Board card device

Abstract

The utility model relates to a board card device, and relates to the technical field of board card design, the board card device comprises a circuit board and a current-carrying heat dissipation plate, the current-carrying heat dissipation plate is arranged on one side of the circuit board; the circuit board is provided with a first conductive connecting part, and the current-carrying heat dissipation plate is provided with a second conductive connecting part; the first conductive connection part is detachably and electrically connected with the second conductive connection part, and the current-carrying heat dissipation plate is used for being connected with an external device to realize current transmission between the circuit board and the external device. Therefore, the circuit board and the current-carrying heat dissipation plate are detachably and electrically connected through the first conductive connection part and the second conductive connection part, so that the circuit board and the current-carrying heat dissipation plate are convenient to mount, dismount and maintain; current-carrying and heat dissipation functions can be simultaneously realized through the current-carrying heat dissipation plate, a current-carrying device and a heat dissipation device do not need to be respectively arranged, and the cost is lower.

Description

Technical Field

[0001] This utility model relates to the field of circuit board design technology, and in particular to a circuit board device. Background Technology

[0002] Circuit boards are important components in electronic devices. In existing solutions, the connection between components on circuit boards mainly relies on soldering. However, soldering is prone to cold solder joints, which can lead to poor contact and affect the connection effect. In addition, it is not easy to disassemble after soldering.

[0003] For heat dissipation of circuit boards, heat dissipation is usually achieved by adding heat sinks. However, heat dissipation increases costs and also increases the size of the circuit board.

[0004] For current carrying on circuit boards, high current is usually carried out through copper foil. Common methods include: 1. Increasing the width of the copper foil: Use copper foil with a corresponding width for different currents. For example, a 200A current requires a 200mm, 1oz copper foil. 2. Increasing the copper thickness: Use a thicker PCB. The line width can be reduced accordingly, but the cost will also increase. 3. Adding busbars to assist in current carrying, but the cost will also increase accordingly.

[0005] It is evident that existing circuit boards have numerous problems in terms of component connections, heat dissipation, and current carrying capacity. Utility Model Content

[0006] This invention provides a circuit board device to solve the problems existing in the connection between components, heat dissipation, and current carrying capacity of the above-mentioned circuit boards.

[0007] This utility model provides a board device, which includes a circuit board and a current-carrying heat sink, the current-carrying heat sink being disposed on one side of the circuit board; the circuit board having a first conductive connection portion, and the current-carrying heat sink having a second conductive connection portion; the first conductive connection portion and the second conductive connection portion are detachably electrically connected, wherein the current-carrying heat sink is used to connect with external devices to realize current transmission between the circuit board and the external devices.

[0008] A further technical solution is that the board device further includes an insulating pad, which is disposed between the circuit board and the current-carrying heat sink.

[0009] A further technical solution is that the circuit board is provided with a heat-generating device, and the board device also includes a thermally conductive pad, which is disposed between the heat-generating device and the current-carrying heat sink.

[0010] A further technical solution is that the insulating pad is provided with a receiving hole, and the thermally conductive pad is embedded in the receiving hole.

[0011] A further technical solution is that one of the first conductive connection part and the second conductive connection part is a fixing hole and the other is a conductive stud, and the fixing hole and the conductive stud are detachably connected by fasteners.

[0012] A further technical solution is that the insulating pad is provided with a through hole corresponding to the conductive stud, and the conductive stud passes through the through hole.

[0013] A further technical solution is that the current-carrying heat sink is an aluminum plate.

[0014] A further technical solution is that the number of current-carrying heat sinks is 2, the external device is a power supply device, and the two current-carrying heat sinks are respectively connected to the positive and negative terminals of the power supply device.

[0015] A further technical solution is that the current-carrying heat sink is provided with a third conductive connection part, which is used to connect with the external device.

[0016] A further technical solution is that the current-carrying heat sink includes a main plate and a connecting plate angled to one side of the main plate, and the third conductive connection part is disposed on the connecting plate.

[0017] The technical solution provided by this utility model embodiment has the following advantages compared with the prior art:

[0018] In the technical solution of this utility model embodiment, the board device includes a circuit board and a current-carrying heat sink, the current-carrying heat sink being disposed on one side of the circuit board; the circuit board has a first conductive connection portion, and the current-carrying heat sink has a second conductive connection portion; the first conductive connection portion and the second conductive connection portion are detachably electrically connected, wherein the current-carrying heat sink is used to connect with external devices to realize current transmission between the circuit board and the external devices. It can be seen that the circuit board and the current-carrying heat sink are detachably electrically connected through the first conductive connection portion and the second conductive connection portion, facilitating installation, disassembly, and maintenance; the current-carrying heat sink can simultaneously achieve current carrying and heat dissipation functions, eliminating the need for separate current-carrying and heat dissipation devices, resulting in lower costs. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0022] Figure 1 An exploded view of a circuit board device provided in an embodiment of this utility model;

[0023] Figure 2 This is a schematic diagram of the structure of a board device provided in an embodiment of the present utility model;

[0024] Figure 3 This is another structural schematic diagram of a board device provided in an embodiment of the present utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] Circuit board 10, current-carrying heat sink 20, insulating pad 30, thermally conductive pad 40, first conductive connection part 11, second conductive connection part 21, third conductive connection part 22, main body plate 23, connecting plate 24, receiving hole 31, through hole 32. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0029] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0030] See Figures 1-3 The present invention provides a board device, which includes a circuit board 10 and a current-carrying heat sink 20. The specific structure is described below:

[0031] The circuit board 10 can be a PCB board or a PCBA board, and this utility model does not specifically limit it. The current-carrying heat sink 20 has good electrical conductivity and good thermal conductivity, and can simultaneously carry current and dissipate heat. For example, the current-carrying heat sink 20 can be an aluminum plate.

[0032] The current-carrying heat sink 20 is disposed on one side of the circuit board 10, and the heat generated by the circuit board 10 can be transferred to the current-carrying heat sink 20 for heat dissipation.

[0033] Furthermore, the circuit board 10 is provided with a first conductive connection portion 11, which is understood to be connected to the internal circuitry of the circuit board 10; the current-carrying heat sink 20 is provided with a second conductive connection portion 21; the first conductive connection portion 11 and the second conductive connection portion 21 are detachably electrically connected. The number of the first conductive connection portion 11 and the second conductive connection portion 21 is the same, and there can be multiple of each.

[0034] The current-carrying heat sink 20 is used to connect to external devices to realize current transmission between the circuit board 10 and the external devices. The external devices may specifically be power supply devices, but this utility model does not specifically limit them.

[0035] In the technical solution of this utility model embodiment, the board device includes a circuit board 10 and a current-carrying heat sink 20, the current-carrying heat sink 20 being disposed on one side of the circuit board 10; the circuit board 10 having a first conductive connection portion 11, and the current-carrying heat sink 20 having a second conductive connection portion 21; the first conductive connection portion 11 and the second conductive connection portion 21 are detachably electrically connected, wherein the current-carrying heat sink 20 is used to connect with external devices to realize current transmission between the circuit board 10 and the external devices. It can be seen that the circuit board 10 and the current-carrying heat sink 20 are detachably electrically connected through the first conductive connection portion 11 and the second conductive connection portion 21, facilitating installation, disassembly, and maintenance; the current-carrying heat sink 20 can simultaneously achieve current carrying and heat dissipation functions, eliminating the need for separate current-carrying and heat dissipation devices, resulting in lower costs.

[0036] In order to achieve reliable insulation between the circuit board 10 and the current-carrying heat sink 20, in some embodiments, such as this embodiment, the board device further includes an insulating pad 30, which is disposed between the circuit board 10 and the current-carrying heat sink 20.

[0037] Specifically, the insulating pad 30 enables reliable insulation between the circuit board 10 and the current-carrying heat sink 20. The insulating pad 30 is made of an insulating material; for example, in some embodiments, the insulating pad 30 is Mylar sheet.

[0038] Furthermore, the circuit board 10 is provided with a heating device, which may specifically be a power device that generates a large amount of heat during operation.

[0039] In order to reliably transfer the heat on the circuit board 10 to the current-carrying heat sink 20 and achieve rapid heat dissipation, in some embodiments, such as this embodiment, the board device further includes a thermal pad 40, which is disposed between the heat-generating device and the current-carrying heat sink 20.

[0040] Specifically, the heat generated by the heat-generating device can be quickly transferred to the current-carrying heat sink 20 through the thermal pad 40, thereby achieving good heat dissipation.

[0041] The thermal pad 40 has good thermal conductivity, thereby enabling rapid heat transfer. For example, in some embodiments, the thermal pad 40 may specifically be a silicone sheet.

[0042] Furthermore, in some embodiments, such as this embodiment, the insulating pad 30 is provided with a receiving hole 31, and the thermally conductive pad 40 is embedded in the receiving hole 31.

[0043] Specifically, the thermal pad 40 is embedded in the receiving hole 31, and both sides of the thermal pad 40 are in contact with the circuit board 10 and the current-carrying heat sink 20, thereby reducing thermal resistance and achieving rapid heat transfer.

[0044] Furthermore, to achieve a reliable connection between the first conductive connection portion 11 and the second conductive connection portion 21, in some embodiments, such as this embodiment, one of the first conductive connection portion 11 and the second conductive connection portion 21 is a fixing hole and the other is a conductive stud, and the fixing hole and the conductive stud are detachably connected by fasteners.

[0045] Specifically, in this embodiment, the first conductive connection part 11 is a fixing hole and the second conductive connection part 21 is a conductive stud; or, in some other embodiments, the first conductive connection part 11 is a conductive stud and the second conductive connection part 21 is a fixing hole.

[0046] Furthermore, the fastener may specifically be a screw, which is inserted into the fixing hole and detachably tightened into the conductive stud. The conductive stud is at least partially embedded in the fixing hole and in contact with the inner wall of the fixing hole. The inner wall of the fixing hole is made of a conductive material and is connected to the internal circuit of the circuit board 10. The conductive stud can be used to transmit large currents. The internal circuit of the circuit board 10 can be designed by those skilled in the art according to actual needs, and this utility model is not specifically limited. The material of the conductive stud is the same as that of the current-carrying heat sink 20, and may specifically be aluminum.

[0047] To improve the reliability of the fixation, some studs that only serve a fixing function can be added to the current-carrying heat sink 20. These studs are fastened to the corresponding fixing holes on the circuit board by screws.

[0048] Furthermore, the insulating gasket 30 is provided with a through hole 32 corresponding to the conductive stud, through which the conductive stud passes. The size of the through hole 32 matches the size of the conductive stud, so that the conductive stud can pass precisely through the through hole 32.

[0049] Furthermore, in some embodiments, such as this embodiment, the external device is a power supply device used to supply power to the circuit board 10. The power supply device includes positive and negative terminals, specifically a positive terminal and a negative terminal.

[0050] Accordingly, there are two current-carrying heat sinks 20, and each current-carrying heat sink 20 is connected to the positive and negative terminals of the power supply device, respectively. The two current-carrying heat sinks 20 are insulated from each other to avoid short circuits. For example, the two current-carrying heat sinks 20 are spaced apart.

[0051] Furthermore, in order to improve the convenience of connecting with external devices, in some embodiments, such as this embodiment, the current-carrying heat sink 20 is provided with a third conductive connection portion 22, which is used to connect with the external device.

[0052] Specifically, the third conductive connection part 22 can be a conductive nut, and the positive and negative terminals of the power supply device are respectively connected to the third conductive connection part 22 (conductive nut) of the two current-carrying heat sinks 20, thereby achieving a reliable electrical connection.

[0053] Furthermore, in order to improve the convenience of connecting with external devices, in some embodiments, such as this embodiment, the current-carrying heat sink 20 includes a main body plate 23 and a connecting plate 24 disposed at an angle on one side of the main body plate 23, and the third conductive connection part 22 is disposed on the connecting plate 24.

[0054] Specifically, the connecting plate 24 is vertically disposed on one side of the main body plate 23, and the third conductive connection part 22 is disposed on the connecting plate 24, thereby enabling side connection with external devices and facilitating user operation.

[0055] The technical solution of this utility model has the following technical effects:

[0056] 1. Aluminum plates can be used for current-carrying heat sinks, which are cheaper.

[0057] 2. The circuit board and the current-carrying heat sink are detachably electrically connected through the first conductive connection part and the second conductive connection part, which improves production efficiency and yield compared with the welding method.

[0058] 3. The current-carrying heat sink has both heat dissipation and current carrying functions, which improves material utilization, reduces the types of materials, and lowers costs.

[0059] 4. The current-carrying capacity of the heat sink is stronger. The current-carrying capacity of the original design is limited by product size, PCB copper foil thickness, etc. In this utility model, the size of the current-carrying heat sink is not limited by space and can theoretically be infinitely large, thus ensuring the current-carrying capacity.

[0060] 5. Enhanced heat dissipation. The heat dissipation capacity of existing designs is limited by the power and size of the heat sink. In this invention, the entire plane of the current-carrying heat sink can dissipate heat, resulting in significantly enhanced heat dissipation capacity.

[0061] 6. The product size can be made smaller. This utility model does not require a large area of ​​copper foil for current carrying, nor does it require an additional heat sink, allowing for a smaller size and improving product competitiveness.

[0062] 7. By adding a current-carrying heat dissipation plate at the bottom, the product has higher rigidity, is not easily deformed, and is less likely to be damaged during production and transportation.

[0063] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0064] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0066] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0067] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0069] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Since these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

[0070] The above description describes specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A circuit board device, characterized in that, The device includes a circuit board and a current-carrying heat sink, the current-carrying heat sink being disposed on one side of the circuit board; the circuit board having a first conductive connection portion, and the current-carrying heat sink having a second conductive connection portion; the first conductive connection portion and the second conductive connection portion are detachably electrically connected, wherein the current-carrying heat sink is used to connect with external devices to realize current transmission between the circuit board and the external devices.

2. The board device according to claim 1, characterized in that, The circuit board assembly also includes an insulating pad, which is disposed between the circuit board and the current-carrying heat sink.

3. The board device according to claim 2, characterized in that, The circuit board is equipped with a heat-generating device, and the board assembly also includes a thermally conductive pad, which is disposed between the heat-generating device and the current-carrying heat sink.

4. The board device according to claim 3, characterized in that, The insulating pad has a receiving hole, and the thermally conductive pad is embedded in the receiving hole.

5. The board device according to claim 2, characterized in that, One of the first conductive connection portion and the second conductive connection portion is a fixing hole and the other is a conductive stud. The fixing hole and the conductive stud are detachably connected by fasteners.

6. The board device according to claim 5, characterized in that, The insulating pad has a through hole corresponding to the conductive stud, and the conductive stud passes through the through hole.

7. The board device according to claim 1, characterized in that, The current-carrying heat sink is an aluminum plate.

8. The board device according to claim 1, characterized in that, The number of current-carrying heat sinks is 2, the external device is a power supply device, and the two current-carrying heat sinks are respectively connected to the positive and negative terminals of the power supply device.

9. The board device according to claim 1, characterized in that, The current-carrying heat sink is provided with a third conductive connection part, which is used to connect with the external device.

10. The board device according to claim 9, characterized in that, The current-carrying heat sink includes a main plate and a connecting plate angled to one side of the main plate, and the third conductive connection part is disposed on the connecting plate.

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