Modularized heat dissipation structure for robot controller

Abstract

The utility model relates to the technical field of heat radiators, in particular to a modularized heat radiation structure for a robot controller, which comprises a heat radiator, a plurality of heat radiation fins are distributed on the surface of the heat radiator, a heat conduction part is arranged on the other surface opposite to the heat radiation fins, and a heat conduction block matched with a CPU (Central Processing Unit) platform is detachably arranged on the heat conduction part. The detachable modular design of the heat conduction block facilitates customization of a heat dissipation system, heat dissipation modules of different specifications and performances can be selected to be combined according to different CPU platforms and heat dissipation requirements so as to meet specific heat dissipation requirements, the heat conduction block is fixed to the heat conduction part through the fastener, the installation process is faster, and the heat dissipation efficiency is improved. The working efficiency is improved, the heat conduction part is recessed towards the surface of the radiator and is in closer contact with the heat conduction block, heat resistance in the heat conduction process is reduced, and meanwhile the heat conduction block can be more accurately positioned during installation.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a modular heat dissipation structure for robot controllers. Background Technology

[0002] With the continuous advancement of intelligent manufacturing and automation technologies, the stability and reliability of robot controllers, as core components of robot systems, are of paramount importance. However, during robot operation, controllers generate a significant amount of heat. If this heat cannot be dissipated effectively and promptly, the controller temperature will rise, affecting its normal operation and potentially causing malfunctions.

[0003] Currently, common heat dissipation methods for robot controllers on the market mainly include natural cooling and forced air cooling. Natural cooling relies primarily on ventilation holes in the controller's casing and air convection for heat dissipation, but this method has low cooling efficiency and cannot meet the cooling requirements of high-power-density controllers. Forced air cooling, on the other hand, uses cooling devices such as fans to accelerate airflow and improve cooling efficiency. However, this method suffers from problems such as high fan noise, easy dust accumulation, and difficult maintenance, and the cooling effect of the fans is significantly reduced in high-dust environments.

[0004] In addition, existing robot controllers often adopt an integrated design for heat dissipation, with the heat dissipation module tightly integrated with the controller body. Once the heat dissipation module fails, the entire controller needs to be disassembled and repaired, which is cumbersome and costly.

[0005] Therefore, this application develops a modular heat dissipation structure for robot controllers to solve the problems existing in the prior art. Utility Model Content

[0006] The purpose of this invention is to provide a modular heat dissipation structure for robot controllers, in order to solve the problems in the existing technology.

[0007] The technical solution of this utility model is: a modular heat dissipation structure for a robot controller, comprising: a heat sink, wherein a plurality of heat sink fins are distributed on the surface of the heat sink, and a heat-conducting part is provided on the other side opposite to the heat sink fins, and a heat-conducting block adapted to the CPU platform is detachably provided on the heat-conducting part.

[0008] Preferably, the heat-conducting portion is recessed into the surface of the heat sink to more effectively conduct heat from the CPU platform to the heat sink.

[0009] Preferably, the surfaces of the heat sink and the heat-conducting part are provided with multiple sets of mounting holes, which match the positioning holes of the corresponding heat-conducting blocks to facilitate the installation and removal of the heat-conducting blocks.

[0010] Preferably, the surface of the heat sink is provided with a pair of grooves, the pair of grooves are symmetrical about the center of the heat sink surface, and at least a portion of the grooves are formed on the heat-conducting part, and a heat-conducting plate is installed in the groove.

[0011] Preferably, the groove has a U-shaped structure.

[0012] Preferably, the thickness of the plurality of heat sinks gradually decreases from the end closest to the heat-conducting part to the end furthest from the heat-conducting part, so as to improve heat dissipation efficiency and airflow.

[0013] Compared with the prior art, the advantages of this utility model are:

[0014] (1) The modular design of the heat dissipation block is detachable, which helps to realize the customization of the heat dissipation system. It can select heat dissipation modules of different specifications and performances to combine according to different CPU platforms and heat dissipation requirements to meet specific heat dissipation requirements.

[0015] (2) The heat-conducting block is fixed to the heat-conducting part by fasteners, which makes the installation process faster and improves work efficiency. The heat-conducting part is recessed into the surface of the heat sink and forms a closer contact with the heat-conducting block, reducing the thermal resistance in the heat conduction process. At the same time, the positioning hole of the heat-conducting block is aligned with the mounting hole of the heat sink, so that the heat-conducting block can be positioned more accurately during installation.

[0016] (3) The thickness of the heat sink gradually decreases from the end closer to the heat conductor to the end farther away from the heat conductor. The thicker part is closer to the heat conductor, which can more effectively absorb and store heat from the heat source; the thinner part is farther away from the heat conductor, which is conducive to the rapid dissipation and transfer of heat, and further reduces thermal resistance. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0018] Figure 1 This is an exploded view of a modular heat dissipation structure for a robot controller according to the present invention.

[0019] Figure 2 This is a top view of a modular heat dissipation structure for a robot controller according to the present invention;

[0020] Figure 3 This is a side view of a modular heat dissipation structure for a robot controller according to the present invention.

[0021] Figure 4 This is a diagram showing the installation structure of the N-series heat-conducting block described in this utility model;

[0022] Figure 5This is a diagram showing the installation structure of the heatsink for the 11th generation Intel Core mobile series according to this invention.

[0023] Figure 6 This is a diagram showing the installation structure of the heatsink for the 12th generation Intel Core mobile series as described in this utility model.

[0024] Wherein: 1. Heat sink; 2. Heat sink fin; 3. Heat-conducting part; 4. Heat-conducting block; 41. First groove; 42. First protrusion; 43. Second protrusion; 44. Third protrusion; 45. Fourth protrusion; 46. Second groove; 47. Third groove; 5. Groove; 6. Mounting hole; 7. Heat-conducting fin; 8. Positioning hole. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to specific embodiments:

[0026] like Figures 1-3 As shown, a modular heat dissipation structure for a robot controller includes a heat sink 1 with multiple heat sink fins 2 distributed on its surface, greatly increasing the heat dissipation area and thus improving heat dissipation efficiency. A heat-conducting part 3 is provided on the side of the heat sink 1 opposite to the heat sink fins 2. Multiple sets of mounting holes 6 are provided on the surfaces of the heat-conducting part 3 and the heat sink 1. Positioning holes 8 on a heat-conducting block 4 correspond to the mounting holes 6. The heat-conducting block 4 is fixed to the heat-conducting part 3 using fasteners, ensuring one side of the heat-conducting block 4 is tightly attached to the heat-conducting part 3. The other side of the heat-conducting block 4 is adapted to the CPU platform, enabling rapid conduction of heat generated by the CPU platform to the heat sink 1, which is then dissipated through the heat sink fins 2, ensuring efficient heat dissipation. Rapid heat transfer and effective dissipation help maintain a stable operating temperature for the CPU platform. Furthermore, securing the heat-conducting block 4 to the heat-conducting part 3 with fasteners not only makes the installation process faster and improves work efficiency, but also helps ensure a tight connection between heat dissipation modules and good heat dissipation effect. The detachable modular design of the heat-conducting block 4 facilitates the customization of the heat dissipation system. Depending on different CPU platforms and heat dissipation requirements, heat dissipation modules of different specifications and performance can be selected and combined to meet specific heat dissipation requirements. When a heat dissipation module fails or needs to be upgraded, the module can be replaced or upgraded individually without making large-scale modifications to the entire heat dissipation system.

[0027] Example 1:

[0028] like Figure 4 As shown, in the N-series CPU, the heatsink 4 has a convex structure and two positioning holes 8. The protruding part of the heatsink 4 is located on the side away from the heatsink 1 and protrudes towards the CPU side. The two positioning holes 8 are located on both sides of the protruding part.

[0029] Example 2:

[0030] like Figure 5As shown, in the 11th generation Core mobile CPU, the heatsink 4 has a convex structure and four positioning holes 8. The protruding part of the heatsink 4 is located on the side away from the heatsink 1 and protrudes towards the CPU side. A first groove 41 is provided along the width direction at the protruding position of the heatsink 4, so that the surface of the heatsink 4 forms a first protrusion 42 and a second protrusion 43, and the widths of the first protrusion 42 and the second protrusion 43 are different. The four positioning holes 8 are located at the four corners of the heatsink 4.

[0031] Example 3:

[0032] like Figure 6 As shown, in the 12th generation Core mobile CPU, the heatsink 4 has a convex structure and four positioning holes 8. The protruding part of the heatsink 4 is located on the side away from the heatsink 1 and protrudes towards the CPU side. A third protrusion 44 and a fourth protrusion 45 are provided at the protruding position of the heatsink 4. The area of ​​the third protrusion 44 and the fourth protrusion 45 is smaller than the area of ​​the protruding part of the heatsink 4, and the third protrusion 44 and the fourth protrusion 45 are set far apart from each other. The surface of the fourth protrusion 45 has a second groove 46 and a third groove 47 respectively opened along the length direction, so that the fourth protrusion 45 forms three stepped surfaces of different heights, and the height of the highest step surface is the same as the height of the third protrusion 44. The four positioning holes 8 are located at the four corners of the heatsink 4.

[0033] Furthermore, the heat-conducting part 3 is recessed into the surface of the heat sink 1, forming a closer contact with the heat-conducting block 4, reducing the thermal resistance during heat conduction. At the same time, the positioning hole 8 of the heat-conducting block 4 is aligned with the mounting hole 6 of the heat sink 1, so that the heat-conducting block 4 can be positioned more accurately during installation.

[0034] To improve CPU heat dissipation efficiency, a pair of U-shaped grooves 5 are formed on the surface of the heatsink 1, and a heat-conducting plate 7 is installed inside the grooves 5. One side of the U-shaped groove 5 is located on the heat-conducting part 3, so that the heat-conducting plate 7 is also in contact with the heat-conducting part 3. The heat-conducting plate 7 is cleverly placed inside the U-shaped groove 5 and in direct contact with the heat-conducting part 3. By optimizing the heat conduction path and reducing thermal resistance, heat can be transferred more efficiently to the surface of the heatsink 1 through the heat-conducting plate 7 and then dissipated into the air.

[0035] Furthermore, the thickness of the heat sink 2 gradually decreases from the end closest to the heat-conducting part 3 to the end furthest from the heat-conducting part 3. The thicker part is closer to the heat-conducting part 3, which can more effectively absorb and store heat from the heat source, while the thinner part is furthest from the heat-conducting part 3, which is conducive to the rapid dissipation and transfer of heat and reduces thermal resistance.

[0036] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.

Claims

1. A modular heat dissipation structure for a robot controller, characterized in that, include: Heat sink (1), the surface of which is distributed with multiple heat sinks (2), and the other side opposite to the heat sinks (2) is provided with a heat-conducting part (3), and the heat-conducting part (3) is detachably provided with a heat-conducting block (4) adapted to the CPU platform.

2. The modular heat dissipation structure for a robot controller according to claim 1, characterized in that: The heat-conducting part (3) is recessed into the surface of the heat sink (1) so as to more effectively conduct heat from the CPU platform to the heat sink (1).

3. The modular heat dissipation structure for a robot controller according to claim 1, characterized in that: The surfaces of the radiator (1) and the heat-conducting part (3) are provided with multiple sets of mounting holes (6), which are matched with the positioning holes (8) of the corresponding heat-conducting block (4) to facilitate the installation and removal of the heat-conducting block (4).

4. A modular heat dissipation structure for a robot controller according to claim 1, characterized in that: The surface of the radiator (1) is provided with a pair of grooves (5), the pair of grooves (5) are symmetrical about the center of the surface of the radiator (1), and at least part of the grooves (5) are opened on the heat-conducting part (3), and a heat-conducting plate (7) is installed in the groove (5).

5. A modular heat dissipation structure for a robot controller according to claim 4, characterized in that: The groove (5) has a U-shaped structure.

6. A modular heat dissipation structure for a robot controller according to claim 1, characterized in that: The thickness of the plurality of heat sinks (2) gradually decreases from one end near the heat-conducting part (3) to the end away from the heat-conducting part (3) to improve heat dissipation efficiency and air circulation.

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