Capacitor

Abstract

The utility model discloses a capacitor, which enables a heat dissipation piece to be exposed outside resin to realize contact cooling with an external cooling source, the external cooling source can be directly contacted with a heating source of the capacitor, the cooling effect is remarkable, and the capacitor comprises a capacitor shell, the resin, a capacitor core, a first busbar, a second busbar and the heat dissipation piece, the accommodating cavity of the capacitor shell is filled with resin; the capacitor core is arranged in the accommodating cavity and is embedded in the resin; the first parts of the first busbar and the second busbar are arranged in the accommodating cavity, are embedded in the resin and are electrically connected with the upper surface and the lower surface of the capacitor core respectively; the second parts of the two are exposed out of the resin and are led to the side edge of the capacitor shell to serve as connecting terminals; the heat dissipation piece comprises an exposed part exposed out of the resin and a buried part buried in the resin; the exposed part is in direct contact with an external cooling source, and the buried part is fixedly connected with the first part of the first busbar; in a plan view, only part of the exposed part is overlapped with the capacitor core, and the rest part is closer to the connecting terminal of the first busbar.

Description

Technical Field

[0001] This utility model belongs to the field of capacitor technology, and specifically refers to a capacitor. Background Technology

[0002] With the rapid development of electronic power technology, metallized film capacitors are being used more and more widely in fields such as industrial control, new energy, automotive electronics, rail transportation, and power grids. At the same time, the problem of capacitor heat generation is becoming more and more prominent.

[0003] In the early days, the industry often used capacitor casings for cooling. However, using plastic casings resulted in poor heat dissipation due to their low thermal conductivity and the distance between the cooling source and the heat source. While metal casings offered high thermal conductivity, the distance between the cooling source and the heat source remained significant. Furthermore, using metal casings increased material costs and product weight, and the insulation between the electrode plates and the metal casing presented challenges. Therefore, the heat dissipation problem remained unresolved, and there were no economic advantages.

[0004] In existing technologies, such as the capacitor disclosed in CN113811965B, the busbar contacts the first electrode of the capacitor and has an exposed portion that protrudes beyond the filling resin. When viewed from a direction perpendicular to the bottom of the housing, this exposed portion overlaps with the capacitor element inside the housing. Although the heat generated by the capacitor element can be conducted through the exposed portion, the heat dissipation effect is still not ideal. It does not address the core problem of capacitor heat generation and also has the following drawbacks: ① The exposed portion does not have direct contact with the capacitor element, resulting in poor heat dissipation; ② The exposed portion has insufficient support strength and is difficult to support cooling units with a certain weight, such as coolers; ③ The busbar is integrally formed from a metal plate through processes such as bending and stamping, which has problems such as complex processes, low yield, and large tolerances during processing. For example, the capacitor disclosed in CN116783669A has a heat-conducting plate disposed on the upper surface of the first electrode at intervals by insulating sheets. The heat-conducting plate has an exposed surface exposed to the filling resin, and a cooling component is fitted on the exposed surface. The insulating sheet affects the heat conduction effect between the capacitor element and the heat-conducting plate. Also, like the previous patent, the position of the heat-conducting plate overlaps with the capacitor element, and the heat dissipation effect is still not ideal. At the same time, the heat-conducting plate is separated from the first electrode by the insulating sheet and is not connected and fixed. The heat-conducting plate is only positioned by the filling resin, which makes the structure unstable and has insufficient mechanical strength. Utility Model Content

[0005] The main purpose of this utility model is to provide a capacitor that improves upon the existing structure by proposing a new heat dissipation design. A heat dissipation component is placed between the heat-generating busbar and the external cooling source, so that the heat dissipation component is exposed outside the resin and can contact the external cooling source for cooling. The external cooling source can directly contact the heat source of the capacitor, resulting in a significant cooling effect.

[0006] To achieve the above objectives, the solution of this utility model is:

[0007] A capacitor includes a capacitor casing, resin, a capacitor core, a first busbar, a second busbar, and a heat sink. The capacitor casing has an upward-opening cavity filled with the resin. The capacitor core is disposed within the cavity and embedded in the resin. First portions of the first and second busbars are both disposed within the cavity and embedded in the resin, and are electrically connected to the upper and lower surfaces of the capacitor core, respectively. Second portions of both busbars protrude from the resin and extend towards the side of the capacitor casing as connection terminals. The heat sink includes an exposed portion protruding from the resin and a embedded portion embedded in the resin. The exposed portion is in direct contact with an external cooling source, and the embedded portion is connected and fixed to the first portion of the first busbar.

[0008] When viewed from a direction perpendicular to the bottom wall of the cavity, the exposed portion only partially overlaps with the capacitor core, and the remaining portion of the exposed portion is closer to the connection terminal of the first busbar.

[0009] The capacitor cores are arranged side by side along the length of the capacitor casing; the heat sink is parallel to the length of the capacitor casing and at least one is arranged along the length of the capacitor casing; or, the heat sink is parallel to the width of the capacitor casing and at least several are arranged side by side along the length of the capacitor casing.

[0010] The external cooling source is wind, air, liquid cooling pipes or liquid cooling panels; the material of the heat sink is aluminum or copper.

[0011] The connection between the heat sink and the first busbar can be achieved by soldering, laser welding, rivetless riveting, or self-positioning assembly.

[0012] The surface of the exposed portion is insulated.

[0013] The first busbar and the second part of the second busbar lead to the same side of the capacitor casing, and the two are isolated by insulating paper.

[0014] Preferably, the first part of the first busbar is a first connecting part embedded in the resin and attached to the upper surface of the capacitor core, and the second part is a plurality of first connecting terminals exposed in the resin. The first connecting part is parallel to the first connecting terminals, and the two are integrally connected by a plurality of first connecting parts that are partially embedded in the resin and partially exposed in the resin. The first connecting parts are perpendicular to the first connecting part.

[0015] Preferably, the first part of the second busbar comprises a second connecting portion embedded in the resin and attached to the lower surface of the capacitor core, a second connecting portion bent and connected to the second connecting portion, and a third connecting portion bent and connected to the second connecting portion. The second part comprises a plurality of second connecting terminals exposed in the resin, and has a fourth connecting portion integrally connected between the third connecting portion and the second connecting terminals. The fourth connecting portion is partially embedded in the resin and partially exposed in the resin. The first connecting portion, the third connecting portion, and the second connecting terminals are all parallel. The second connecting portion and the fourth connecting portion are parallel and perpendicular to the first connecting portion. The third connecting portion is located on the lower surface of the first connecting portion, the fourth connecting portion is located on the outer side of the first connecting portion, and the second connecting terminals are located on the lower surface of the first connecting terminals, and are all separated by the insulating paper.

[0016] The heat sink is a solid component. Alternatively, the exposed portion of the heat sink is a plate-shaped or sheet-shaped component that does not contact the resin, and its embedded portion consists of several connecting pieces bent and connected to both sides of the exposed portion. The connecting pieces are embedded in the resin and connected and fixed to the first busbar. Several through holes are provided at the connection between the exposed portion and the embedded portion.

[0017] After adopting the above technical solution, the present invention has the following technical effects:

[0018] This invention features a heat sink with an embedded portion that directly contacts the heat source inside the resin—the first busbar—and an exposed portion that protrudes from the resin. This allows the heat from the busbar to be directly conducted away, and the exposed portion, which directly contacts an external cooling source, dissipates heat, thereby reducing the internal temperature of the capacitor and providing excellent thermal conductivity. Furthermore, the heat sink is positioned closer to the busbar's connection terminals, which is also closer to the main heat source during capacitor operation—the location where the current enters the capacitor. Therefore, the heat sink can simultaneously be close to both the heat source and the cooling source, further enhancing the heat dissipation effect on the capacitor. Attached Figure Description

[0019] Figure 1 This is a perspective view of the first embodiment of the present utility model;

[0020] Figure 2This is an exploded view of the first embodiment of the present invention;

[0021] Figure 3 This is a cross-sectional view of the first embodiment of the present invention;

[0022] Figure 4 This is a top view of the first embodiment of the present invention (with resin hidden).

[0023] Figure 5 This is a perspective view of the second embodiment of the present utility model;

[0024] Figure 6 This is an exploded view of the second embodiment of the present invention;

[0025] Figure 7 This is a cross-sectional view of the second embodiment of the present invention;

[0026] Figure 8 This is a top view of the second embodiment of the present invention (with resin hidden).

[0027] Explanation of icon numbers:

[0028] 1-Capacitor casing; 11-Cellulum;

[0029] 2-Resin;

[0030] 3-Capacitor core;

[0031] 4-First busbar; 41-First connecting part; 42-First connecting terminal; 43-First connecting part;

[0032] 5-Second busbar; 51-First connecting part; 52-Second connecting part; 53-Third connecting part; 54-Second connecting terminal; 55-Fourth connecting part;

[0033] 6-Heat dissipation component; 61-Exposed part; 62-Concealed part; 63-Perforation;

[0034] 7-Insulating paper. Detailed Implementation

[0035] To further explain the technical solution of this utility model, the following detailed description is provided through specific embodiments.

[0036] refer to Figure 1-8 As shown, this utility model discloses a capacitor, including a capacitor shell 1, resin 2, capacitor core 3, first busbar 4, second busbar 5 and heat sink 6;

[0037] The capacitor casing 1 is provided with an upward-opening cavity 11, and the cavity 11 is filled with resin 2;

[0038] The capacitor core 3 is disposed within the capacitor cavity 11 and embedded in the resin 2;

[0039] The first part of the first busbar 4 and the second busbar 5 are both disposed in the cavity 11 and buried in the resin 2 and electrically connected to the upper and lower surfaces of the capacitor core 3 respectively; the second part of both are exposed in the resin 2 and lead to the side of the capacitor shell 1 as a connection terminal.

[0040] The heat sink 6 includes an exposed portion 61 exposed to the resin 2 and a buried portion 62 embedded in the resin 2; the exposed portion 61 is in direct contact with an external cooling source, and the buried portion 62 is connected and fixed to the first part of the first busbar 4.

[0041] When viewed from a direction perpendicular to the bottom wall of the cavity 11 (i.e., from a top-down perspective), the exposed portion 61 only partially overlaps with the capacitor core 3, and the rest of the exposed portion 61 is closer to the connection terminal of the first busbar 4.

[0042] Through the above solution, this utility model, by setting a heat sink 6, has a buried part 62 that directly contacts the heat source inside the resin 2—the first busbar 4—and an exposed part 61 that is exposed outside the resin 2. It can directly conduct the heat from the busbar and dissipate heat through the exposed part 61 that is directly in contact with the external cooling source, thereby reducing the internal temperature of the capacitor and achieving good thermal conductivity. At the same time, the heat sink 6 is arranged closer to the connection terminal of the busbar, that is, closer to the main heat source when the capacitor is running—the position where the current enters the capacitor. Therefore, the heat sink 6 can simultaneously achieve proximity to the heat source and the cooling source, further improving the heat dissipation effect on the capacitor.

[0043] In some embodiments of this utility model, several capacitor cores 3 are arranged side by side along the length of the capacitor housing 1; the heat sink 6 is parallel to the length of the capacitor housing 1, and at least one is arranged along the length of the capacitor housing 1; when only one heat sink 6 is provided, its length is preferably able to cover all the capacitor cores 3, that is, in the top view, the heat sink 6 and each capacitor core 3 partially overlap; when multiple heat sinks 6 are provided, in the top view, it is preferably ensured that each capacitor core 3 has at least one heat sink 6 that partially overlaps with it.

[0044] In some embodiments of this utility model, several capacitor cores 3 are arranged side-by-side along the length of the capacitor housing 1; heat sinks 6 are parallel to the width of the capacitor housing 1 and at least several are arranged side-by-side along the length of the capacitor housing 1. From a top-down view, it is preferable to ensure that each capacitor core 3 has at least one heat sink 6 that partially overlaps with it.

[0045] In some embodiments of this utility model, the aforementioned external cooling sources include, but are not limited to, wind, air, liquid cooling pipes, liquid cooling panels, etc.

[0046] In some embodiments of this utility model, the material of the heat sink 6 is including, but not limited to, high thermal conductivity materials such as aluminum and copper.

[0047] In some embodiments of this utility model, the connection methods between the heat sink 6 and the first busbar 4 include, but are not limited to, soldering, laser welding, rivetless riveting, self-positioning assembly, etc.

[0048] In some embodiments of this utility model, if necessary, insulation treatment can be applied to the surface of the exposed portion 61, such as by adding an insulating component. The material of the insulating component can be insulating paper, plastic, etc.

[0049] In some embodiments of this utility model, the second parts of the first busbar 4 and the second busbar 5 lead to the same side of the capacitor casing 1, and the two are isolated by insulating paper 7 to meet the insulation requirements between the positive and negative terminals of the capacitor.

[0050] Furthermore, the first part of the first busbar 4 is a first connecting part 41 embedded in the resin 2 and attached to the upper surface of the capacitor core 3, and the second part is a plurality of first connecting terminals 42 exposed in the resin 2. The first connecting part 41 and the first connecting terminal 42 are parallel to each other, and a plurality of first connecting parts 43 partially embedded in the resin 2 and partially exposed in the resin 2 are integrally connected between them. The first connecting parts 43 are perpendicular to the first connecting part 41, and the first connecting parts 43, the first connecting part 41, and the first connecting terminal 2 can be formed by bending.

[0051] Secondly, the first part of the aforementioned second busbar 5 consists of a second connecting part 51 embedded in the resin 2 and attached to the lower surface of the capacitor core 3, a second connecting part 52 bent and connected to the second connecting part 51, and a third connecting part 53 bent and connected to the second connecting part 52. The second part consists of a plurality of second connecting terminals 54 exposed in the resin 2, and has a fourth connecting part 55 integrally connected between the third connecting part 53 and the second connecting terminals 54. The fourth connecting part 55 is partially embedded in the resin 2 and partially exposed in the resin 2. The first connecting part 51, the third connecting part 53, and the second connecting terminals 54 are all parallel. The second connecting part 52 and the fourth connecting part 55 are parallel and perpendicular to the first connecting part 51. The third connecting part 53 is located on the lower surface of the first connecting part 41, the fourth connecting part 55 is located on the outer side of the first connecting part 43, and the second connecting terminals 54 are located on the lower surface of the first connecting terminals 42, and are all separated by insulating paper 7.

[0052] See Figure 1-4 The first embodiment of the present invention is shown.

[0053] In the first embodiment, the heat sink 6 is a solid component with a certain thickness. Because the heat sink 6 is connected and fixed to the first busbar 4 during assembly, it has a certain positional stability. Its solid structure also ensures sufficient support strength. In actual products, even when a liquid cooling panel or other cooling components of a certain weight are installed on the upper surface of the heat sink 6, it will not collapse. Furthermore, the first busbar 4 and the capacitor core 3 have a close-fitting contact area, and the use of the solid heat sink 6 for heat dissipation results in better heat dissipation.

[0054] See Figure 5-8 The second embodiment of this utility model is shown.

[0055] In the second embodiment, the exposed portion 61 of the heat sink 6 is a plate-shaped or sheet-shaped component that does not contact the resin 2, and its embedded portion 62 consists of several connecting pieces bent and connected to both sides of the exposed portion 61. The connecting pieces are embedded in the resin 2 and connected and fixed to the first busbar 4. Furthermore, the first busbar 4 and the capacitor core 3 are in close contact, resulting in a large contact area. The heat sink 6 is then used for heat dissipation, leading to better heat dissipation.

[0056] Furthermore, several perforations 63 are provided at the connection between the exposed portion 61 and the buried portion 62. Since the heat sink 6 is connected and fixed to the first busbar 4, the heat sink 6 is already assembled on the first busbar 4 and placed above the capacitor core 3 before filling with resin 2. By opening the perforations 63, the air below the exposed portion 61 can be easily discharged when filling with resin 2, so that resin 2 can be more fully filled into the lower part of the heat sink 6, especially the lower part of the exposed portion 61, ensuring good sealing performance of resin 2; at the same time, since resin 2 can fill a part of the perforations 63, the structural stability of the heat sink 6 can be further improved.

[0057] The above embodiments and figures are not intended to limit the product form and style of this utility model. Any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of this utility model.

Claims

1. A capacitor, characterized in that: Includes capacitor casing, resin, capacitor core, first busbar, second busbar, and heat sink; The capacitor casing has an upward-opening cavity, which is filled with the resin. The capacitor core is disposed within the capacitor cavity and embedded in the resin; The first part of the first busbar and the first part of the second busbar are both disposed in the cavity and embedded in the resin and are electrically connected to the upper and lower surfaces of the capacitor core, respectively; the second part of both are exposed in the resin and lead to the side of the capacitor shell as a connection terminal. The heat dissipation component includes an exposed portion exposed to the resin and a buried portion embedded in the resin; the exposed portion is in direct contact with an external cooling source, and the buried portion is connected and fixed to a first part of the first busbar.

2. The capacitor as claimed in claim 1, characterized in that: When viewed from a direction perpendicular to the bottom wall of the cavity, the exposed portion only partially overlaps with the capacitor core, and the remaining portion of the exposed portion is closer to the connection terminal of the first busbar.

3. The capacitor as claimed in claim 1, characterized in that: Several capacitor cores are arranged side by side along the length of the capacitor casing; The heat sink is parallel to the length direction of the capacitor housing, and at least one is provided in the length direction of the capacitor housing; Alternatively, the heat sink is parallel to the width direction of the capacitor housing, and at least a plurality of them are arranged side by side along the length direction of the capacitor housing.

4. The capacitor as claimed in claim 1, characterized in that: The external cooling source is wind, air, liquid cooling pipes or liquid cooling panels; the material of the heat sink is aluminum or copper.

5. The capacitor as claimed in claim 1, characterized in that: The connection between the heat sink and the first busbar can be achieved by soldering, laser welding, rivetless riveting, or self-positioning assembly.

6. The capacitor as claimed in claim 1, characterized in that: The surface of the exposed portion is insulated.

7. The capacitor as claimed in claim 1, characterized in that: The first busbar and the second part of the second busbar lead to the same side of the capacitor casing, and the two are isolated by insulating paper.

8. The capacitor as claimed in claim 7, characterized in that: The first part of the first busbar is a first connecting part embedded in the resin and attached to the upper surface of the capacitor core. The second part is a plurality of first connecting terminals exposed in the resin. The first connecting part is parallel to the first connecting terminals. The two are integrally connected by a plurality of first connecting parts that are partially embedded in the resin and partially exposed in the resin. The first connecting parts are perpendicular to the first connecting part.

9. The capacitor as claimed in claim 8, characterized in that: The first part of the second busbar consists of a second connecting part embedded in the resin and attached to the lower surface of the capacitor core, a second connecting part bent and connected to the second connecting part, and a third connecting part bent and connected to the second connecting part. The second part consists of a plurality of second connecting terminals exposed in the resin, and has a fourth connecting part integrally connected between the third connecting part and the second connecting terminals. The fourth connecting part is partially embedded in the resin and partially exposed in the resin. The first connecting part, the third connecting part, and the second connecting terminals are all parallel. The second connecting part and the fourth connecting part are parallel and perpendicular to the first connecting part. The third connecting part is located on the lower surface of the first connecting part, the fourth connecting part is located on the outer side of the first connecting part, and the second connecting terminals are located on the lower surface of the first connecting terminals, and are all separated by the insulating paper.

10. The capacitor as claimed in any one of claims 1 to 9, characterized in that: The heat sink is a solid part; or the exposed part of the heat sink is a plate-shaped or sheet-shaped part that does not contact the resin, and its embedded part is a plurality of connecting pieces bent and connected to both sides of the exposed part. The connecting pieces are embedded in the resin and connected and fixed to the first busbar; a plurality of through holes are provided at the connection between the exposed part and the embedded part.

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