Novel tungsten filament surface copper alloy electroplating equipment

Abstract

The utility model provides novel tungsten wire surface copper alloy electroplating equipment which comprises an electroplating bath, and an anode plate is arranged at the inner bottom of the electroplating bath; an isolation plate is arranged in the electroplating tank to divide the electroplating tank into an upper chamber and a lower chamber, and a plurality of rows of communicating holes are formed in the isolation plate at equal intervals; an air supply pipe is arranged at the bottom of the isolation plate, a plurality of vertically downward air distribution pipes are arranged on the air supply pipe, all the air distribution pipes are communicated with the air supply pipe, and an air compressor is arranged at a pipe opening of the air supply pipe. During use, the interior of the electroplating bath is divided into an upper cavity and a lower cavity by arranging the isolation plate in the electroplating bath, meanwhile, the air supply pipe is arranged at the bottom of the isolation plate to be connected with the air compressor, the multiple vertically-downward air distribution pipes are arranged on the air supply pipe, and air flow is output into the electroplating bath through the air compressor so that electroplating liquid can be stirred in a floating mode; and the floating force of the electroplating liquid is isolated by the isolation plate, so that the effect of protecting the tungsten filament while improving the uniformity of the electroplating liquid is achieved.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to a novel copper alloy electroplating equipment for tungsten wire surfaces. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhancing aesthetics.

[0003] Tungsten wire is characterized by high hardness, poor toughness, and easy oxidation. To improve the toughness and oxidation resistance of tungsten wire, it can be electroplated to form a copper alloy layer on its outer surface.

[0004] During electroplating, the plating solution is typically stirred to improve its uniformity. However, the poor toughness of tungsten wire makes it prone to breakage during stirring. Therefore, only small-scale stirring is possible, but even this is insufficient to achieve uniformity in the plating solution composition.

[0005] Therefore, this application proposes a novel copper alloy electroplating equipment for tungsten wire surfaces, which improves the uniformity of the electroplating solution during the electroplating of tungsten wires. Utility Model Content

[0006] In view of the shortcomings of the prior art mentioned above, the purpose of this utility model is to provide a new type of copper alloy electroplating equipment for tungsten wire surface, which solves the problem of uneven electroplating solution in the tungsten wire electroplating process mentioned in the prior art.

[0007] To achieve the above and other related objectives, this utility model provides a novel copper alloy electroplating equipment for tungsten wire surfaces, including an electroplating tank, wherein an anode plate is provided at the bottom of the electroplating tank;

[0008] The electroplating tank is internally equipped with a partition plate that divides the electroplating tank into an upper chamber and a lower chamber. The partition plate is provided with multiple rows of connecting holes at equal intervals.

[0009] The bottom of the isolation plate is provided with an air supply pipe, and several vertically downward air distribution pipes are provided on the air supply pipe. All the air distribution pipes are connected to the air supply pipe. An air compressor is provided at the pipe opening of the air supply pipe, and the air compressor is located on the outer surface of the electroplating tank.

[0010] The inner wall of the electroplating tank is provided with a side support plate, and a tungsten wire support frame is supported on the side support plate;

[0011] The outer surface of the electroplating tank is provided with a cathode terminal, which is electrically connected to the side support plate.

[0012] Preferably, the isolation plate is an insulating plate.

[0013] Preferably, the air supply pipe is suspended at the bottom of the isolation plate, and the air supply pipe is distributed along the gap between the connecting holes.

[0014] Preferably, the gas distribution pipe extends directly above the anode plate, and a one-way valve is provided at the opening of the gas distribution pipe.

[0015] Preferably, the number of side support plates is several, and the several side support plates are symmetrically distributed on both sides of the inner wall of the electroplating tank. Both ends of the tungsten wire support frame are supported by the side support plates on both sides, and a gap is left between the bottom of the tungsten wire support frame and the top of the isolation plate.

[0016] Preferably, except for the side support plate and tungsten wire support frame which are electrically connected to the cathode terminal, the remaining side support plates and tungsten wire support frames are made of insulating materials.

[0017] Preferably, each of the tungsten wire support frames is provided with a plurality of limiting posts at its top, and the limiting posts are rubber rods.

[0018] Preferably, all side support plates have floating slides on their surfaces facing the center of the electroplating tank, and both ends of the tungsten wire support frame extend into the interior of the floating slides, and the tungsten wire support frame can float up and down along the floating slides.

[0019] Preferably, both ends of the tungsten wire support frame are provided with limit sliders, which extend into the interior of the floating slide and are limited.

[0020] Preferably, in a top view, the tungsten wire support frame is located directly above the connecting hole, and the tungsten wire support frame completely blocks the connecting hole directly below it.

[0021] As described above, the novel copper alloy electroplating equipment for tungsten wire surfaces of this utility model has the following beneficial effects:

[0022] 1. This utility model divides the interior of the electroplating tank into upper and lower chambers by setting an isolation plate inside the electroplating tank. At the same time, an air supply pipe is set at the bottom of the isolation plate and connected to an air compressor. Several vertically downward air distribution pipes are set on the air supply pipe. The air compressor outputs airflow into the interior of the electroplating tank to make the electroplating solution float and stir. The floating force of the electroplating solution is isolated by the isolation plate, which achieves the effect of improving the uniformity of the electroplating solution while protecting the tungsten wire.

[0023] 2. This utility model sets a floating slide on the side support plate, so that both ends of the tungsten wire support frame extend into the interior of the floating slide and are limited by a limiting slider, so that the tungsten wire support frame is located directly above the connecting hole. When the one-way valve aerates the interior of the electroplating solution, because the space of the lower chamber of the electroplating tank is small, the electroplating solution will rise from the connecting hole and push the tungsten wire support frame to float, thereby causing the tungsten wire to move up and down. During the descent, it is supported by the buoyancy of the electroplating solution and slowly descends, so as to increase the contact area between the tungsten wire and the electroplating solution.

[0024] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value. Attached Figure Description

[0025] Figure 1 The diagram shown is a structural schematic of this utility model.

[0026] Figure 2 The diagram shown is a top view of the structure of this utility model.

[0027] Figure 3 The diagram shown is a cross-sectional view of the structure of this utility model.

[0028] Figure 4 The diagram shown is an installation schematic of the isolation plate of this utility model.

[0029] Figure 5 The diagram shown is an installation schematic of the air delivery pipe of this utility model.

[0030] Figure 6 The diagram shown is a structural schematic of the tungsten wire support frame of this utility model.

[0031] Component designation explanation:

[0032] 1. Electroplating tank; 2. Anode plate; 3. Isolation plate; 4. Connecting hole; 5. Air supply pipe; 6. Air distribution pipe; 7. One-way valve; 8. Air compressor; 9. Side support plate; 10. Cathode terminal block; 11. Tungsten wire support frame; 12. Limiting post; 13. Floating slide; 14. Limiting slider. Detailed Implementation

[0033] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0034] Please see Figures 1 to 6It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, the terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and are not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0035] like Figures 1-3 As shown, this utility model provides a novel copper alloy electroplating equipment for tungsten wire surfaces, including an electroplating tank 1. The electroplating tank 1 is filled with a large amount of electroplating solution, such as copper alloy electroplating solution, which completely submerges the tungsten wire during electroplating. An anode plate 2 is provided at the bottom of the electroplating tank 1 and connected to an external power source. When the anode plate 2 is energized, metal ions are generated and enter the electroplating solution to achieve electroplating.

[0036] An internal partition plate 3 divides the electroplating tank 1 into an upper chamber and a lower chamber. Tungsten wires are electroplated above the partition plate 3, which keeps them away from the bottom of the tank. Multiple rows of connecting holes 4 are evenly spaced on the partition plate 3. The electroplating solution activated by metal ions from the anode plate 2 combines with the tungsten wires through these holes, adhering to the outer surface of the wires to form an electroplated layer. The partition plate 3 is an insulating plate used to prevent it from participating in the electroplating process of the tungsten wires.

[0037] An air supply pipe 5 is installed at the bottom of the isolation plate 3. Several vertically downward-pointing air distribution pipes 6 are installed on the air supply pipe 5, and all air distribution pipes 6 are connected to the air supply pipe 5. An air compressor 8 is installed at the inlet of the air supply pipe 5, and the air compressor 8 is located on the outer surface of the electroplating tank 1. During the electroplating process, the air compressor 8 compresses air and transmits high-pressure air to the air supply pipe 5, which is then released through the air distribution pipes 6 to agitate the electroplating solution settled at the bottom of the electroplating tank 1, improving the uniformity of the internal components of the electroplating solution. The violently vibrating electroplating solution is blocked by the isolation plate 3, thereby reducing the agitation force of the electroplating solution and protecting the tungsten filament.

[0038] The inner wall of the electroplating tank 1 is provided with a side support plate 9, on which a tungsten wire support frame 11 is supported. During tungsten wire electroplating, a whole roll of tungsten wire is placed on the tungsten wire support frame 11 and immersed in the electroplating solution. The outer surface of the electroplating tank 1 is provided with a cathode terminal 10, which is electrically connected to the side support plate 9. The cathode terminal 10 is connected to the cathode of the power supply, thereby connecting to the tungsten wire through the side support plate 9, making the tungsten wire the negative electrode for electroplating.

[0039] like Figure 3 As shown, in some embodiments, the air supply pipe 5 of this invention is suspended from the bottom of the isolation plate 3, thereby creating a gap between the air supply pipe 5 and the isolation plate 3 to increase the amount of electroplating solution passing through the connecting hole 4. The air supply pipe 5 is distributed along the gap between the connecting holes 4 to further avoid the air supply pipe 5 obstructing the connecting holes 4.

[0040] like Figure 3 As shown, in some embodiments, the gas distribution pipe 6 of this invention extends directly above the anode plate 2. When the gas distribution pipe 6 starts aeration, it causes the electroplating solution around the anode plate 2 to flow violently, thereby increasing the movement speed of metal ions on the anode plate 2 and improving the electroplating effect. A one-way valve 7 is provided at the opening of the gas distribution pipe 6 to prevent the electroplating solution from flowing back and damaging the air compressor 8 when the air compressor 8 is not working.

[0041] like Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, the number of side support plates 9 of this invention is several, and the several side support plates 9 are symmetrically distributed on both sides of the inner wall of the electroplating tank 1. Both ends of the tungsten wire support frame 11 are supported by the side support plates 9 on both sides, and a gap is left between the bottom of the tungsten wire support frame 11 and the top of the isolation plate 3. By setting multiple tungsten wire support frames 11, the support area for the tungsten wire is increased, the amount of tungsten wire drooping is reduced, and the tungsten wire can be placed in the middle layer of the electroplating solution. The gap left between the tungsten wire support frame 11 and the isolation plate 3 is used to increase the contact area between the tungsten wire and the electroplating solution, thereby improving the efficiency of electroplating.

[0042] It should be noted that, except for the side support plate 9 and tungsten wire support frame 11 which are electrically connected to the cathode terminal 10, the remaining side support plates 9 and tungsten wire support frames 11 are made of insulating material. This is to prevent the remaining side support plates 9 and tungsten wire support frames 11 from participating in the electroplating reaction, thereby reducing the consumption of electroplating solution.

[0043] like Figure 1 , Figure 2 and Figure 3As shown, in some embodiments, each tungsten wire support frame 11 of this invention is provided with several limiting posts 12 at its top. When the tungsten wire is placed on top of the tungsten wire support frame 11, the limiting posts 12 are used to limit the tungsten wire and prevent it from slipping onto the isolation plate 3. The limiting posts 12 are rubber rods to prevent electroplating reactions. At the same time, they are used to reduce friction between the limiting posts 12 and the tungsten wire, protecting the tungsten wire from damage.

[0044] like Figure 1 and Figure 3 As shown, in some embodiments, all side support plates 9 of this invention have floating slides 13 on their surfaces facing the center of the electroplating tank 1. Both ends of the tungsten wire support frame 11 extend into the interior of the floating slides 13, and the tungsten wire support frame 11 can float up and down along the floating slides 13. When gas aerates the electroplating solution in the electroplating tank 1 through the gas distribution pipe 6, bubbles rise with the electroplating solution. At this time, the rising bubbles push the tungsten wire support frame 11 to float irregularly up and down, causing the tungsten wire to float up and down as well. The floating tungsten wire can stir the electroplating solution in the upper chamber of the electroplating tank 1, making its internal components evenly mixed. Furthermore, the buoyancy of the electroplating solution can cause the tungsten wire to slowly fall back onto the tungsten wire support frame 11, allowing the electroplating solution to electroplat the contact area between the tungsten wire and the tungsten wire support frame 11.

[0045] like Figure 6 As shown, in some embodiments, both ends of the tungsten wire support frame 11 of this invention are provided with limiting sliders 14, which extend into the interior of the floating slide 13 and are limited. The limitation by the limiting sliders 14 can prevent the tungsten wire support frame 11 from detaching from the constraint of the floating slide 13, thereby ensuring the stability of the tungsten wire support frame 11.

[0046] like Figure 2 As shown, in some embodiments, in a top view, the tungsten wire support frame 11 is located directly above the connecting hole 4, and the tungsten wire support frame 11 completely blocks the connecting hole 4 directly below it. When the electroplating solution is driven by gas, the power of the electroplating solution is transmitted to the top of the isolation plate 3 through the connecting hole 4. At this time, the power of the electroplating solution acts directly on the tungsten wire support frame 11 through the connecting hole 4, making the tungsten wire support frame 11 easier to move.

[0047] In summary, the novel copper alloy electroplating equipment for tungsten wire surfaces of this utility model divides the interior of the electroplating tank 1 into upper and lower chambers by setting an isolation plate 3 inside the electroplating tank 1. At the same time, an air supply pipe 5 is set at the bottom of the isolation plate 3 and connected to an air compressor 8. Several vertically downward air distribution pipes 6 are set on the air supply pipe 5. The air compressor 8 outputs airflow into the interior of the electroplating tank 1 to make the electroplating solution float and stir. The force of the electroplating solution floating is isolated by the isolation plate 3, which achieves the effect of improving the uniformity of the electroplating solution while protecting the tungsten wire.

[0048] This invention provides a floating slide 13 on the side support plate 9, allowing both ends of the tungsten wire support frame 11 to extend into the interior of the floating slide 13 and be limited by the limiting slider 14, so that the tungsten wire support frame 11 is located directly above the connecting hole 4. When the one-way valve 7 aerates the interior of the electroplating solution, because the space of the lower chamber of the electroplating tank 1 is small, the electroplating solution will rise from the connecting hole 4 and push the tungsten wire support frame 11 to float, thereby causing the tungsten wire to move up and down. During the descent, it is supported by the buoyancy of the electroplating solution and slowly descends, thereby increasing the contact area between the tungsten wire and the electroplating solution.

[0049] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0050] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A novel copper alloy electroplating equipment for tungsten wire surfaces, characterized in that, It includes an electroplating tank (1), and an anode plate (2) is provided at the bottom of the inner part of the electroplating tank (1); The electroplating tank (1) is provided with an isolation plate (3) to divide the electroplating tank (1) into an upper chamber and a lower chamber. The isolation plate (3) is provided with multiple rows of connecting holes (4) at equal intervals. The bottom of the isolation plate (3) is provided with an air supply pipe (5), and a number of vertically downward air distribution pipes (6) are provided on the air supply pipe (5). All the air distribution pipes (6) are connected to the air supply pipe (5). An air compressor (8) is provided at the pipe opening of the air supply pipe (5), and the air compressor (8) is located on the outer surface of the electroplating tank (1). The inner wall of the electroplating tank (1) is provided with a side support plate (9), and a tungsten wire support frame (11) is supported on the side support plate (9); The outer surface of the electroplating tank (1) is provided with a cathode terminal (10), which is electrically connected to the side support plate (9).

2. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 1, characterized in that: The isolation plate (3) is an insulating plate.

3. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 2, characterized in that: The air supply pipe (5) is suspended at the bottom of the isolation plate (3), and the air supply pipe (5) is distributed along the gap between the connecting holes (4).

4. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 3, characterized in that: The gas distribution pipe (6) extends directly above the anode plate (2), and a one-way valve (7) is provided at the opening of the gas distribution pipe (6).

5. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 1, characterized in that: The number of side support plates (9) is several, and the several side support plates (9) are symmetrically distributed on both sides of the inner wall of the electroplating tank (1). Both ends of the tungsten wire support frame (11) are supported by the side support plates (9) on both sides, and a gap is left between the bottom of the tungsten wire support frame (11) and the top of the isolation plate (3).

6. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 5, characterized in that: Except for the side support plate (9) and tungsten wire support frame (11) which are electrically connected to the cathode terminal (10), the other side support plate (9) and tungsten wire support frame (11) are made of insulating material.

7. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 6, characterized in that: Each of the tungsten wire support frames (11) is provided with a number of limiting posts (12) at its top, and the limiting posts (12) are rubber rods.

8. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 7, characterized in that: All side support plates (9) have floating slides (13) on their surfaces facing the center of the electroplating tank (1). Both ends of the tungsten wire support frame (11) extend into the interior of the floating slide (13), and the tungsten wire support frame (11) can float up and down along the floating slide (13).

9. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 8, characterized in that: Both ends of the tungsten wire support frame (11) are provided with limit sliders (14), which extend into the interior of the floating slide (13) and are limited.

10. The novel copper alloy electroplating equipment for tungsten wire surface according to claim 9, characterized in that: In a top view, the tungsten wire support frame (11) is located directly above the connecting hole (4), and the tungsten wire support frame (11) completely blocks the connecting hole (4) directly below it.

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