Circuit board tin immersion clamping device for full-automatic tin immersion machine
The innovative design of the clamping and adjustment mechanism solves the problems of versatility and flexibility of the circuit board tinning device, achieving stable clamping and precise positioning of different circuit boards, improving tinning efficiency and quality, and reducing production costs.
Patent Information
- Application Number
- CN202520245446.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-02-17
AI Technical Summary
Existing circuit board tinning equipment lacks versatility and flexibility, making it difficult to adapt to different types and sizes of circuit boards, resulting in high production costs and long preparation times.
It employs a clamping and adjusting mechanism, including a T-shaped movable plate, an electric telescopic rod, and a stepper motor. The spacing of the clamping bars is adjusted through sliding connections, threaded holes, and bolts, and the rubber layer increases friction to achieve stable clamping of different circuit boards. The position is precisely adjusted by the stepper motor.
It improves the accuracy and stability of circuit board tinning operations, reduces manual intervention, enhances production efficiency and product quality, avoids circuit board slippage and scratches, has strong adaptability, and reduces production costs.
Smart Images
Figure CN223843975U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board manufacturing technology, and more specifically, to a circuit board tin-dipping clamping device for a fully automatic tin-dipping machine. Background Technology
[0002] In the electronics manufacturing industry, the tin-dipping process for circuit boards is a crucial step in ensuring a reliable connection between electronic components and the circuit board. As electronic products develop towards miniaturization, high precision, and high integration, the requirements for the quality of tin-dipping of circuit boards are also increasing. Fully automatic tin-dipping machines have emerged to improve tin-dipping efficiency and quality, and reduce errors and instabilities caused by manual operation.
[0003] Existing mechanisms typically use pneumatic or electric grippers to clamp circuit boards, controlling the lifting and movement of the boards in and out of the solder bath via linear guides and cylinders. However, different types and sizes of circuit boards vary in shape, thickness, and pin layout. Simple mechanical clamping devices often only clamp specific types or size ranges of circuit boards, lacking versatility and flexibility. When producing multiple different specifications of circuit boards, it is necessary to frequently change clamping devices or make complex adjustments, increasing production costs and preparation time. Utility Model Content
[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a circuit board tin-dipping clamping device for a fully automatic tin-dipping machine to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A circuit board tinning clamping device for a fully automatic tinning machine includes a tinning bath, a support frame fixedly mounted on the top of the tinning bath, a support plate fixedly mounted on one side of the support frame, and a clamping mechanism mounted on the bottom of the support plate.
[0007] The clamping mechanism includes a T-shaped movable plate slidably disposed inside the support plate. A first electric telescopic rod is fixedly disposed at the bottom of the T-shaped movable plate. A fixed frame is fixedly disposed at the output end of the first electric telescopic rod. A partition is fixedly disposed inside the fixed frame. A second electric telescopic rod is fixedly disposed on both sides of the partition. A movable strip is fixedly disposed at the output end of the second electric telescopic rod. Multiple clamping strips are disposed at the bottom of the movable strip.
[0008] By adopting the above technical solution: based on the immersion bath, a stable structure is constructed through support frame and support plate, which facilitates overall layout and installation, saves space, can adjust the position in the horizontal and vertical directions, and can also adjust the spacing between the movable strip and the clamping strip to adapt to different circuit board sizes and shapes.
[0009] As a further description of the above technical solution: the movable strip is slidably connected to the fixed frame, and multiple threaded holes are opened on the surface of both the movable strip and the clamping strip. Bolts are threaded into the interior of the multiple threaded holes. A protruding block is fixedly provided at the bottom of the clamping strip, and a rubber layer is fixedly provided on one side of the protruding block.
[0010] By adopting the above technical solution, the sliding connection between the movable bar and the fixed frame makes the movement smoother, and the threaded holes and bolt connection on the surfaces of the movable bar and the clamping bar facilitate the adjustment of the clamping bar spacing, which enhances the adaptability of the device to circuit boards of different sizes, and increases the friction with the circuit board to ensure stable clamping and prevent the circuit board from slipping.
[0011] As a further description of the above technical solution: an adjustment mechanism is provided on one side of the support frame. The adjustment mechanism includes a stabilizing plate fixedly installed on one side of the support frame. A stepper motor is fixedly installed on the top of the stabilizing plate. A screw is fixedly installed at the output end of the stepper motor. One end of the screw passes through the support frame and is rotatably connected to the inner wall of the support frame. A threaded groove is opened on the surface of the T-shaped movable plate. The screw matches the threaded groove. Stabilizing frames are fixedly installed on both sides of the support frame. The cross-section of the stabilizing frame is L-shaped.
[0012] By adopting the above technical solution, precise horizontal adjustment of the T-shaped movable plate can be achieved, which facilitates accurate positioning of the circuit board, helps improve the accuracy of the tinning operation, and enhances the structural stability of the entire device, ensuring the stability of each component during the tinning operation.
[0013] The technical effects and advantages of this utility model are as follows:
[0014] By setting up a clamping mechanism, compared with existing technologies, the movable bar and the fixed frame are slidably connected, resulting in smooth and straight movement. The clamping bar is connected to the movable bar by bolts, and the spacing can be adjusted according to the size and shape of the circuit board to achieve a stable clamping. It is suitable for various circuit boards. The rubber layer on the protruding block at the bottom of the clamping bar has both elasticity and friction, which prevents the circuit board from slipping and avoids scratches, ensuring the surface quality of the circuit board. After clamping the circuit board, it is first lifted to prevent movement and collision. After tinning, it is slowly lifted to allow excess molten solder to drip smoothly, and then the clamp is released. All links work closely together to improve the efficiency and quality of tinning. The electric telescopic rod realizes automatic control, improves work efficiency and stability, reduces manual intervention, and ensures the accuracy and consistency of tinning operation.
[0015] By setting up an adjustment mechanism, compared with existing technologies, this method utilizes a stepper motor to drive a screw to rotate, which engages with the threaded groove on the surface of the T-shaped movable plate. By controlling the rotation angle and direction of the stepper motor, the T-shaped movable plate can move horizontally within the support plate, thus roughly aligning with the circuit board position and completing the initial horizontal positioning. This lays the foundation for subsequent precise clamping, improving positioning efficiency and accuracy. After the T-shaped movable plate is positioned, the first electric telescopic rod extends, pushing the fixed frame vertically downwards towards the circuit board. This enhances the device's adaptability to circuit boards of different heights, ensuring the accuracy and stability of the clamping operation, effectively avoiding clamping failures or damage to the circuit board due to unsuitable height, and improving overall work efficiency and product quality. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0017] Figure 2 This is a cross-sectional structural diagram of the clamping mechanism of this utility model.
[0018] Figure 3 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle.
[0019] Figure 4 This is a schematic diagram of the clamping mechanism of this utility model.
[0020] Figure 5 This is a schematic diagram of the adjustment mechanism of this utility model.
[0021] The attached figures are labeled as follows: 1. Solder bath; 2. Support frame; 3. Support plate; 4. T-shaped movable plate; 5. First electric telescopic rod; 6. Fixed frame; 7. Partition plate; 8. Second electric telescopic rod; 9. Movable bar; 10. Clamping bar; 11. Bolt; 12. Protrusion; 13. Rubber layer; 14. Stabilizing plate; 15. Stepper motor; 16. Screw; 17. Stabilizing frame. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] The embodiments disclosed in this application are as follows: Figure 1-5The circuit board tinning clamping device for a fully automatic tinning machine shown includes a tinning bath 1, a support frame 2 fixedly installed on the top of the tinning bath 1, a support plate 3 fixedly installed on one side of the support frame 2, and a clamping mechanism installed at the bottom of the support plate 3.
[0024] The clamping mechanism includes a T-shaped movable plate 4 slidably disposed inside the support plate 3. A first electric telescopic rod 5 is fixedly disposed at the bottom of the T-shaped movable plate 4. A fixed frame 6 is fixedly disposed at the output end of the first electric telescopic rod 5. A partition 7 is fixedly disposed inside the fixed frame 6. A second electric telescopic rod 8 is fixedly disposed on both sides of the partition 7. A movable bar 9 is fixedly disposed at the output end of the second electric telescopic rod 8. Multiple clamping bars 10 are disposed at the bottom of the movable bar 9. When the movable bar 9 continues to move toward the circuit board, the protrusion 12 at the bottom of the clamping bar 10 first contacts the edge of the circuit board. Then, the first electric telescopic rod 5 slowly extends, driving the fixed frame 6 and the clamped circuit board to descend uniformly into the molten solder bath 1. According to the preset molten solder bath process parameters, the control system precisely controls the descent speed and immersion depth of the first electric telescopic rod 5, so that the circuit board stays in the molten solder for a suitable time, so as to ensure that each solder joint and connection part of the circuit board can be uniformly plated with a molten solder layer of the required thickness.
[0025] After the tinning time is over, the first electric telescopic rod 5 retracts, slowly lifting the circuit board from the tinning bath 1. During the lifting process, excess molten solder can drip smoothly back into the tinning bath 1. When the circuit board is lifted to a certain height, the second electric telescopic rod 8 retracts, driving the movable bar 9 to move away from the circuit board, causing the clamping bar 10 to loosen its grip on the circuit board and transport it to the subsequent process.
[0026] Reference Figure 2-3 As shown, the movable bar 9 is slidably connected to the fixed frame 6. Both the movable bar 9 and the clamping bar 10 have multiple threaded holes on their surfaces, and bolts 11 are threaded into the interior of each threaded hole. A protrusion 12 is fixedly provided at the bottom of the clamping bar 10, and a rubber layer 13 is fixedly provided on one side of the protrusion 12. When the movable bar 9 continues to move toward the circuit board, the protrusion 12 at the bottom of the clamping bar 10 first contacts the edge of the circuit board. The rubber layer 13 on one side of the protrusion 12 has a certain elasticity and friction, which can increase the contact friction with the circuit board, ensuring that the circuit board will not slip during the tinning process, and also avoid scratching the surface of the circuit board, thereby achieving stable clamping of the circuit board. After the circuit board is firmly clamped, the first electric telescopic rod 5 retracts a certain distance again, slightly lifting the circuit board to prevent the circuit board from colliding with the edge of the tinning bath 1 or other components during subsequent movement.
[0027] Reference Figure 4-5As shown, an adjustment mechanism is provided on one side of the support frame 2. The adjustment mechanism includes a stabilizing plate 14 fixedly installed on one side of the support frame 2. A stepper motor 15 is fixedly installed on the top of the stabilizing plate 14. A screw 16 is fixedly installed at the output end of the stepper motor 15. One end of the screw 16 passes through the support frame 2 and is rotatably connected to the inner wall of the support frame 2. A threaded groove is opened on the surface of the T-shaped movable plate 4. The screw 16 matches the threaded groove. Stabilizing frames 17 are fixedly installed on both sides of the support frame 2. The cross-section of the stabilizing frame 17 is L-shaped. When the stepper motor 15 is started, the output shaft of the stepper motor 15 drives the screw 16 to rotate. Since the T-shaped movable plate 4 has a threaded groove that matches the screw 16, the rotation of the screw 16 causes the T-shaped movable plate 4 to move horizontally inside the support plate 3. By controlling the rotation angle and direction of the stepper motor 15, the T-shaped movable plate 4 can be roughly aligned with the position of the circuit board, completing the initial positioning of the clamping mechanism in the horizontal direction.
[0028] After the position of the T-shaped movable plate 4 is determined, the first electric telescopic rod 5 fixed at its bottom is activated and extended. The first electric telescopic rod 5 pushes the fixed frame 6 to move downward in the vertical direction, so that the fixed frame 6 gradually approaches the circuit board. During the descent of the fixed frame 6, the extension amount of the first electric telescopic rod 5 can be finely adjusted by the control system according to the actual height of the circuit board to ensure that the fixed frame 6 descends to a suitable height so that the movable strip 9 can accurately contact the two sides of the circuit board.
[0029] Working principle of this utility model:
[0030] This utility model is a circuit board tinning clamping device for a fully automatic tinning machine. When using this device, first ensure that an appropriate amount of molten solder at a suitable temperature has been added to the tinning bath 1. When the circuit board to be tinned is transported to a designated position near the external tinning machine, start the stepper motor 15. The output shaft of the stepper motor 15 drives the screw 16 to rotate. Since the surface of the T-shaped movable plate 4 has a threaded groove that matches the screw 16, the rotation of the screw 16 causes the T-shaped movable plate 4 to move horizontally inside the support plate 3. By controlling the rotation angle and direction of the stepper motor 15, the T-shaped movable plate 4 can be roughly aligned with the position of the circuit board, completing the initial positioning of the clamping mechanism in the horizontal direction.
[0031] After the position of the T-shaped movable plate 4 is determined, the first electric telescopic rod 5 fixed at its bottom is activated and extended. The first electric telescopic rod 5 pushes the fixed frame 6 to move downward in the vertical direction, so that the fixed frame 6 gradually approaches the circuit board. During the descent of the fixed frame 6, the extension amount of the first electric telescopic rod 5 can be finely adjusted by the control system according to the actual height of the circuit board to ensure that the fixed frame 6 descends to a suitable height so that the movable strip 9 can accurately contact the two sides of the circuit board.
[0032] Once the fixed frame 6 reaches the appropriate height, the second electric telescopic rods 8 on both sides of the partition 7 begin to work. The second electric telescopic rods 8 extend and push the movable strip 9 to move horizontally toward the circuit board within the fixed frame 6. Because the movable strip 9 and the fixed frame 6 are slidably connected, its movement is smooth and straight. Multiple clamping strips 10 are provided at the bottom of the movable strip 9. They are threadedly connected to the threaded holes on the surface of the movable strip 9 by bolts 11, allowing the distance between the clamping strips 10 to be flexibly adjusted within a certain range according to the specific size and shape of the circuit board to achieve a better clamping effect.
[0033] As the movable bar 9 continues to move toward the circuit board, the protrusion 12 at the bottom of the clamping bar 10 first contacts the edge of the circuit board. The rubber layer 13 on one side of the protrusion 12 has a certain elasticity and friction, which can increase the contact friction with the circuit board to ensure that the circuit board will not slip during the tin dipping process, and also avoid scratching the surface of the circuit board, thereby achieving stable clamping of the circuit board. After the circuit board is firmly clamped, the first electric telescopic rod 5 retracts a certain distance again to slightly lift the circuit board and prevent the circuit board from colliding with the edge of the tin dipping bath 1 or other components during subsequent movement.
[0034] Subsequently, the first electric telescopic rod 5 slowly extends, driving the fixed frame 6 and the clamped circuit board to descend at a constant speed into the molten solder bath 1. According to the preset molten solder bath process parameters, the control system precisely controls the descent speed and immersion depth of the first electric telescopic rod 5, so that the circuit board stays in the molten solder for a suitable time, so as to ensure that each solder joint and connection part of the circuit board can be uniformly plated with a molten solder layer of the required thickness.
[0035] After the tinning time is over, the first electric telescopic rod 5 retracts, slowly lifting the circuit board from the tinning bath 1. During the lifting process, excess molten solder can drip smoothly back into the tinning bath 1. When the circuit board is lifted to a certain height, the second electric telescopic rod 8 retracts, driving the movable bar 9 to move away from the circuit board, causing the clamping bar 10 to loosen its grip on the circuit board and transport it to the subsequent process.
[0036] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A circuit board tin-dipping clamping device for a fully automatic tin-dipping machine, comprising a tin-dipping bath (1), characterized in that: A support frame (2) is fixedly installed on the top of the tin-immersion bath (1), a support plate (3) is fixedly installed on one side of the support frame (2), and a clamping mechanism is installed at the bottom of the support plate (3). The clamping mechanism includes a T-shaped movable plate (4) slidably disposed inside the support plate (3). A first electric telescopic rod (5) is fixedly disposed at the bottom of the T-shaped movable plate (4). A fixed frame (6) is fixedly disposed at the output end of the first electric telescopic rod (5). A partition (7) is fixedly disposed inside the fixed frame (6). A second electric telescopic rod (8) is fixedly disposed on both sides of the partition (7). A movable strip (9) is fixedly disposed at the output end of the second electric telescopic rod (8). A plurality of clamping strips (10) are disposed at the bottom of the movable strip (9).
2. The circuit board tinning clamping device for a fully automatic tinning machine according to claim 1, characterized in that: The movable strip (9) is slidably connected to the fixed frame (6). The surfaces of the movable strip (9) and the clamping strip (10) are provided with multiple threaded holes, and bolts (11) are threadedly connected inside the multiple threaded holes.
3. The circuit board tinning clamping device for a fully automatic tinning machine according to claim 1, characterized in that: The bottom of the clamping bar (10) is fixedly provided with a protrusion (12), and a rubber layer (13) is fixedly provided on one side of the protrusion (12).
4. The circuit board tinning clamping device for a fully automatic tinning machine according to claim 1, characterized in that: An adjustment mechanism is provided on one side of the support frame (2). The adjustment mechanism includes a stabilizing plate (14) fixedly installed on one side of the support frame (2). A stepper motor (15) is fixedly installed on the top of the stabilizing plate (14). A screw (16) is fixedly installed at the output end of the stepper motor (15). One end of the screw (16) passes through the support frame (2) and is rotatably connected to the inner wall of the support frame (2).
5. The circuit board tin-dipping clamping device for a fully automatic tin-dipping machine according to claim 4, characterized in that: The surface of the T-shaped movable plate (4) is provided with a threaded groove, and the screw (16) is matched with the threaded groove.
6. The circuit board tin-dipping clamping device for a fully automatic tin-dipping machine according to claim 1, characterized in that: Both sides of the support frame (2) are fixedly provided with a stabilizing frame (17), and the cross-section of the stabilizing frame (17) is L-shaped.