Removal apparatus

Abstract

The utility model provides a removing device. The removing device is constructed to remove materials from a component bearing part during manufacturing of the plate-shaped component bearing part. The removal apparatus includes: a transport unit configured to hold and transport the component carrier; a removing unit configured to remove a material from a surface of the component carrier transported by the transporting unit; a cleaning unit including an ultrasonic cleaning device having an ultrasonic plate, the ultrasonic cleaning device facing at least one main surface of the component carrier transported by the transport unit; and a purge unit configured to spray a gas toward the main surface of the component carrier to remove a residue on the main surface of the component carrier.

Description

Technical Field

[0001] This utility model relates to the field of electronic devices, and in particular to a removal device. Background Technology

[0002] With the increasing functionality of component carriers equipped with one or more electronic components, the gradual miniaturization of such components, and the growing number of components to be mounted on component carriers such as printed circuit boards, increasingly powerful array-like components or packages with multiple contacts or connections are being adopted. The spacing between these contacts is becoming increasingly smaller, placing higher demands on the structural precision of the component carriers. Therefore, the manufacturing process of component carriers involves a series of operations such as drilling, polishing, and cleaning on the board, creating numerous small and dense holes (e.g., vias or through-holes) for future copper plating, component placement, and other operations.

[0003] However, in the existing process flow for producing component carriers, especially component carriers with ultra-high density holes, the holes are often blocked due to the particles generated during drilling not being thoroughly cleaned, which affects subsequent processing. For example, impurities can seep into the plating layer during copper plating, and components cannot be properly embedded or buried in the component carrier, resulting in a decline in the quality of the final product.

[0004] For the reasons mentioned above, there is an urgent need in the art for a removal device that can clean holes to improve the quality of drilling. Utility Model Content

[0005] The purpose of this invention is to provide a removal device that at least addresses the deficiencies described above in the prior art.

[0006] According to an exemplary embodiment of the present invention, a removal device is provided, which can be configured to remove material from a component carrier during the manufacture of a plate-shaped component carrier. The removal device may include: a transport unit configured to hold and transport the component carrier; a removal unit configured to remove material from a surface of the component carrier transported by the transport unit; a cleaning unit that may include an ultrasonic cleaning device having an ultrasonic plate oriented toward at least one main surface of the component carrier transported by the transport unit; and a purging unit configured to spray gas onto the main surface of the component carrier to remove residues from the main surface of the component carrier.

[0007] In the context of this application, the term "component carrier" may specifically refer to any support structure, such as a plate-like structure, capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be constructed as a mechanical and / or electronic carrier of a component. In particular, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid plate combining different carriers of the above-described types of component carriers.

[0008] In the context of this application, the term "component carrier structure" may specifically refer to a prefabricated component carrier currently being manufactured. Specifically, a component carrier structure may include multiple component carriers or prefabricated components that remain integrally connected, and these component carriers or prefabricated components may be manufactured in a batch process prior to individualization. In particular, a component carrier structure may be a panel (e.g., having a size of 18 inches × 24 inches or larger) or an array (e.g., an array of six component carriers currently being manufactured). For example, the manufactured component carrier may be a printed circuit board or an IC substrate.

[0009] In alternative embodiments, the manufactured component carrier may include a stack of at least one electrically insulating layer structure and / or at least one conductive layer structure. For example, the component carrier may be a laminate of electrically insulating and conductive layer structures, particularly formed by applying mechanical pressure and / or heat. A “stack” can provide a plate-like component carrier that offers a large mounting surface for other components while remaining very thin and compact. The term “layer structure” may specifically refer to a continuous layer, a patterned layer, or multiple discontinuous islands within a common plane.

[0010] In an alternative implementation, the component carrier is shaped like a plate. This contributes to a compact design, where the component carrier still provides a large base for mounting components. Furthermore, particularly as a bare mold for embedded electronic components, its small thickness allows for easy embedding into thin plates, such as printed circuit boards.

[0011] In an alternative implementation, the component carrier is configured as one of a group consisting of a printed circuit board, a substrate (particularly an IC substrate), and an intermediate layer.

[0012] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a board-shaped component carrier formed by laminating several conductive layer structures with several electrically insulating layer structures, for example by applying pressure and / or by providing heat. As the preferred material for PCB technology, the conductive layer structures are made of copper, while the electrically insulating layer structures can consist of resin and / or glass fiber, i.e., so-called prepreg or FR4 material. Various conductive layer structures can be formed with through-holes in the laminate, for example by laser drilling or mechanical drilling, and connected to each other in the desired manner by filling them with a conductive material (particularly copper), thus forming through-hole connections. In addition to one or more components that can be embedded in the PCB, PCBs are generally constructed to accommodate one or more components on one or two opposing surfaces of the board-shaped PCB. They can be soldered to their respective main surfaces. The dielectric portion of the PCB can consist of resin and reinforcing fibers (such as glass fiber).

[0013] At least one “component” that can be embedded in and / or surface-mounted on a component carrier may be selected from the group consisting of: non-conductive inlays (e.g., ceramic inlays, preferably including aluminum nitride or aluminum oxide), conductive inlays (e.g., metallic inlays, preferably including copper or aluminum), heat transfer units (e.g., heat pipes), light guiding elements (e.g., optical waveguides or optical conductor connections), optical elements (e.g., lenses), electronic components, or combinations thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light-emitting diode, an optical connector, a voltage converter (e.g., a DC / DC converter or an AC / DC converter), a encryption component, a transmitter and / or a receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may be embedded in the component carrier. For example, magnetic elements may be used as components. This magnetic element can be a permanent magnetic element (e.g., a ferromagnetic element, an antiferromagnetic element, a multiferromagnetic element, or a ferrite core) or a paramagnetic element. However, the component can also be a substrate, an interlayer, or another component carrier, such as in a board-in-board configuration. The component can be surface-mounted on a component carrier and / or embedded therein. Furthermore, other components can also be used as components.

[0014] In an alternative embodiment, the component carrier can be a laminated component carrier. In such an embodiment, the component carrier can be a multilayered compound that is stacked and bonded together by applying pressure and / or heat. After processing the inner layer structure of the component carrier, one or two opposing main surfaces of the processed layer structure can be symmetrically or asymmetrically covered (particularly by lamination) with one or more additional electrically insulating and / or conductive layer structures. In other words, accumulation can continue until the desired number of layers is obtained. After completing the stack of electrically insulating and conductive layer structures, the obtained layer structure or component carrier can be surface-treated, perforated, etc.

[0015] Specifically, regarding drilling, mechanical drilling, laser drilling, or other methods can be used to process the plate-shaped parts, thereby creating, for example, through holes or vias. The drilled plate-shaped parts are then transported to the removal equipment of this embodiment for further processing and cleaning.

[0016] In the foregoing of this application, the terms “longitudinal” and “longitudinal direction” may specifically refer to the transport direction of the removal equipment or a direction parallel to the transport direction, such as direction X shown in the figures; the terms “lateral” and “lateral direction” may specifically refer to a direction perpendicular to the transport direction of the removal equipment and nearly parallel to the ground on which the removal equipment is installed, such as direction Y shown in the figures; and the terms “vertical” and “vertical direction” may specifically refer to a direction perpendicular or approximately perpendicular to the ground on which the processing equipment is installed, such as direction Z shown in the figures.

[0017] Other example implementations of removing the device will be described below.

[0018] In an optional embodiment, the ultrasonic cleaning device may include an upper cleaning device and a lower cleaning device. When the component carrier is transported through the ultrasonic cleaning device by the transport unit, the upper cleaning device and the lower cleaning device may face the upper and lower main surfaces of the component carrier, respectively. This allows both the upper and lower surfaces of the component carrier to be effectively cleaned.

[0019] In an optional embodiment, the upper cleaning device and / or the lower cleaning device may include at least one ultrasonic plate.

[0020] In an alternative implementation, the ultrasonic plate may be driven by an ultrasonic generator associated with the ultrasonic plate.

[0021] In an optional embodiment, the ultrasonic cleaning device can be immersed in a pool of cleaning fluid to maximize the efficiency of ultrasonic cleaning.

[0022] In an optional embodiment, the ultrasonic cleaning device can generate ultrasonic waves with frequencies in the range of 20 kHz to 50 kHz.

[0023] In an optional embodiment, the ultrasonic cleaning device can generate ultrasonic waves with a frequency of 40 kHz.

[0024] In an optional embodiment, the transport unit may include rollers that contact at least one main surface of the component carrier. Preferably, the rollers may be arranged in a row of side-by-side rollers to achieve support and transport of the component carrier.

[0025] In an optional embodiment, when the component carrier passes through the ultrasonic cleaning device, the roller contacting the upper main surface of the component carrier can be located between the component carrier and the upper cleaning device, and the roller contacting the lower main surface of the component carrier can be located between the component carrier and the lower cleaning device. This arrangement allows the ultrasonic cleaning device to clean the component carrier while the transport unit transports it, thereby improving cleaning efficiency.

[0026] In an optional implementation, the transport unit may be driven by a motor.

[0027] In an optional embodiment, the removal unit may include an upper removal device and a lower removal device. The upper removal device and the lower removal device may be configured to contact and process the upper and lower main surfaces of the component carrier, respectively, to effectively remove particulate impurities and other contaminants from the upper and lower main surfaces of the component carrier.

[0028] In an optional embodiment, each of the upper removal device and the lower removal device may include at least one roughening roller for polishing the main surface of the component carrier.

[0029] In an optional embodiment, the surface of the roughening roller may be provided with bristles.

[0030] In an optional embodiment, the purging unit can be located in the loading area and / or unloading area of ​​the removal device. A purging unit located in the loading area can pre-purge the component carrier, initially removing particulate impurities and other contaminants from the surface and pores of the component carrier, thereby improving the overall cleaning and removal efficiency of the device.

[0031] In an optional implementation, the residue can be a liquid, such as a cleaning fluid. The purging unit located in the unloading area can not only further remove particulate impurities and other contaminants from the surface and holes of the component carrier, but also serve a drying function to remove the (cleaning) fluid remaining on the surface and in the holes of the component carrier.

[0032] In an optional embodiment, the cleaning unit may further include a container. The cleaning unit and the container are in fluid communication, and the cleaning liquid can be transported and stored in the container through a connecting line. After being filtered, the liquid can be pumped back into the cleaning unit to clean the component carrier. This arrangement of the cleaning unit, container, filter, and pump forms a circulation loop for the cleaning fluid.

[0033] In an optional embodiment, the removal device may further include a pre-cleaning unit located upstream of the cleaning unit along the transport direction of the component carrier. The pre-cleaning unit can remove particulate impurities and other contaminants from the surface and pores of the component carrier, improving the overall cleaning and removal efficiency of the device.

[0034] In an optional embodiment, the pre-cleaning unit may include at least one pre-cleaning nozzle and a container, into which the liquid after pre-cleaning the component carrier may be transported and stored.

[0035] In an optional embodiment, the container may be provided with a filter for filtering the liquid and a pump for pumping the filtered liquid back to the pre-cleaning nozzle.

[0036] In an optional embodiment, the cleaning unit may further include a rotatable cleaning device.

[0037] According to the embodiments of this application, the removal device, through the cooperation of various mechanisms such as the transport unit, the purging unit, the cleaning unit, and the pre-cleaning unit, effectively treats the surface of the component carrier plate, cleans the holes multiple times, improves the drilling quality, ensures that the plating layer on the holes will not contain foreign matter, and that the components can be properly placed, embedded, or buried in the component carrier, thereby improving the yield of the final product and ensuring the normal use of the electronic devices in the future. Attached Figure Description

[0038] The above-defined aspects and other aspects of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings. The present invention will be described below with reference to the embodiments, but the present invention is not limited to the described embodiments.

[0039] Figure 1 This is a schematic diagram of a removal device according to an embodiment of the present invention; and

[0040] Figure 2 This is a top-view schematic perspective view of an ultrasonic cleaning device installed in a removal device according to an embodiment of the present invention.

[0041] List of reference numerals in the attached diagram:

[0042] 1. Removal equipment; 10. Component carrier; 2. Transport unit; 3. Removal unit;

[0043] 32 Upper removal device; 34 Lower removal device; 4 Cleaning unit;

[0044] 42 Ultrasonic cleaning device; 422 Upper cleaning device; 424 Lower cleaning device;

[0045] 426 Ultrasonic plate; 428 Cleaning tank; 5 Blowing unit; 52 Upper blowing device;

[0046] 54 Lower purging device; 6 Pre-cleaning unit; 62 Pre-cleaning nozzle; 64 Container. Detailed Implementation

[0047] The illustrations in the accompanying drawings are schematic. It should be noted that in different drawings, similar or identical elements or features are given the same reference numerals or reference numerals that differ only in the first digit. To avoid unnecessary repetition, elements or features already described with respect to the foregoing embodiments will not be described again in subsequent descriptions.

[0048] Furthermore, spatially related terms, such as "front" and "back," "up" and "down," "left" and "right," are used to describe the relationship between one element and another as shown in the figures. Thus, spatially related terms can be applied to orientations in use that differ from those illustrated in the figures. Clearly, all such spatially related terms refer only to the orientations shown in the figures for ease of description and are not necessarily limiting, as the device according to the embodiments of this invention may be assumed to have orientations different from those illustrated in the figures during use. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0050] Figure 1A schematic diagram of a removal device 1 according to an embodiment of the present invention. The removal device 1 can be configured to remove material from the component carrier 10 during the manufacturing of the plate-shaped component carrier 10, for example, by treating the edges of holes in a perforated plate-shaped component or by cleaning the inside of the holes to remove foreign objects.

[0051] The removal device 1 may include: a transport unit 2 configured to hold and transport the component carrier 10; a removal unit 3 configured to remove material from the surface of the component carrier 10 transported by the transport unit 2; a cleaning unit 4 including an ultrasonic cleaning device 42 having an ultrasonic plate 426 facing at least one main surface of the component carrier 10 transported by the transport unit 2; and a purging unit 5 configured to spray gas onto the main surface of the component carrier 10 to remove residues on the main surface of the component carrier 10.

[0052] It is understood that the transport unit 2 can extend throughout the entire removal device 1, thereby transporting the component carrier 10 from the loading end of the removal device 1 to the various processing units of the removal device 1 until the component carrier 10 leaves the removal device 1 from the unloading end. In some embodiments, the transport unit 2 may include rollers that contact at least one main surface of the component carrier 10, and the transport unit 2 may be driven by a motor. In a preferred embodiment, the transport unit 2 may include rollers that contact both main surfaces of the component carrier 10, and only the rollers that contact the lower surface of the component carrier 10 are driven by a motor.

[0053] refer to Figure 1 As shown, the transport unit 2 includes two rows of conveyor rollers that clamp the component carrier 10, with the two rows of conveyor rollers contacting the upper and lower main surfaces of the component carrier 10, respectively. The surfaces of the conveyor rollers may be provided with rubber rings to cushion and protect the surfaces of the component carrier 10 during transport. It is understood that the transport unit 2 may also include only one row of conveyor rollers, supporting the component carrier 10 from below and transporting it to the various units of the removal device 1. Alternatively, the transport unit 2 may take other forms, such as a conveyor belt.

[0054] In some embodiments, the purging unit 5 may be located in the loading area and / or unloading area of ​​the removal device 1. (See reference...) Figure 1 As shown, along the transport direction of the removal device 1, a purging unit 5 is provided at the loading end and the unloading end of the removal device 1, respectively. The purging unit 5 can be connected to an air pump, for example, so that pressurized gas is sprayed onto the surface of the plate-shaped member through, for example, a hose or nozzle, to remove excess liquid from the surface of the plate-shaped member at the loading end and the unloading end, or residual liquid in the holes of the plate-shaped member.

[0055] The purging unit 5 may include an upper purging device 52 and a lower purging device 54. The upper purging device 52 and the lower purging device 54 may each include at least one nozzle, which is configured to spray gas onto the upper main surface and the lower main surface of the component carrier 10, respectively.

[0056] It will be understood by those skilled in the art that Figure 1 The arrangement of the purging unit 5 shown is merely illustrative; more or fewer purging units 5 can be set according to production requirements. A single purging unit 5 can be set at either the loading or unloading end, or purging units 5 can be set along the transport direction between various units, such as between the loading end and the removal unit 3, between the removal unit 3 and the cleaning unit 4, and between the cleaning unit 4 and the unloading end, to ensure the cleanliness of the plate-shaped component surface at all times.

[0057] refer to Figure 1 As shown, the removal unit 3 may include an upper removal device 32 and a lower removal device 34. When the component carrier 10 is transported by the transport unit 2 through the removal unit 3, the upper removal device 32 and the lower removal device 34 contact the upper main surface and the lower main surface of the component carrier 10, respectively, and perform processing.

[0058] Specifically, each of the upper removal device 32 and the lower removal device 34 may include four roughening rollers (e.g., Figure 1 The rollers shown have shaded lines on their surfaces) and four drive rollers (e.g. Figure 1 (The roller shown has no shaded lines on its surface). In the longitudinal direction, taking the upper removal device 32 as an example, four roughening rollers and four drive rollers can be arranged at intervals. In the vertical direction, one roughening roller of the upper removal device 32 can be aligned with one drive roller of the lower removal device 34, and correspondingly, one drive roller of the upper removal device 32 can be aligned with one roughening roller of the lower removal device 34. With this arrangement, the component carrier 10 is clamped by the upper removal device 32 and the lower removal device 34 when passing through the removal unit 3, and at least one main surface is acted upon by the roughening roller, so that the surface of the component carrier 10 is polished, and the burrs on the edge of the hole are also removed, enhancing the smoothness of the hole edge.

[0059] It is understood that the above arrangement of the roughening rollers is merely illustrative, and the number and position of the roughening rollers can be adjusted according to production requirements. For example, the upper removal device 32 and / or the lower removal device 34 can be equipped with 2, 3, 5, 6, or 7 roughening rollers, with no drive rollers between them, or with one drive roller between 2 or 3 roughening rollers. Furthermore, the arrangement of the roughening rollers in the upper removal device 32 and the lower removal device 34 can be the same or different; the specific number and arrangement will not be listed in detail here.

[0060] In some embodiments, the roughening roller may have a layer of polishing material on its surface, such as bristles or polishing pads, to polish the main surface of the component carrier 10.

[0061] The cleaning unit 4 may include an ultrasonic cleaning device 42 having an ultrasonic plate 426. The ultrasonic cleaning device 42 faces at least one main surface of the component carrier 10 being transported by the transport unit 2. The ultrasonic cleaning device 42 may include an upper cleaning device 422 and a lower cleaning device 424. When the component carrier 10 is transported by the transport unit 2 through the ultrasonic cleaning device 42, the upper cleaning device 422 and the lower cleaning device 424 face the upper and lower main surfaces of the component carrier 10, respectively.

[0062] Specifically, refer to Figure 1 Schematic diagram and Figure 2 The ultrasonic cleaning apparatus 42 shown is a perspective view. The ultrasonic cleaning apparatus 42 may have an upper cleaning device 422 and a lower cleaning device 424. When the component carrier 10 is transported by the transport unit 2 through the ultrasonic cleaning apparatus 42 of the cleaning unit 4, the upper roller of the transport unit 2 is located between the upper surface of the component carrier 10 and the upper cleaning device 422, and the lower roller of the transport unit 2 is located between the lower surface of the component carrier 10 and the lower cleaning device.

[0063] When the component carrier 10 is transported by the transport unit 2 through the ultrasonic cleaning device 42 of the cleaning unit 4, the component carrier 10 is immersed in the cleaning tank 428 of the ultrasonic cleaning device 42. Preferably, at least a portion of the transport unit 2 that holds the component carrier 10 is also immersed in the cleaning tank 428 of the ultrasonic cleaning device 42; more preferably, the transport unit 2 that holds the component carrier 10 is completely immersed in the cleaning tank 428 of the ultrasonic cleaning device 42.

[0064] As shown in the figure, the upper cleaning device 422 includes two ultrasonic plates 426 located above the component carrier 10, while the lower cleaning device 424 includes one ultrasonic plate 426 located below the component carrier 10. The upper and lower ultrasonic plates 426 are arranged in an alternating manner, and each ultrasonic plate 426 can be driven by an ultrasonic generator associated with the ultrasonic plate 426.

[0065] Specifically, after the ultrasonic generator is activated, it emits a high-frequency oscillation signal, which is converted into high-frequency mechanical oscillation by a transducer and propagates into the cleaning liquid. The ultrasonic waves radiate forward in the cleaning liquid in alternating dense and rarefaction patterns, causing the liquid to flow and generating tens of thousands of tiny bubbles with diameters ranging from 50μm to 500μm. These tiny bubbles in the liquid vibrate under the influence of the acoustic field. On the one hand, local tensile stress occurs within the liquid, creating negative pressure. This decrease in pressure causes the gas originally dissolved in the liquid to become supersaturated and escape from the liquid, forming small bubbles. On the other hand, the generated strong tensile stress "tears" the liquid apart, creating a cavity, a phenomenon known as cavitation.

[0066] Under cavitation, ultrasonic waves are transmitted into the liquid at a high frequency of over 20,000 cycles per second, alternating between compression and decompression. During decompression, vacuum bubble clusters are generated within the liquid. Under compression, these clusters are crushed, generating a powerful impact that removes dirt from the surface of the object being cleaned. During cavitation, the collapse of these bubbles can create instantaneous high pressures exceeding 1000 atmospheres.

[0067] These bubbles form and grow in the negative pressure zone where ultrasound propagates, while in the positive pressure zone, when the sound pressure reaches a certain value, the bubbles rapidly enlarge and then suddenly collapse. The collapse of the bubbles generates shock waves, creating thousands of atmospheres of pressure around them, thus breaking down the dirt and dispersing it in the cleaning liquid. When aggregated particles are coated with oil and adhere to the surface of the part being cleaned, the oil is emulsified, and the solid particles detach, thereby achieving the purpose of cleaning the part.

[0068] Understandable Figure 1 and Figure 2 The arrangement of the ultrasonic plates 426 in the illustrated cleaning apparatus is merely illustrative. Those skilled in the art can configure more or fewer ultrasonic plates 426 according to specific production requirements. For example, the upper cleaning apparatus 422 and / or the lower cleaning apparatus 424 may include one, two, three, four, five, six, or more ultrasonic plates 426. Furthermore, the arrangement of the upper and lower ultrasonic plates 426 can be the same or different. For instance, the upper and lower ultrasonic plates 426 can be arranged in a staggered manner, or they can be aligned vertically or partially overlapped.

[0069] Understandably, the arrangement of the ultrasonic plate 426 can also be determined based on factors such as the plate's emitting area and power. Typically, the power density of the ultrasonic plate 426 = emitting power (W) / emitting area (cm²) 2 The higher the power density of the ultrasonic wave, the stronger the cavitation effect, the faster the speed, and the better the cleaning effect. In some embodiments of this invention, the power density can be greater than or equal to 0.3 W / cm². 2 .

[0070] In some embodiments, the ultrasonic cleaning apparatus 42 can generate ultrasonic waves with frequencies in the range of 20 kHz to 50 kHz. Preferably, the frequency of the ultrasonic waves can be, but is not limited to, 20 kHz, 25 kHz, 30 kHz, 35 kHz, 40 kHz, 45 kHz, and 50 kHz.

[0071] In some embodiments, the cleaning tank 428 can hold cleaning liquid occupying at least half of its total volume, preferably two-thirds of its total volume. The cleaning liquid can be water or a solution with added cleaning agent, such as a chemical solvent or a water-based cleaning agent. When the cleaning liquid is water, the surface of the component carrier 10 can be cleaned solely through the physical action of ultrasonic cleaning. When the cleaning liquid contains a cleaning agent, ultrasonic cleaning achieves cleaning through physical action, while the cleaning agent achieves cleaning through chemical action, accelerating the ultrasonic cleaning effect. The combination of these two actions ensures a thorough and complete cleaning of the surface of the component carrier 10.

[0072] During use, the cleaning liquid can be heated, for example, to increase the activity of the cleaning agent and achieve a better cleaning effect. For example, the cleaning liquid can be heated to a temperature not exceeding 60°C, such as, but not limited to, 10°C, 20°C, 30°C, 40°C, 50°C, and 60°C.

[0073] In some embodiments, the cleaning unit 4 may further include a container. The cleaning unit 4 and the container are in fluid communication, and the cleaning liquid can be transported and stored in the container through a connecting pipeline. After being filtered by a filter, the liquid can be pumped back into the cleaning unit 4 to clean the component carrier. This arrangement of the cleaning unit 4, container, filter, and pump can form a circulation loop for the cleaning fluid.

[0074] In some embodiments, the cleaning unit 4 may further include a rotatable cleaning device. For example, the rotatable cleaning device may be configured to spray fluid onto the main surface of the component carrier 10 through at least one rotatable cleaning conduit. The rotatable cleaning device may rotate about a rotation axis perpendicular to the main surface of the component carrier 10, for example, about a vertical axis Z. Specifically, the rotatable cleaning conduit of the rotatable cleaning device rotates about the rotation axis, thereby spraying cleaning liquid onto the entire upper main surface of the component carrier 10 it passes over.

[0075] In some embodiments, when multiple rotatable cleaning pipes are used, the pipes can be arranged radially around the axis of rotation. For example, with three cleaning pipes, the angle between two adjacent pipes can be 120 degrees; with four pipes, they can be arranged in a cross shape; or five, six, or more pipes can be provided to supply sufficient cleaning fluid to the main surface of the component carrier 10. With even more cleaning pipes, they can be fixed rather than rotating; in the fixed case, the fluid supplied by the pipes can still rinse the entire main surface of the component carrier 10.

[0076] Understandably, the arrangement of the cleaning pipes in a rotatable cleaning device can be adjusted and changed according to different production needs.

[0077] Furthermore, the number of cleaning pipes can be determined based on factors such as the surface area of ​​the main surface of the component carrier 10 to be treated and the distance between the pipe nozzle and the main surface of the component carrier 10. For example, the larger the surface area of ​​the main surface, the more cleaning pipes can be; the farther the pipe nozzle is from the main surface of the component carrier 10, the more cleaning pipes can be, and vice versa.

[0078] In some implementations, the cleaning pipes can be made of different materials. For example, the cleaning pipes can be made of metal, preferably with an anti-corrosion coating on the surface. Alternatively, the cleaning pipes can be made of corrosion-resistant plastics.

[0079] In some embodiments, the rotatable cleaning device can spray fluid at a pressure in the range of 90 bar to 110 bar through a cleaning pipe. Preferably, the fluid pressure can be, but is not limited to, 90 bar, 95 bar, 100 bar, 105 bar, or 110 bar.

[0080] In some embodiments, the rotational angular velocity w of the cleaning pipe, the transport speed v of the transport unit 2, and the length L of the component carrier 10 along the transport direction X can be set to satisfy the formula: w = 4πv / L.

[0081] For example, if the length L of the component carrier 10 to be processed is typically 518 mm, and the transport speed v of the transport unit 2 can be set to 2 m / min, then the rotational angular velocity w of the cleaning pipe can be set to 48.5 radians / min.

[0082] In some embodiments, the removal device 1 may further include a pre-cleaning unit 6 located upstream of the cleaning unit 4 along the transport direction of the component carrier 10. The pre-cleaning unit 6 may include at least one pre-cleaning nozzle 62 and a container 64, into which liquid after pre-cleaning the component carrier 10 is conveyed and stored.

[0083] For example, refer to Figure 1 As shown, the pre-cleaning unit 6 is equipped with eight pre-cleaning nozzles 62 and a container 64. Four pre-cleaning nozzles 62 are located above the transport unit 2, and the other four are located below the transport unit 2. They supply liquid to the upper and lower main surfaces of the component carrier 10, respectively, to perform pre-cleaning. The pre-cleaned liquid is transported and stored in the lower container 64. The container 64 may be equipped with a filter to filter the liquid and a pump to pump the filtered liquid back to the pre-cleaning nozzles 62, such as P1-P6 shown in the figure.

[0084] In some embodiments, the pressure of the liquid provided by the pre-cleaning unit 6 can be in the range of 10 bar to 17 bar. Preferably, the pressure of the liquid provided by the pre-cleaning unit 6 can be, for example, but not limited to, 10 bar, 11 bar, 12 bar, 13 bar, 14 bar, 15 bar, 16 bar, or 17 bar.

[0085] Furthermore, those skilled in the art will understand that, in the case of high production volume, the transport unit 2 continuously conveys multiple spaced-apart component carriers 10 through the removal device 1. Therefore, each unit of the removal device 1 may not require sensing devices and can operate continuously to process the passing component carriers 10. Alternatively, the removal device 1 may also be equipped with sensing devices, such as infrared sensors, which can be located at the entrance of each unit. When the sensing device detects the arrival of a component carrier 10, the transport unit 2 stops. After each unit completes the processing of the component carrier 10, the transport unit 2 continues to operate to transport the processed component carrier 10 to the next unit or away from the removal device 1.

[0086] In summary, the operating principle of the removal device 1 provided by the exemplary embodiment of this utility model is as follows: The component carrier 10 to be processed enters the removal device 1 at the loading end, and is first transported by the transport unit 2 to the purging unit 5. The purging unit 5 sprays pressurized gas onto the main surface of the component carrier 10 to remove residual liquid and some contaminants from the previous process from the main surface. Then, it is transported by the transport unit 2 to the removal unit 3. The rough roller of the removal unit 3 processes the main surface, making the main surface polished and the edges of the holes flat. Then, it is transported by the transport unit 2 to the pre-cleaning unit 6. The pre-cleaning unit 6 uses a low-pressure liquid to pre-clean the component carrier 10. Then, it is transported by the transport unit 2 to the cleaning unit 4. The ultrasonic cleaning device 42 in the cleaning unit 4 performs a deep cleaning of the component carrier 10 again using ultrasonic waves to ensure that there are no foreign objects in all the holes of the component carrier 10. Finally, it is transported by the transport unit 2 to another purging unit 5 to blow away the residual liquid on the main surface and in the holes of the component carrier 10, and then it is transported to the unloading end.

[0087] Although, in the exemplary embodiment shown, the removal device 1 includes a purging unit 5, a removal unit 3, a pre-cleaning unit 6, a cleaning unit 4, and another purging unit 5 along the transport direction, those skilled in the art will understand that the number and arrangement order of the various units are not fixed. Depending on different production requirements, the removal device 1 may include more purging units 5, removal units 3, pre-cleaning units 6, and cleaning units 4, and the arrangement order of the various units may also vary, as long as the component carrier 10 is ultimately thoroughly cleaned.

[0088] Unless the context explicitly requires it, the word "comprising" and similar terms in the specification and claims are considered to have an inclusive meaning, as opposed to an exclusive or comprehensive meaning; that is, they mean "including but not limited to". The use of singular or plural terms also includes the plural or singular, respectively. Furthermore, when the terms "here", "above", "below", and similar terms are used in this application, they refer to the entire application and not to any particular part of it.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A removal device, characterized in that, The removal device (1) is configured to remove material from the component carrier (10) during the manufacture of the plate-shaped component carrier (10), and the removal device (1) includes: Transport unit (2), the transport unit (2) being configured to hold and transport the component carrier (10); Removal unit (3) is configured to remove material from the surface of the component carrier (10) being transported by the transport unit (2); Cleaning unit (4), the cleaning unit (4) including an ultrasonic cleaning device (42) having an ultrasonic plate (426), the ultrasonic cleaning device (42) facing at least one main surface of the component carrier (10) being transported by the transport unit (2); and A purging unit (5) is configured to spray gas onto the main surface of the component carrier (10) to remove residues on the main surface of the component carrier (10).

2. The removal device according to claim 1, characterized in that, The ultrasonic cleaning device (42) includes an upper cleaning device (422) and a lower cleaning device (424). When the component carrier (10) is transported by the transport unit (2) through the ultrasonic cleaning device (42), the upper cleaning device (422) and the lower cleaning device (424) face the upper main surface and the lower main surface of the component carrier (10), respectively.

3. The removal device according to claim 2, characterized in that, The upper cleaning device (422) and / or the lower cleaning device (424) include at least one ultrasonic plate (426).

4. The removal device according to claim 3, characterized in that, The ultrasonic plate (426) is driven by an ultrasonic generator associated with the ultrasonic plate.

5. The removal device according to any one of claims 1 to 4, characterized in that, The ultrasonic cleaning device (42) is immersed in the cleaning solution.

6. The removal device according to any one of claims 1 to 4, characterized in that, The ultrasonic cleaning device (42) generates ultrasonic waves with a frequency range of 20 kHz to 50 kHz.

7. The removal device according to any one of claims 2 to 4, characterized in that, The transport unit (2) includes a roller that contacts at least one main surface of the component carrier (10).

8. The removal device according to claim 7, characterized in that, When the component carrier passes through the ultrasonic cleaning device (42), the roller that contacts the upper main surface of the component carrier is located between the component carrier and the upper cleaning device (422), and the roller that contacts the lower main surface of the component carrier is located between the component carrier and the lower cleaning device (424).

9. The removal device according to any one of claims 1 to 4, characterized in that, The transport unit (2) is driven by a motor.

10. The removal device according to claim 1 or 2, characterized in that, The removal unit (3) includes an upper removal device (32) and a lower removal device (34), which are configured to contact and process the upper and lower main surfaces of the component carrier (10), respectively.

11. The removal device according to claim 10, characterized in that, Each of the upper removal device (32) and the lower removal device (34) includes at least one roughening roller for polishing the main surface of the component carrier (10).

12. The removal device according to claim 11, characterized in that, The surface of the rough roller is provided with bristles.

13. The removal device according to claim 1 or 2, characterized in that, The purging unit (5) is located in the loading area and / or unloading area of ​​the removal device (1).

14. The removal device according to claim 1, characterized in that, The residue is a liquid.

15. The removal device according to claim 1 or 2, characterized in that, The removal device (1) also includes a pre-cleaning unit (6) upstream of the cleaning unit (4) along the transport direction of the component carrier (10).

16. The removal device according to claim 15, characterized in that, The pre-cleaning unit (6) includes at least one pre-cleaning nozzle and a container, into which the liquid after pre-cleaning the component carrier (10) is transported and stored.

17. The removal device according to claim 16, characterized in that, The container is equipped with a filter for filtering the liquid and a pump for pumping the filtered liquid back to the pre-cleaning nozzle.

18. The removal device according to claim 1, characterized in that, The cleaning unit (4) also includes a rotatable cleaning device.

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