Notebook computer

Abstract

The utility model relates to a notebook computer. The notebook computer comprises a first computer main body; the first computer main body comprises a first shell part, a heat dissipation system and a computer main board with a heat source concentration area; a first cold air grid hole, a plurality of heat extraction grid holes and a pair of second cold air grid holes are formed in the first shell part; the heat dissipation system comprises a first fan assembly and a pair of second fan assemblies. The first fan assembly is provided with a first air inlet and a first air outlet; the second fan assembly is provided with a second air inlet, a second air outlet and a third air outlet; the first fan assembly and the third air outlets of the pair of second fan assemblies surround a heat source concentration area so that cold airflow can be blown to the heat source concentration area from the first air outlets and the third air outlets. According to the notebook computer, through the design that the first fan assembly and the pair of second fan assemblies are additionally arranged, the heat dissipation efficiency of the notebook computer can be effectively improved, the stable and efficient performance of the notebook computer can be improved, and the overall noise can be effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of laptop computer technology, and in particular to a laptop computer with a multi-fan cooling system. Background Technology

[0002] Laptops are widely used due to their portability, and are especially suitable for users who travel frequently or find it inconvenient to use a desktop computer.

[0003] As laptops continue to pursue ultimate performance, especially gaming laptops, the chips or electronic components in the laptop (which can also be understood as the motherboard) generate a lot of heat. This causes the surface of the laptop's first casing to reach a high temperature, and the heat can also accumulate inside the first casing, reducing chip performance and thus lowering the user's experience.

[0004] Currently, the main challenge for laptops is how to improve their heat dissipation capacity or efficiency to enhance the user experience (improving the user experience can include reducing noise during heat dissipation, lowering the temperature of the laptop's primary casing components, and enhancing the laptop's stable and efficient performance).

[0005] In the prior art, traditional laptops use a dual-fan cooling system, and the dual-fan cooling system adopts a four-vent cooling method; two of the four vents exhaust air from the rear of the first housing component, while the other two vents exhaust air from the left and right sides of the first housing component.

[0006] In conclusion, traditional laptops still have some shortcomings:

[0007] (1) The air vents on the left and right sides of traditional laptops are far from the heat source concentration area and are limited by the space inside the first shell component, resulting in a small heat dissipation area of ​​the heat dissipation fins located on the rear side of the first shell component, which leads to poor heat dissipation efficiency of traditional laptops.

[0008] (2) Traditional laptops need to open holes on the left and right sides of the first shell component for heat dissipation. Since the fan is the main noise source of traditional laptops, opening holes on the left and right sides of the first shell component will cause traditional laptops to generate higher noise levels under the same heat dissipation solution and the same fan speed.

[0009] (3) Since there is no air flow in the heat source concentration area of ​​a traditional laptop, the surface temperature of the first shell component corresponding to the heat source concentration area is high, thereby reducing the user experience. Utility Model Content

[0010] The laptop computer provided by this utility model is intended to solve at least some of the defects of existing laptop computers.

[0011] This utility model embodiment provides a laptop computer. The laptop computer includes:

[0012] A first computer body; the first computer body includes a first housing component, a heat dissipation system, and a computer motherboard with a concentrated heat source area; the computer motherboard and the heat dissipation system are both housed inside the first housing component;

[0013] The first housing component is provided with a first cold air grille, a plurality of heat dissipation grilles, and a pair of second cold air grilles; the computer motherboard is provided with a pair of clearance areas, and the pair of clearance areas corresponds to the pair of second cold air grilles.

[0014] The heat dissipation system includes a first fan assembly, a heat pipe, a pair of heat sinks, and a pair of second fan assemblies; the first fan assembly has a first air inlet and a first air outlet; the second fan assembly has a second air inlet, a second air outlet, and a third air outlet.

[0015] The first fan assembly is mounted on the side of the computer motherboard away from the heat dissipation grille, and a pair of second fan assemblies are mounted in a pair of the air-proof areas. At this time, the third air outlets of the first fan assembly and the pair of second fan assemblies surround the heat source concentration area.

[0016] A first cold airflow flows from the first cold air grille to the first air inlet, and flows into the heat source concentration area through the first air outlet to form a first hot airflow; the pair of heat sinks correspond to the second air outlets of the pair of second fan assemblies; the two ends of the heat pipe are respectively connected to the pair of heat sinks, and at least a portion of the heat pipe is disposed in the heat source concentration area;

[0017] The second cold airflow flows from the second cold air grille to the second air inlet, and then flows into the interior of the second fan assembly from the second air inlet; a portion of the second cold airflow flows to the radiator through the second air outlet to form a second hot airflow; another portion of the second cold airflow flows into the heat source concentration area through the third air outlet to form a third hot airflow.

[0018] The first hot airflow, the second hot airflow, and the third hot airflow all flow to the outside of the first housing through a plurality of heat exhaust grid holes.

[0019] In some embodiments, the laptop computer further includes:

[0020] The second computer body includes at least a second housing component and a display screen; the second housing component is used to support and fix the display screen, and the display screen is oriented towards the first computer body;

[0021] The second computer body is connected to the first computer body, and the second computer body can rotate relative to the first computer body.

[0022] In some embodiments, the first housing component includes:

[0023] Keyboard housing; a plurality of the aforementioned heat dissipation grilles are formed on the keyboard housing and located on the side where the first computer body and the second computer body are connected;

[0024] A bottom shell and feet; the bottom shell covers the keyboard housing to enclose and form a receiving space; the feet are disposed on the outer surface of the bottom shell, and the outer surface of the bottom shell is located outside the receiving space.

[0025] In some embodiments, the first cold air grille hole and a pair of second cold air grille holes are both formed on the bottom shell and penetrate the outer surface and inner surface of the bottom shell, and are connected to the receiving space;

[0026] The inner surface of the bottom shell is located inside the receiving space and is away from the foot pad.

[0027] In some embodiments, the computer motherboard includes at least:

[0028] Substrate; a pair of the aforementioned clearance regions are symmetrically formed on both sides of the substrate;

[0029] A plurality of electronic components; all of the plurality of electronic components are disposed on the substrate, and at least a portion of the plurality of electronic components are arranged in the heat source concentration area.

[0030] In some embodiments, the heat dissipation system further includes:

[0031] A fixed bracket; the fixed bracket has a through hole and is disposed in the heat source concentration area, whereby the through hole can expose at least one electronic component arranged in the heat source concentration area;

[0032] A heat-conducting plate; the heat-conducting plate is embedded in the through hole and abuts against the electronic components exposed by the through hole; at least a portion of the heat pipe can abut against the heat-conducting plate.

[0033] In some embodiments, a positioning mounting post is provided on the substrate; the first fan assembly includes:

[0034] First fan body; the first fan body is fixed on the positioning and mounting post, and at this time there is a preset target distance between the first fan body and the substrate;

[0035] A first sealing portion is disposed on the first fan body to fill the gap between the first fan body and the inner surface of the bottom shell, and to fill the gap between the first fan body and the substrate.

[0036] In some embodiments, the second fan assembly includes:

[0037] A second fan body and a second sealing part; the second fan body is disposed in the clearance area; the second sealing part is disposed on the second fan body to fill the gap between the second fan body and the inner surface of the bottom shell, and to fill the gap between the second fan body and the substrate.

[0038] In some embodiments, the first sealing portion and the second sealing portion enclose a closed heat source concentration area, and both the first fan body and the second fan body are located outside the heat source concentration area.

[0039] In some embodiments, a plurality of the heat dissipation grid holes may form a first group of heat dissipation grid holes and a pair of second group of heat dissipation grid holes;

[0040] The first hot air stream and the third hot air stream can be discharged through the first heat dissipation grid hole group;

[0041] A pair of second heat exchanger holes corresponds to a pair of heat sinks, and the second hot airflow can be discharged through the pair of second heat exchanger holes.

[0042] At least one beneficial effect of the laptop computer provided by this utility model embodiment is that it proposes a novel laptop computer with a multi-fan cooling system. By adding a first fan assembly and a pair of second fan assemblies, airflow is made in the area where the heat source is concentrated, which is more conducive to the dissipation of heat in the area where the heat source is concentrated. This reduces the surface temperature of the first shell component and the heat of the computer motherboard, thereby effectively improving the heat dissipation efficiency of the laptop computer and improving its stable and efficient performance. In addition, since the laptop computer does not have heat dissipation holes on the left and right sides of the first shell component, the overall noise of the laptop computer can be effectively reduced. Attached Figure Description

[0043] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0044] Figure 1 A schematic diagram of the structure of a laptop computer provided for an embodiment of this utility model (I);

[0045] Figure 2 A schematic diagram (II) of the structure of a laptop computer provided for an embodiment of this utility model;

[0046] Figure 3 A schematic diagram of the structure of the first computer body provided in this embodiment of the present utility model, excluding the bottom shell;

[0047] Figure 4 A schematic diagram of airflow in the first computer body provided in an embodiment of this utility model;

[0048] Figure 5 An exploded view of the heat dissipation system and computer motherboard provided in an embodiment of this utility model;

[0049] Figure 6 This is a schematic diagram of the structure of the first fan assembly and the second fan assembly provided in an embodiment of the present utility model.

[0050] Reference numerals: 100, notebook computer; 1001, first cold airflow; 1002, second cold airflow; 1003, a portion of the second cold airflow; 1004, another portion of the second cold airflow; 1005, first hot airflow; 1006, second hot airflow; 1007, third hot airflow; 1, first computer body; 11, first casing component; 12, cooling system; 13, computer motherboard; 111, keyboard casing; 112, bottom casing; 113, feet; 121, first fan assembly; 122, heat pipe; 123, radiator; 124, second fan assembly; 125, mounting bracket; 126, heat conduction plate; 131, substrate; 132, electronic component; 1111 1. First row of heat grid holes; 1112. Second row of heat grid holes; 1121. First cold air grid hole; 1122. Second cold air grid hole; 1131. Long strip foot pad; 1132. Short strip foot pad; 1201. First air inlet; 1202. First air outlet; 1203. Second air inlet; 1204. Second air outlet; 1205. Third air outlet; 1211. First fan body; 1212. First sealing part; 1241. Second fan body; 1242. Second sealing part; 1251. Through hole; 1301. Heat source concentration area; 1311. Clearance area; 1312. Positioning and mounting post; 2. Second computer body; 21. Second shell component; 22. Display screen. Detailed Implementation

[0051] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "bottom," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0052] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0053] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0054] Figure 1 A schematic diagram of the structure of a laptop computer provided for an embodiment of this utility model (I). Figure 2 A schematic diagram (II) of the structure of a laptop computer provided for an embodiment of this utility model. Figure 3 A schematic diagram of the structure of the first computer body provided in this embodiment of the present utility model, excluding the bottom shell. Figure 4 A schematic diagram of airflow in the first computer body provided for an embodiment of this utility model. Figure 5 This is an exploded view of the heat dissipation system and computer motherboard provided in an embodiment of the present invention. Figure 6 This is a schematic diagram of the structure of the first fan assembly and the second fan assembly provided in an embodiment of the present utility model.

[0055] Please see Figures 1-6 The laptop computer 100 includes: a first computer body 1.

[0056] The first computer body 1 can be understood as a laptop with a C shell and a D shell; the C shell refers to the keyboard part of the laptop, and includes at least the keyboard area and the touchpad area; the D shell refers to the bottom shell of the laptop, that is, the side that contacts the desktop; the D shell usually contains various heat dissipation holes and screw holes for fixing internal hardware; in addition, the heat dissipation hole design on the D shell is crucial for maintaining the temperature stability inside the laptop.

[0057] Specifically, the first computer body 1 includes a first casing component 11, a heat dissipation system 12, and a computer motherboard 13 with a heat source concentration area 1301.

[0058] The computer motherboard 13 and the heat dissipation system 12 are both housed inside the first housing component 11.

[0059] In addition, the first housing component 11 is provided with a first cold air grille 1121, a number of heat dissipation grilles and a pair of second cold air grilles 1122; the computer motherboard 13 is provided with a pair of clearance areas 1311, and the pair of clearance areas 1311 correspond to the pair of second cold air grilles 1122.

[0060] In addition, the heat dissipation system 12 includes a first fan assembly 121, a heat pipe 122, a pair of heat sinks 123 and a pair of second fan assemblies 124; the first fan assembly 121 has a first air inlet 1201 and a first air outlet 1202; the second fan assembly 124 has a second air inlet 1203, a second air outlet 1204 and a third air outlet 1205.

[0061] It should be noted that the first fan assembly 121 is mounted on the side of the computer motherboard 13 away from the heat dissipation grille, and a pair of second fan assemblies 124 are installed in a pair of air-relief areas 1311. At this time, the third air outlet 1205 of the first fan assembly 121 and the pair of second fan assemblies 124 surrounds the heat source concentration area 1301.

[0062] It is understood that the first cold airflow 1001 flows from the first cold air grille hole 1121 to the first air inlet 1201, and flows into the heat source concentration area 1301 through the first air outlet 1202 to form the first hot airflow 1005; the second air outlet 1204 of the pair of heat sinks 123 corresponds to the pair of second fan assemblies 124; the two ends of the heat pipe 122 are respectively connected to the pair of heat sinks 123, and at least a portion of the heat pipe 122 is disposed in the heat source concentration area 1301.

[0063] To further explain, the second cold airflow 1002 flows from the second cold air grille hole 1122 to the second air inlet 1203, and then flows into the interior of the second fan assembly 124 from the second air inlet 1203; a portion of the second cold airflow 1003 flows to the radiator 123 through the second air outlet 1204 to form the second hot airflow 1006; another portion of the second cold airflow 1004 flows into the heat source concentration area 1301 through the third air outlet 1205 to form the third hot airflow 1007.

[0064] In this embodiment, the first hot air flow 1005, the second hot air flow 1006, and the third hot air flow 1007 all flow to the outside of the first housing through a plurality of heat exhaust grid holes.

[0065] Traditional laptops employ a dual-fan cooling system, which includes two traditional heat pipes, a pair of traditional fans, and two pairs of traditional heat sinks. Each traditional fan has a first and a second exhaust vent. The two pairs of heat sinks are respectively positioned at the first and second exhaust vents of the pair of traditional fans. Furthermore, one end of one of the two heat pipes is connected to one of the pair of heat sinks located at the first exhaust vent of the pair of traditional fans; and the other end of the other heat pipe is connected to another pair of heat sinks located at the second exhaust vent of the pair of traditional fans. The heat concentrated in the traditional heat source area of ​​a traditional laptop is primarily conducted to the heat sinks via the heat pipes, and then the pair of traditional fans draws in cool air to directly remove the heat concentrated in the heat sinks.

[0066] In a traditional laptop, the first traditional air outlet is the same as the second air outlet 1204 of the laptop 100, while the second traditional air outlet is different from the third air outlet 1205 of the laptop 100. The second traditional air outlet blows outward away from the traditional heat source concentration area, while the third air outlet 1205 of the laptop 100 blows inward towards the heat source concentration area 1301. This causes airflow within the heat source concentration area 1301 of the laptop 100, thereby increasing the heat dissipation efficiency of the laptop 100.

[0067] The first fan assembly 121 in this notebook computer 100 can be used to further increase the total airflow into the heat source concentration area 1301, which can effectively expand the coverage of the heat source concentration area 1301 by the cold airflow, thereby taking care of the heat source positions that cannot be covered by the pair of second fan assemblies 124, and further improving the heat dissipation efficiency of this notebook computer 100.

[0068] In summary, by incorporating a third air vent 1205 and a first air vent 1202, this laptop 100 allows airflow within the heat source concentration area 1301. This effectively prevents heat concentration within the heat source concentration area 1301, thus avoiding the risk of performance degradation of the motherboard 13 due to excessive heat. Furthermore, preventing heat concentration in the heat source concentration area 1301 also reduces the surface temperature of the first casing component 11 at the location corresponding to the heat source concentration area 1301. In further explanation, compared to traditional laptops, this laptop 100 enhances the user experience.

[0069] In some embodiments, such as Figure 1 and Figure 2 As shown, the laptop 100 also includes a second computer body 2.

[0070] The second computer body 2 can be understood as the part of the laptop with an A shell and a B shell; the A shell refers to the top surface of the laptop when it is closed, which is the back of the screen; the A shell usually has the manufacturer's brand logo printed on it; the B shell refers to the bezel part of the laptop that supports the screen.

[0071] Specifically, the second computer body 2 includes at least a second housing component 21 and a display screen 22; the second housing component 21 is used to support and fix the display screen 22, and the display screen 22 is positioned facing the first computer body 1.

[0072] It should be noted that the second computer body 2 is connected to the first computer body 1, and the second computer body 2 can rotate relative to the first computer body 1.

[0073] In some embodiments, combined with Figures 1-4 It is known that the first housing component 11 includes: keyboard housing 111, bottom housing 112 and feet 113.

[0074] The keyboard housing 111 is the aforementioned C-shell, and the bottom housing 112 is the aforementioned D-shell; the feet 113 include a long strip foot 1131 disposed on the rear side of the bottom housing 112 (the rear side is the side where the first computer body 1 and the second computer body 2 are connected) and a short strip foot 1132 disposed on the front side of the bottom housing 112 (the front side is the side opposite to the rear side).

[0075] The elongated foot pads can separate the heat dissipation area (the heat dissipation area is the corresponding area where the first hot airflow 1005, the second hot airflow 1006, and the third hot airflow 1007 are discharged to the outside of the first housing component 11) from the cold air area (the cold air area is the corresponding area where the first cold airflow 1001 and the second cold airflow 1002 are drawn into the first fan assembly 121 and the second fan assembly 124) to prevent the dissipated heat from rapidly returning to the cold air area and being carried into the heat source concentration area 1301 by the first fan assembly 121 and the second fan assembly 124, thereby forming a harmful cycle of temperature superposition.

[0076] Several heat dissipation grilles are formed on the keyboard housing 111 and located on the side where the first computer body 1 and the second computer body 2 are connected; in other words, several heat dissipation grilles are formed on the rear side of the first housing component 11.

[0077] In addition, the bottom shell 112 covers the keyboard shell 111 to enclose and form a receiving space; the feet 113 are provided on the outer surface of the bottom shell 112, and the outer surface of the bottom shell 112 is located outside the receiving space.

[0078] In some embodiments, according to Figure 1 and Figure 2It is known that the first cold air grille hole 1121 and the pair of second cold air grille holes 1122 are both opened on the bottom shell 112, and penetrate through the outer surface and the inner surface of the bottom shell 112, and are connected to the accommodating space; in other words, the first cold air grille hole 1121 and the pair of second cold air grille holes 1122 are both opened at the bottom of the first shell component 11.

[0079] Understandably, the inner surface of the bottom shell 112 is located inside the receiving space and away from the foot pad 113.

[0080] In some embodiments, refer to Figures 3-6 It can be seen that the computer motherboard 13 includes at least: a substrate 131 and several electronic components 132.

[0081] In this embodiment, a pair of clearance regions 1311 are symmetrically formed on both sides of the substrate 131.

[0082] To further explain, a number of electronic components 132 are disposed on the substrate 131, and at least a portion of the electronic components 132 are arranged within the heat source concentration area 1301.

[0083] In some embodiments, please continue reading Figures 3-6 The heat dissipation system 12 also includes: a fixed bracket 125 and a heat-conducting plate 126.

[0084] The fixed bracket 125 has a through hole 1251 and is located in the heat source concentration area 1301. At this time, the through hole 1251 can expose at least one electronic component 132 arranged in the heat source concentration area 1301.

[0085] In addition, the heat-conducting plate 126 is embedded in the through hole 1251 and abuts against the electronic component 132 exposed by the through hole 1251; at least a portion of the heat pipe 122 can abut against the heat-conducting plate 126.

[0086] The heat-conducting plate can be made of a material with good thermal conductivity, such as copper. Using a material with good thermal conductivity allows the heat-conducting plate to transfer heat to the heat pipe more effectively.

[0087] In some embodiments, such as Figures 3-6 As shown, a positioning mounting post 1312 is provided on the substrate 131.

[0088] Specifically, the first fan assembly 121 includes a first fan body 1211 and a first sealing part 1212.

[0089] It is understandable that the first fan body 1211 is fixed on the positioning mounting post 1312, and at this time there is a preset target distance between the first fan body 1211 and the substrate 131.

[0090] It should be noted that the first sealing part 1212 is disposed on the first fan body 1211 to fill the gap between the first fan body 1211 and the inner surface of the bottom shell 112, and to fill the gap between the first fan body 1211 and the substrate 131.

[0091] In order to avoid further encroaching on the limited area on the computer motherboard 13 used for arranging electronic components, the first fan body 1211 needs to be offset from the CPU (Central Processing Unit), GPU (Graphics Processing Unit), and other electronic components with relatively large dimensions, and placed directly above the front area of ​​the computer motherboard 13 (the front can be understood as the side opposite to the rear side mentioned above). There is a preset target distance between the first fan body 1211 and the substrate 131. Specifically, the target distance can be 1.8mm, so that conventional ICs (Integrated Circuits) and resistors / capacitors can be placed normally on the computer motherboard 13, and the computer motherboard 13 does not need to be hollowed out to avoid the first fan body 1211.

[0092] In some embodiments, combined with Figures 3-6 It is known that the second fan assembly 124 includes: a second fan body 1241 and a second sealing part 1242.

[0093] In this embodiment, the second fan body 1241 is disposed in the clearance area 1311; the second sealing part 1242 is disposed on the second fan body 1241 to fill the gap between the second fan body 1241 and the inner surface of the bottom shell 112, and to fill the gap between the second fan body 1241 and the substrate 131.

[0094] A pair of clearance areas 1311 are symmetrically arranged on the left and right sides of the computer motherboard 13 (the left and right sides are the sides on which several USB ports are provided on the first housing component 11). After being hollowed out, space can be made for a pair of second fan bodies 1241. Furthermore, the second fan body 1241 is larger than the first fan body 1211, thus forming a multi-fan cooling system with two large and one small cooling fan.

[0095] In some embodiments, according to Figure 2 and Figure 6 It can be seen that the first sealing part 1212 and the second sealing part 1242 enclose a closed heat source concentration area 1301, and the first fan body 1211 and the second fan body 1241 are both located outside the heat source concentration area 1301.

[0096] Both the first sealing part 1212 and the second sealing part 1242 are compressible spacer materials, so that the inner surfaces of the first fan body 1211, the second fan body 1241, the substrate 131 and the bottom shell 112 enclose a relatively sealed space (the relatively sealed space can be understood as a closed heat source concentration area 1301).

[0097] When the electronic components in the heat source concentration area 1301 are working, they generate a lot of heat. At this time, the heat pipe can conduct a part of the heat in the heat source concentration area 1301 to the heat sink 123. A part of the second cold airflow 1003 can directly carry the heat accumulated on the heat sink 123 to the external environment. The other part of the second cold airflow 1004 and the first cold airflow 1001 can blow all the residual heat in the heat source concentration area 1301 to the external environment. Then, the layout of the first sealing part 1212 and the second sealing part 1242 in the heat source concentration area 1301 can block the heat so that the heat does not spread around in the closed heat source concentration area 1301, thereby preventing the heat from being directly returned to the interior of the first fan body 1211 and the second fan body 1241, and thus preventing the harmful cycle of heat accumulation in the heat source concentration area 1301.

[0098] In some embodiments, refer to Figures 2-6 It can be seen that a number of heat dissipation grid holes can form a first row of heat dissipation grid hole group 1111 and a pair of second row of heat dissipation grid hole groups 1112.

[0099] The first hot air flow 1005 and the third hot air flow 1007 can be discharged through the first row of heat grid holes 1111.

[0100] In addition, a pair of second-row heat grid hole groups 1112 correspond to a pair of heat sinks 123, and the second hot air flow 1006 can be discharged through the pair of second-row heat grid hole groups 1112.

[0101] In summary, the laptop computer provided by this embodiment of the invention, through the addition of a first fan assembly and a pair of second fan assemblies, allows airflow within the heat source concentration area, thereby facilitating heat dissipation and reducing the surface temperature of the first casing component and the heat generated by the motherboard. This effectively improves the laptop's heat dissipation efficiency and enhances its stable and efficient performance. Furthermore, since the laptop computer does not have ventilation holes on the left and right sides of the first casing component, it effectively reduces the overall noise level. Therefore, the laptop computer provided by this embodiment of the invention possesses a certain degree of novelty compared to traditional laptop computers.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it; under the concept of this utility model, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this utility model as described above, which are not provided in detail for the sake of brevity; although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A laptop computer, characterized in that, include: A first computer body; the first computer body includes a first housing component, a heat dissipation system, and a computer motherboard with a concentrated heat source area; the computer motherboard and the heat dissipation system are both housed inside the first housing component; The first housing component is provided with a first cold air grille, a plurality of heat dissipation grilles, and a pair of second cold air grilles; the computer motherboard is provided with a pair of clearance areas, and the pair of clearance areas corresponds to the pair of second cold air grilles. The heat dissipation system includes a first fan assembly, a heat pipe, a pair of heat sinks, and a pair of second fan assemblies; the first fan assembly has a first air inlet and a first air outlet; the second fan assembly has a second air inlet, a second air outlet, and a third air outlet. The first fan assembly is mounted on the side of the computer motherboard away from the heat dissipation grille, and a pair of second fan assemblies are mounted in a pair of the air-proof areas. At this time, the third air outlets of the first fan assembly and the pair of second fan assemblies surround the heat source concentration area. A first cold airflow flows from the first cold air grille to the first air inlet, and flows into the heat source concentration area through the first air outlet to form a first hot airflow; the pair of heat sinks correspond to the second air outlets of the pair of second fan assemblies; the two ends of the heat pipe are respectively connected to the pair of heat sinks, and at least a portion of the heat pipe is disposed in the heat source concentration area; The second cold airflow flows from the second cold air grille to the second air inlet, and then flows into the interior of the second fan assembly from the second air inlet; a portion of the second cold airflow flows to the radiator through the second air outlet to form a second hot airflow; another portion of the second cold airflow flows into the heat source concentration area through the third air outlet to form a third hot airflow. The first hot airflow, the second hot airflow, and the third hot airflow all flow to the outside of the first housing through a plurality of heat exhaust grid holes.

2. The laptop computer according to claim 1, characterized in that, Also includes: The second computer body includes at least a second housing component and a display screen; the second housing component is used to support and fix the display screen, and the display screen is oriented towards the first computer body; The second computer body is connected to the first computer body, and the second computer body can rotate relative to the first computer body.

3. The laptop computer according to claim 2, characterized in that, The first housing component includes: Keyboard housing; a plurality of the aforementioned heat dissipation grilles are formed on the keyboard housing and located on the side where the first computer body and the second computer body are connected; A bottom shell and feet; the bottom shell covers the keyboard housing to enclose and form a receiving space; the feet are disposed on the outer surface of the bottom shell, and the outer surface of the bottom shell is located outside the receiving space.

4. The laptop computer according to claim 3, characterized in that, The first cold air grille hole and a pair of second cold air grille holes are both formed on the bottom shell, and penetrate through the outer surface and the inner surface of the bottom shell, and are connected to the receiving space; The inner surface of the bottom shell is located inside the receiving space and is away from the foot pad.

5. The laptop computer according to claim 4, characterized in that, The computer motherboard includes at least: Substrate; a pair of the aforementioned clearance regions are symmetrically formed on both sides of the substrate; A plurality of electronic components; all of the plurality of electronic components are disposed on the substrate, and at least a portion of the plurality of electronic components are arranged in the heat source concentration area.

6. The laptop computer according to claim 5, characterized in that, The heat dissipation system also includes: A fixed bracket; the fixed bracket has a through hole and is disposed in the heat source concentration area, whereby the through hole can expose at least one electronic component arranged in the heat source concentration area; A heat-conducting plate; the heat-conducting plate is embedded in the through hole and abuts against the electronic components exposed by the through hole; at least a portion of the heat pipe can abut against the heat-conducting plate.

7. The laptop computer according to claim 5, wherein the substrate is provided with positioning mounting posts, characterized in that, The first fan assembly includes: First fan body; the first fan body is fixed on the positioning and mounting post, and at this time there is a preset target distance between the first fan body and the substrate; A first sealing portion is disposed on the first fan body to fill the gap between the first fan body and the inner surface of the bottom shell, and to fill the gap between the first fan body and the substrate.

8. The laptop computer according to claim 7, characterized in that, The second fan assembly includes: A second fan body and a second sealing part; the second fan body is disposed in the clearance area; the second sealing part is disposed on the second fan body to fill the gap between the second fan body and the inner surface of the bottom shell, and to fill the gap between the second fan body and the substrate.

9. The laptop computer according to claim 8, characterized in that, The first sealing part and the second sealing part enclose a closed heat source concentration area, and both the first fan body and the second fan body are located outside the heat source concentration area.

10. The laptop computer according to claim 1, characterized in that, Several of the aforementioned heat dissipation grid holes can form a first row of heat dissipation grid holes and a pair of second row of heat dissipation grid holes; The first hot air stream and the third hot air stream can be discharged through the first heat dissipation grid hole group; A pair of second heat exchanger holes corresponds to a pair of heat sinks, and the second hot airflow can be discharged through the pair of second heat exchanger holes.

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