Self-heat-dissipation mica sheet device
By setting components such as air frame, air inlet filter, air outlet filter, air collector and guide plate on mica sheet, an efficient air circulation channel is formed, and heat sink and spikes are used to increase the heat dissipation area, which solves the problem of low heat dissipation efficiency of traditional mica sheet and is suitable for electronic devices with limited space.
Patent Information
- Application Number
- CN202423277307.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Traditional mica sheets have low heat dissipation efficiency and are limited in the installation of additional heat dissipation devices in space-constrained electronic devices.
Design a self-heating mica sheet device, including a wind frame, an air inlet filter, an air outlet filter, an air collector cover, an air inlet pipe, and a guide plate. These components form an efficient air circulation channel, utilizing external cold air to directly blow onto the mica sheet for heat dissipation, and increasing the heat dissipation area by setting heat sinks and heat dissipation spikes.
It achieves efficient self-heating function of mica sheets, is suitable for electronic devices with limited space, improves heat dissipation efficiency, and has a compact structure.
Smart Images
Figure CN223844094U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of mica sheet technology, specifically relating to a self-heating mica sheet device. Background Technology
[0002] Mica sheets are an important insulating material widely used in electronic and electrical equipment. During the operation of many electronic devices, the temperature of the mica sheet rises due to the heat generated by the current flowing through it. If heat cannot be dissipated effectively and in a timely manner, excessively high temperatures can affect the insulation performance of the mica sheet and even lead to equipment malfunction.
[0003] Traditional mica sheet heat dissipation methods mainly rely on the overall heat dissipation system of the device, such as passive heat dissipation through fans or heat sinks inside the chassis. However, with the continuous increase in the power of electronic devices, this passive heat dissipation method often cannot meet the heat dissipation efficiency requirements of mica sheets. Moreover, in some electronic devices with limited space, installing additional heat dissipation devices is subject to space constraints. Therefore, a self-heating mica sheet device is needed to solve the above problems. Utility Model Content
[0004] The purpose of this invention is to provide a self-heating mica sheet device to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a self-heating mica sheet device, comprising a mica sheet, a wind frame fixedly disposed on the mica sheet, multiple air inlet filter holes and multiple air outlet filter holes respectively opened on both sides of the wind frame, an air collecting hood connected to one side of the multiple air inlet filter holes, an air inlet pipe connected to one end of the air collecting hood, and two guide plates fixedly disposed inside the air collecting hood.
[0006] By incorporating inlet filters, the air frame on the mica sheet can directly dissipate heat from the mica sheet. The inlet and outlet filters on both sides of the air frame form a good airflow channel. The air collector hood connected to one side of the inlet filters can effectively gather air and introduce external cold air through the air inlet pipe. The guide plate inside the air collector hood can optimize the airflow direction, allowing the cold air to be precisely blown onto the mica sheet, carrying away heat and then being discharged from the outlet filters, achieving a highly efficient self-heating function. This solves the problem of low heat dissipation efficiency of traditional mica sheets and has a compact structure, making it suitable for electronic devices with limited space.
[0007] In a preferred embodiment, the two guide vanes are arranged obliquely inside the air collection shroud.
[0008] In a preferred embodiment, a plurality of heat sinks are fixedly disposed on the mica sheet, the plurality of heat sinks are located within the air frame, and the plurality of heat sinks are provided with heat dissipation spikes.
[0009] In a preferred embodiment, the plurality of heat sinks are arranged vertically in the air frame plate where the plurality of air inlet filters and the plurality of air outlet filters are located.
[0010] In a preferred embodiment, the upper surface of the wind frame is open.
[0011] In a preferred embodiment, multiple connecting blocks are fixedly provided on both the front and back of the wind frame.
[0012] By incorporating heat sinks, the heat dissipation area of the mica sheet is increased, while the heat dissipation spikes further increase the surface area in contact with the air, allowing heat to dissipate more quickly into the flowing air. The upper surface of the fan frame is designed with openings to facilitate better air circulation and exchange, allowing the cool air entering from the air inlet filter to come into full contact with the mica sheet, heat sinks, and heat dissipation spikes, carrying away heat before being discharged from the air outlet filter, further optimizing the device's heat dissipation performance.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] This invention, by setting an air inlet filter, allows the air frame on the mica sheet to directly act on the mica sheet for heat dissipation. The air inlet and outlet filters on both sides of the air frame form a good airflow channel. The air collector hood connected to one side of the air inlet filter can effectively gather air, and external cold air is introduced through the air inlet pipe. The guide plate inside the air collector hood can optimize the airflow direction, so that the cold air can be accurately blown onto the mica sheet, carrying away heat and being discharged from the air outlet filter, achieving a highly efficient self-heating function. This solves the problem of low heat dissipation efficiency of traditional mica sheets, and the structure is compact, making it suitable for electronic devices with limited space.
[0015] This invention, by incorporating heat sinks, increases the heat dissipation area of the mica sheet, while the heat dissipation spikes further increase the surface area in contact with the air, allowing heat to dissipate more quickly into the flowing air. The upper surface of the fan frame is designed with an opening, which facilitates better air circulation and exchange, allowing the cold air entering from the air inlet filter to make more full contact with the mica sheet, heat sink, and heat dissipation spikes, carrying away heat before being discharged from the air outlet filter, thus further optimizing the heat dissipation performance of the device. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention;
[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the mica sheet of this utility model;
[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of this utility model viewed from below.
[0019] In the diagram: 1. Mica sheet; 2. Air frame; 3. Inlet filter; 4. Outlet filter; 5. Air collector cover; 6. Inlet duct; 7. Guide plate; 8. Heat sink; 9. Heat sink spikes; 10. Connecting block. Detailed Implementation
[0020] The present invention will be further described below with reference to the embodiments.
[0021] The following embodiments are used to illustrate the present invention, but should not be used to limit the scope of protection of the present invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the premise of the concept of the present invention are all within the scope of protection claimed by the present invention.
[0022] Please see Figure 1-3 This utility model provides a self-heating mica sheet device, including a mica sheet 1, a wind frame 2 fixedly mounted on the mica sheet 1, multiple air inlet filters 3 and multiple air outlet filters 4 respectively opened on both sides of the wind frame 2, an air collecting hood 5 connected to one side of the multiple air inlet filters 3, an air inlet pipe 6 connected to one end of the air collecting hood 5, and two guide plates 7 fixedly mounted inside the air collecting hood 5. By setting the air inlet filters 3, the wind frame 2 on the mica sheet 1 can directly act on the mica sheet 1 for heat dissipation. The air inlet filters 3 and the air outlet filters 4 on both sides of the wind frame 2 can form a good air circulation channel. The air collecting hood 5 connected to one side of the air inlet filters 3 can effectively collect air, and introduce external cold air through the air inlet pipe 6. The guide plates 7 inside the air collecting hood 5 can optimize the airflow direction, so that the cold air can be accurately blown towards the mica sheet 1, and after taking away the heat, it is discharged from the air outlet filters 4, realizing a highly efficient self-heating function. This solves the problem of low heat dissipation efficiency of traditional mica sheets, and the structure is compact, making it suitable for electronic devices with limited space.
[0023] Two guide vanes 7 are obliquely arranged inside the air collection hood 5.
[0024] Multiple heat sinks 8 are fixedly installed on the mica sheet 1. The multiple heat sinks 8 are located inside the air frame 2. The multiple heat sinks 8 are provided with heat dissipation spikes 9.
[0025] Multiple heat sinks 8 are arranged vertically on the surface of the air frame 2 where multiple air inlet filters 3 and multiple air outlet filters 4 are located.
[0026] The upper surface of wind frame 2 is open.
[0027] Multiple connecting blocks 10 are fixedly installed on both the front and back of the fan frame 2. By setting heat sinks 8, the heat sink 8 increases the heat dissipation area of the mica sheet 1, while the heat dissipation spikes 9 further increase the surface area in contact with the air, so that heat can be dissipated into the flowing air more quickly. The upper surface of the fan frame 2 is designed with an opening, which helps the air to circulate and exchange better, so that the cold air entering from the air inlet filter hole 3 can come into more full contact with the mica sheet 1, heat sink 8 and heat dissipation spikes 9, and after taking away the heat, it is discharged from the air outlet filter hole 4, further optimizing the heat dissipation performance of the device.
[0028] The working principle and usage process of this utility model are as follows: First, the mica sheet 1 serves as the core component, with a wind frame 2 fixed on its top. The upper surface of the wind frame 2 is designed with an opening, which facilitates airflow within the device. Multiple inlet filters 3 and multiple outlet filters 4 are respectively arranged on both sides of the wind frame 2. One side of the multiple inlet filters 3 is connected to an air collecting hood 5, and one end of the air collecting hood 5 is connected to an inlet pipe 6. External cold air enters the air collecting hood 5 through the inlet pipe 6. Inside the air collecting hood 5, two diagonally arranged guide plates 7 are used to guide the flow of cold air, making it more effectively blown onto the mica sheet 1. Multiple heat sinks 8 are also fixed on the mica sheet 1, and these heat sinks 8 are vertically aligned... The air frame 2, which is located on the air inlet filter 3 and the air outlet filter 4, is arranged in a straight line. The heat sink 8 is provided with heat dissipation spikes 9. These heat dissipation spikes 9 greatly increase the heat dissipation area and help the heat dissipate quickly. In addition, multiple connecting blocks 10 are fixed on the front and back of the air frame 2. The entire self-heating mica sheet device can be firmly installed in the electronic equipment through these connecting blocks 10. During the operation of the equipment, cold air enters the air collector shroud 5 through the air inlet pipe 6. After being guided by the guide plate 7, it blows from the air inlet filter 3 onto the mica sheet 1 and the heat sink 8 and heat dissipation spikes 9 on it. The heat is carried away by the cold air and discharged from the air outlet filter 4, thereby realizing the efficient self-heating of the mica sheet 1.
[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A self-heating mica sheet device, comprising a mica sheet (1), characterized in that: A wind frame (2) is fixedly installed on the mica sheet (1). Multiple air inlet filter holes (3) and multiple air outlet filter holes (4) are opened on both sides of the wind frame (2). A wind collector hood (5) is connected to one side of the multiple air inlet filter holes (3). An air inlet pipe (6) is connected to one end of the wind collector hood (5). Two guide plates (7) are fixedly installed inside the wind collector hood (5).
2. The self-heating mica sheet device according to claim 1, characterized in that: The two guide vanes (7) are obliquely arranged inside the air collection shroud (5).
3. The self-heating mica sheet device according to claim 1, characterized in that: Multiple heat sinks (8) are fixedly disposed on the mica sheet (1), the multiple heat sinks (8) are located inside the air frame (2), and the multiple heat sinks (8) are provided with heat dissipation spikes (9).
4. The self-heating mica sheet device according to claim 3, characterized in that: Multiple heat sinks (8) are arranged vertically on the surface of the air frame (2) where multiple air inlet filters (3) and multiple air outlet filters (4) are located.
5. The self-heating mica sheet device according to claim 1, characterized in that: The upper surface of the wind frame (2) is open.
6. The self-heating mica sheet device according to claim 1, characterized in that: Multiple connecting blocks (10) are fixedly installed on both the front and back of the wind frame (2).