Flexible lamp strip base material and LED lamp strip

Abstract

According to the flexible lamp strip base material and the LED lamp strip, the flexible lamp strip base material and the base material are of a strip-shaped structure made of conductive materials, a first frame and a second frame are formed by stamping the flexible lamp strip base material and the base material, and the first frame and the second frame are parallel to each other; a plurality of bearing parts which are mutually spaced are arranged in a spacing area between the first frame and the second frame along the length direction; the bearing part comprises a first carrier and a second carrier which are spaced from each other; at least two adjacent bearing parts form a light-emitting unit, one first carrier of each light-emitting unit is connected with the first frame, and one second carrier of each light-emitting unit is connected with the second frame; the adjacent bearing parts in the same light-emitting unit are connected through a connecting line; the first carrier, the second carrier and the connecting line are all formed by stamping a base material. The LED lamp strip comprises the flexible lamp strip base material, and the flexible lamp strip base material is provided with a plurality of light-emitting units in the length direction. According to the scheme, the process is simpler, no pollution is caused to the environment, and the production cost can be effectively reduced.

Description

Technical Field

[0001] This utility model belongs to the technical field of LED light strip substrate structure, and particularly relates to a flexible light strip substrate and an LED light strip. Background Technology

[0002] Existing flexible LED light strips typically consist of flexible printed circuit boards (FPCs) and LED chips. These FPCs are usually manufactured using a printed circuit production process, which includes multiple steps such as exposure, development, etching, film removal, ink application, and anti-oxidation treatment. This process creates a circuit pattern, resulting in a complex production flow, difficulty in further improving production efficiency, and high production costs. Furthermore, many steps in the production process generate a large amount of wastewater, requiring dedicated wastewater treatment facilities, which further increases production costs. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a flexible LED strip substrate and an LED strip. The substrate for the LED strip is formed by stamping conductive metal, which not only maintains the flexibility of the LED strip but also simplifies the process, eliminates environmental pollution, and effectively reduces production costs.

[0004] In order to achieve the purpose of this utility model, the following solution is proposed:

[0005] A flexible LED strip substrate, wherein the substrate is a strip structure made of conductive material, and the first frame and the second frame formed by stamping are used to connect the positive and negative terminals of the power supply, respectively. The first frame and the second frame are parallel to each other and are spaced apart.

[0006] Multiple spaced-apart support portions are provided along the length direction in the interval area between the first and second borders, with the support portions spaced apart from the first and second borders;

[0007] The carrier includes a first carrier and a second carrier spaced apart from each other; the same end of the first carrier and the second carrier is used to connect the same LED chip;

[0008] At least two adjacent carriers form a light-emitting unit. In each light-emitting unit, one first carrier is connected to the first frame and one second carrier is connected to the second frame. In the same light-emitting unit, adjacent carriers are connected by connecting lines. The first carrier, the second carrier and the connecting lines are all formed by stamping of the substrate.

[0009] An LED light strip includes the aforementioned flexible light strip substrate, wherein the flexible light strip substrate is provided with multiple light-emitting units along its length.

[0010] The beneficial effects of this utility model are as follows:

[0011] 1. This solution utilizes conductive metal stamping to form the substrate of the light strip, which not only maintains the flexibility of the light strip, but also simplifies the manufacturing process and reduces the number of steps compared to traditional flexible circuit board processes. Furthermore, it avoids the generation of wastewater, effectively improving production efficiency and reducing production costs.

[0012] 2. The base material has frames on both sides, which can effectively improve the tensile strength of the light strip. Attached Figure Description

[0013] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of this invention.

[0014] Figure 1 A partial structural schematic diagram of the flexible LED strip substrate of this application is shown.

[0015] Figure 2 It shows Figure 1 A magnified view of a portion of point A in the middle.

[0016] The markings in the diagram are: First border - 11, Second border - 12, Supporting part - 2, First carrier - 21, Second carrier - 22, Connecting line - 23, Resistor - 24, Light-emitting unit - 3, LED chip - 4. Detailed Implementation

[0017] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0018] Example 1, as Figure 1 , Figure 2 As shown, a flexible LED strip substrate is characterized in that the substrate is a strip structure made of conductive material, and the first frame 11 and the second frame 12 formed by stamping are used to connect the positive and negative poles of the power supply, respectively. The first frame 11 and the second frame 12 are parallel to each other and spaced apart. The material of the substrate is made of metals with good ductility such as copper or aluminum.

[0019] Specifically, such as Figure 1 As shown, a plurality of mutually spaced support portions 2 are provided along the length direction in the interval area between the first frame 11 and the second frame 12, and the support portions 2 are spaced apart from the first frame 11 and the second frame 12.

[0020] Specifically, such as Figure 2As shown, the support part 2 includes a first carrier 21 and a second carrier 22 spaced apart from each other. Since the support part 2 is spaced apart from the first frame 11 and the second frame 12, both the first carrier 21 and the second carrier 22 are spaced apart from the first frame 11 and the second frame 12.

[0021] Specifically, the first carrier 21, the second carrier 22, and the connecting line 23 are all formed by stamping the substrate. The first carrier 21 and the second carrier 22 can be elongated, elliptical, or circular, and are mainly used to support and connect the LED chip 4. As a preferred embodiment, the first carrier 21, the second carrier 22, and the connecting line 23 are stamped simultaneously with the first frame 11 and the second frame 12 to improve production efficiency, reduce the time spent on substrate transfer and positioning, and help improve stamping accuracy.

[0022] Specifically, such as Figure 1 As shown, at least two adjacent carrier parts 2 form a light-emitting unit 3. In each light-emitting unit 3, one first carrier 21 is connected to the first frame 11, and one second carrier 22 is connected to the second frame 12. As a conventional arrangement, each light-emitting unit 3 can be provided with four, six, or eight carrier parts 2.

[0023] like Figure 1 , Figure 2 As shown, in the same light-emitting unit 3, adjacent carrier parts 2 are connected by connecting lines 23. Specifically, the first carrier 21 of one carrier part 2 can be connected to the second carrier 22 of the adjacent carrier part 2; or the second carrier 22 of one carrier part 2 can be connected to the first carrier 21 of the adjacent carrier part 2.

[0024] Specifically, such as Figure 2 As shown, the same end of the first carrier 21 and the second carrier 22 is used to connect the same LED chip 4. For ease of display, the position is... Figure 2 The rectangular dashed line outline represents the LED chip 4. This means that for each pair of first carriers 21 and second carriers 22, one LED chip 4 can be placed at each end, i.e., one carrier part 2 can have two LED chips 4. After assembly, the LED chips 4 are fixed by reflow soldering. After the LED chips 4 are fixed, a transparent protective sleeve can be formed on the outside of the substrate by injection molding to provide waterproofing and light transmission.

[0025] This solution utilizes a substrate formed by stamping to create flexible light strips. Compared to traditional flexible circuit board processes, this method is simpler, involves fewer steps, and avoids wastewater generation, effectively improving production efficiency and reducing production costs.

[0026] Preferred, such as Figure 2As shown, each light-emitting unit 3 is equipped with a resistor 24, which is located between adjacent supporting parts 2. For ease of display, the position is determined using... Figure 2 The grid outline represents resistor 24. More specifically, resistor 24 is connected to the first carrier 21 of the carrier portion 2 and to the second carrier 22 of the other carrier portion 2, and neither the first carrier 21 nor the second carrier 22 to which resistor 24 is connected has a connecting wire 23. As a preferred structure, when a light-emitting unit 3 has eight carrier portions 2, resistor 24 is located between the fourth and fifth carrier portions 2; when a light-emitting unit 3 has six carrier portions 2, resistor 24 is located between the third and fourth carrier portions 2.

[0027] Preferred, such as Figure 1 As shown, the second carrier 22, which is arranged in pairs with the first carrier 21 connected to the first frame 11, is connected to the first carrier 21 of the adjacent carrier part 2 via a connecting line 23; the first carrier 21, which is arranged in pairs with the second carrier 22 connected to the second frame 12, is connected to the second carrier 22 of the connected carrier part 2 via a connecting line 23.

[0028] Preferred, such as Figure 1 As shown, within the same light-emitting unit 3, the first carrier 21 connected to the first frame 11 and the second carrier 22 connected to the second frame 12 are located at opposite ends of the light-emitting unit 3.

[0029] Preferred, such as Figure 2 As shown, both the first carrier 21 and the second carrier 22 are rectangular structures, with their length direction parallel to the length direction of the substrate, to form a single row of LED light strips.

[0030] Preferred, such as Figure 2 As shown, the width of the middle section of the first carrier 21 and the second carrier 22 is smaller than the width of the two ends, so that the two ends of the first carrier 21 and the second carrier 22 have sufficient area to support the LED chip 4. At the same time, the smaller size of the middle section can effectively reduce the stress residue after the first carrier 21 and the second carrier 22 are stamped.

[0031] Example 2: An LED light strip includes the flexible light strip substrate described in Example 1. The flexible light strip substrate has multiple light-emitting units 3 along its length. When in use, the LED light strip can be cut from between adjacent light-emitting units 3 according to the actual required length. Each of the carrier parts 2 is provided with two LED chips 4, which are respectively connected to the top surfaces of the first carrier 21 and the second carrier 22 at both ends.

[0032] Preferably, the LED chip 4 is disposed on the top surface of the substrate, and the bottom and top surfaces of the substrate are provided with an insulating layer. The insulating layer on the top surface of the substrate has an opening structure corresponding to the position where the LED chip 4 is disposed, for disposing of the LED chip 4, so that the LED chip 4 is exposed on the insulating layer. The insulating layer is connected to the substrate by hot pressing. As a preferred structure, the surface of the insulating layer is provided with self-adhesive to facilitate connection with the substrate.

[0033] The above description is merely a preferred embodiment of this utility model and does not imply its uniqueness or limitation. Those skilled in the art should understand that various changes or equivalent substitutions made to this utility model without departing from its scope are all within the protection scope of this utility model.

Claims

1. A flexible LED strip substrate, characterized in that, The substrate is a strip structure made of conductive material. The first frame (11) and the second frame (12) formed by stamping are used to connect the positive and negative poles of the power supply, respectively. The first frame (11) and the second frame (12) are parallel to each other and spaced apart. Multiple spaced-apart support portions (2) are provided along the length direction in the interval area between the first frame (11) and the second frame (12), and the support portions (2) are spaced apart from the first frame (11) and the second frame (12); The carrier (2) includes a first carrier (21) and a second carrier (22) spaced apart from each other. The same end of the first carrier (21) and the second carrier (22) is used to connect the same LED chip (4). At least two adjacent carriers (2) form a light-emitting unit (3), and in each light-emitting unit (3), one of the first carriers (21) is connected to the first frame (11), and one of the second carriers (22) is connected to the second frame (12); Adjacent carriers (2) within the same light-emitting unit (3) are connected by a connecting line (23); the first carrier (21), the second carrier (22) and the connecting line (23) are all formed by stamping of the substrate.

2. The flexible LED strip substrate according to claim 1, characterized in that, Each light-emitting unit (3) is provided with a resistor (24), and the resistor (24) is located between adjacent support parts (2).

3. The flexible LED strip substrate according to claim 1, characterized in that, The second carrier (22) which is paired with the first carrier (21) which is connected to the first frame (11) is connected to the first carrier (21) of the adjacent carrier (2) via a connecting line (23); the first carrier (21) which is paired with the second carrier (22) which is connected to the second frame (12) is connected to the second carrier (22) of the connected carrier (2) via a connecting line (23).

4. The flexible LED strip substrate according to claim 1, characterized in that, Within the same light-emitting unit (3), the first carrier (21) connected to the first frame (11) and the second carrier (22) connected to the second frame (12) are located at both ends of the light-emitting unit (3).

5. The flexible LED strip substrate according to claim 1, characterized in that, Both the first carrier (21) and the second carrier (22) are rectangular structures, and their length direction is parallel to the length direction of the substrate.

6. The flexible LED strip substrate according to claim 1, characterized in that, The width of the middle section of the first carrier (21) and the second carrier (22) is smaller than the width of the two ends.

7. An LED light strip, characterized in that, The flexible light strip substrate includes any one of claims 1 to 6. The flexible light strip substrate is provided with a plurality of light-emitting units (3) along the length direction. Each of the carrier parts (2) is provided with two LED chips (4), which are respectively connected to the top surfaces of the first carrier (21) and the second carrier (22).

8. An LED light strip according to claim 7, characterized in that, The LED chip (4) is disposed on the top surface of the substrate. The bottom and top surfaces of the substrate are provided with an insulating layer. The insulating layer on the top surface of the substrate has an opening structure corresponding to the position where the LED chip (4) is disposed, for the purpose of disposing of the LED chip (4).

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