Direct type backlight lamp panel

Abstract

The embodiment of the utility model belongs to the technical field of backlight lamp panels. The utility model further relates to a direct type backlight lamp panel which comprises a circuit board, a plurality of lamp beads are arranged on one face of the circuit board, a heat conduction connecting piece is connected to the face, away from the lamp beads, of the circuit board, the heat conduction connecting piece is connected with a heat dissipation plate, and a plurality of heat dissipation fins are arranged on the face, away from the heat conduction connecting piece, of the heat dissipation plate. The heat conduction connecting piece is used for transmitting heat generated during operation of the circuit board to the heat dissipation plate and the heat dissipation fins so as to achieve heat dissipation during operation of the circuit board. According to the direct type backlight lamp panel, the heat dissipation plate and the heat dissipation fins are arranged, heat on the circuit board is transmitted to the heat dissipation plate and the heat dissipation fins through the heat conduction connecting piece and dissipated to the outside through the heat dissipation plate and the heat dissipation fins, the heat dissipation efficiency is improved, the heat dissipation problem of the direct type backlight lamp panel is effectively solved, the stability of the lamp panel is improved, and the service life of the lamp panel is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of backlight panel technology, and more specifically, to a direct-lit backlight panel. Background Technology

[0002] Local dimming backlighting can significantly improve the contrast of a display screen and save energy, making it widely used in many consumer and automotive electronics. However, when displaying bright white images, all backlights need to be turned on. This direct-lit backlighting provides high brightness, ensuring readability even in sunlight, but it also introduces other problems, such as excessive heat, which can easily cause various malfunctions in electronic products. Therefore, we have proposed an improvement: a direct-lit backlight panel. Utility Model Content

[0003] The technical problem to be solved by this utility model embodiment is that direct-lit backlights can provide high brightness, but there is a problem that the temperature is too high, causing electronic products to malfunction.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A direct-lit backlight panel includes a circuit board. A plurality of LEDs are disposed on one side of the circuit board. A thermally conductive connector is connected to the side of the circuit board away from the LEDs. A heat sink is connected to the thermally conductive connector. A plurality of heat dissipation fins are disposed on the side of the heat sink away from the thermally conductive connector. The thermally conductive connector is used to transfer the heat generated by the circuit board during operation to the heat sink and the heat dissipation fins, thereby achieving heat dissipation during circuit board operation. The heat on the circuit board is transferred to the heat sink and the heat dissipation fins through the thermally conductive connector, and then dissipated to the outside by the heat sink and the heat dissipation fins, improving heat dissipation efficiency.

[0006] As an improvement of this utility model, a number of the LED beads are arranged in a matrix on the circuit board.

[0007] As an improvement of this utility model, the thermally conductive connector is a silicone grease thermal adhesive, which is connected between the circuit board and the heat sink.

[0008] As an improvement of this utility model, the side of the heat sink away from the heat sink fins is provided with a plastic frame, and the thermal grease is located inside the plastic frame.

[0009] As an improvement of this utility model, the substrate of the circuit board is a ceramic substrate or a glass substrate.

[0010] As an improvement of this utility model, a light guide plate is provided between the sides of several of the lamp beads that are away from the circuit board.

[0011] As an improvement of this utility model, a lower diffusion film is connected to the side of the light guide plate away from the lamp beads, and a functional film layer is provided on the side of the lower diffusion film away from the light guide plate.

[0012] As an improvement of this utility model, the functional film layer includes a prism sheet, which is connected to the side of the lower diffusion film away from the light guide plate.

[0013] As an improvement of this utility model, the functional film layer further includes an upper diffusion film, which is connected to the side of the prism sheet away from the lower diffusion film.

[0014] As an improvement of this utility model, the functional film layer further includes a brightness enhancement film, which is connected to the side of the upper diffusion film away from the prism sheet.

[0015] Compared with the prior art, the embodiments of this utility model have the following main advantages:

[0016] To address the issue that while direct-lit backlighting in existing technologies can provide high brightness, excessive heat can lead to electronic product malfunctions, this application addresses this problem by incorporating a heat sink and heat dissipation fins. Heat from the circuit board is transferred to the heat sink and fins via thermally conductive connectors, and then dissipated to the outside by the heat sink and fins. This improves heat dissipation efficiency, effectively solves the heat dissipation problem of direct-lit backlight boards, enhances the stability and lifespan of the backlight board, and provides strong support for the stable operation of the display screen in high-brightness mode. Attached Figure Description

[0017] Figure 1 A schematic diagram of the direct-lit backlight panel provided in this application;

[0018] Figure 2 Exploded view of the direct-lit backlight panel provided in this application;

[0019] Figure 3 A bottom view of the direct-lit backlight panel provided in this application;

[0020] Figure 4 A partial side view of the direct-lit backlight panel provided in this application.

[0021] The image shows:

[0022] 1. Circuit board; 101. LED beads; 2. Thermal grease; 3. Heat sink; 301. Heat sink fins; 4. Light guide plate; 5. Lower diffuser film; 501. Prism sheet; 502. Upper diffuser film; 503. Brightness enhancement film; 6. Frame. Detailed Implementation

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The reference herein to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] As described in the background section, local dimming backlighting can significantly improve the contrast of a display screen and save energy, and is used in many consumer electronics and automotive electronics. However, if a bright white image needs to be displayed, all backlights need to be turned on. This direct-lit backlight can provide very high brightness, making the display screen readable even in sunlight, but it also brings some other problems, such as excessively high temperature, which can easily cause various malfunctions in many electronic products.

[0025] To solve this technical problem, this utility model provides a direct-lit backlight panel.

[0026] For details, please refer to Figures 1-4 The direct-lit backlight panel specifically includes:

[0027] Circuit board 1, one side of circuit board 1 is provided with a number of LED beads 101, the side of circuit board 1 away from LED beads 101 is connected to a heat-conducting connector, the heat-conducting connector is connected to a heat sink 3, the side of heat sink 3 away from the heat-conducting connector is provided with a number of heat dissipation fins 301, the heat-conducting connector is used to transfer the heat generated by circuit board 1 during operation to heat sink 3 and heat dissipation fins 301, so as to realize the heat dissipation of circuit board 1 during operation.

[0028] The direct-lit backlight panel provided by this utility model, through the heat sink 3 and heat sink fins 301, allows heat from the circuit board 1 to be transferred to the heat sink 3 and heat sink fins 301 via a thermally conductive connector, and then dissipated to the outside by the heat sink 3 and heat sink fins 301, thereby improving heat dissipation efficiency, effectively solving the heat dissipation problem of the direct-lit backlight panel, improving the stability and service life of the panel, and also providing a strong guarantee for the stable operation of the display screen in high brightness mode.

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0030] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] Embodiment 1 of the direct-lit backlight panel of this utility model

[0033] Please refer to Figures 1-4 The present invention relates to a direct-lit backlight panel comprising: a circuit board 1, on one side of which are arranged a plurality of LED beads 101; a heat-conducting connector is connected to the side of the circuit board 1 away from the LED beads 101; a heat sink 3 is connected to the heat-conducting connector; and a plurality of heat dissipation fins 301 are arranged on the side of the heat sink 3 away from the heat-conducting connector. The heat-conducting connector is used to transfer the heat generated by the circuit board 1 during operation to the heat sink 3 and the heat dissipation fins 301, thereby dissipating the heat during operation of the circuit board 1. The combination of the heat sink 3 and the heat dissipation fins 301 constitutes a heat dissipation system. The heat dissipation fins 301, through their sheet-like structure, greatly increase the contact area with air, accelerating the heat exchange process between heat and the surrounding air. The heat sink 3, as a bridge for heat conduction, can disperse the heat on the circuit board 1 to the various heat sinks. The thermal conductivity of the fins 301 and the heat-conducting connectors ensures the transfer of heat from the circuit board 1 to the heat sink 3. This synergistic effect allows the heat generated by the circuit board 1 to be dissipated into the external environment, reducing the accumulation of heat on the circuit board 1. Through effective heat dissipation, this application can operate in a stable temperature environment, thereby extending the service life of the LED bead 101 and the entire circuit board 1, and reducing the maintenance and replacement costs caused by overheating. For the display screen, especially in high brightness mode, the LED bead 101 generates more heat. A good heat dissipation system ensures that the display screen can continuously and stably output high-quality images, reducing display abnormalities such as image flicker, color distortion, and local dark spots caused by overheating of the circuit board 1, and providing users with a clear, smooth, and interference-free visual experience.

[0034] Furthermore, several LED beads 101 are arranged in a matrix on the circuit board 1. From an optical perspective, this uniform distribution allows light to be emitted relatively evenly in all directions. The light emitted by each LED bead 101 can complement and blend with the light of adjacent LED beads 101, reducing the occurrence of areas with excessively strong or weak light caused by uneven distribution of LED beads 101. In terms of display effect, this means that the brightness uniformity of the image is greatly improved. Whether in the center area or the corners of the screen, users can feel a consistent brightness level without obvious differences in brightness.

[0035] Furthermore, such as Figure 2 and Figure 4 As shown, the thermally conductive connector is silicone grease 2, which connects the circuit board 1 and the heat sink 3. Silicone grease 2 possesses unique physical and chemical properties, and its microstructure exhibits the ability to fill tiny gaps. Even after precision machining, some microscopic unevenness and gaps inevitably exist between the circuit board 1 and the heat sink 3. Silicone grease 2 perfectly fills these gaps, forming a heat conduction channel between the circuit board 1 and the heat sink 3. Compared to air, silicone grease 2 has a much higher thermal conductivity, which greatly reduces the thermal resistance during heat transfer. Heat can be conducted from the circuit board 1 to the heat sink 3 at a faster rate through silicone grease 2, without heat accumulation or retention at the interface. This not only maximizes heat dissipation efficiency but also significantly improves the stability and reliability of the entire heat dissipation system. During long-term use, silicone grease 2 maintains its excellent thermal conductivity and will not fail or degrade due to temperature changes, vibration, or other factors.

[0036] Furthermore, such as Figure 2 As shown, a frame 6 is provided on the side of the heat sink 3 away from the heat sink fins 301, and the thermal paste 2 is located inside the frame 6. The frame 6 provides a stable space for the thermal paste 2, ensuring that the thermal paste 2 is kept in the ideal position and can continuously and stably perform its heat conduction function. Secondly, the frame 6 can also play a certain sealing role, reducing the entry of external dust, moisture and other impurities into the area between the heat sink 3 and the circuit board 1, reducing the risk of failure and damage caused by environmental factors, and improving the reliability and stability of the product.

[0037] Furthermore, the substrate of circuit board 1 is a ceramic substrate or a glass substrate. Ceramic substrates and glass substrates have excellent heat dissipation effects and can effectively conduct the heat generated by the LED bead 101 to the heat sink 3, thereby improving the heat dissipation effect.

[0038] Embodiment 2 of the direct-lit backlight panel of this utility model

[0039] Further, this utility model of a direct-lit backlight panel, such as... Figure 4As shown, a light guide plate 4 is disposed between the sides of several LED beads 101 away from the circuit board 1. The light guide plate 4 utilizes the principles of light refraction and total internal reflection to effectively guide and redistribute the light emitted by the LED beads 101. After entering the light guide plate 4, the light emitted by the LED beads 101 undergoes multiple refractions and reflections inside the light guide plate 4, making the originally diffuse and disordered light gradually more orderly and uniform. The light guide plate 4 can concentrate the light within a specific angle range and distribute it evenly on the entire light-emitting surface of the light guide plate 4. This greatly improves the uniformity of the backlight board's light output and effectively reduces the light spots or dark areas caused by the direct emission of light from the LED beads 101. In display screen applications, uniform backlighting can make the brightness of the displayed image more consistent and the colors more vivid and realistic.

[0040] Furthermore, such as Figure 4 As shown, a lower diffusion film 5 is connected to the side of the light guide plate 4 away from the lamp bead 101. A functional film layer is provided on the side of the lower diffusion film 5 away from the light guide plate 4. The lower diffusion film 5 plays a role in further optimizing the light distribution. It can diffuse the light emitted from the light guide plate 4 again, and disperse the light more finely in the horizontal direction, so that the light distribution in the horizontal direction is more uniform and softer.

[0041] Furthermore, such as Figure 4 As shown, the functional film layer includes a prism sheet 501, which is connected to the side of the lower diffuser film 5 away from the light guide plate 4. The prism sheet 501 can refract and reflect light in a specific direction. When light shines on the prism sheet 501, it will concentrate the light within a specific angle range according to the angle and shape of the prism sheet 501, usually towards the front of the display screen. In this way, the light that might have been scattered in other directions is effectively collected and guided to the front of the display screen, which greatly improves the utilization rate of light and the amount of light emitted from the front.

[0042] Furthermore, such as Figure 4 As shown, the functional film layer also includes an upper diffusion film 502, which is connected to the side of the prism sheet 501 away from the lower diffusion film 5. The upper diffusion film 502 plays a role in further optimizing the uniformity and softness of light in the optical structure. After the light is refracted and reflected by the prism sheet 501, although the brightness is improved, the light may become relatively concentrated and harsh. The upper diffusion film 502 can diffuse the light again, and evenly disperse the light after it has been processed by the prism sheet 501 over a larger range, further eliminating the slight light unevenness that may be caused by the prism sheet 501, making the light softer. In terms of visual effect, this makes the image on the display screen look more comfortable and natural, and reduces the glare and visual fatigue caused by the excessive concentration of light.

[0043] Furthermore, such as Figure 4 As shown, the functional film layer also includes a brightness enhancement film 503. The brightness enhancement film 503 is connected to the side of the upper diffusion film 502 away from the prism sheet 501. The main function of the brightness enhancement film 503 is to improve the overall light output efficiency of the display screen. Through a special optical design, it can reflect some of the side or back light back to the front, thereby increasing the amount of light output from the front.

[0044] Embodiment 3 of the direct-lit backlight panel of this utility model

[0045] Furthermore, in this utility model of a direct-lit backlight panel, carbon circuitry is fabricated on a ceramic substrate or a glass substrate, and the fabrication method can be screen printing, transfer printing, etc.

[0046] A substrate with carbon-printed circuitry is immersed in a copper solution, where the carbon adsorbs copper ions to form copper circuitry.

[0047] Alternatively, copper circuits can be formed by electroplating, where an anode is connected to a copper block and a cathode is connected to a carbon circuit.

[0048] The LED 101 is mounted on the substrate using SMT on the copper circuit;

[0049] Bond FPCs or chips onto a substrate;

[0050] The substrate is attached to the heat sink 3 using thermal grease 2, and then the light guide plate 4, the lower diffusion film 5, the prism sheet 501, the upper diffusion film 502, and the brightness enhancement film 503 are sequentially arranged.

[0051] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A direct-lit backlight panel, characterized in that, The circuit board (1) includes a circuit board (1) with a plurality of LED beads (101) on one side. A heat-conducting connector is connected to the side of the circuit board (1) away from the LED beads (101). A heat sink (3) is connected to the heat sink (3). A plurality of heat sink fins (301) are provided on the side of the heat sink (3) away from the heat-conducting connector. The heat-conducting connector is used to transfer the heat generated by the circuit board (1) during operation to the heat sink (3) and the heat sink fins (301) so as to dissipate the heat during the operation of the circuit board (1). Several of the aforementioned LED beads (101) are arranged in a matrix on the circuit board (1); The thermally conductive connector is a silicone grease thermal paste (2), which is connected between the circuit board (1) and the heat sink (3); The heat sink (3) has a frame (6) on the side away from the heat sink fins (301), and the thermal paste (2) is located inside the frame (6); The substrate of the circuit board (1) is a ceramic substrate or a glass substrate.

2. The direct-lit backlight panel according to claim 1, characterized in that, A light guide plate (4) is provided between the sides of several of the lamp beads (101) away from the circuit board (1).

3. The direct-lit backlight panel according to claim 2, characterized in that, The side of the light guide plate (4) away from the lamp bead (101) is connected to a lower diffusion film (5), and the side of the lower diffusion film (5) away from the light guide plate (4) is provided with a functional film layer.

4. The direct-lit backlight panel according to claim 3, characterized in that, The functional film layer includes a prism sheet (501) which is connected to the side of the lower diffusion film (5) away from the light guide plate (4).

5. The direct-lit backlight panel according to claim 4, characterized in that, The functional film layer also includes an upper diffusion film (502), which is connected to the side of the prism sheet (501) away from the lower diffusion film (5).

6. The direct-lit backlight panel according to claim 5, characterized in that, The functional film layer also includes a brightness enhancement film (503), which is attached to the side of the upper diffusion film (502) away from the prism sheet (501).

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