Temperature sampling device and vehicle-mounted charger
By setting an insulating and thermally conductive component and a thermally conductive metal layer between the circuit board and the heat sink, the problems of complex processes requiring hole drilling and high thermal resistance in the prior art are solved, achieving simplified operation and improved temperature sampling accuracy.
Patent Information
- Application Number
- CN202520143224.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-21
AI Technical Summary
Existing liquid cooling medium temperature sampling methods require drilling holes in the heat sink, which is a complex process and results in a large thermal resistance between the liquid cooling medium and the thermistor, affecting sampling accuracy.
An insulating thermally conductive component is installed between the circuit board and the heat sink. One side of the insulating thermally conductive component is thermally connected to the heat sink, and the other side is connected to the thermally conductive metal layer. A surface-mount thermistor is placed on the circuit board. Heat is conducted to the thermistor through the insulating thermally conductive component and the thermally conductive metal layer, avoiding the need for drilling holes.
It simplifies operation, reduces the impact on the heat sink structure, improves temperature sampling accuracy, and avoids the problem of high thermal resistance.
Smart Images
Figure CN223841331U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of temperature sampling technology, and in particular to a temperature sampling device and an on-board charger. Background Technology
[0002] Accurate sampling of the liquid cooling medium temperature not only ensures a stable derating power curve for liquid cooling radiators at high temperatures, but also prevents damage to liquid cooling radiators due to untimely over-temperature protection.
[0003] Current methods for sampling the temperature of liquid cooling media are primarily based on the drilling method. This involves creating a hole in the surface of the liquid cooler, then using a through-hole thermistor as the sensing element on a circuit board. One end of the thermistor is soldered to the PCB, while the other end extends into the hole. The gap between the hole and the thermistor is filled with thermally conductive gel. The temperature of the liquid cooling media is conducted to the thermistor through the water channel walls of the liquid cooler and the thermally conductive gel filling the hole, thus affecting the thermistor's resistance. The temperature of the liquid cooling media is then determined based on the resistance change of the thermistor with temperature. This method requires drilling holes in the liquid cooler, which is a complex process, and the relatively high thermal resistance between the liquid cooling media and the thermistor affects the sampling accuracy. Utility Model Content
[0004] The main purpose of this invention is to propose a temperature sampling device that solves the problem that the existing technology uses plug-in thermistors, which requires drilling holes in the heat sink. This not only makes the process complicated, but also results in a large thermal resistance between the liquid cooling medium and the thermistor, affecting the sampling accuracy.
[0005] To achieve the above objectives, the temperature sampling device proposed in this utility model includes:
[0006] heat sink;
[0007] A circuit board, wherein the circuit board is spaced apart from the heat sink, and there is an installation gap between the circuit board and the heat sink; the circuit board is provided with a thermally conductive metal layer and a temperature detection circuit.
[0008] An insulating and thermally conductive assembly is disposed in the mounting gap, with one side of the assembly thermally connected to the heat sink and the other side thermally connected to the thermally conductive metal layer; and
[0009] A surface-mount thermistor is disposed on the circuit board, and one pin of the surface-mount thermistor is thermally connected to the thermally conductive metal layer, while the other pin of the surface-mount thermistor is electrically connected to the temperature detection circuit on the circuit board.
[0010] In some embodiments, the insulating thermally conductive assembly includes a ceramic substrate and a metal component, one side of the ceramic substrate being at least partially thermally connected to the heat sink via a thermally conductive adhesive layer, the other side of the ceramic substrate being at least partially thermally connected to at least a portion of the surface of the metal component via a thermally conductive adhesive layer, and the metal component being soldered to the thermally conductive metal layer on the circuit board.
[0011] In some embodiments, the thickness of the thermally conductive adhesive layer between the ceramic substrate and the heat sink is 25–150 μm; and / or, the thickness of the thermally conductive adhesive layer between the ceramic substrate and the metal part is 25–150 μm.
[0012] In some embodiments, the metal component is a copper block.
[0013] In some embodiments, the surface-mount thermistor is an NTC type thermistor.
[0014] In some embodiments, the radiator is a liquid-cooled radiator.
[0015] In some embodiments, the liquid-cooled radiator includes a liquid-cooled plate thermally connected to the insulating thermally conductive component, the liquid-cooled plate being a harmonica-tube type liquid-cooled plate.
[0016] This utility model also proposes an on-board charger, which includes a temperature sampling device.
[0017] The technical solution of this utility model involves placing an insulating thermally conductive component in the mounting gap between the circuit board and the heat sink. One side of the insulating thermally conductive component is thermally connected to the heat sink, and the other side is thermally connected to the thermally conductive metal layer, simplifying the operation. A surface-mount thermistor is then placed on the circuit board, with one pin of the thermistor thermally connected to the thermally conductive metal layer, and the other pin electrically connected to the temperature detection circuit on the circuit board. This configuration allows heat from the heat sink to be conducted to the surface-mount thermistor through the insulating thermally conductive component and the thermally conductive metal layer, avoiding the need to drill holes in the heat sink and improving sampling accuracy. Furthermore, the use of an insulating thermally conductive component with low thermal resistance as an intermediate medium further enhances sampling accuracy. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0019] Figure 1A schematic diagram of an embodiment of the temperature sampling device provided by this utility model;
[0020] Figure 2 A schematic diagram of another embodiment of the temperature sampling device provided by this utility model.
[0021] Explanation of icon numbers:
[0022] 100. Temperature sampling device; 10. Heat sink; 20. Circuit board; 21. Thermally conductive metal layer;
[0023] 30. Insulating and thermally conductive components; 31. Ceramic substrate; 32. Metal parts;
[0024] 40. Surface mount thermistor; 50. Thermally conductive adhesive layer; 70. Mounting gap.
[0025] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0027] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0028] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0029] Current methods for sampling the temperature of liquid cooling media are primarily based on the drilling method. This involves creating a hole in the surface of the liquid cooler, then using a through-hole thermistor as the sensing element on a circuit board. One end of the thermistor is soldered to the PCB, while the other end extends into the hole. The gap between the hole and the thermistor is filled with thermally conductive gel. The temperature of the liquid cooling media is conducted to the thermistor through the water channel walls of the liquid cooler and the thermally conductive gel filling the hole, thus affecting the thermistor's resistance. The temperature of the liquid cooling media is then determined based on the resistance change of the thermistor with temperature. This method requires drilling holes in the liquid cooler, which is a complex process, and the relatively high thermal resistance between the liquid cooling media and the thermistor affects the sampling accuracy.
[0030] This utility model proposes a temperature sampling device 100. Please refer to [link / reference]. Figure 1 The temperature sampling device 100 proposed in this utility model includes:
[0031] Radiator 10;
[0032] Circuit board 20 is spaced apart from heat sink 10, and there is an installation gap 70 between circuit board 20 and heat sink 10. Circuit board 20 is provided with thermally conductive metal layer 21 and temperature detection circuit.
[0033] An insulating thermally conductive component 30 is disposed in the mounting gap 70, with one side of the component thermally conductively connected to the heat sink 10 and the other side thermally connected to the thermally conductive metal layer 21; and
[0034] A surface mount thermistor 40 is mounted on the circuit board 20. One pin of the surface mount thermistor 40 is thermally connected to the thermally conductive metal layer 21, and the other pin of the surface mount thermistor 40 is electrically connected to the temperature detection circuit on the circuit board 20.
[0035] Because the insulating thermally conductive component 30 not only has thermal conductivity but also insulation properties, in one embodiment, the insulating thermally conductive component 30 is disposed between the heat sink 10 and the circuit board 20. The insulating thermally conductive component 30 can separate the heat sink 10 and the circuit board 20 to prevent the circuit board 20 from being electrically connected to the heat sink 10 and causing a short circuit. At the same time, in order to ensure that the heat from the heat sink 10 can be conducted through the insulating thermally conductive component 30 to the surface mount thermistor 40 disposed on the circuit board 20, one side of the insulating thermally conductive component 30 is thermally connected to the heat sink 10, and the other side is thermally connected to the thermally conductive metal layer 21 on the circuit board 20. One pin of the surface mount thermistor 40 is also thermally connected to the thermally conductive metal layer 21, thereby allowing the heat from the heat sink 10 to be conducted through the insulating thermally conductive component 30 to the thermally conductive metal layer 21 on the circuit board 20, and then through the thermally conductive metal layer 21 to the surface mount thermistor 40.
[0036] The insulating thermally conductive component 30 can be installed onto the heat sink 10 by adhesive bonding. Alternatively, it can be embedded into the heat sink 10 via snap-fit or plug-in methods. One side of the insulating thermally conductive component 30 is thermally connected to the heat sink 10. Then, the side of the insulating thermally conductive component 30 facing away from the heat sink 10 can be connected to the thermally conductive metal layer 21 of the circuit board 20. This facilitates heat transfer from the heat sink 10 to the thermally conductive metal layer 21 through the insulating thermally conductive component 30. This eliminates the need to drill holes in the heat sink 10, simplifying the operation, saving time and effort, and having minimal impact on the overall structure of the heat sink 10, without affecting its normal heat dissipation function.
[0037] Furthermore, the heat from the heat sink 10 dissipates into and out of the mounting gap 70. By placing the surface-mount thermistor 40 within the mounting gap 70 between the circuit board 20 and the heat sink 10, the surface-mount thermistor 40 can quickly receive the heat dissipated by the heat sink 10. The heat from the heat sink 10 is also transferred to the surface-mount thermistor 40 through the insulating thermally conductive component 30 and the thermally conductive metal layer 21, allowing the surface-mount thermistor 40 to receive a greater amount of heat from the heat sink 10. Since the heat from the heat sink 10 is conducted to the surface-mount thermistor 40 through both thermal radiation and thermal conduction, the surface-mount thermistor 40 can receive not only the heat dissipated by thermal radiation but also the heat conducted by thermal conduction, thus improving the sampling accuracy of the surface-mount thermistor 40. In particular, the surface-mount thermistor 40 has high sensitivity, and the temperature of the heat sink 10 can be determined by observing the temperature change characteristics of the surface-mount thermistor 40.
[0038] Optionally, the thermally conductive metal layer 21 can be a metal structure such as copper foil or copper sheet. The thermally conductive metal layer 21 has good thermal conductivity, thus transferring the heat conducted by the insulating thermally conductive component 30 to the surface-mount thermistor 40. In one embodiment, one end of the thermally conductive metal layer 21 extends along the direction of the insulating thermally conductive component 30 and is connected to it, while the other end of the thermally conductive metal layer 21 is connected to the surface-mount thermistor 40, so as to transfer the heat conducted by the insulating thermally conductive component 30 to the surface-mount thermistor 40.
[0039] The technical solution of this utility model involves setting an insulating thermally conductive component 30 in the mounting gap 70 between the circuit board 20 and the heat sink 10. One side of the insulating thermally conductive component 30 is thermally connected to the heat sink 10, and the other side is thermally connected to the thermally conductive metal layer 21, simplifying the operation. A surface-mount thermistor 40 is then placed on the circuit board 20, with one pin of the surface-mount thermistor 40 thermally connected to the thermally conductive metal layer 21, and the other pin electrically connected to the temperature detection circuit on the circuit board 20. With this configuration, the heat from the heat sink 10 is conducted to the surface-mount thermistor 40 through the insulating thermally conductive component 30 and the thermally conductive metal layer 21, avoiding the need to drill holes in the heat sink 10 and improving sampling accuracy. Furthermore, the use of the insulating thermally conductive component 30 with low thermal resistance as an intermediate medium further enhances sampling accuracy.
[0040] Optionally, the insulating and thermally conductive assembly 30 can be a separate structure. The insulating and thermally conductive assembly 30 includes a ceramic substrate 31 and a metal component 32. One side of the ceramic substrate 31 is at least partially thermally connected to the heat sink 10 through a thermally conductive adhesive layer 50, and the other side of the ceramic substrate 31 is at least partially thermally connected to at least a portion of the surface of the metal component 32 through a thermally conductive adhesive layer 50. The metal component 32 is soldered to the thermally conductive metal layer 21 on the circuit board 20.
[0041] Both the ceramic substrate 31 and the metal component 32 have high thermal conductivity and low thermal resistance. Specifically, the thermal conductivity of the ceramic substrate 31 can reach 200 W / (m·K), and the thermal conductivity of the metal component 32 can reach 200 W / (m·K) to 400 W / (m·K). Optionally, the metal component 32 can be an aluminum block or a copper block.
[0042] Furthermore, because components are mounted on the circuit board 20, and these components are relatively tall, the ceramic substrate 31 may not easily connect to the thermally conductive metal layer 21. Therefore, a metal component 32 is connected to the circuit board 20. The metal component 32 not only supports the circuit board 20, preventing the components on the circuit board 20 from being squeezed by the heat sink 10, but also connects the ceramic substrate 31 and the thermally conductive metal layer 21, so that the heat conducted to the ceramic substrate 31 can be conducted through the metal component 32 to the thermally conductive metal layer 21, and then to the surface-mount thermistor 40.
[0043] In one embodiment, one side of the metal component 32 is connected to the ceramic substrate 31, and the other side of the metal component 32 is connected to the thermally conductive metal layer 21. This allows the metal component 32 to conduct heat from the ceramic substrate 31 to the heat sink 10 to the thermally conductive metal layer 21, thereby enabling the surface-mount thermistor 40 to receive heat from the ceramic substrate 31 and the thermally conductive metal layer 21 to the heat sink 10. The metal component 32 can be grounded through the thermally conductive metal layer 21 to further prevent the metal component 32 from being energized, thus avoiding a short circuit between the heat sink 10 and the circuit board 20 via the metal component 32.
[0044] Furthermore, since the ceramic substrate 31 and the metal component 32 can be mounted to the heat sink 10 using thermally conductive adhesive, there is no need to drill holes in the outer wall of the heat sink 10. This not only reduces the number of processing steps required for the outer wall of the heat sink 10 but also lowers the flow rate of the coolant within the heat sink 10, thus reducing its impact on the sampling accuracy of the surface-mount thermistor 40. Both the ceramic substrate 31 and the metal component 32 have high thermal conductivity and low thermal resistance, allowing for more precise heat transfer from the heat sink 10 to the surface-mount thermistor 40, thereby improving its sampling accuracy.
[0045] To reduce the space occupied by the thermally conductive adhesive layer 50 in the temperature sampling device 100 and to prevent the thermally conductive adhesive layer 50 from being too thick and affecting the heat conduction from the heat sink 10 to the ceramic substrate 31, the thickness of the thermally conductive adhesive layer 50 is less than that of the insulating thermally conductive component 30. Specifically, the thickness of the thermally conductive adhesive layer 50 between the ceramic substrate 31 and the heat sink 10 is 25–150 μm. The thickness of the thermally conductive adhesive layer 50 between the ceramic substrate 31 and the metal part 32 can also be 25–150 μm.
[0046] To improve heat conduction, the metal component 32 is a copper block. The thermal conductivity of the copper block is 400 W / (m·K). The high thermal conductivity and low thermal resistance of the copper block allow for more accurate heat transfer from the heat sink 10 to the surface mount thermistor 40, thereby improving the sampling accuracy of the surface mount thermistor 40.
[0047] In one embodiment, please refer to Figure 1 The quantity of metal part 32 is one.
[0048] In another implementation, please refer to Figure 2The number of metal components 32 is at least two. A surface-mount thermistor 40 and at least two metal components 32 are arrayed along the surface of the circuit board 20, with the surface-mount thermistor 40 thermally connected to the at least two metal components 32. The side of the at least two metal components 32 facing away from the circuit board 20 is connected to the ceramic substrate 31. Specifically, the at least two metal components 32 are arrayed around the surface of the circuit board 20, centered on the surface-mount thermistor 40, so that the at least two metal components 32 can be arranged around the surface-mount thermistor 40. The number of thermally conductive metal layers 21 can correspond one-to-one with the number of metal components 32, so that the surface-mount thermistor 40 can be connected to the at least two metal components 32 through the thermally conductive metal layers 21. Since at least two metal components 32 are connected to the ceramic substrate 31, both metal components 32 can receive heat conducted from the ceramic substrate 31, making the temperature around the surface-mount thermistor 40 more similar. The surface mount thermistor 40 can receive heat not only from the thermally conductive metal layer 21, but also from the heat dissipated by at least two metal parts 32, thus improving the sampling accuracy of the surface mount thermistor 40.
[0049] In one embodiment, the surface-mount thermistor 40 is an NTC type thermistor. The resistance of an NTC type thermistor decreases as the temperature increases, enabling it to accurately sense minute temperature changes and providing high sensitivity, thereby giving the temperature sampling device 100 high sampling accuracy.
[0050] Because the liquid cooling plate used in the existing radiator is not a harmonica tube type, there is a gap between the coolant and the water channel wall when the coolant flow rate is low, which causes the surface mount thermistor 40 to be unable to accurately sample the coolant temperature.
[0051] In one embodiment, the liquid-cooled radiator 10 includes a liquid-cooled plate thermally connected to the insulating thermally conductive component 30. The liquid-cooled plate is a harmonica-tube type liquid-cooled plate. Because the harmonica-tube type liquid-cooled plate has microchannels inside, the coolant flows continuously within the microchannels, making it easier for the surface-mount thermistor 40 to sample the coolant temperature. Therefore, using a harmonica-tube type liquid-cooled plate eliminates the problem of gaps between the coolant and the channel walls, preventing the surface-mount thermistor 40 from accurately sampling the coolant temperature.
[0052] This utility model also proposes an on-board charger, including a temperature sampling device 100. The specific structure of the temperature sampling device 100 is as described in the above embodiments. Since this on-board charger adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0053] In one embodiment, the on-board charger is equipped with a heat sink 10 and a circuit board 20. An insulating thermally conductive component 30 is disposed in the mounting gap 70 between the circuit board 20 and the heat sink 10. One side of the insulating thermally conductive component 30 is thermally connected to the heat sink 10, and the other side is thermally connected to the thermally conductive metal layer 21, simplifying operation. A surface-mount thermistor 40 is then placed on the circuit board 20, with one pin of the surface-mount thermistor 40 thermally connected to the thermally conductive metal layer 21, and the other pin electrically connected to the temperature detection circuit on the circuit board 20. With this configuration, the heat from the heat sink 10 is conducted to the surface-mount thermistor 40 through the insulating thermally conductive component 30 and the thermally conductive metal layer 21, avoiding the need to drill holes in the heat sink 10 and improving sampling accuracy. Furthermore, the use of the insulating thermally conductive component 30 with low thermal resistance as an intermediate medium further enhances sampling accuracy.
[0054] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A temperature sampling device, characterized in that, include: heat sink; A circuit board, wherein the circuit board is spaced apart from the heat sink, and there is an installation gap between the circuit board and the heat sink; the circuit board is provided with a thermally conductive metal layer and a temperature detection circuit. An insulating and thermally conductive assembly is disposed in the mounting gap, and one side of the insulating and thermally conductive assembly is thermally connected to the heat sink, and the other side is thermally connected to the thermally conductive metal layer. as well as A surface-mount thermistor is disposed on the circuit board, and one pin of the surface-mount thermistor is thermally connected to the thermally conductive metal layer, while the other pin of the surface-mount thermistor is electrically connected to the temperature detection circuit on the circuit board.
2. The temperature sampling device as described in claim 1, characterized in that, The insulating and thermally conductive assembly includes a ceramic substrate and a metal component. At least one side of the ceramic substrate is thermally connected to the heat sink via a thermally conductive adhesive layer. At least one side of the ceramic substrate is thermally connected to at least a portion of the surface of the metal component via a thermally conductive adhesive layer. The metal component is soldered to the thermally conductive metal layer on the circuit board.
3. The temperature sampling device as described in claim 2, characterized in that, The thickness of the thermally conductive adhesive layer between the ceramic substrate and the heat sink is 25–150 μm; and / or, the thickness of the thermally conductive adhesive layer between the ceramic substrate and the metal part is 25–150 μm.
4. The temperature sampling device as described in claim 2, characterized in that, The metal part is a copper block.
5. The temperature sampling device as described in claim 1, characterized in that, The surface-mount thermistor is an NTC type thermistor.
6. The temperature sampling device as described in claim 1, characterized in that, The radiator is a liquid-cooled radiator.
7. The temperature sampling device as described in claim 6, characterized in that, The liquid-cooled radiator includes a liquid-cooled plate that is thermally connected to the insulating thermally conductive component, and the liquid-cooled plate is a harmonica tube type liquid-cooled plate.
8. An on-board charger, characterized in that, Includes the temperature sampling device as described in any one of claims 1 to 7.