Testing device

By incorporating a liquid storage component and a heating component into the liquid cooling equipment testing device, the heat dissipation medium is preheated to prevent condensation, thus solving the malfunction problem caused by condensation during liquid cooling equipment testing and ensuring equipment reliability and testing accuracy.

CN223841488UActive Publication Date: 2026-01-27西安远图未来科技有限公司
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Patent Information

Application Number
CN202520547227.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-26
Publication Date
2026-01-27
Estimated Expiration
2035-03-26

AI Technical Summary

Technical Problem

During the testing of liquid cooling equipment, condensation flowing into the equipment caused malfunctions, and existing technologies are unable to effectively prevent condensation formation.

Method used

A testing device was designed, including a liquid storage component, a heating component, and a working fluid management component. The heating component preheats the heat dissipation working fluid to a temperature higher than the ambient dew point temperature, thereby preventing condensation.

Benefits of technology

It effectively prevents condensation from forming on the working fluid management components, avoids condensation from flowing into the liquid cooling equipment, and ensures the reliability of the equipment and the accuracy of test results.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the utility model provides a testing device, and relates to the technical field of liquid cooling equipment. The testing device comprises a device body; the liquid storage assembly is arranged on the device body, and the liquid storage assembly is used for storing a heat dissipation working medium; the heating assembly is arranged on the device body, the heating assembly communicates with the liquid storage assembly, and the heating assembly is used for heating the heat dissipation working medium; and the working medium management assembly is arranged on the device body, the working medium management assembly communicates with the heating assembly, the working medium management assembly is used for being connected with the liquid cooling equipment, and the working medium management assembly is used for conveying the heat dissipation working medium into the liquid cooling equipment. According to the testing device, condensation on the working medium management assembly can be avoided, so that the situation that the condensation flows into the liquid cooling equipment to cause faults of the liquid cooling equipment is avoided.
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Description

Technical Field

[0001] This application relates to the field of liquid cooling equipment technology, and more particularly to a testing device. Background Technology

[0002] In the research and development or deployment of liquid cooling equipment such as liquid-cooled servers, it is necessary to verify the reliability of its hardware and software under different environmental conditions.

[0003] Related technologies provide a testing device whose pipes are connected to a liquid cooling device, thereby providing a testing environment for the liquid cooling device.

[0004] However, in some scenarios, condensation may occur on the pipes, and if this condensation flows into the liquid cooling equipment, it can cause the equipment to malfunction. Utility Model Content

[0005] This application provides a testing device to prevent condensation from occurring on the working fluid management component, thereby preventing condensation from flowing into the liquid cooling equipment and causing malfunctions.

[0006] This application provides a testing apparatus, including:

[0007] device body;

[0008] Liquid storage component, which is installed on the main body of the device, is used to store heat dissipation working fluid;

[0009] A heating component is installed on the main body of the device and is connected to a liquid storage component. The heating component is used to heat the heat dissipation working fluid.

[0010] The working fluid management component is installed on the main body of the device. The working fluid management component is connected to the heating component and is used to connect to the liquid cooling equipment. The working fluid management component is used to deliver the heat dissipation working fluid into the liquid cooling equipment.

[0011] In one possible implementation, the heating component includes:

[0012] A heating chamber is installed on the main body of the device and is connected to the liquid storage component;

[0013] The heating element is located inside the heating chamber and is used to heat the heat dissipation medium.

[0014] In one possible implementation, the heating element is a heating rod.

[0015] In one possible implementation, the heating assembly further includes a temperature sensing element for detecting the temperature of the heat dissipation medium within the heating cavity.

[0016] In one possible implementation, the liquid storage component, the heating component, and part of the working fluid management component are arranged sequentially along the height of the device body.

[0017] In one possible implementation, the working fluid management component includes:

[0018] A cooling distribution unit is installed inside the device body;

[0019] The water distributor is connected to the side of the device body and is connected to the cooling distribution unit.

[0020] Connecting components are used to connect the water distributor and the liquid cooling equipment.

[0021] In one possible implementation, the working fluid management component further includes a rotating element, through which the distributor is rotatably connected to the device body, so that the distributor can switch between a position that is in contact with the side wall of the device body and a position that has an angle with the side wall of the device body; the rotating element is a hinge.

[0022] In one possible implementation, the working fluid management component further includes a connector that is attached to the side of the device body;

[0023] The manifold has connection holes, and the connector is inserted into the connection holes so that the manifold and the connector can be detachably connected.

[0024] In one possible implementation, the connector includes a connecting section and a limiting section that are interconnected, the connecting section being connected to the side of the device body, and the radial width of the limiting section being greater than the radial width of the connecting section.

[0025] The connecting hole includes a first hole segment and a second hole segment that are interconnected. The diameter of the first hole segment is greater than or equal to the radial width of the limiting segment, and the diameter of the second hole segment is greater than or equal to the radial width of the connecting segment, and the diameter of the second hole segment is less than the radial width of the limiting segment.

[0026] In one possible implementation, the testing apparatus further includes a roller assembly disposed at the bottom of the apparatus body.

[0027] The testing apparatus provided in this application embodiment includes a main body that serves as the supporting frame for the entire testing apparatus, providing a basic structure for the installation and fixation of each functional component. A liquid storage component is installed on the main body to store the heat dissipation medium, ensuring a sufficient supply of heat dissipation medium during testing. A heating component, connected to the liquid storage component, is installed on the main body to heat the heat dissipation medium. A working fluid management component, connected to the heating component, is installed on the main body. During the process of the working fluid management component delivering the heat dissipation medium to the liquid cooling equipment and providing a testing environment for the liquid cooling equipment, the heating component preheats the heat dissipation medium, ensuring that the temperature of the heat dissipation medium entering the working fluid management component is higher than the ambient dew point temperature. This prevents condensation from forming on the working fluid management component and avoids condensation flowing into the liquid cooling equipment, which could cause malfunctions. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0029] Figure 1 This is a schematic diagram of the structure of the testing device provided in the embodiments of this application;

[0030] Figure 2 for Figure 1 Schematic diagram of the heating element;

[0031] Figure 3 for Figure 1 Schematic diagram of the rotating component;

[0032] Figure 4 for Figure 1 Schematic diagram of the central water distributor;

[0033] Figure 5 for Figure 4 Schematic diagram of the middle connector;

[0034] Figure 6 for Figure 4 A schematic diagram of the connection hole set on the water distributor.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100-Device body;

[0037] 200 - Liquid storage assembly;

[0038] 300 - Heating assembly; 310 - Heating cavity; 320 - Heating element; 330 - Temperature detection element;

[0039] 400 - Working fluid management component; 410 - Cooling distribution unit; 420 - Water distributor; 430 - Rotating component; 431 - First blade; 432 - Rotating shaft; 433 - Second blade; 434 - Extension; 440 - Connector; 441 - Connecting section; 442 - Limiting section; 450 - Connecting hole; 451 - First hole section; 452 - Second hole section;

[0040] 500-roller assembly.

[0041] To facilitate understanding of the embodiments of this application, the spline curves and arrows used in the reference numerals in the accompanying drawings are explained below: the components indicated by spline curves without arrows can be solid components, that is, components with solid structures; the components indicated by spline curves with arrows can be virtual components, that is, components without solid structures; in some cases, the components indicated by spline curves with arrows can also be assemblies with solid structures or virtual structures.

[0042] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the description of the embodiments of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships (if present), are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Where there is no conflict, embodiments of this application and the various features thereof can be combined with each other, all of which are within the scope of protection of this application.

[0045] In the research and development or deployment of liquid cooling equipment such as liquid-cooled servers, it is necessary to verify the reliability of its hardware and software under different environmental conditions.

[0046] Related technologies provide a testing device whose pipes are connected to a liquid cooling device, thereby providing a testing environment for the liquid cooling device.

[0047] However, in some scenarios, such as when the ambient temperature is higher than the temperature of the heat dissipation medium inside the pipe, condensation will appear on the pipe. If the condensation flows into the liquid cooling equipment, it will cause the liquid cooling equipment to malfunction.

[0048] To address the aforementioned technical problems, embodiments of this application provide a testing device. Figure 1 This is a schematic diagram of the testing device.

[0049] Please see Figure 1The testing device includes: a device body 100; a liquid storage component 200, which is disposed on the device body 100 and is used to store the heat dissipation working fluid; a heating component 300, which is disposed on the device body 100 and is connected to the liquid storage component 200, and is used to heat the heat dissipation working fluid; and a working fluid management component 400, which is disposed on the device body 100 and is connected to the heating component 300, and is used to connect to a liquid cooling device and to deliver the heat dissipation working fluid into the liquid cooling device.

[0050] The testing device provided in this application embodiment has a device body 100, which serves as the support frame for the entire testing device and provides a basic structure for the installation and fixation of the various functional components of the testing device.

[0051] By providing a liquid storage component 200 on the device body 100, the liquid storage component 200 can be used to store heat dissipation medium to ensure a sufficient supply of heat dissipation medium during the test.

[0052] A heating component 300 is provided on the device body 100, and the heating component 300 is connected to the liquid storage component 200. The heating component 300 can be used to heat the heat dissipation medium. In specific implementation, the heat dissipation medium in the liquid storage component 200 can flow through the heating component 300, and the heating component 300 can heat the heat dissipation medium flowing through it.

[0053] By setting a working fluid management component 400 on the device body 100, the working fluid management component 400 is used to connect with the liquid cooling equipment, and the working fluid management component 400 is connected to the liquid storage component 200 through the heating component 300. The liquid storage component 200 can transfer the heat dissipation working fluid into the working fluid management component 400, so that the working fluid management component 400 can deliver the heat dissipation working fluid into the liquid cooling equipment. In this process, the working fluid management component 400 can manage the heat dissipation working fluid entering the liquid cooling equipment (such as temperature management, flow management, etc.), thereby providing a test environment for the liquid cooling equipment.

[0054] Furthermore, by connecting the heating component 300 to the working fluid management component 400, during the process of the working fluid management component 400 delivering the heat dissipation working fluid to the liquid cooling equipment and providing a test environment for the liquid cooling equipment, the heating component 300 can preheat the heat dissipation working fluid so that the temperature of the heat dissipation working fluid entering the working fluid management component 400 is higher than the ambient dew point temperature, thereby preventing condensation from forming on the working fluid management component 400 and thus avoiding condensation flowing into the liquid cooling equipment and causing the liquid cooling equipment to malfunction.

[0055] It should be noted that the embodiments of this application do not limit the specific connection methods between the various components of the testing device, as long as a stable connection can be achieved. For example, the fixed connection between the various components can be achieved by welding, screwing, or riveting, while the pipe connection can be achieved by flange connection, etc.

[0056] The preferred technical solution of the testing device according to the embodiments of this application is described below with reference to the accompanying drawings. Figure 2 for Figure 1 Schematic diagram of the structure of the heating component 300; Figure 3 for Figure 1 Schematic diagram of the structure of the rotating component 430; Figure 4 for Figure 1 Schematic diagram of the structure of the 420 central water distributor; Figure 5 for Figure 4 Schematic diagram of the middle connector 440; Figure 6 for Figure 4 A schematic diagram of the connection hole 450 set on the water distributor 420.

[0057] In some embodiments, please refer to Figure 2 The heating assembly 300 includes: a heating cavity 310, which is disposed on the device body 100 and communicates with the liquid storage assembly 200; and a heating element 320, which is disposed inside the heating cavity 310 and is used to heat the heat dissipation medium.

[0058] In this embodiment, the heating cavity 310 is disposed on the device body 100 and is connected to the liquid storage component 200, so that the heat dissipation medium can flow smoothly from the liquid storage component 200 into the heating cavity 310. The heating cavity 310 serves as a heating space for the heat dissipation medium, which can accommodate an appropriate amount of heat dissipation medium and ensure that the heat dissipation medium is heated uniformly within the heating cavity 310.

[0059] In practice, the heating chamber 310 has an inlet pipe and an outlet pipe. The inlet pipe is connected to the liquid storage component 200, and the outlet pipe is connected to the working fluid management component 400.

[0060] It should be noted that this embodiment does not limit the specific shape of the heating cavity 310, and it can be adjusted according to specific needs. For example, the heating cavity 310 is cube-shaped, cuboid-shaped, cylindrical, or spherical.

[0061] In this embodiment, the heating element 320 is disposed inside the heating cavity 310 and is the core component for realizing the heating function of the heat dissipation medium. The heating element 320 directly heats the heat dissipation medium inside the heating cavity 310 by converting electrical energy into heat energy.

[0062] It should be noted that by controlling the operating state of the heating element 320, the temperature of the heat dissipation medium can always be kept higher than the ambient dew point temperature, thus solving the problem of condensation in the pipeline. Furthermore, by controlling the operating state of the heating element 320, the temperature of the heat dissipation medium can also be kept lower than the cooling temperature required for the liquid cooling equipment to operate, ensuring that the testing device can simultaneously perform both cooling and anti-condensation functions.

[0063] For some specific implementation methods, please refer to Figure 2 The heating element 320 is a heating rod.

[0064] By placing the heating rod inside the heating chamber 310, the heating rod can directly contact the heat dissipation medium, thereby achieving efficient heating of the heat dissipation medium. The power of the heating rod can be selected according to actual test requirements to ensure that the temperature of the heat dissipation medium is controllable.

[0065] Furthermore, the heating rod has a compact structure, occupies little space, and is easy to install and maintain. Inside the heating cavity 310, the heating rod can be bent according to the shape of the cavity, so as to make full use of the cavity space and improve heating efficiency.

[0066] It should be noted that the heating rod is a known structural design in the field of heating elements, and will not be elaborated upon here.

[0067] In other specific embodiments, the heating element 320 is a heating wire, a PTC heating element, or an infrared heating element.

[0068] It should be noted that heating wires, PTC heating elements, and infrared heating elements are known structural design methods in the field of heating elements, and will not be elaborated here.

[0069] In other embodiments, please refer to Figure 2 The heating assembly 300 also includes a temperature detection element 330, which is used to detect the temperature of the heat dissipation medium inside the heating cavity 310.

[0070] In this embodiment, by setting a temperature detection element 330, the temperature detection element 330 can quickly respond to changes in the temperature of the heat dissipation medium, so that the tester can monitor the temperature of the heat dissipation medium in the heating cavity 310 in real time, so as to ensure that the heat dissipation medium is always kept within a suitable temperature range, thereby ensuring the stability of the test environment, the accuracy of the test results, and the reliability of the liquid cooling equipment operation.

[0071] In some specific implementations, the temperature sensing element 330 is a thermometer.

[0072] In this embodiment, by setting the temperature sensing element 330 as a thermometer, the tester can intuitively detect the temperature of the heat dissipation medium to ensure that the heat dissipation medium is always kept within a suitable temperature range.

[0073] In some other embodiments, please refer to Figure 1 The liquid storage component 200, the heating component 300, and part of the working fluid management component 400 are arranged sequentially along the height direction of the device body 100.

[0074] In this embodiment, the liquid storage component 200, the heating component 300, and part of the working fluid management component 400 are arranged sequentially along the height of the device body 100, forming a vertical layout design. This vertical layout design makes full use of gravity, creating a naturally flowing heat dissipation working fluid supply system within the testing device, significantly improving the system's operating efficiency.

[0075] Specifically, the liquid storage component 200 is located at the upper part of the device body 100, the heating component 300 is located below the liquid storage component 200, and part of the working fluid management component 400 is located below the heating component 300. This vertical layout design allows the heat dissipation working fluid to flow naturally from the liquid storage component 200 to the heating component 300 under the action of gravity, and after being heated, it flows to the working fluid management component 400, and is finally delivered to the interior of the liquid cooling equipment.

[0076] The main advantage of this vertical layout design is that it makes full use of gravitational potential energy, reducing the need for additional power units. When the heat dissipation medium flows from the liquid storage component 200 to the heating component 300, gravity provides the power for natural flow, eliminating the need for additional pumps or other pressurization equipment, simplifying the system structure and reducing energy consumption.

[0077] Furthermore, by rationally arranging the components in the vertical direction, the testing device can achieve more functions within a limited footprint, improving space utilization and making the entire testing device more compact.

[0078] In some embodiments, please refer to Figure 1 The working fluid management component 400 includes: a cooling distribution unit 410 (CDU), which is disposed within the device body 100; a water distributor 420, which is connected to the side of the device body 100 and communicates with the cooling distribution unit 410; and a connecting member (not shown in the figure), which is used to connect the water distributor 420 with the liquid cooling equipment.

[0079] In this embodiment, the cooling distribution unit 410 is located inside the device body 100, serving as a transfer station and adjustment center for the heat dissipation medium. When the heat dissipation medium flows out from the heating component 300, it first enters the cooling distribution unit 410, which can regulate the temperature and control the flow rate of the heat dissipation medium flowing out from the heating component 300. In actual testing, the cooling distribution unit 410 needs to provide heat dissipation medium to multiple liquid cooling devices simultaneously, or it needs to adjust the flow rate according to the heat dissipation requirements of different liquid cooling devices. This flow control capability can improve the adaptability of the testing device, enabling it to meet the needs of various testing scenarios. Furthermore, when the temperature of the heat dissipation medium flowing out from the heating component 300 is high, the cooling distribution unit 410 can cool the heat dissipation medium to ensure it meets the heat dissipation requirements.

[0080] It should be noted that the cooling distribution unit 410 is a structural design known in the art, and will not be described in detail here.

[0081] The water distributor 420 is connected to the side of the device body 100 and is connected to the cooling distribution unit 410. The water distributor 420 can be provided with multiple interfaces, which can connect to multiple liquid cooling devices at the same time. The heat dissipation working fluid output from the cooling distribution unit 410 can be further distributed to multiple liquid cooling devices through these interfaces, so that one test device can provide a test environment for multiple liquid cooling devices at the same time, thereby improving test efficiency.

[0082] It should be noted that the water distributor 420 is a structural design known in the art, and will not be described in detail here.

[0083] By setting up a connecting element, the water distributor 420 is connected to the liquid cooling equipment. The heat dissipation working fluid transmitted by the water distributor 420 can be transferred to the liquid cooling equipment through the connecting element.

[0084] However, when the surface temperature of the connecting parts is lower than the ambient dew point temperature, water vapor in the air will condense into water droplets on the surface of the connecting parts, forming condensation. If this condensation flows into the liquid cooling equipment along the connecting parts, it may cause short circuits, corrosion, and other malfunctions in the liquid cooling equipment, seriously affecting the accuracy of test results and the safety of the liquid cooling equipment.

[0085] To address this issue, the heating component 300 heats the heat dissipation medium, maintaining its temperature within an appropriate range. When the heated medium flows through the connecting member, heat is transferred to it via thermal conduction, raising the surface temperature of the connecting member and maintaining it above the ambient dew point temperature, effectively preventing condensation from forming on its surface.

[0086] It should be noted that this embodiment does not limit the specific type of the connecting element, and can be adjusted according to specific needs. For example, the connecting element is a pipe.

[0087] In other embodiments, please refer to Figure 1 and Figure 3 The working fluid management component 400 also includes a rotating component 430, and the water distributor 420 is rotatably connected to the device body 100 through the rotating component 430, so that the water distributor 420 can switch between a position that is in contact with the side wall of the device body 100 and a position that has an angle with the side wall of the device body 100.

[0088] In this embodiment, by setting a rotating component 430, the water distributor 420 is movably connected to the device body 100 through the rotating component 430, so that the water distributor 420 can flexibly switch between two positions: one is a position that fits against the side wall of the device body 100, and the other is a position that has a certain angle with the side wall of the device body 100.

[0089] In some scenarios, testers need to move the testing device from one location to another for testing. If the water distributor 420 protrudes significantly from the side wall of the device body 100, it may cause the testing device to collide with other objects, resulting in damage to the testing device. Therefore, this embodiment incorporates a rotating component 430. When the water distributor 420 rotates to a position where it is in contact with the side wall of the device body 100, it facilitates the transfer of the testing device and makes the overall shape of the testing device compact, with a small space occupancy.

[0090] When connecting to liquid cooling equipment or used in special locations, the tester can rotate the manifold 420 to a position with a certain angle (such as 90° or other appropriate angle) relative to the side wall of the device body 100. This flexible angle adjustment capability allows the test device to adapt to various testing environments. For example, in a narrow machine room, a specific angle of the manifold 420 is required to match the existing piping system. If the position of the manifold 420 remains fixed, the placement and connection methods of the test device will be severely limited, and it may not be able to meet the needs of these special locations. By setting the rotating component 430, the manifold 420 can be adjusted according to actual needs, thereby improving the adaptability and flexibility of the test device and expanding its application range.

[0091] For some specific implementation methods, please refer to Figure 3 The rotating part 430 is a hinge.

[0092] By designing the rotating component 430 as a hinge, the simple structure of the hinge reduces the manufacturing and installation costs. Furthermore, the hinge's strong load-bearing capacity allows the rotating component 430 to stably support the weight of the manifold 420 and its connected pipes.

[0093] In its specific implementation, the hinge includes a first blade 431, a second blade 433, and a rotating shaft 432. The first blade 431 is connected to the second blade 433 via the rotating shaft 432. The first blade 431 is connected to the device body 100, and the second blade 433 is connected to the water distributor 420.

[0094] Furthermore, the hinge also includes an extension 434, which is disposed on the second blade 433. The second blade 433 is connected to the water distributor 420 through the extension 434. By providing the extension 434, the contact area between the hinge and the water distributor 420 can be increased, making the connection between the hinge and the water distributor 420 easier.

[0095] In some other embodiments, please refer to Figure 3 and Figure 4 The device includes a connector 440 connected to the side of the device body 100; the water distributor 420 has a connection hole 450, and the connector 440 is inserted into the connection hole 450 so that the water distributor 420 and the connector 440 can be detachably connected.

[0096] In the research and development or deployment of liquid cooling equipment, different projects have different requirements for cooling capacity. For example, high-performance computing servers usually require a larger cooling capacity to cope with their high heat load, while ordinary office servers have relatively lower cooling requirements.

[0097] The difference in cooling capacity mainly lies in the flow rate and distribution of the heat dissipation medium. Different distributors 420 can have different numbers of interfaces, different internal flow channel designs, and different flow control mechanisms to adapt to different cooling needs. When the test equipment needs to provide a test environment for servers with high heat dissipation requirements, a distributor 420 with a larger flow rate can be installed; when the test equipment needs to provide a test environment for servers with lower heat dissipation requirements, a distributor 420 with a standard configuration can be used. If the test equipment uses a fixed distributor 420, it cannot flexibly cope with these differentiated needs. However, with the detachable distributor 420 design, only one test equipment and multiple distributors 420 of different specifications are needed to meet various test requirements, thereby reducing equipment investment costs.

[0098] In practice, the replacement process of the manifold 420 is simple and quick. The operator only needs to pull the connector 440 out of the connection hole 450 of the current manifold 420, and then align the new manifold 420 with the connector 440, so that the connector 440 is inserted into the connection hole 450 of the new manifold 420 to complete the replacement.

[0099] For some specific implementation methods, please refer to Figure 5 and Figure 6The connector 440 includes a connecting section 441 and a limiting section 442 that are connected to each other. The connecting section 441 is connected to the side of the device body 100, and the radial width of the limiting section 442 is greater than the radial width of the connecting section 441.

[0100] The connecting hole 450 includes a first hole segment 451 and a second hole segment 452 that are interconnected. The diameter of the first hole segment 451 is greater than or equal to the radial width of the limiting segment 442, the diameter of the second hole segment 452 is greater than or equal to the radial width of the connecting segment 441, and the diameter of the second hole segment 452 is less than the radial width of the limiting segment 442.

[0101] In this embodiment, since the diameter of the first hole 451 is greater than or equal to the radial width of the limiting segment 442, and the radial width of the limiting segment 442 is greater than the radial width of the connecting segment 441, both the connecting segment 441 and the limiting segment 442 can pass smoothly through the first hole 451. Since the diameter of the second hole 452 is greater than or equal to the radial width of the connecting segment 441, the connecting segment 441 can enter the second hole 452 from the first hole 451. Since the diameter of the second hole 452 is smaller than the radial width of the limiting segment 442, when the connecting segment 441 is inserted into the second hole 452, the limiting segment 442 cannot pass through the second hole 452, thus forming a natural limiting mechanism.

[0102] Therefore, when the connector 440 is connected to the side of the device body 100, the connecting hole 450 on the distributor 420 is aligned with the connector 440. The first hole section 451 of the connecting hole 450 allows the connecting section 441 and the limiting section 442 of the connector 440 to pass through, and the second hole section 452 of the connecting hole 450 allows the connecting section 441 of the connector 440 to pass through. The limiting section 442 will limit the insertion depth of the distributor 420 and prevent the distributor 420 from detaching from the connector 440, thereby realizing the quick assembly and disassembly of the distributor 420.

[0103] In a specific implementation, the connecting section 441 can be connected to the extension 434 of the rotating member 430.

[0104] In some embodiments, please refer to Figure 1 The testing device also includes a roller assembly 500, which is located at the bottom of the device body 100.

[0105] In real-world testing environments, testing equipment often needs to be deployed in different locations to accommodate various testing requirements. For example, during the R&D phase, testing equipment may need to be moved between different areas of the laboratory to accommodate different testing projects; during field installation testing, testing equipment may need to be moved to different devices for testing. If the testing equipment lacks mobility, it will lead to low testing efficiency.

[0106] In this embodiment, by setting a roller assembly 500 at the bottom of the device body 100, the testing device has good mobility. Operators can easily push or pull the testing device to quickly adjust its position, thereby meeting the turnover needs in multiple site scenarios and improving work efficiency.

[0107] It should be noted that this embodiment does not limit the specific type of the roller assembly 500, and can be adjusted according to specific needs. For example, the roller assembly 500 is a caster wheel assembly.

[0108] It should be understood that the embodiments of this application are not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A testing device, characterized in that, include: Device body (100); A liquid storage assembly (200) is disposed on the device body (100) and is used to store heat dissipation working fluid; A heating component (300) is disposed on the device body (100), the heating component (300) is connected to the liquid storage component (200), and the heating component (300) is used to heat the heat dissipation working fluid; A working fluid management component (400) is disposed on the device body (100). The working fluid management component (400) is connected to the heating component (300). The working fluid management component (400) is used to connect to the liquid cooling equipment and to deliver the heat dissipation working fluid to the liquid cooling equipment.

2. The testing apparatus according to claim 1, characterized in that, The heating assembly (300) includes: A heating chamber (310) is disposed on the device body (100) and is connected to the liquid storage assembly (200); A heating element (320) is disposed inside the heating cavity (310) and is used to heat the heat dissipation medium.

3. The testing apparatus according to claim 2, characterized in that, The heating element (320) is a heating rod.

4. The testing apparatus according to claim 2, characterized in that, The heating assembly (300) further includes a temperature detection element (330) for detecting the temperature of the heat dissipation medium inside the heating cavity (310).

5. The testing apparatus according to claim 1, characterized in that, The liquid storage component (200), the heating component (300), and part of the working fluid management component (400) are arranged sequentially along the height direction of the device body (100).

6. The testing apparatus according to any one of claims 1-5, characterized in that, The working fluid management component (400) includes: A cooling distribution unit (410) is disposed within the device body (100); Water distributor (420), which is connected to the side of the device body (100) and is connected to the cooling distribution unit (410); A connecting element for connecting the water distributor (420) to the liquid cooling device.

7. The testing apparatus according to claim 6, characterized in that, The working fluid management component (400) also includes a rotating component (430), and the water distributor (420) is rotatably connected to the device body (100) through the rotating component (430) so that the water distributor (420) can switch between a position that fits against the side wall of the device body (100) and a position that has an angle with the side wall of the device body (100); the rotating component (430) is a hinge.

8. The testing apparatus according to claim 6, characterized in that, The working fluid management component (400) also includes a connector (440) connected to the side of the device body (100); The water distributor (420) has a connection hole (450), and the connector (440) is inserted into the connection hole (450) so that the water distributor (420) and the connector (440) can be detachably connected.

9. The testing apparatus according to claim 8, characterized in that, The connector (440) includes a connecting section (441) and a limiting section (442) that are connected to each other. The connecting section (441) is connected to the side of the device body (100), and the radial width of the limiting section (442) is greater than the radial width of the connecting section (441). The connecting hole (450) includes a first hole segment (451) and a second hole segment (452) that are interconnected. The diameter of the first hole segment (451) is greater than or equal to the radial width of the limiting segment (442). The diameter of the second hole segment (452) is greater than or equal to the radial width of the connecting segment (441), and the diameter of the second hole segment (452) is less than the radial width of the limiting segment (442).

10. The testing apparatus according to any one of claims 1-5, characterized in that, It also includes a roller assembly (500) disposed at the bottom of the device body (100).