrate is disposed on the side of the mask 300 away from the support surface. Along the thickness direction of the mask 300, the first sub-opening 331 coincides with the first region, the second sub-opening 332 coincides with the second region, and the mask body 320 coincides with the isolation region.

[0074] See Figure 3 and Figure 4 In the first operating state, the first shielding member 100 is assembled on one side of the mask 300 along the thickness direction, covering the first sub-opening 331, so that the mask assembly 10 exposes the second sub-opening 332 to form a second doped layer on the semiconductor substrate located in the second region. At this time, the second shielding member 200 and the mask 300 are in a disassembled state. Thus, since the first shielding member 100 and the semiconductor substrate are respectively located on opposite sides of the mask 300 along the thickness direction, the mask 300 can prevent the first shielding member 100 from contacting the semiconductor substrate, avoiding wear on the film layer (e.g., passivation layer) on the semiconductor substrate during the disassembly and alignment of the first shielding member 100, thereby improving the conversion efficiency of the solar cell. Furthermore, by separating the first sub-opening 331 and the second sub-opening 332 by the mask body 320, it is beneficial to reduce the deposition of material into the first region through the gap between the first shielding member 100 and the semiconductor substrate, which helps to improve the accuracy of the deposition pattern.

[0075] See Figure 5 and Figure 6In the second operating state, the second shielding member 200 is assembled on one side of the mask plate 300, covering the second sub-opening 332, so that the mask plate assembly 10 exposes the first sub-opening 331 to form a first doped layer on the semiconductor substrate located in the first region. At this time, the first shielding member 100 is in a disassembled state. Thus, since the second shielding member 200 and the semiconductor substrate are located on opposite sides of the mask plate 300 along its thickness direction, the mask plate 300 can prevent the second shielding member 200 from contacting the semiconductor substrate, avoiding wear on the film layer (e.g., passivation layer) on the semiconductor substrate during the disassembly and alignment of the second shielding member 200, thereby improving the conversion efficiency of the solar cell. Furthermore, by separating the first sub-opening 331 and the second sub-opening 332 with the mask body 320, it is beneficial to reduce the deposition of material into the second region through the gap between the second shielding member 200 and the semiconductor substrate, which helps improve the accuracy of the deposition pattern.

[0076] This embodiment integrates a first sub-opening 331 corresponding to the first doped layer pattern and a second sub-opening 332 corresponding to the second doped layer pattern into a single mask 300. The mask 300 pattern is replaced with a simple mechanical movement by replacing the first shielding member 100 and the second shielding member 200, reducing the number of patterned masks 300 and mitigating damage to the passivation layer during mask replacement and alignment. Integrating two mask patterns onto a single mask 300 eliminates the need to replace a separate mask when patterning the first and second regions of the solar cell. The mask pattern can be replaced simply by replacing the first shielding member 100 and the second shielding member 200, avoiding damage to the passivation layer during mask replacement and pattern alignment. This prevents a decrease in solar cell efficiency caused by mask replacement and alignment, and promotes the use of hard masking in the large-scale production of HBC cells.

[0077] In some embodiments, see Figure 1The first sub-opening 331 includes a first sub-opening portion 3311 and a plurality of second sub-opening portions 3312. The plurality of second sub-opening portions 3312 are arranged at intervals along a first direction A and extend along a second direction B. The plurality of second sub-opening portions 3312 are located on one side of the first sub-opening portion 3311 along the second direction B, and the plurality of second sub-opening portions 3312 are all connected to the first sub-opening portion 3311. The second sub-opening 332 includes a third sub-opening portion 3323 and a plurality of fourth sub-opening portions 3324. The plurality of fourth sub-opening portions 3324 are arranged at intervals along the first direction A. The plurality of fourth sub-opening portions 3324 extend along the second direction B. The plurality of fourth sub-opening portions 3324 are located on one side of the third sub-opening portion 3323 along the second direction B, and the plurality of fourth sub-opening portions 3324 are connected to the third sub-opening portion 3323. The first sub-opening portion 3311 and the third sub-opening portion 3323 are respectively located at both ends of the opening 330 along the second direction B. The second sub-opening portions 3312 and the fourth sub-opening portions 3324 are arranged alternately along the first direction A, that is, a fourth sub-opening portion 3324 is provided between any two adjacent second sub-opening portions 3312, and a second sub-opening portion 3312 is provided between any two adjacent fourth sub-opening portions 3324. Thus, both the first sub-opening 331 and the second sub-opening 332 are interdigitated, so that the shape of the first sub-opening 331 can be adapted to the first region which is interdigitated, and the shape of the second sub-opening 332 can be adapted to the second region which is interdigitated.

[0078] In some embodiments, see Figure 1 The mask body 320 includes a plurality of first mask body portions 321 and a plurality of second mask body portions 322 arranged along a first direction A. A second mask body portion 322 is disposed between any two adjacent first mask body portions 321, and a first mask body portion 321 is disposed between any two adjacent second mask body portions 322. The first mask body portion 321 is connected to one end of the second mask body portion 322 along a second direction B. One second mask body portion 322 can enclose and form a second sub-opening 3312, and a fourth sub-opening 3324 is formed between two adjacent second mask body portions 322. The opening 330 includes a first inner wall 311 and a second inner wall 312 disposed opposite to and spaced apart along the second direction B. A first sub-opening 3311 is formed between the first inner wall 311 and the plurality of first mask body portions 321, and a third sub-opening 3323 is formed between the second inner wall 312 and the plurality of second mask body portions 322. Thus, by setting the mask body 320, the first sub-opening 331 and the second sub-opening 332 can be arranged in an interdigital shape.

[0079] For example, see Figure 1The second mask body portion 322 includes a first sub-portion 3221 and two second sub-portions 3222 arranged along a first direction A. The two second sub-portions 3222 are located on one side of the first sub-portion 3221 along a second direction B, and both second sub-portions 3222 are connected to the first sub-portion 3221. The first sub-portion 3221 and the two second sub-portions 3222 together form a second sub-opening portion 3312. In adjacent first mask body portions 321 and second mask body portions 322, the first mask body portion 321 and the end of the second sub-portion 3222 opposite to the first sub-portion 3221 are connected.

[0080] In some embodiments, see Figure 3 and Figure 4 The first shielding member 100 includes a first shielding portion 110 and a plurality of second shielding portions 120. The plurality of second shielding portions 120 are arranged at intervals along a first direction A and extend along a second direction B. The plurality of second shielding portions 120 are located on one side of the first shielding portion 110 along the second direction B, and the plurality of second shielding portions 120 are connected to the first shielding portion 110. The plurality of second shielding portions 120 are correspondingly disposed with a plurality of second sub-opening portions 3312. In the first working state, the first shielding portion 110 covers the first sub-opening portion 3311, and the second shielding portion 120 covers the corresponding second sub-opening portion 3312. Thus, the first shielding member 100 can be interdigitated to shield the interdigitated first sub-opening 331 in the first working state, thereby shielding the semiconductor substrate in the first region and exposing the semiconductor substrate in the second region.

[0081] In some embodiments, see Figure 5 and Figure 6 The second shielding member 200 includes a third shielding portion 230 and a plurality of fourth shielding portions 240. The plurality of fourth shielding portions 240 are arranged at intervals along a first direction A and extend along a second direction B. The plurality of fourth shielding portions 240 are located on one side of the third shielding portion 230 along the second direction B, and each of the plurality of fourth shielding portions 240 is connected to the third shielding portion 230. The plurality of fourth shielding portions 240 are correspondingly disposed with a plurality of fourth sub-opening portions 3324. In the second operating state, the third shielding portion 230 covers the third sub-opening portion 3323, and the fourth shielding portion 240 covers the corresponding fourth sub-opening portion 3324. Thus, the second shielding member 200 can be interdigitated to shield the interdigitated second sub-opening 332 in the second operating state, thereby shielding the semiconductor substrate in the second region and exposing the semiconductor substrate in the first region.

[0082] In some embodiments, see Figure 2 and Figure 8The mask assembly 10 includes a first limiting member 410. The first limiting member 410 can be used to limit and fix the first blocking member 100 in the first working state, and can also reduce the difficulty of aligning the first blocking member 100. In addition, by setting the first limiting member 410, the center of gravity of the first blocking member 100 can be ensured at the first limiting member 410, so that the first limiting member 410 and the mask 300 are stably assembled.

[0083] For example, see Figure 3 and Figure 8 The first limiting member 410 is disposed on one side of the frame 310 along the thickness direction, and the first limiting member 410 is located on one side of the opening 330 along the second direction B. The first limiting member 410 has a first limiting hole 411 that penetrates the first limiting member 410 along the second direction B. In the first working state, part of the first blocking part 110 covers the first sub-opening 3311, and part of the first blocking part 110 is inserted into the first limiting hole 411. Thus, by inserting a portion of the first blocking part 110 into the first limiting hole 411, the first limiting member 410 limits and fixes the first blocking member 100. In addition, by pushing and pulling the first blocking member 100 along the second direction B, the first blocking member 100 moves in the first limiting hole 411, so as to adjust the blocking of the first sub-opening 331 by the first blocking member 100. This helps to reduce the alignment difficulty between the first blocking member 100 and the first sub-opening 331, thereby reducing the alignment difficulty between the first blocking member 100 and the semiconductor substrate located in the first region.

[0084] In some embodiments, see Figure 3 and Figure 9The first shielding portion 110 includes a plurality of first sub-shielding portions 111 and a plurality of second sub-shielding portions 112 arranged along the first direction A. A second sub-shielding portion 112 is disposed between any two adjacent first sub-shielding portions 111, and a first sub-shielding portion 111 is disposed between any two adjacent second sub-shielding portions 112. The dimension of the second sub-shielding portion 112 along the thickness direction of the mask plate 300 is larger than the dimension of the first sub-shielding portion 111 along the thickness direction of the mask plate 300. The plurality of second sub-shielding portions 112 are correspondingly disposed with the plurality of second shielding portions 120. The second sub-shielding portion 112 is connected to the corresponding second shielding portion 120. The dimensions of the second sub-shielding portion 112 and the corresponding second shielding portion 120 along the thickness direction of the mask plate 300 are the same. Correspondingly, the first limiting hole 411 includes a plurality of first sub-limiting holes 4111 and a plurality of second sub-limiting holes 4112 arranged along the first direction A and connecting them. A second sub-limiting hole 4112 is provided between any two adjacent first sub-limiting holes 4111, and a first sub-limiting hole 4111 is provided between any two adjacent second sub-limiting holes 4112. The dimension of the first sub-limiting hole 4111 along the third direction C is smaller than the dimension of the second sub-limiting hole 4112 along the third direction C and the dimension of the second sub-blocking portion 112 along the third direction C. The plurality of first sub-limiting holes 4111 are correspondingly provided with the plurality of first sub-blocking portions 111, and the plurality of second sub-limiting holes 4112 are correspondingly provided with the plurality of second sub-blocking portions 112. The mask assembly 10 is configured in a first working state, where the first sub-blocking portion 111 is inserted into the corresponding first sub-limiting hole 4111, and the second sub-blocking portion 112 is inserted into the corresponding second sub-limiting hole 4112.

[0085] This configuration, where the first sub-blocking part 111 is limited and fixed by the first sub-limiting hole 4111 and the second sub-blocking part 112 is limited and fixed by the second sub-limiting hole 4112, helps reduce the alignment difficulty of the first blocking member 100 and ensures the alignment accuracy between the first blocking member 100 and the first sub-opening 331. In addition, making the first sub-blocking part 111 thinner and the second sub-blocking part 112 and the second blocking part 120 thicker helps reduce the distance between the second sub-blocking part 112, the second blocking part 120 and the support surface, making it easier for the second sub-blocking part 112, the second blocking part 120 to contact the support surface. This helps prevent the deposition material from depositing into the second area through the gap between the first blocking member 100 and the mask plate 300, and helps improve the accuracy of the deposition pattern.

[0086] In some embodiments, see Figure 2 and Figure 10The mask assembly 10 includes a second limiting member 420. The second limiting member 420 can be used to limit and fix the second blocking member 200 in the second working state, which helps to reduce the difficulty of aligning the second limiting member 420 and helps to ensure the alignment accuracy between the second limiting member 420 and the second sub-opening 332. In addition, by setting the second limiting member 420, the center of gravity of the second blocking member 200 can be ensured to be at the second limiting member 420, so that the second limiting member 420 and the mask 300 are stably assembled.

[0087] For example, see Figure 5 and Figure 10 The second limiting member 420 is disposed on one side of the frame 310 along the thickness direction, and the second limiting member 420 is located on the other side of the opening 330 along the second direction B. The second limiting member 420 has a second limiting hole 422 that penetrates the second limiting member 420 along the second direction B. The mask assembly 10 is configured in a second working state, in which a portion of the third blocking portion 230 covers the third sub-opening 3323, and a portion of the third blocking portion 230 is inserted into the second limiting hole 422. Thus, by inserting a portion of the second blocking portion 120 into the second limiting hole 422, the second limiting member 420 limits and fixes the second blocking member 200.

[0088] In some embodiments, see Figure 5 and Figure 11The third masking part 230 includes a plurality of third sub-masking parts 233 and a plurality of fourth sub-masking parts 234 arranged along the first direction A. A fourth sub-masking part 234 is disposed between any two adjacent third sub-masking parts 233, and a third sub-masking part 233 is disposed between any two adjacent fourth sub-masking parts 234. The dimension of the fourth sub-masking part 234 along the thickness direction of the mask plate 300 is larger than the dimension of the third sub-masking part 233 along the thickness direction of the mask plate 300. The plurality of fourth sub-masking parts 234 are correspondingly disposed with the plurality of fourth masking parts 240. The fourth sub-masking part 234 is connected to the corresponding fourth masking part 240. The dimensions of the fourth sub-masking part 234 and the corresponding fourth masking part 240 along the thickness direction of the mask plate 300 are the same. Correspondingly, the second limiting hole 422 includes a plurality of third sub-limiting holes 4223 and a plurality of fourth sub-limiting holes 4224 arranged along the first direction A. A fourth sub-limiting hole 4224 is provided between any two adjacent third sub-limiting holes 4223, and a third sub-limiting hole 4223 is provided between any two adjacent fourth sub-limiting holes 4224. The dimension of the third sub-limiting hole 4223 along the third direction C is smaller than the dimension of the fourth sub-limiting hole 4224 along the third direction C and the dimension of the fourth sub-blocking portion 234 along the third direction C. The plurality of third sub-limiting holes 4223 are correspondingly arranged with the plurality of third sub-blocking portions 233, and the plurality of fourth sub-limiting holes 4224 are correspondingly arranged with the plurality of fourth sub-blocking portions 234. The mask assembly 10 is configured in a second working state, where the third sub-blocking portion 233 is inserted into the corresponding third sub-limiting hole 4223, and the fourth sub-blocking portion 234 is inserted into the corresponding fourth sub-limiting hole 4224.

[0089] This configuration, where the third sub-blocking part 233 is limited and fixed by the third sub-limiting hole 4223 and the fourth sub-blocking part 234 is limited and fixed by the fourth sub-limiting hole 4224, helps reduce the alignment difficulty of the second sub-blocking member 200 and ensures the alignment accuracy between the second sub-blocking member 200 and the second sub-opening 332. In addition, making the third sub-blocking part 233 thinner and the fourth sub-blocking parts 234 and 240 thicker helps reduce the distance between the fourth sub-blocking parts 234 and 240 and the support surface, facilitating contact between the fourth sub-blocking parts 234 and 240 and the support surface. This also helps reduce the deposition of material from the gap between the second sub-blocking member 200 and the mask plate 300 into the first region, thus improving the accuracy of the deposition pattern.

[0090] For example, the dimensions of the first limiting member 410 and / or the second limiting member 420 along the thickness direction (i.e., the third direction C) of the mask plate 300 range from 500μm to 800μm.

[0091] For example, the dimensions of the first limiting member 410 and / or the second limiting member 420 along the second direction B range from 30μm to 100μm. The dimensions of the first limiting member 410 and / or the second limiting member 420 along the first direction A and the second direction B can be determined according to the size of the solar cell.

[0092] In some embodiments, see Figure 3 , Figure 5 and Figure 7 The surface of the first blocking portion 110 facing away from the second blocking portion 120 is designated as the first surface 141, and the surface of the third blocking portion 230 facing away from the fourth blocking portion 240 is designated as the second surface 262. At least one of the first surface 141 and the second surface 262 includes a mounting surface, and an operating element 430 is provided on the mounting surface. This embodiment of the application will be described using an example where both the first surface 141 and the second surface 262 are provided with an operating element 430.

[0093] For example, an operating member 430 can be provided on the first surface 141. The first blocking member 100 can be pushed and pulled through the operating member 430, and the first blocking member 100 can be easily installed and removed.

[0094] For example, an operating member 430 can be provided on the second side 262, through which the second blocking member 200 can be pushed and pulled, and the second blocking member 200 can be easily installed and removed.

[0095] For example, the size of the operating member 430 along the first direction A ranges from 2cm to 4cm.

[0096] For example, the size of the operating member 430 along the second direction B ranges from 2cm to 4cm.

[0097] For example, the dimension of the operating element 430 along the thickness direction of the mask plate 300 ranges from 2cm to 3cm.

[0098] For example, the operating component 430 includes a first operating part and a second operating part connected together. The first operating part is connected to the mounting surface, and the second operating part is disposed at the end of the first operating part away from the mounting surface and extends away from the first operating part along the thickness direction of the mask plate 300. The second operating part is spaced apart from and opposite to the operating surface. For example, the operating component 430 can be an L-shaped handle, which makes the shape of the operating component 430 simpler and helps to reduce the manufacturing difficulty and cost of the operating component 430.

[0099] In some embodiments, at least one of the first limiting member 410 and the second limiting member 420 is a ferromagnetic solid, and the operating member 430 is a magnet. The ferromagnetic solid can be magnetized under the magnetic field of the magnet and thus acquire magnetism. When a ferromagnetic object (such as iron, cobalt, nickel, etc.) and a magnet approach each other, the magnetic field of the magnet causes the magnetic moments within the ferromagnetic object to align, resulting in a magnetic attraction that draws the magnet and the ferromagnetic object closer together and causes them to adhere. In the first operating state, the first limiting member 410 and the operating member 430 attract each other, which helps improve the assembly stability of the first shielding member 100 and the mask plate 300. Furthermore, in the second operating state, the second limiting member 420 and the operating member 430 attract each other, which helps improve the assembly stability of the second shielding member 200 and the mask plate 300.

[0100] In some embodiments, the mask plate 300 has a support surface on one side along the thickness direction. In the first working state, the first shielding member 100 is in contact with the support surface, so that the support surface can support the first shielding member 100. This helps to reduce the deposition of material from the gap between the first shielding member 100 and the mask plate 300 into the second region, and helps to improve the accuracy of the deposition pattern.

[0101] In some embodiments, in the second working state, the second shielding member 200 contacts the supporting surface, thereby enabling the supporting surface to support the second shielding member 200. This helps to reduce the deposition of material from the gap between the second shielding member 200 and the mask plate 300 into the first region, and helps to improve the accuracy of the deposition pattern.

[0102] In some embodiments, see Figure 1 and Figure 3The mask body 320 includes a first sidewall 341 facing the first sub-opening 331 and a second sidewall 342 facing the second sub-opening 332. The orthographic projection of the first sidewall 341 on the reference plane is a first orthographic projection, and the orthographic projection of the second sidewall 342 on the reference plane is a second orthographic projection. In the first operating state, the first shielding member 100 includes a third sidewall 133 facing the second sub-opening 332. The orthographic projection of the third sidewall 133 on the reference plane is a third orthographic projection, which is located between the first and second orthographic projections. The distance between the third orthographic projection and the first orthographic projection is in the range of 3μm-8μm (i.e., the width of the mask body 320 covered by the first shielding member 100 is in the range of 3μm-8μm). This can avoid the distance being too small, which is beneficial to increasing the contact area between the first shielding member 100 and the mask body 320, thereby improving the support stability of the mask body 320 on the first shielding member 100. It can also prevent the deposited material from being deposited on the passivation layer on the back of the solar cell located in the first region through the gap between the first shielding member 100 and the mask body 320. In addition, this can avoid the distance being too large, so as to avoid the mask body 320 being too large and affecting the effective setting area of ​​the first doped layer and the second doped layer. For example, the distance can be 3μm, 4μm, 6μm, 8μm, or any value between 3μm and 8μm.

[0103] In some embodiments, see Figure 1 and Figure 5 In the second operating state, the second shielding member 200 includes a fourth sidewall 254 facing the first sub-opening 331. The orthographic projection of the fourth sidewall 254 on the reference plane is a fourth orthographic projection, which is located between the first and second orthographic projections. The distance between the fourth orthographic projection and the second orthographic projection is in the range of 3μm-8μm (i.e., the width of the mask body 320 covered by the second shielding member 200 is in the range of 3μm-8μm). This can avoid the distance being too small, which is beneficial to increasing the contact area between the second shielding member 200 and the mask body 320, thereby improving the support stability of the mask body 320 for the second shielding member 200. It can also prevent the deposited material from being deposited on the passivation layer on the back of the solar cell located in the second region through the gap between the second shielding member 200 and the mask body 320. In addition, it can also avoid the distance being too large, so as to avoid the mask body 320 being too large and affecting the effective setting area of ​​the first doped layer and the second doped layer. For example, the distance can be 3μm, 4μm, 6μm, 8μm, or any value between 3μm and 8μm.

[0104] For example, the material of the mask 300 may include a metallic material.

[0105] The deposition apparatus provided in the embodiments of this application will be described below.

[0106] For example, the size of the mask 300 along the first direction A ranges from 156.75mm to 210mm. For instance, the size of the mask 300 along the first direction A can be 156.75mm, 182mm, 210mm, or any value between 156.75mm and 210mm.

[0107] For example, the dimension of the mask 300 along the second direction B ranges from 156.75mm to 210mm. Specifically, the dimension of the mask 300 along the second direction B can be 156.75mm, 182mm, 210mm, or any value between 156.75mm and 210mm. This application embodiment does not limit the dimension of the mask 300; the dimension of the mask 300 can be determined according to the required size of the solar cell to be fabricated.

[0108] In the embodiment where the first region corresponds to the N-type region and the second region corresponds to the P-type region, the size range of the second blocking part 120 along the first direction A is 50μm-200μm, and the size range of the fourth blocking part 240 along the first direction A is 500μm-800μm.

[0109] In the embodiment where the first region corresponds to the N-type region and the second region corresponds to the P-type region, the size range of the second sub-limiting hole 4112 along the first direction A is 50μm-200μm, and the size range of the fourth sub-limiting hole 4224 along the first direction A is 500μm-800μm.

[0110] For example, the dimensions of the second sub-limiting hole 4112 and / or the fourth sub-limiting hole 4224 along the thickness direction of the mask plate 300 range from 300μm to 500μm.

[0111] For example, the dimensions of the first sub-limiting hole 4111 and / or the third sub-limiting hole 4223 along the thickness direction of the mask plate 300 range from 200μm to 300μm.

[0112] For example, the thickness of the mask 300 ranges from 300 μm to 500 μm.

[0113] For example, a method for fabricating a solar cell may include step S1, obtaining a single-sided polished and clean silicon wafer. The surface of the original silicon wafer is double-sided polished using an alkaline or acidic solution to remove the cutting damage layer on the silicon wafer surface. Then, the silicon wafer is cleaned using acid and alkaline solutions respectively to remove organic and metal ion contaminants from the silicon wafer surface. Next, a silicon oxynitride layer is deposited on one side of the silicon wafer using chemical vapor deposition (this is taken as the back side of the solar cell). Then, the front side of the silicon wafer is texturized using a 1%-10% potassium hydroxide solution to form a pyramidal textured structure from the polished surface. Finally, the protective layer on the back side of the silicon wafer is removed using hydrofluoric acid solution, exposing the polished surface on the back side of the silicon wafer. Step S2, a first intrinsic amorphous silicon layer and a silicon nitride layer are sequentially deposited on the front side of the silicon wafer using chemical vapor deposition, and a second intrinsic amorphous silicon layer is deposited on the back side of the silicon wafer. The first intrinsic amorphous silicon layer and the silicon nitride layer can provide chemical passivation, while the silicon nitride layer can provide anti-reflection. After forming the second intrinsic amorphous silicon, the mask assembly 10 can be used to prepare the first doped layer in the first region and the second doped layer in the second region, respectively.

[0114] The thickness of the first intrinsic amorphous silicon layer ranges from 5 nm to 10 nm, and its refractive index ranges from 3.5 to 4.5. The thickness of the second intrinsic amorphous silicon layer also ranges from 5 nm to 10 nm, and its refractive index ranges from 3.5 to 4.5. The thickness of the silicon nitride layer ranges from 75 nm to 100 nm, and its refractive index ranges from 1.8 to 2.2.

[0115] This application provides a deposition apparatus, which includes the mask assembly 10 described in the above embodiments.

[0116] For example, deposition setups may include atomic layer deposition (ALD) equipment, physical vapor deposition (PVD) equipment, or chemical vapor deposition (CVD) equipment.

[0117] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0118] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A mask assembly, characterized in that, include: A mask plate, the mask plate including a frame and a mask body, the frame forming an opening, the mask body being located in the opening and dividing the opening into a first sub-opening and a second sub-opening; The first and second shielding components are detachably assembled with the mask plate; The mask assembly is configured such that: in a first operating state, the first blocking member is assembled on one side of the mask to cover the first sub-opening, thereby exposing the second sub-opening of the mask assembly; and in a second operating state, the second blocking member is assembled on one side of the mask to cover the second sub-opening, thereby exposing the first sub-opening of the mask assembly.

2. The mask assembly according to claim 1, characterized in that, The mask body includes a plurality of first mask body portions and a plurality of second mask body portions arranged along a first direction. A second mask body is disposed between any two adjacent first mask body parts, and a first mask body is disposed between any two adjacent second mask body parts. The first mask body is connected to one end of the second mask body part along a second direction, and the first direction and the second direction intersect.

3. The mask assembly according to claim 2, characterized in that, The second mask body portion includes a first sub-portion and two second sub-portions arranged along the first direction. The two second sub-portions are located on one side of the first sub-portion along the second direction and are connected to the first sub-portion. In adjacent first mask body portions and second mask body portions, the first mask body portion is connected to the end of the second sub-portion opposite to the first sub-portion.

4. The mask assembly according to any one of claims 1-3, characterized in that, The first sub-opening includes a first sub-opening portion and a plurality of second sub-opening portions. The plurality of second sub-opening portions are arranged along a first direction and extend along a second direction. The plurality of second sub-opening portions are located on one side of the first sub-opening portion along the second direction and are all connected to the first sub-opening portion.

5. The mask assembly according to claim 4, characterized in that, The second sub-opening includes a third sub-opening and a plurality of fourth sub-openings. The plurality of fourth sub-openings are arranged along the first direction and extend along the second direction. The plurality of fourth sub-openings are located on one side of the third sub-opening along the second direction and are all connected to the third sub-opening. The first sub-opening and the third sub-opening are respectively located at both ends of the opening along the second direction. A fourth sub-opening is provided between any two adjacent second sub-openings, and a second sub-opening is provided between any two adjacent fourth sub-openings.

6. The mask assembly according to claim 5, characterized in that, The first shielding member includes a first shielding part and a plurality of second shielding parts. The plurality of second shielding parts are arranged at intervals along the first direction and extend along the second direction. The plurality of second shielding parts are located on one side of the first shielding part along the second direction and are all connected to the first shielding part. The plurality of second blocking portions are correspondingly disposed with the plurality of second sub-opening portions; in the first working state, the first blocking portion covers the first sub-opening portion, and the second blocking portion covers the corresponding second sub-opening portion.

7. The mask assembly according to claim 6, characterized in that, The second shielding member includes a third shielding part and a plurality of fourth shielding parts. The plurality of fourth shielding parts are arranged at intervals along the first direction and extend along the second direction. The plurality of fourth shielding parts are located on one side of the third shielding part along the second direction and are all connected to the third shielding part. The plurality of fourth blocking parts are correspondingly arranged with the plurality of fourth sub-opening parts; in the second working state, the third blocking part covers the third sub-opening part, and the fourth blocking part covers the corresponding fourth sub-opening part.

8. The mask assembly according to any one of claims 1-3, characterized in that, The mask assembly includes a first limiting member, which is disposed on one side of the frame and located on the side of the opening along the second direction. The first limiting member has a first limiting hole that penetrates the first limiting member along the second direction. The first blocking member includes a first blocking part and a plurality of second blocking parts. In the first working state, a portion of the first blocking part is inserted into the first limiting hole.

9. The mask assembly according to claim 8, characterized in that, The first shielding portion includes a plurality of first sub-shielding portions and a plurality of second sub-shielding portions arranged along a first direction. A second sub-shielding portion is disposed between any two adjacent first sub-shielding portions, and a first sub-shielding portion is disposed between any two adjacent second sub-shielding portions. The dimension of the second sub-shielding portion along the thickness direction of the mask plate is greater than the dimension of the first sub-shielding portion along the thickness direction of the mask plate. The plurality of second sub-blocking parts are provided corresponding to the plurality of second blocking parts, and the second sub-blocking parts are connected to the corresponding second blocking parts.

10. The mask assembly according to claim 9, characterized in that, The first limiting hole includes a plurality of first sub-limiting holes and a plurality of second sub-limiting holes arranged and connected along the first direction. A second sub-limiting hole is provided between any two adjacent first sub-limiting holes, and a first sub-limiting hole is provided between any two adjacent second sub-limiting holes. The dimension of the first sub-limiting hole along the thickness direction of the mask plate is smaller than the dimension of the second sub-limiting hole along the thickness direction of the mask plate and the dimension of the second sub-blocking portion along the thickness direction of the mask plate. The plurality of first sub-limiting holes are correspondingly provided with the plurality of first sub-blocking parts, and the plurality of second sub-limiting holes are correspondingly provided with the plurality of second sub-blocking parts; In the first working state, the first sub-blocking part is inserted into the corresponding first sub-limiting hole, and the second sub-blocking part is inserted into the corresponding second sub-limiting hole.

11. The mask assembly according to claim 8, characterized in that, The mask assembly includes a second limiting member, which is disposed on one side of the frame along the thickness direction and on the other side of the opening along the second direction. The second limiting member has a second limiting hole that penetrates the second limiting member along the second direction. The second blocking member includes a third blocking part and a plurality of fourth blocking parts. In the second working state, part of the third blocking part is inserted into the second limiting hole.

12. The mask assembly according to claim 11, characterized in that, The third shielding portion includes a plurality of third sub-shielding portions and a plurality of fourth sub-shielding portions arranged along the first direction. A fourth sub-shielding portion is disposed between any two adjacent third sub-shielding portions, and a third sub-shielding portion is disposed between any two adjacent fourth sub-shielding portions. The dimension of the fourth sub-shielding portion along the thickness direction of the mask plate is larger than the dimension of the third sub-shielding portion along the thickness direction of the mask plate. The plurality of fourth sub-blocking parts are provided corresponding to the plurality of fourth blocking parts, and the fourth sub-blocking parts are connected to the corresponding fourth blocking parts.

13. The mask assembly according to claim 12, characterized in that, The second limiting hole includes a plurality of third sub-limiting holes and a plurality of fourth sub-limiting holes arranged along the first direction. A fourth sub-limiting hole is disposed between any two adjacent third sub-limiting holes, and a third sub-limiting hole is disposed between any two adjacent fourth sub-limiting holes. The dimension of the third sub-limiting hole along the thickness direction of the mask plate is smaller than the dimension of the fourth sub-limiting hole along the thickness direction of the mask plate and the dimension of the fourth sub-blocking portion along the thickness direction of the mask plate. The plurality of third sub-limiting holes are correspondingly disposed with the plurality of third sub-blocking portions, and the plurality of fourth sub-limiting holes are correspondingly disposed with the plurality of fourth sub-blocking portions. In the second working state, the third sub-blocking part is inserted into the corresponding third sub-limiting hole, and the fourth sub-blocking part is inserted into the corresponding fourth sub-limiting hole.

14. The mask assembly according to claim 7, characterized in that, The side of the first shielding portion facing away from the second shielding portion is the first surface, and the side of the third shielding portion facing away from the fourth shielding portion is the second surface. At least one of the first surface and the second surface includes a mounting surface. An operating component is provided on the mounting surface. The operating component includes a first operating part and a second operating part connected together. The first operating part is connected to the mounting surface, and the second operating part is disposed at the end of the first operating part away from the mounting surface and extends away from the first operating part along the thickness direction of the mask plate.

15. The mask assembly according to claim 14, characterized in that, The operating component is a magnet.

16. The mask assembly according to claim 11, characterized in that, At least one of the first limiting member and the second limiting member is a ferromagnetic solid member.

17. The mask assembly according to any one of claims 1-3, characterized in that, The mask plate has a support surface on one side along the thickness direction; In the first operating state, the first shielding member is in contact with the supporting surface; and / or, in the second operating state, the second shielding member is in contact with the supporting surface.

18. The mask assembly according to any one of claims 1-3, characterized in that, The mask body includes a first sidewall facing the first sub-opening and a second sidewall facing the second sub-opening. The orthographic projection of the first sidewall on the reference plane is a first orthographic projection, and the orthographic projection of the second sidewall on the reference plane is a second orthographic projection. The reference surface is perpendicular to the thickness direction of the mask plate; In the first working state, the first shielding member includes a third sidewall facing the second sub-opening. The orthographic projection of the third sidewall on the reference plane is a third orthographic projection. The third orthographic projection is located between the first orthographic projection and the second orthographic projection, and the distance between the third orthographic projection and the first orthographic projection is in the range of 3μm-8μm. And / or, in the second operating state, the second shielding member includes a fourth sidewall facing the first sub-opening, the orthographic projection of the fourth sidewall on the reference plane being a fourth orthographic projection, the fourth orthographic projection being located between the first orthographic projection and the second orthographic projection, and the distance between the fourth orthographic projection and the second orthographic projection being in the range of 3μm-8μm.

19. A deposition apparatus, characterized in that, include: The mask assembly according to any one of claims 1-18.

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