Computer chip heat dissipation device

Abstract

The utility model discloses a computer chip heat dissipation device, and particularly relates to the technical field of computer chip heat dissipation devices.The computer chip heat dissipation device comprises a main body mechanism, an outer frame mechanism is fixedly installed at the top of the main body mechanism, the outer frame mechanism comprises an installation frame and two sets of heat dissipation fans, and two sets of limiting rods are fixedly installed on the left side and the right side of each heat dissipation fan; and eight groups of limiting grooves are formed in the inner side of the mounting frame. According to the computer chip heat dissipation device, the position of the heat dissipation fan in the mounting frame is limited through the cooperation between the limiting groove and the limiting rod, the heat dissipation fan is fixed in the mounting frame through the cooperation between the locking block and the locking groove, and when the heat dissipation fan needs to be disassembled, only a control button needs to be pressed; the first mounting rod and the U-shaped block overcome the elastic force of the spring to move downwards, the outer walls of the two sets of elastic pieces are extruded, the locking block moves towards the second mounting rod, then the locking block and the locking groove are separated from the locking relation, and the cooling fan can be pulled out from the interior of the mounting frame.

Description

Technical Field

[0001] This utility model relates to the technical field of computer chip heat dissipation devices, specifically a computer chip heat dissipation device. Background Technology

[0002] The field of computer chip heat dissipation technology focuses on solving the thermal management problems of high-performance chips under high load. Through efficient heat conduction, convection, and radiation technologies, the heat generated by the chip is rapidly dissipated into the surrounding environment to maintain a stable operating temperature. This field involves various heat dissipation technologies, including air cooling (such as fans and heat sinks), liquid cooling (such as water cooling blocks and circulating pumps), heat pipe cooling, vapor chamber technology, and phase change material cooling. Combined with intelligent temperature control systems, it achieves precise temperature regulation and energy consumption optimization, and is widely used in high-power electronic devices such as CPUs, GPUs, and AI chips.

[0003] Dual-tower air coolers are a type of computer chip cooling device. Existing dual-tower air coolers typically use four sets of fan mounting clips to fix the fans to the cooling tower. While this meets the usage requirements to some extent, it has been found in actual use that some computer cases have a compact internal structure, and the mounting clips are stuck in the middle of the cooling tower. When removing the fans, personnel need to reach into the case to remove them, making installation and removal difficult, especially when operating in a small case, which can easily result in cuts or damage to the hardware. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation device for computer chips to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a computer chip heat dissipation device, comprising a main body mechanism, an outer frame mechanism fixedly mounted on the top of the main body mechanism, the outer frame mechanism including a mounting frame and two sets of heat dissipation fans, two sets of limiting rods fixedly mounted on the left and right sides of each heat dissipation fan, eight sets of limiting grooves opened on the inner side of the mounting frame, the limiting rods slidably mounted inside the limiting grooves, two sets of first mounting rods slidably mounted on one side of the mounting frame, a control button fixedly mounted on the top of each first mounting rod, the first mounting rods being positioned between the two sets of limiting grooves, a U-shaped block fixedly mounted on the bottom of each first mounting rod, two sets of second mounting rods fixedly mounted on one side of the mounting frame, spring pieces fixedly mounted on the left and right sides of each second mounting rod, a locking block fixedly mounted on one side of each spring piece, the locking block slidably mounted inside the limiting groove, a spring fixedly mounted on the top of each second mounting rod, and a locking groove opened on the bottom of each limiting rod.

[0006] Preferably, four sets of elastic elements are fixedly installed at the bottom of the mounting frame, and the four sets of elastic elements are arranged in pairs at the bottom of the cooling fan.

[0007] Preferably, two sets of elastic contacts are fixedly installed on the top of the mounting frame, the elastic contacts are located at the bottom of the cooling fan, and a connection port is provided on one side of the mounting frame.

[0008] Preferably, a magnetic dustproof net is movably installed on one side of the mounting frame.

[0009] Preferably, a magnetic screen is movably mounted on the top of the mounting frame.

[0010] Preferably, the main body includes a heat-conducting block, inside which a plurality of heat pipes are fixedly installed, and on the outer wall of the heat pipes are fixedly installed an mounting plate. Four sets of mounting shafts are fixedly installed on the top of the mounting plate. A plurality of washers are slidably installed on the outer wall of the mounting shafts, and a plurality of heat sinks are slidably installed on the outer wall of the mounting shafts. The heat sinks and washers are alternately installed on the outer wall of the mounting shafts. A mounting cover is movably installed on the top of the mounting shafts, and both the mounting cover and the heat sinks are slidably installed on the outer wall of the heat pipes.

[0011] Preferably, a heat sink is fixedly installed on the top of the heat-conducting block.

[0012] Compared with the prior art, the beneficial effects of this utility model are: the computer chip heat dissipation device;

[0013] 1. The position of the cooling fan inside the mounting frame is limited by the cooperation between the limiting groove and the limiting rod. The cooling fan is fixed inside the mounting frame by the cooperation between the locking block and the locking groove. When the cooling fan needs to be removed, simply press the control button to make the first mounting rod and the U-shaped block move downward against the spring force, squeezing the outer wall of the two sets of springs, causing the locking block to move towards the second mounting rod, thereby disengaging the locking block and the locking groove, and the cooling fan can be pulled out from inside the mounting frame. In summary, this device has the advantage of convenient installation and removal of cooling fans.

[0014] 2. By using the mounting plate, mounting shaft, mounting cover, gaskets, and heat sinks to form a heat dissipation tower, the heat dissipation area of ​​the heat pipe is increased. The mounting cover and mounting shaft fix several heat sinks and gaskets to the top of the mounting plate. During dust removal operations, personnel can remove the mounting cover to take out several gaskets and heat sinks from the top of the mounting plate and clean each component separately, thus solving the problem of excessive cleaning dead corners in existing integrated heat sinks. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the outer frame mechanism of this utility model;

[0017] Figure 3 This is a partial structural diagram of the outer frame mechanism of this utility model;

[0018] Figure 4 This is a schematic diagram of the main structure of the present utility model;

[0019] Figure 5 This is a structural unfolded diagram of the main body of this utility model.

[0020] In the diagram: 1. Main body mechanism; 101. Heat-conducting block; 102. Heat pipe; 103. Mounting plate; 104. Mounting shaft; 105. Mounting cover; 106. Washer ring; 107. Heat sink; 108. Heat sink block; 2. Outer frame mechanism; 201. Mounting frame; 202. Cooling fan; 203. Limiting groove; 204. Limiting rod; 205. First mounting rod; 206. Control button; 207. U-shaped block; 208. Spring; 209. Second mounting rod; 210. Spring piece; 211. Locking block; 212. Locking groove; 213. Elastic element; 214. Elastic contact; 215. Connection port; 216. Magnetic dustproof mesh; 217. Magnetic screen. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3This utility model provides a technical solution: a computer chip heat dissipation device, including a main body mechanism 1, an outer frame mechanism 2 fixedly installed on the top of the main body mechanism 1, the outer frame mechanism 2 including a mounting frame 201 and two sets of cooling fans 202, two sets of limiting rods 204 fixedly installed on the left and right sides of the cooling fans 202, eight sets of limiting grooves 203 opened on the inner side of the mounting frame 201, the limiting rods 204 slidably installed in the limiting grooves 203, and two sets of first mounting rods 205 slidably installed on one side of the mounting frame 201, the top of the first mounting rods 205 being fixedly installed. Equipped with a control button 206, a first mounting rod 205 is positioned between two sets of limiting grooves 203. A U-shaped block 207 is fixedly mounted at the bottom of the first mounting rod 205. Two sets of second mounting rods 209 are fixedly mounted on one side of the mounting frame 201. Spring pieces 210 are fixedly mounted on both sides of the second mounting rods 209. A locking block 211 is fixedly mounted on one side of the spring piece 210. The locking block 211 is slidably mounted inside the limiting groove 203. A spring 208 is fixedly mounted on the top of the second mounting rods 209. A locking groove 212 is opened at the bottom of the limiting rod 204. Four sets of elastic elements 213 are fixedly installed at the bottom of the frame 201. Each pair of elastic elements 213 is positioned at the bottom of the cooling fan 202. These four sets of elastic elements 213 provide a spring force to the cooling fan 202 towards the top of the mounting frame 201, causing the cooling fan 202 to automatically spring towards the top of the mounting frame 201 after the locking block 211 and locking groove 212 disengage. This facilitates the removal of the cooling fan 202. Two sets of elastic contacts 214 are fixedly installed at the top of the mounting frame 201. These elastic contacts 214 are located at the bottom of the cooling fan 202. A connection port 215 is provided on one side of the mounting frame 201. The cooling fan 202 is connected to the computer motherboard through the cooperation between the elastic contact 214 and the connection port 215. This solves the problem of the heat sink fan needing to be connected to the motherboard separately, which is not aesthetically pleasing in the prior art. A magnetic dust filter 216 is movably installed on one side of the mounting frame 201. The magnetic dust filter 216 filters the airflow and prevents dust from accumulating inside the device quickly. A magnetic screen 217 is movably installed on the top of the mounting frame 201. The magnetic screen 217 displays data such as the speed of the cooling fan 202 and the chip temperature. Personnel can intuitively understand the hardware status without the need for software, which is convenient for timely adjustment of the heat dissipation strategy.

[0023] The specific implementation method is as follows: the position of the cooling fan 202 inside the mounting frame 201 is limited by the cooperation between the limiting groove 203 and the limiting rod 204. The cooling fan 202 is fixed inside the mounting frame 201 by the cooperation between the locking block 211 and the locking groove 212. When it is necessary to remove the cooling fan 202, simply press the control button 206 to make the first mounting rod 205 and the U-shaped block 207 move downward against the elastic force of the spring 208, and squeeze the outer wall of the two sets of spring pieces 210, so that the locking block 211 moves toward the second mounting rod 209, thereby disengaging the locking relationship between the locking block 211 and the locking groove 212, and the cooling fan 202 can be pulled out from inside the mounting frame 201. In summary, this device has the advantage of convenient disassembly and assembly of the cooling fan 202.

[0024] Please see Figure 1-5 This utility model provides a technical solution: a computer chip heat dissipation device, the main body 1 includes a heat-conducting block 101, a plurality of heat pipes 102 are fixedly installed inside the heat-conducting block 101, an mounting plate 103 is fixedly installed on the outer wall of the heat pipes 102, four sets of mounting shafts 104 are fixedly installed on the top of the mounting plate 103, a plurality of washers 106 are slidably installed on the outer wall of the mounting shafts 104, a plurality of heat sinks 107 are slidably installed on the outer wall of the mounting shafts 104, the plurality of heat sinks 107 and washers 106 are alternately installed on the outer wall of the mounting shafts 104, an mounting cover 105 is movably installed on the top of the mounting shafts 104, the mounting cover 105 and the heat sinks 107 are both slidably installed on the outer wall of the heat pipes 102, and a heat sink 108 is fixedly installed on the top of the heat-conducting block 101, the heat sink 108 further increases the heat dissipation efficiency of the heat-conducting block 101.

[0025] The specific implementation method is as follows: the heat dissipation tower is formed by the cooperation between the mounting plate 103, mounting shaft 104, mounting cover 105, gasket 106, and heat sink 107, increasing the heat dissipation area of ​​the heat pipe 102. The heat sink 107 and gasket 106 are fixed to the top of the mounting plate 103 by the cooperation between the mounting cover 105 and the mounting shaft 104. During dust removal operations, the gasket 106 and heat sink 107 can be removed from the top of the mounting plate 103 by disassembling the mounting cover 105, and each component can be cleaned separately, which solves the problem of excessive cleaning dead corners in the existing integrated heat dissipation tower.

[0026] Working principle: When using this computer chip heat dissipation device, the position of the heat dissipation fan 202 inside the mounting frame 201 is limited by the cooperation between the limiting groove 203 and the limiting rod 204. The heat dissipation fan 202 is fixed inside the mounting frame 201 by the cooperation between the locking block 211 and the locking groove 212. When it is necessary to remove the heat dissipation fan 202, simply press the control button 206 to make the first mounting rod 205 and the U-shaped block 207 move downward against the elastic force of the spring 208, and squeeze the outer wall of the two sets of spring pieces 210. This causes the locking block 211 to move toward the second mounting rod 209, thereby disengaging the locking relationship between the locking block 211 and the locking groove 212. The heat dissipation fan 202 can then be pulled out from inside the mounting frame 201. In summary, this device has the advantage of convenient disassembly and assembly of the heat dissipation fan 202.

[0027] Four sets of elastic elements 213 provide elastic force to the cooling fan 202 towards the top of the mounting frame 201, so that the cooling fan 202 will automatically spring towards the top of the mounting frame 201 after the locking block 211 and the locking groove 212 are disengaged, making it easy for personnel to pull out the cooling fan 202. The cooling fan 202 is connected to the computer motherboard through the cooperation between the elastic contact 214 and the connection port 215, which solves the problem that the heat sink fan needs to be connected to the motherboard separately in the prior art, which is not aesthetically pleasing. The airflow is filtered by the magnetic dustproof mesh 216 to prevent the rapid accumulation of dust inside the equipment. The data such as the speed of the cooling fan 202 and the chip temperature are displayed by the magnetic screen 217, so that personnel can intuitively understand the hardware status without the need for software, which is convenient for timely adjustment of the heat dissipation strategy.

[0028] The heat dissipation tower is formed by the cooperation between the mounting plate 103, mounting shaft 104, mounting cover 105, gasket 106, and heat sink 107, increasing the heat dissipation area of ​​the heat pipe 102. The cooperation between the mounting cover 105 and the mounting shaft 104 fixes several heat sinks 107 and gaskets 106 to the top of the mounting plate 103. During dust removal operations, personnel can remove several gaskets 106 and heat sinks 107 from the top of the mounting plate 103 by disassembling the mounting cover 105, and clean each component separately, which solves the problem of excessive cleaning dead corners in the existing integrated heat dissipation tower.

[0029] The heat dissipation efficiency of the heat conduction block 101 is further increased by the heat sink 108.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A computer chip heat dissipation device, comprising a main body (1), wherein an outer frame (2) is fixedly mounted on the top of the main body (1), characterized in that: The outer frame mechanism (2) includes a mounting frame (201) and two sets of cooling fans (202). Two sets of limiting rods (204) are fixedly installed on both the left and right sides of the cooling fans (202). Eight sets of limiting grooves (203) are opened on the inner side of the mounting frame (201). The limiting rods (204) are slidably installed inside the limiting grooves (203). Two sets of first mounting rods (205) are slidably installed on one side of the mounting frame (201). A control button (206) is fixedly installed on the top of the first mounting rod (205). The first mounting rods (205) are set in the two sets of limiting grooves (202). Between 03), a U-shaped block (207) is fixedly installed at the bottom of the first mounting rod (205), two sets of second mounting rods (209) are fixedly installed on one side of the mounting frame (201), spring pieces (210) are fixedly installed on both the left and right sides of the second mounting rod (209), a locking block (211) is fixedly installed on one side of the spring piece (210), the locking block (211) is slidably installed inside the limiting groove (203), a spring (208) is fixedly installed at the top of the second mounting rod (209), and a locking groove (212) is opened at the bottom of the limiting rod (204).

2. The computer chip heat dissipation device according to claim 1, characterized in that, Four sets of elastic elements (213) are fixedly installed at the bottom of the mounting frame (201), and the four sets of elastic elements (213) are arranged in pairs at the bottom of the cooling fan (202).

3. The computer chip heat dissipation device according to claim 1, characterized in that, Two sets of elastic contacts (214) are fixedly installed on the top of the mounting frame (201). The elastic contacts (214) are located at the bottom of the cooling fan (202). A connection port (215) is provided on one side of the mounting frame (201).

4. A computer chip heat dissipation device according to claim 1, characterized in that, A magnetic dustproof net (216) is movably installed on one side of the mounting frame (201).

5. A computer chip heat dissipation device according to claim 1, characterized in that, A magnetic screen (217) is movably mounted on the top of the mounting frame (201).

6. A computer chip heat dissipation device according to claim 1, characterized in that, The main body (1) includes a heat-conducting block (101), a plurality of heat pipes (102) are fixedly installed inside the heat-conducting block (101), an mounting plate (103) is fixedly installed on the outer wall of the heat pipes (102), four sets of mounting shafts (104) are fixedly installed on the top of the mounting plate (103), a plurality of washers (106) are slidably installed on the outer wall of the mounting shafts (104), a plurality of heat sinks (107) are slidably installed on the outer wall of the mounting shafts (104), a plurality of heat sinks (107) are alternately installed on the outer wall of the mounting shafts (104), an mounting cover (105) is movably installed on the top of the mounting shafts (104), and the mounting cover (105) and the heat sinks (107) are both slidably installed on the outer wall of the heat pipes (102).

7. A computer chip heat dissipation device according to claim 6, characterized in that, A heat sink (108) is fixedly installed on the top of the heat-conducting block (101).

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