CPU double-layer cooling device

Abstract

The utility model discloses a CPU double-layer cooling device, and belongs to the technical field of CPU cooling, and the CPU double-layer cooling device is characterized by comprising two cooling clamping pieces which are symmetrically arranged and fix a CPU between the two cooling clamping pieces, the two cooling clamping pieces are tightly attached to the surface of a CPU board, and conveying guide pipes communicated with the interiors of the two cooling clamping pieces are arranged on the two cooling clamping pieces respectively; the same communicating pipe communicating with the interiors of the two cooling clamping pieces is arranged between the two cooling clamping pieces, any conveying guide pipe communicates with external cooling liquid through a water pump, the double-layer cooling function is achieved, rapid heat dissipation can be conducted on a CPU, and the good heat dissipation effect is achieved.

Description

Technical Field

[0001] This application relates to the field of CPU cooling technology, and more specifically to a CPU dual-layer cooling device. Background Technology

[0002] The normal operation of electronic devices depends on the operation of their internal CPU, and the normal operation of the CPU is closely related to its heat dissipation.

[0003] CPUs typically use heatsinks or heat pipes for cooling. The CPU's heat is first transferred to the heatsink or heat pipe, and then the forced convection of the fan dissipates the heat into the air. While this cooling method is sufficient for the normal operation of electronic devices, it often leads to excessive heat generation and overheating when the CPU is overclocked. In severe cases, this can damage the CPU and render it unusable.

[0004] In view of this, the present invention designs a dual-layer cooling device for rapid cooling of the CPU. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a CPU dual-layer cooling device, which has the advantage that the dual-layer cooling can quickly dissipate heat from the CPU and has a better heat dissipation effect.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a CPU dual-layer cooling device, comprising two cooling clamps symmetrically arranged and fixing the CPU between the two, the two cooling clamps being in close contact with the CPU board surface, each of the two cooling clamps being provided with a delivery conduit communicating with its interior, the two cooling clamps being provided with the same connecting pipe communicating with the interior of both, and any of the delivery conduits being connected to an external coolant via a water pump.

[0007] By adopting the above technical solution, when the CPU needs to be cooled, the water pump delivers external coolant to the connected delivery conduit, and then the coolant flows into the cooling clamp. The cooling clamp absorbs the heat from the CPU and conducts it to the coolant. After absorbing a certain amount of heat, the coolant flows through the connecting pipe to another cooling clamp, where it absorbs the heat again and is discharged through the corresponding delivery conduit of that cooling clamp. This achieves rapid heat dissipation for the CPU and provides a good cooling effect.

[0008] The present invention is further configured such that: the cooling clamp includes a metal heat-absorbing frame that is in contact with the CPU board surface, a sealing frame disposed at the end of the metal heat-absorbing frame away from the CPU and forming a sealed space with the metal heat-absorbing frame, a plurality of heat sinks disposed on the end face of the metal heat-absorbing frame away from the CPU, and a support frame disposed on the end face of the sealing frame facing the CPU and used to abut against the heat sinks; the sealing frame is provided with a connection port that communicates with a connecting pipe, and the sealing frame is provided with a delivery port that communicates with a delivery conduit; both the connection port and the delivery port are connected to the sealed space formed by the metal heat-absorbing frame and the sealing frame.

[0009] By adopting the above technical solution, when the CPU needs to be cooled, the heat of the CPU can be absorbed by the metal heat-absorbing frame. The heat on the metal heat-absorbing frame is then distributed to several heat sinks. This increases the contact between the coolant and the heat sinks as the coolant flows, allowing the coolant to quickly absorb the heat on the heat sinks and dissipate it, thereby achieving the effect of rapid heat dissipation.

[0010] The present invention is further configured such that: the sealing frame at the end away from the metal heat-absorbing frame and on the edge corresponding to the connection port and the delivery port are provided with flanges that fit into the corresponding connecting pipe openings and delivery conduit openings.

[0011] By adopting the above technical solution, the flange can facilitate the connection between the connecting pipe and the connection port, and facilitate the connection between the delivery conduit and the delivery port.

[0012] The present invention is further configured such that: a first detection port communicating with the interior of the connecting pipe is provided on the side of the connecting pipe that is connected to the cooling clamp and away from the cooling clamp, and a first sealing cap is provided on the first detection port.

[0013] By adopting the above technical solution, the setting of the first detection port and the first sealing cap can facilitate inspection and cleaning when the connecting pipe is blocked.

[0014] The present invention is further configured such that: a second detection port communicating with the interior of the conveying conduit is provided on the side of the conveying conduit that is connected to the cooling clamp and away from the cooling clamp, and a second sealing cap is provided on the second detection port.

[0015] By adopting the above technical solution, the second detection port and the second sealing cap can facilitate inspection and cleaning when the delivery conduit is blocked.

[0016] In summary, this utility model has the following advantages:

[0017] 1. When the CPU needs to be cooled, the water pump delivers external coolant to the connected delivery conduit, which then flows into the cooling clamp. The cooling clamp absorbs the heat from the CPU and transfers it to the coolant. After absorbing a certain amount of heat, the coolant flows through a connecting pipe to another cooling clamp, where it absorbs the heat again and is then discharged through the corresponding delivery conduit. This process achieves rapid heat dissipation for the CPU and provides a good cooling effect.

[0018] 2. When the CPU needs to be cooled, the CPU's heat can be absorbed by the metal heat-absorbing frame. The heat on the metal heat-absorbing frame is then distributed to several heat sinks. This increases the contact between the coolant and the heat sinks as the coolant flows, allowing the coolant to quickly absorb the heat on the heat sinks and dissipate it, thus achieving a rapid cooling effect. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this embodiment;

[0020] Figure 2 This is a cross-sectional structural diagram of this embodiment;

[0021] Figure 3 This is a schematic diagram of the exploded structure of this embodiment.

[0022] Explanation of reference numerals in the attached drawings: 1. Conveying conduit; 2. Connecting pipe; 3. Metal heat-absorbing frame; 4. Sealing frame; 5. Heat sink; 6. Support frame; 7. Connecting port; 8. Conveying port; 9. Flange; 10. First detection port; 11. First sealing cover; 12. Second detection port; 13. Second sealing cover. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to the accompanying drawings.

[0024] A dual-layer CPU cooling device, such as Figure 1 , 2 As shown, it includes two cooling clamps symmetrically arranged and fixing the CPU between them. The two cooling clamps are in close contact with the CPU board surface. Each of the two cooling clamps is equipped with a delivery conduit 1 that communicates with its interior. The two cooling clamps are connected by the same connecting pipe 2 that communicates with the interior of both. Either delivery conduit 1 is connected to the external coolant through a water pump.

[0025] like Figure 2 , 3As shown, the cooling clamp includes a metal heat-absorbing frame 3 that fits against the CPU board surface, a sealing frame 4 installed on the end of the metal heat-absorbing frame 3 away from the CPU and forming a sealed space with the metal heat-absorbing frame 3, several heat sinks 5 integrally formed on the end face of the metal heat-absorbing frame 3 away from the CPU, and a support frame 6 installed on the end face of the sealing frame 4 facing the CPU and used to abut against the heat sinks 5. The sealing frame 4 has a connection port 7 connected to the connecting pipe 2 and a delivery port 8 connected to the delivery conduit 1. Both the connection port 7 and the delivery port 8 are connected to the sealed space formed by the metal heat-absorbing frame 3 and the sealing frame 4. When the CPU needs to be cooled, the heat of the CPU can be absorbed by the metal heat-absorbing frame 3 and the heat on the metal heat-absorbing frame 3 can be distributed to the heat sinks 5. When the coolant flows, the contact between the coolant and the heat sinks 5 can be increased, so that the coolant can quickly absorb the heat on the heat sinks 5 and dissipate it, thereby achieving the effect of rapid heat dissipation.

[0026] like Figure 2 , 3 As shown, the sealing frame 4 is provided with flanges 9 on the edge of the end away from the metal heat absorption frame 3 and on the edge corresponding to the connection port 7 and the delivery port 8, which are fitted with the corresponding openings of the connecting pipe 2 and the delivery conduit 1, so as to facilitate the docking of the connecting pipe 2 with the connection port 7 and the delivery conduit 1 with the delivery port 8.

[0027] Furthermore, a first inspection port 10 communicating with the interior of the connecting pipe 2 is provided on the side of the connecting pipe 2 away from the cooling clamp where it connects with the cooling clamp. A first sealing cap 11 is installed on the first inspection port 10, which facilitates inspection and cleaning when the connecting pipe is blocked.

[0028] Furthermore, a second inspection port 12 communicating with the interior of the conveying conduit 1 is provided on the side of the conveying conduit 1 that is connected to the cooling clamp and away from the cooling clamp. A second sealing cap 13 is installed on the second inspection port 12, which facilitates inspection and cleaning when the conveying conduit 1 is blocked.

[0029] The working process and beneficial effects of this utility model are as follows: When the CPU needs to be cooled, the water pump delivers external coolant to the connected delivery conduit 1, and then the coolant flows into the cooling clamp. The cooling clamp absorbs the heat of the CPU and conducts it to the coolant. After absorbing a certain amount of heat, the coolant flows through the connecting pipe 2 to another cooling clamp, where it absorbs the heat again and discharges it through the corresponding delivery conduit 1. This achieves rapid heat dissipation of the CPU and has a good heat dissipation effect.

[0030] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the design concept of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A CPU dual-layer cooling device, characterized in that: The system includes two cooling clamps symmetrically arranged and fixing the CPU between them. The two cooling clamps are in close contact with the CPU board surface. Each of the two cooling clamps is provided with a delivery conduit (1) that communicates with its interior. The two cooling clamps are provided with the same connecting pipe (2) that communicates with the interior of both of them. Each of the delivery conduits (1) is connected to the external coolant through a water pump.

2. The CPU dual-layer cooling device according to claim 1, characterized in that: The cooling clamp includes a metal heat-absorbing frame (3) that is in contact with the CPU board surface, a sealing frame (4) that is disposed at the end of the metal heat-absorbing frame (3) away from the CPU and forms a closed space with the metal heat-absorbing frame (3), a plurality of heat sinks (5) disposed on the end face of the metal heat-absorbing frame (3) away from the CPU, and a support frame (6) disposed on the end face of the sealing frame (4) facing the CPU and used to abut against the heat sinks (5). The sealing frame (4) is provided with a connection port (7) that is connected to the connecting pipe (2), and the sealing frame (4) is provided with a delivery port (8) that is connected to the delivery conduit (1). The connection port (7) and the delivery port (8) are both connected to the closed space formed by the metal heat-absorbing frame (3) and the sealing frame (4).

3. A CPU dual-layer cooling device according to claim 2, characterized in that: The sealing frame (4) is provided with flanges (9) on the edge of the end away from the metal heat absorption frame (3) and on the edge corresponding to the connection port (7) and the delivery port (8), which are fitted with the opening of the corresponding connecting pipe (2) and the opening of the delivery conduit (1).

4. A CPU dual-layer cooling device according to claim 1, characterized in that: The connecting pipe (2) is provided with a first detection port (10) communicating with the inside of the connecting pipe (2) on the side away from the cooling clamp at the connection point with the cooling clamp, and a first sealing cap (11) is provided on the first detection port (10).

5. A CPU dual-layer cooling device according to claim 1, characterized in that: A second detection port (12) communicating with the interior of the delivery conduit (1) is provided on the side of the delivery conduit (1) that is connected to the cooling clamp and away from the cooling clamp. A second sealing cap (13) is provided on the second detection port (12).

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