Ultrasonic detection instrument

Abstract

The utility model relates to the technical field of semiconductor detection, in particular to an ultrasonic detection instrument which comprises a fixed seat, a groove is formed in the surface of the fixed seat, a water tank is arranged in the groove, a bearing plate is arranged above the water tank, a limiting ring is arranged on the bearing plate, and a wafer is placed on the limiting ring; the pair of first driving mechanisms is mounted on the fixed seat; the second driving mechanism stretches across the groove, and the two ends of the second driving mechanism are arranged on the first driving mechanism in a sliding mode to serve as rotors of the first driving mechanism; the sliding device comprises a sliding block and a plurality of detection devices, the sliding block is arranged on the second driving mechanism in a sliding mode, the multiple detection devices are all located above the wafer and used for detecting the wafer, each detection device comprises a third driving mechanism, a magnetic spring and a detection head, and the driving end of the third driving mechanism is connected with the detection head and drives the detection head to be close to or away from the wafer. The magnetic spring is connected with the third driving mechanism, and when power is off, the magnetic spring supports the driving end of the third driving mechanism to keep the height unchanged.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to an ultrasonic testing instrument. Background Technology

[0002] Ultrasonic wafer inspection instruments, as one of the core pieces of equipment in semiconductor manufacturing and quality control, are undeniably important. Especially with the increasing prevalence of advanced packaging technologies, these instruments are widely used to detect minute gaps between wafers, which is crucial for ensuring the reliability of inter-chip connections and overall performance. However, some existing ultrasonic wafer inspection instruments face the dual challenges of insufficient stability during movement and the risk of the motor falling and damaging the wafer during power outages when performing this critical task.

[0003] In the process of inspecting inter-wafer gaps, ultrasonic probes need to move across the wafer surface with extremely high precision and stability to capture and analyze the reflected ultrasonic signals, thereby accurately determining the contact state between wafers. However, due to design flaws in some instruments, such as instability in the drive system, insufficient vibration damping measures, or limitations in probe positioning accuracy, the probe may wobble during movement. This not only affects the accuracy of the inspection results but may also cause wafer damage due to unintended contact between the probe and the wafer surface.

[0004] More seriously, when the instrument experiences a power outage, the motor assembly, lacking an effective protection mechanism, may instantly lose control and fall freely, impacting the wafer. This impact not only causes direct physical damage to the wafer, such as cracks, fragments, or surface scratches, but also, due to the excessive weight of the motor and the force of the impact, can damage the inter-wafer connections, or even cause the entire package structure to fail. Furthermore, the falling motor may damage other critical components of the testing instrument, such as probes, guide rails, sensors, or circuit boards, further increasing maintenance costs and the risk of production disruption.

[0005] Therefore, this application develops an ultrasonic testing instrument to solve the problems existing in the prior art. Utility Model Content

[0006] The purpose of this invention is to provide an energy storage module to solve the problem in the prior art where the drive device vibrates during wafer inspection, causing errors in wafer inspection.

[0007] The technical solution of this utility model is: an ultrasonic testing instrument, comprising:

[0008] A fixing base has a groove on its surface, a water tank is provided in the groove, and a support plate is provided above the water tank. A limiting ring is provided on the support plate, and the wafer is placed on the limiting ring.

[0009] A pair of first drive mechanisms are mounted on the fixed base and arranged symmetrically relative to the groove;

[0010] The second driving mechanism spans the groove and its two ends are respectively slidably disposed on the first driving mechanism as moving parts of the first driving mechanism;

[0011] A sliding device includes a slider and multiple detection devices. The slider is slidably mounted on the second driving mechanism. The multiple detection devices are all located above the wafer and are used for wafer detection. Each detection device includes a third driving mechanism, a magnetic spring, and a detection head. The driving end of the third driving mechanism is connected to the detection head, driving the detection head to move closer to or away from the wafer. The magnetic spring is connected to the third driving mechanism, and when the power is off, the magnetic spring supports the driving end of the third driving mechanism to maintain a constant height.

[0012] Preferably, the second driving mechanism moves along the movement path of the first driving mechanism, the slider moves along the movement path of the second driving mechanism, and the two movement paths are perpendicular to each other.

[0013] Preferably, the magnetic spring includes a magnetic shaft and a magnetic sleeve. The magnetic sleeve is connected to the drive end of the third drive mechanism through a connecting plate, so that the magnetic sleeve controls the movement of the drive end of the third drive mechanism.

[0014] Preferably, one end of the detection head is connected to a water inlet pipe, and the side wall of the detection head is connected to a water outlet connector, with the water outlet of the water outlet connector being vertically upward.

[0015] Preferably, the slider is provided with a first reading head and a first grating ruler on the two sides close to the second driving mechanism.

[0016] Preferably, the two ends of the second drive mechanism and the two sides close to the fixed base are respectively provided with a second reading head and a second grating ruler.

[0017] Preferably, the plurality of detection devices are arranged side by side along the path direction of the first driving mechanism, and all are located above the wafer.

[0018] Compared with the prior art, the advantages of this utility model are:

[0019] (1) By setting up four detection devices in parallel and working simultaneously, the waiting and transfer time of wafers between different detection devices is reduced, the detection time of a single wafer is significantly shortened, thereby improving the overall production efficiency;

[0020] (2) The combination of voice coil motor and magnetic spring enables the detection head to quickly adjust its height to adapt to different wafer surface morphologies, ensuring the continuity and stability of the detection. At the same time, the magnetic spring provides tension when the power is off, preventing the detection head from causing impact damage to the wafer.

[0021] (3) The slider and the second drive mechanism, and the second drive mechanism and the first drive mechanism are precisely measured and monitored in real time through the reading head and the grating ruler, which ensures that the slider and the second drive mechanism can be accurately positioned at the predetermined position, thereby improving the positioning accuracy of the system. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0023] Figure 1 This is a schematic diagram of the structure of an ultrasonic testing instrument according to the present invention;

[0024] Figure 2 for Figure 1 Enlarged structural diagram of A in the middle;

[0025] Figure 3 for Figure 1 Enlarged structural diagram of B in the middle;

[0026] Figure 4 This is a schematic diagram of the detection device described in this utility model.

[0027] The components are as follows: 1. Fixed base; 11. Groove; 12. Water tank; 13. Bearing plate; 14. Limiting ring; 15. Second grating ruler; 2. First driving mechanism; 3. Second driving mechanism; 31. First grating ruler; 32. Second reading head; 4. Sliding device; 41. Sliding block; 411. First reading head; 42. Detection device; 421. Third driving mechanism; 422. Magnetic spring; 4221. Magnetic shaft; 4222. Magnetic sleeve; 4223. Connecting plate; 423. Detection head; 424. Water outlet connector. Detailed Implementation

[0028] The present invention will be further described in detail below with reference to specific embodiments:

[0029] like Figures 1-3As shown, an ultrasonic testing instrument includes a fixed base 1, a first driving mechanism 2, a second driving mechanism 3, and a sliding device 4. The fixed base 1 has a groove 11 forming upward protrusions on both sides. A water tank 12 and a support plate 13 are arranged within the groove 11. A limiting ring 14 is provided on the support plate 13. A wafer is placed on the limiting ring 14 and fixed, ensuring precise positioning of the wafer and providing stable support while preventing the wafer from shifting or rotating during testing. A pair of first driving mechanisms 2 are located on the two protrusions of the fixed base 1, while the second driving mechanism 3 acts as the moving part of the first driving mechanism 2, with both ends slidably connected to the first driving mechanism 2. The sliding device 4 includes a slider 41 and a detection device 42, with the slider 41 and the detection device 42 fixedly connected. The wafer is fixedly connected and slidably mounted on the second drive mechanism 3. In this embodiment, four detection devices 42 are arranged side by side along the path of the first drive mechanism 2, and all are located above the wafer. During wafer detection, the four detection devices 42 simultaneously detect the wafer and move along the path of the second drive mechanism 3 under the drive of the second drive mechanism 3 to complete the wafer detection of one path. Then, the first drive mechanism 2 drives the second drive mechanism 3 to advance one point, and the detection device 42 moves along the path of the second drive mechanism 3 again until the wafer detection is completed. Since the detection process is parallel and the detection devices 42 work at the same time, the waiting and transfer time of the wafer between different detection devices 42 is reduced, the detection time of a single wafer is significantly shortened, and the overall production efficiency is improved.

[0030] Specifically, both the first drive mechanism 2 and the second drive mechanism 3 are linear motors. The paths of the first drive mechanism 2 and the second drive mechanism 3 are perpendicular to each other, achieving full coverage inspection of the wafer to ensure no omissions. This also helps to achieve high-precision positioning of the inspection device 42 on the wafer, thereby improving the accuracy of the inspection.

[0031] In this embodiment, as Figure 4As shown, the detection device 42 includes a third drive mechanism 421, a magnetic spring 422, and a detection head 423. When detecting the gap between two wafers, it is necessary to maintain the distance between the detection head 423 and the wafer at all times, and also ensure that the third drive mechanism 421 remains at a safe distance from the wafer when power is off. Therefore, the detection head 423 is connected to the drive end of the third drive mechanism 421, and the third drive mechanism 421 controls the lifting and lowering of the detection head 423. The third drive mechanism 421 is a voice coil motor. Before wafer detection, the detection head 423, driven by the first drive mechanism 2 and the second drive mechanism 3, first scans the wafer to determine the surface irregularities. The voice coil motor has the characteristics of high precision and high response speed, and can quickly adjust the detection head 423 according to the scanning results. The height of 23 ensures that the detection head 423 maintains an appropriate distance from the wafer surface, which helps improve the accuracy and efficiency of the detection. At the same time, the height of the detection head 423 can be adapted to different wafer surface morphologies, thereby ensuring the continuity and stability of the detection. When the voice coil motor is de-energized, its drive end will drop without support and cause impact damage to the wafer. The magnetic spring 422 includes a magnetic shaft 4221 and a magnetic sleeve 4222. Therefore, the drive end of the third drive mechanism 421 is connected to the magnetic sleeve 4222 through the connecting plate 4223. The magnetic shaft 4221 is made of permanent magnet material. Through the magnetic force between the magnetic shaft 4221 and the magnetic sleeve 4222, the connecting plate 4223 generates a pulling force on the drive end of the third drive mechanism 421. Thus, in the event of a power failure, the drive end will not fall and damage the wafer.

[0032] Furthermore, in this embodiment, the detection head 423 uses ultrasound to inspect the wafer. A water outlet connector 424 is provided on the side wall of the detection head 423, with the water outlet of the connector 424 vertically upward. When pure water is supplied to the detection head 423, the pure water flows out from the water outlet connector 424, placing the wafer in the pure water. Pure water, as a good propagation medium for ultrasound, helps the ultrasound signal to propagate and reflect in the wafer. When the ultrasound is emitted from the detection head 423, passes through the pure water layer, and reaches the wafer surface, it can more clearly reflect the defects and structural features inside the wafer. At the same time, pure water, as a buffering medium, can reduce the direct impact of ultrasound on the wafer surface, thereby reducing the risk of damage to the wafer during the inspection process. It can also wash away tiny impurities and particles on the wafer surface, reducing the interference of these impurities on the ultrasound signal and ensuring the accuracy of the inspection results.

[0033] To ensure the stability of the detection device 42 during wafer scanning, such as Figures 2-3As shown, the slider 41 is provided with a first reading head 411 and a first grating ruler 31 on the two sides close to the second driving mechanism 3, and the two ends of the second driving mechanism 3 are provided with a second reading head 32 and a second grating ruler 15 on the two sides close to the fixed base 1, so that when the slider 41 moves along the second driving mechanism 3 and the second driving mechanism 3 moves along the first driving mechanism 2, the position can be monitored and error compensation can be performed in real time, ensuring that the slider 41 and the second driving mechanism 3 can be accurately positioned at the predetermined position, thereby improving the positioning accuracy of the system and making the movement in the wafer inspection process more stable and accurate, thereby improving the accuracy and reliability of the inspection.

[0034] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.

Claims

1. An ultrasonic testing instrument, characterized in that, include: A fixing base (1) has a groove (11) on its surface, a water tank (12) is provided in the groove (11), and a support plate (13) is provided above the water tank (12). A limiting ring (14) is provided on the support plate (13), and the wafer is placed on the limiting ring (14). A pair of first drive mechanisms (2) are mounted on the fixed base (1) and are symmetrically arranged relative to the groove (11); The second drive mechanism (3) spans the groove (11) and its two ends are respectively slidably disposed on the first drive mechanism (2) as the moving parts of the first drive mechanism (2); A sliding device (4) is provided, comprising a slider (41) and multiple detection devices (42). The slider (41) is slidably disposed on the second driving mechanism (3). The multiple detection devices (42) are located above the wafer and are used for wafer detection. Each detection device (42) comprises a third driving mechanism (421), a magnetic spring (422), and a detection head (423). The driving end of the third driving mechanism (421) is connected to the detection head (423) to drive the detection head (423) to move closer to or away from the wafer. The magnetic spring (422) is connected to the third driving mechanism (421). When the power is off, the magnetic spring (422) supports the driving end of the third driving mechanism (421) to maintain a constant height.

2. The ultrasonic testing instrument according to claim 1, characterized in that: The second driving mechanism (3) moves along the movement path of the first driving mechanism (2), and the slider (41) moves along the movement path of the second driving mechanism (3), with the two movement paths being perpendicular to each other.

3. The ultrasonic testing instrument according to claim 1, characterized in that: The magnetic spring (422) includes a magnetic shaft (4221) and a magnetic sleeve (4222). The magnetic sleeve (4222) is connected to the drive end of the third drive mechanism (421) through a connecting plate (4223), so that the magnetic sleeve (4222) controls the movement of the drive end of the third drive mechanism (421).

4. An ultrasonic testing instrument according to claim 1, characterized in that: One end of the detection head (423) is connected to a water inlet pipe, and the side wall of the detection head (423) is connected to a water outlet connector (424), with the water outlet of the water outlet connector (424) set vertically upward.

5. An ultrasonic testing instrument according to claim 1, characterized in that: The slider (41) is provided with a first reading head (411) and a first grating ruler (31) on the two sides close to the second driving mechanism (3).

6. An ultrasonic testing instrument according to claim 1, characterized in that: The second drive mechanism (3) has a second reading head (32) and a second grating ruler (15) on its two ends and the two sides of the fixed base (1) respectively.

7. An ultrasonic testing instrument according to claim 1, characterized in that: Multiple detection devices (42) are arranged side by side along the path direction of the first driving mechanism (2), and are all located above the wafer.

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