Wafer test probe and test equipment
By setting multiple grooves on the surface and sides of the wafer test probe, heat dissipation performance is enhanced, the problem of probe thermal deformation in high-temperature testing is solved, the test accuracy and reliability are improved, and tip deviation and wafer surface damage are avoided.
Patent Information
- Application Number
- CN202520175519.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-26
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-26
AI Technical Summary
Wafer test probes are prone to thermal deformation during high-temperature testing, which can cause the probe tip position to shift, affecting test accuracy and reliability, and even causing damage to the chip surface.
The wafer test probe is designed with multiple grooves on its surface and sides, including a connected third groove, to enhance heat dissipation, mitigate thermal deformation, and improve test accuracy and reliability.
It effectively reduces probe thermal deformation, improves test accuracy and reliability, avoids tip deviation and wafer surface damage, and ensures test efficiency and yield.
Smart Images
Figure CN223841996U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a wafer test probe and testing equipment. Background Technology
[0002] Wafer testing is a crucial step in integrated circuit manufacturing. The wafer testing process involves using test probes to test wafer transistors. For memory products, high-temperature testing is often required. Probes are prone to overheating during prolonged testing, and the significant thermal deformation of the probes at high temperatures can cause misalignment of the probe tip with the wafer test pads. This can lead to uncontrollable probe mark deviation, test failures, chip surface damage, yield losses, and reliability risks. Utility Model Content
[0003] The purpose of this invention is to provide a wafer test probe and test equipment that facilitates heat dissipation of the probe, reduces thermal deformation of the probe at high temperatures, and improves test accuracy and reliability.
[0004] In a first aspect, this utility model provides a wafer testing probe, including a probe body;
[0005] The probe body includes a first surface, a first side surface, a second surface, and a second side surface connected end to end; the first surface and the second surface are arranged opposite to each other, and the first side surface and the second side surface are arranged opposite to each other;
[0006] The first surface and / or the second surface are provided with a plurality of first grooves;
[0007] The first side and / or the second side are provided with a second groove;
[0008] The probe body is provided with a third groove that connects to multiple first grooves, and the multiple third grooves are staggered.
[0009] In an optional embodiment, the first side is provided with a plurality of second grooves, and the plurality of second grooves are evenly spaced apart;
[0010] And / or, the second side is provided with a plurality of second grooves, the plurality of second grooves being evenly spaced.
[0011] In an optional embodiment, a plurality of first grooves are spaced apart along a first direction; at least one third groove is provided between two adjacent first grooves; the direction in which the third groove is disposed is at an angle to the first direction.
[0012] In an optional embodiment, the width of the first groove in the first direction is greater than or equal to the width of the second groove in the first direction.
[0013] In an optional embodiment, the third groove is a through groove that extends through the first surface and the second surface.
[0014] In an optional embodiment, the second groove and the first groove are respectively provided, and the first groove and the second groove are connected.
[0015] In an optional embodiment, the second groove and the first groove are misaligned.
[0016] In an optional embodiment, the cross-section of the third groove is rectangular or elliptical.
[0017] In an optional embodiment, the probe body includes a connection end and a test end disposed opposite to each other. The connection end is used to connect to a test instrument, and the test end is used to connect to a wafer pad. The end face of the test end is set at an acute angle to a first direction. The first direction is the direction from the test end to the connection end.
[0018] Secondly, this utility model provides a testing device, including a testing instrument and a wafer test probe as described in any of the foregoing embodiments, wherein the testing instrument and the wafer test probe are connected.
[0019] The wafer test probe and test equipment provided in this embodiment of the utility model have the following advantages:
[0020] The wafer test probe provided in this embodiment of the invention has a first groove on its surface, a second groove on its side, and a third groove connecting multiple first grooves, resulting in good heat dissipation performance. It is suitable for high-temperature testing, effectively reducing probe thermal deformation and improving testing accuracy and reliability.
[0021] The testing equipment provided in this embodiment of the present invention includes the wafer testing probe described above, which can reduce the thermal deformation of the probe during high-temperature testing or long-term testing, improve testing accuracy and reliability, and prevent the probe from scratching the wafer surface after deformation. Attached Figure Description
[0022] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the structure of the wafer test probe provided in an embodiment of the present invention.
[0024] Icons: 100 - Wafer test probe; 111 - First surface; 112 - First side; 121 - First groove; 122 - Second groove; 123 - Third groove; 131 - Connector; 133 - Test end. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0027] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0029] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0030] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0031] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0032] This invention provides a wafer test probe and test equipment for testing wafer transistors, such as electrical performance testing or other functional testing.
[0033] Combination Figure 1 The wafer test probe 100 provided in this embodiment includes a probe body, which includes a first surface 111, a first side surface 112, a second surface, and a second side surface connected end to end. The first surface 111 and the second surface are arranged opposite to each other, as are the first side surface 112 and the second side surface. The first surface 111 and / or the second surface are provided with a plurality of first grooves 121. The first side surface 112 and / or the second side surface are provided with second grooves 122. The probe body is provided with third grooves 123 that connect the plurality of first grooves 121, and the plurality of third grooves 123 are staggered. This wafer test probe 100 has good heat dissipation performance, which helps to mitigate thermal deformation of the probe at high temperatures and improves test accuracy and reliability.
[0034] It is understood that the first groove 121 is provided on at least one of the first surface 111 and the second surface. For example, only the first surface 111 has one or more first grooves 121. Or, only the second surface has one or more first grooves 121. Or, the first surface 111 and the second surface each have one or more first grooves 121. In this embodiment, the first surface 111 and the second surface each have multiple first grooves 121. The multiple first grooves 121 are evenly spaced, resulting in better heat dissipation performance and more uniform heat dissipation, avoiding localized high temperatures.
[0035] Similarly, a second groove 122 is provided in at least one of the first side surface 112 and the second side surface. For example, only the first side surface 112 may have one or more second grooves 122. Alternatively, only the second side surface may have one or more second grooves 122. Or, the first side surface 112 and the second side surface may each have one or more second grooves 122. In this embodiment, the first side surface 112 and the second side surface may each have a plurality of second grooves 122. The plurality of second grooves 122 are evenly spaced, resulting in better heat dissipation performance and more uniform heat dissipation, avoiding localized high temperatures.
[0036] The third groove 123 is disposed on the first surface 111 or the second surface, or the first surface 111 and the second surface are respectively provided with the third groove 123. The third groove 123 can increase the heat dissipation area and improve the heat dissipation performance. In this embodiment, the third groove 123 is used to connect multiple first grooves 121, which can guide the heat of the first grooves 121 to dissipate and further improve the heat dissipation performance.
[0037] In this embodiment, the staggered arrangement of the third grooves 123 means that the multiple third grooves 123 are not arranged in a straight line. In other words, the vertical distance from the center of each third groove 123 to the first side 112 or the second side is not equal. This helps to improve the uniformity of heat dissipation, resulting in more uniform heat dissipation in the direction perpendicular to the first side 112 or the second side.
[0038] Since multiple first grooves 121 are spaced apart in a first direction, which is the length direction of the probe body, a third groove 123 is used to connect adjacent first grooves 121, meaning the third groove 123 is also arranged along the first direction. Thus, the staggered arrangement of the third grooves 123 can be understood as a stepped distribution in the direction perpendicular to the first side 112 or the second side.
[0039] Optionally, at least one third groove 123 may be provided between two adjacent first grooves 121. That is, one or more third grooves 123 may be provided between two adjacent first grooves 121. If multiple third grooves 123 are provided, the multiple third grooves 123 may be arranged in parallel, or they may be arranged intersecting or at an angle, without specific limitations.
[0040] Optionally, the third groove 123 is positioned at an angle to the first direction. That is, the third groove 123 is inclined relative to the first side 112 or the second side, which helps to increase the heat dissipation area and improve heat dissipation performance.
[0041] Optionally, the third groove 123 is a through-slot that penetrates the first surface 111 and the second surface. This design allows for better heat dissipation from the probe body to the outside, resulting in higher heat dissipation efficiency and better heat dissipation performance. In addition, the through-slot design of the third groove 123 also helps to reduce the overall weight of the probe body, preventing the probe body from being too heavy and pressing on the pads on the wafer surface, thereby causing damage to the wafer surface.
[0042] It should be noted that the first groove 121, the second groove 122 and the third groove 123 not only have the functions of ventilation, heat dissipation and heat conduction, but also have the function of reducing weight.
[0043] Optionally, the width of the first groove 121 in the first direction is greater than or equal to the width of the second groove 122 in the first direction. Since the surface areas of the first surface 111 and the second surface are equal, and the surface areas of the first side surface 112 and the second side surface are equal, the surface area of the first side surface 112 is smaller than that of the first surface 111. Therefore, the first surface 111 can handle a larger amount of heat dissipation, and the wider design of the first groove 121 is beneficial for the rapid heat dissipation of the first surface 111 and the second surface.
[0044] Optionally, the second groove 122 and the first groove 121 are correspondingly arranged, and the first groove 121 and the second groove 122 are connected. By connecting the first groove 121 and the second groove 122, the heat dissipation area is larger and the air circulation is better, which is more conducive to improving heat dissipation efficiency and enhancing heat dissipation performance.
[0045] Of course, in some other embodiments, the second groove 122 and the first groove 121 are staggered. That is, the first groove 121 and the second groove 122 are not directly connected. With this design, the first groove 121 and the second groove 122 can dissipate heat independently, and the distribution of the second groove 122 is more flexible.
[0046] It should be understood that in some embodiments, among the plurality of second grooves 122, some second grooves 122 may be connected to the first groove 121, while the remaining second grooves 122 and the first groove 121 may be misaligned. This is not specifically limited here.
[0047] In this embodiment, the cross-section of the third groove 123 is rectangular or elliptical. Of course, it is not limited to this. In some other embodiments, the cross-section of the third groove 123 can be circular, semi-circular, crescent-shaped, wavy, Z-shaped, L-shaped or other arbitrary shapes, which are not specifically limited here.
[0048] Optionally, the probe body includes a connecting end 131 and a test end 133 disposed opposite to each other. The connecting end 131 is used to connect to a test instrument, and the test end 133 is used to connect to a wafer pad. The end face of the test end 133 is set at an acute angle to a first direction; wherein, the first direction is the direction from the test end 133 to the connecting end 131, that is, the length direction of the probe body. This configuration, where the test end 133 is wedge-shaped or triangular, helps to reduce the contact area between the test end 133 and the wafer pad, thereby reducing heat generation.
[0049] This utility model embodiment also provides a testing device, including a testing instrument and the aforementioned wafer test probe 100, wherein the testing instrument and the wafer test probe 100 are connected.
[0050] During testing, the test end 133 of the probe body contacts the pads on the wafer to achieve electrical continuity and determine whether the transistor circuit is functioning properly. Because the probe body has a first groove 121, a second groove 122, and a third groove 123, it has excellent heat dissipation performance, preventing thermal deformation caused by excessive probe body temperature. This avoids displacement of the test end 133 in contact with the pads, resulting in high testing efficiency, high testing accuracy, and a reliable structure. It also avoids test failures caused by test end 133 displacement and defects such as scratches on the wafer surface.
[0051] In summary, the wafer test probe 100 and test equipment provided in this embodiment of the present invention have the following beneficial effects, including:
[0052] The wafer test probe 100 provided in this embodiment of the invention has a first groove 121 on its surface, a second groove 122 on its side, and a third groove 123 connecting multiple first grooves 121, resulting in excellent heat dissipation performance. It is particularly suitable for high-temperature testing or long-term testing, effectively mitigating probe thermal deformation and improving testing accuracy and reliability. It also prevents wafer surface damage that could reduce yield. Furthermore, this wafer test probe 100 has good ventilation, a large heat dissipation area, is lightweight, and is convenient for testing.
[0053] The testing equipment provided in this embodiment of the present invention includes the wafer test probe 100 described above, which can reduce the thermal deformation of the probe during high-temperature testing or long-term testing, improve the testing accuracy and reliability, and prevent the probe from scratching the wafer surface after deformation.
[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.
Claims
1. A wafer testing probe, characterized in that, Including the probe body; The probe body includes a first surface, a first side surface, a second surface, and a second side surface connected end to end; the first surface and the second surface are arranged opposite to each other, and the first side surface and the second side surface are arranged opposite to each other; The first surface and / or the second surface are provided with a plurality of first grooves; The first side and / or the second side are provided with a second groove; The probe body is provided with a third groove that connects to multiple first grooves, and the multiple third grooves are staggered.
2. The wafer test probe according to claim 1, characterized in that, The first side surface is provided with a plurality of second grooves, which are evenly spaced apart; And / or, the second side is provided with a plurality of second grooves, the plurality of second grooves being evenly spaced.
3. The wafer test probe according to claim 1, characterized in that, Multiple first grooves are spaced apart along a first direction; at least one third groove is provided between two adjacent first grooves; the direction in which the third groove is located is at an angle to the first direction.
4. The wafer test probe according to claim 3, characterized in that, The width of the first groove in the first direction is greater than or equal to the width of the second groove in the first direction.
5. The wafer test probe according to claim 1, characterized in that, The third groove is a through groove that penetrates both the first surface and the second surface.
6. The wafer test probe according to claim 1, characterized in that, The second groove is provided correspondingly to the first groove, and the first groove and the second groove are connected.
7. The wafer test probe according to claim 1, characterized in that, The second groove and the first groove are misaligned.
8. The wafer test probe according to claim 1, characterized in that, The cross-section of the third groove is rectangular or elliptical.
9. The wafer test probe according to any one of claims 1 to 8, characterized in that, The probe body includes a connection end and a test end arranged opposite to each other. The connection end is used to connect to a test instrument, and the test end is used to connect to a wafer pad. The end face of the test end is set at an acute angle to a first direction. The first direction is the direction from the test end to the connection end.
10. A testing device, characterized in that, It includes a testing instrument and a wafer test probe according to any one of claims 1 to 9, wherein the testing instrument and the wafer test probe are connected.