Heat dissipation mechanism of solid-state relay

Abstract

The utility model relates to the field of solid-state relays, in particular to a heat dissipation mechanism of a solid-state relay, which comprises a first mounting seat and a second mounting seat, the first mounting seat is used for being connected with the solid-state relay, the second mounting seat is used for being slidably connected with a U-shaped clamping rail, and a supporting block is fixedly mounted between the first mounting seat and the second mounting seat. A plurality of first cooling fins are fixedly mounted on the side, close to the second mounting base, of the first mounting base, and second cooling fins are fixedly mounted on the two sides of the supporting block. The heat dissipation mechanism has the effect of reducing the damage condition of the heat dissipation mechanism.

Description

Technical Field

[0001] This application relates to the field of solid-state relays, and in particular to heat dissipation mechanisms for solid-state relays. Background Technology

[0002] Solid-state relays, as important electronic components, are widely used in power control and automation systems. With the continuous development of industrial technology, the application range of solid-state relays is constantly expanding, and their power requirements are also increasing. However, high-power solid-state relays generate a large amount of heat during operation. If this heat is not dissipated effectively and in a timely manner, it will seriously affect their performance and lifespan. Therefore, efficient and reliable heat dissipation has become one of the key aspects of solid-state relay design.

[0003] A typical solid-state relay consists of a relay body and an outer casing, with the relay body located inside the casing. A heat dissipation mechanism is also installed inside the casing, and this mechanism is in contact with the relay body. The heat dissipation mechanism has multiple heat dissipation fins, and the heat from the relay body is transferred to these fins for cooling. The outer casing has ventilation holes, allowing airflow to expel the heat from the heat dissipation fins.

[0004] However, solid-state relays generate different amounts of heat, and therefore require different heat dissipation capabilities. Existing heat dissipation mechanisms typically achieve this by adjusting the size of the heat sink fins to meet the heat dissipation needs of solid-state relays. However, as the size of the heat sink fins increases while their thickness decreases, they become prone to deformation and damage when heated. Utility Model Content

[0005] To reduce the occurrence of damage to the heat dissipation mechanism, this application provides a heat dissipation mechanism for a solid-state relay.

[0006] The heat dissipation mechanism of the solid-state relay provided in this application adopts the following technical solution:

[0007] The heat dissipation mechanism of the solid-state relay includes a first mounting base and a second mounting base. The first mounting base is used to connect with the solid-state relay, and the second mounting base is used to slide and connect with a U-shaped rail. A support block is fixedly installed between the first mounting base and the second mounting base. Multiple first heat dissipation fins are fixedly installed on the side of the first mounting base near the second mounting base, and second heat dissipation fins are fixedly installed on both sides of the support block.

[0008] By adopting the above technical solution, the heat generated by the solid-state relay is transferred to the first mounting base, which then transfers the heat to the first heat sink fins for dissipation. Simultaneously, the second fins absorb the heat dissipated by the first fins, thereby accelerating the heat dissipation speed of the first heat sink fins and improving the heat dissipation effect on the solid-state relay.

[0009] By using a first and a second heat dissipation fin for tiered heat dissipation, the size of the first heat dissipation fin can be reduced, thus minimizing the likelihood of deformation and damage to the first fin after heating, and consequently reducing the risk of damage to the heat dissipation mechanism. The second heat dissipation fin primarily absorbs the heat dissipated by the first heat dissipation fin, resulting in less heat on the second fin compared to the first, which allows for a larger size of the second heat dissipation fin to enhance heat dissipation.

[0010] Optionally, both the first and second heat dissipation fins are repeatedly bent into a pulse-rectangular configuration.

[0011] By adopting the above technical solution, both the first and second heat dissipation fins are repeatedly bent, thereby increasing the heat dissipation area and improving the heat dissipation effect of the heat dissipation mechanism on the solid-state relay.

[0012] Optionally, a first clamping block and a second clamping block are fixedly installed on the side of the second mounting base away from the first mounting base. The first clamping block and the second clamping block are used for the U-shaped rail to enter. The second clamping block is provided with a pressure block. A clamping component is installed between the pressure block and the second clamping block. The clamping component is used to drive the pressure block to clamp the U-shaped rail.

[0013] By adopting the above technical solution, solid-state relays are generally installed in electrical equipment such as power cabinets or switch cabinets. The electrical equipment has U-shaped rails for installing solid-state relays. After the U-shaped rails are inserted between the first and second clamping blocks, the clamping assembly drives the pressure block to press the U-shaped rails, thus facilitating the installation of the solid-state relays in the electrical equipment.

[0014] Optionally, the clamping assembly includes a connecting rod, an elastic rod, a limiting block, and a spring. One end of the connecting rod is fixedly connected to the pressure block, and the other end of the connecting rod is fixedly connected to one end of the elastic rod. The other end of the elastic rod is fixedly connected to the limiting block. The elastic rod and the limiting block have contraction openings. The second clamping block has a through hole for the elastic rod to pass through. The spring is fixedly installed on the pressure block and is located between the pressure block and the second clamping block. The spring is used to drive the pressure block to move away from the second clamping block.

[0015] By adopting the above technical solution, pulling the limiting block allows the pressure block to move towards the second clamping block, thus facilitating the U-shaped rail to enter between the first and second clamping blocks. After the U-shaped rail enters between the first and second clamping blocks, the limiting block is released, and the spring drives the pressure block to press the U-shaped rail, thereby keeping the solid-state relay fixed on the U-shaped rail.

[0016] Optionally, the pressure block and the first clamping block are provided with a clearance groove on the side facing each other, and the clearance groove is used to allow the edge of the U-shaped rail to enter.

[0017] By adopting the above technical solution, when the pressure block presses the U-shaped rail, the edges on both sides of the U-shaped rail will enter the clearance groove, thereby reducing the occurrence of the pressure block and the first clamping block squeezing and deforming the edges of the U-shaped rail.

[0018] Optionally, the diameter of the elastic rod gradually increases from one end near the pressure block to the other end.

[0019] By adopting the above technical solution, the diameter of the elastic rod gradually increases from one end near the pressure block to the other end, which facilitates the contact between the body of the elastic rod and the inner wall of the through hole, thereby reducing the occurrence of pressure block shaking.

[0020] Optionally, both the first mounting base and the second mounting base have mounting holes for mounting a fan.

[0021] By adopting the above technical solution, the fan is mounted on the first mounting base and the second mounting base through mounting holes. The fan increases the airflow speed between the first mounting base and the second mounting base, thereby improving the heat dissipation effect of the heat dissipation mechanism.

[0022] Optionally, a first connecting plate is fixedly installed on both sides of the second mounting base, and a second connecting plate is fixedly installed on the side of the first connecting plate away from the second mounting base. The first connecting plate is perpendicular to the second connecting plate and the second mounting base, and an installation notch is provided on the side of the second connecting plate away from the first connecting plate.

[0023] By adopting the above technical solution, after the second mounting seat moves into place along the U-shaped rail, the bolt is tightened after passing through the notch, which makes it easy for the second mounting seat to be fixed on the U-shaped rail.

[0024] In summary, this application includes at least one of the following beneficial technical effects:

[0025] 1. Heat dissipation is achieved through a first heat sink and a second heat sink. The heat generated by the solid-state relay is first transferred to the first heat sink through the first mounting base. The second heat sink assists in heat dissipation of the first heat sink, which makes it easier to reduce the size of the first heat sink while still meeting the heat dissipation needs of the solid-state relay, thereby reducing the occurrence of damage to the heat dissipation mechanism. At the same time, the second heat sink mainly absorbs the heat dissipated by the first heat sink. The temperature of the second fin is low, which makes it easier to increase the size of the second fin to improve the heat dissipation effect.

[0026] 2. By pre-drilling mounting holes on the first and second mounting bases for mounting the fan, the higher the heat dissipation capacity required by the solid-state relay, the better the heat dissipation effect of the heat dissipation mechanism on the solid-state relay can be improved by mounting the fan on the first and second mounting bases through the mounting holes. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the heat dissipation structure of this application installed on a solid-state relay and a U-shaped rail;

[0028] Figure 2 yes Figure 1 A schematic diagram of the structure after removing the outer cover;

[0029] Figure 3 This is a schematic diagram of the overall structure of an embodiment of this application;

[0030] Figure 4 This is an exploded view of the clamping assembly and the second mounting base according to an embodiment of this application;

[0031] Figure 5 yes Figure 4 Enlarged view at point A;

[0032] Figure 6 This is a schematic diagram of the structure of the clamping component according to an embodiment of this application.

[0033] Explanation of reference numerals in the attached drawings: 1. Outer casing; 2. Relay body; 3. Heat dissipation vent; 4. First mounting base; 5. Second mounting base; 6. Elevating strip; 7. Screw hole; 8. Support block; 9. First heat dissipation fin; 10. Second heat dissipation fin; 11. Mounting hole; 12. First clamping block; 13. Second clamping block; 14. Pressure block; 15. Clamping assembly; 151. Connecting rod; 152. Elastic rod; 153. Limiting block; 154. Spring; 16. Telescopic opening; 17. Clearance groove; 18. Support plate; 19. First connecting plate; 20. Second connecting plate; 21. Mounting notch. Detailed Implementation

[0034] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0035] This application discloses a heat dissipation mechanism for a solid-state relay.

[0036] Reference Figure 1 , Figure 2 The solid-state relay includes an outer casing 1 and a relay body 2. The relay body 2 is equipped with a heat dissipation mechanism. The outer casing 1 encloses the relay body 2 and the heat dissipation mechanism. Multiple heat dissipation vents 3 are provided on the outer casing 1.

[0037] Reference Figure 2 , Figure 3 The heat dissipation mechanism of the solid-state relay includes a first mounting base 4 and a second mounting base 5. Two shims 6 are fixedly installed on one side of the first mounting base 4, and screw holes 7 are provided on the shims 6. Bolts are screwed into the screw holes 7 after passing through the pre-drilled holes in the relay body 2, so as to conveniently fix the relay body 2 to the first mounting base 4.

[0038] The relay body 2 is generally composed of a circuit board and electronic components. Some electronic components do not require heat dissipation, while others do. By raising the relay body 2 with the shim 6, the electronic components that do not require heat dissipation are moved away from the first mounting base 4, while the electronic components that require heat dissipation are cooled by applying thermal grease or installing thermal pads to contact the first mounting base 4.

[0039] Reference Figure 1 , Figure 3 A support block 8 is fixedly installed between the side of the first mounting base 4 away from the shim strip 6 and the side of the second mounting base 5. The outer cover 1 is fixedly connected to the second mounting base 5 after covering the relay body 2, the first mounting base 4 and the support block 8, thereby installing the heat dissipation mechanism on the solid-state relay.

[0040] Reference Figure 3 , Figure 4 Multiple first heat dissipation fins 9 are fixedly mounted on the side of the first mounting base 4 near the second mounting base 5. The heat generated by the relay body 2 is transferred to the first mounting base 4, and then the first mounting plate transfers the heat to the first heat dissipation fins 9. The heat dissipated by the first heat dissipation fins 9 is discharged through the heat dissipation vents 3 on the outer cover 1, thereby facilitating the heat dissipation mechanism to cool the solid-state relay.

[0041] Reference Figure 3 , Figure 4 Multiple second heat dissipation fins 10 are fixedly mounted on both sides of the support block 8. When the heat emitted by the first heat dissipation fin 9 is discharged through airflow, the second heat dissipation fins 10 also absorb some of the heat emitted by the first heat dissipation fin 9, thereby accelerating the heat dissipation speed of the first heat dissipation fin 9. The accelerated heat dissipation speed of the first heat dissipation fin 9, in turn, accelerates the transfer of heat from the relay body 2 to the first heat dissipation fin 9 through the first mounting base 4, thereby improving the heat dissipation effect of the heat dissipation mechanism on the solid-state relay.

[0042] By setting up a first heat dissipation fin 9 and a second heat dissipation fin 10 for staged heat dissipation, the size of the first heat dissipation fin 9 can be reduced, thus reducing the likelihood of deformation and damage to the first heat dissipation fin 9 after heating, and consequently reducing the risk of damage to the heat dissipation mechanism. The second heat dissipation fin 10 mainly absorbs the heat dissipated by the first heat dissipation fin 9, resulting in less heat on the second heat dissipation fin 10 compared to the first heat dissipation fin 9. This allows the second heat dissipation fin 10 to be enlarged for enhanced heat dissipation.

[0043] Both the first heat dissipation fin 9 and the second heat dissipation fin 10 are repeatedly bent into a pulsed rectangular shape, thereby increasing the surface area of ​​the first heat dissipation fin 9 and the second heat dissipation fin 10, and thus improving the heat dissipation effect of the heat dissipation mechanism. In another embodiment, the first heat dissipation fin 9 and the second heat dissipation fin 10 can also be arranged in a wavy line.

[0044] Reference Figure 3 Both the first mounting base 4 and the second mounting base 5 have mounting holes 11. As the heat dissipation requirements of the solid-state relay increase, a fan is used to accelerate the airflow around the heat dissipation mechanism, thereby improving the heat dissipation effect of the heat dissipation mechanism on the solid-state relay. The fan is located outside the outer casing 1. A bolt is screwed into the mounting hole 11 after passing through the fan's pre-drilled hole and the heat dissipation vent 3 on the outer casing 1, thus facilitating fan installation.

[0045] In another embodiment, the mounting hole 11 can be used as a splicing mechanism for multiple heat dissipation mechanisms, thereby facilitating the application of heat dissipation mechanisms to solid-state relays of different sizes.

[0046] Reference Figure 4 , Figure 5 A first clamping block 12 and a second clamping block 13 are fixedly installed on the side of the second mounting base 5 away from the first mounting base 4. The second clamping block 13 is provided with a pressure block 14 and a clamping assembly 15. The clamping assembly 15 includes a connecting rod 151, an elastic rod 152, a limiting block 153, and a spring 154. One end of the connecting rod 151 is fixedly connected to the pressure block 14, and the other end of the connecting rod 151 is fixedly connected to one end of the elastic rod 152.

[0047] Reference Figure 5 , Figure 6 The other end of the elastic rod 152 is fixedly connected to the limiting block 153. Both the elastic rod 152 and the limiting block 153 have contraction openings. The telescopic opening 16 extends from the side of the limiting block 153 away from the connecting rod 151 to the elastic rod 152, dividing the limiting block 153 into two parts, with a portion of the elastic rod 152 still connected together. The second clamping block 13 has a through hole for the elastic rod 152 to pass through, and the spring 154 is fixedly installed on the pressure block 14. The spring 154 is located between the pressure block 14 and the second clamping block 13.

[0048] Solid-state relays are typically installed inside electrical equipment such as distribution cabinets and switchgear. These electrical equipments have U-shaped mounting rails for installing the solid-state relays. To install the solid-state relay, first pull the limit block 153 to move the pressure block 14 away from the first clamping block 12, then allow the U-shaped mounting rail to enter between the first clamping block 12 and the second clamping block 13. After the U-shaped mounting rail is in place, release the limit block 153; the spring 154 then causes the pressure block 14 to press the U-shaped mounting rail, thus installing the solid-state relay inside the electrical equipment.

[0049] When it is necessary to adjust the position of the solid-state relay inside the electrical equipment, pull the limit block 153 away from the pressure block 14 to release the U-shaped rail, so that the solid-state relay can slide on the U-shaped rail and thus make it easier to adjust the position of the solid-state relay.

[0050] Reference Figure 4 , Figure 5The pressure block 14 and the first clamping block 12 are provided with a relief groove 17 on the side facing each other. The edges of the U-shaped rail have protrusions. After the pressure block 14 presses the U-shaped rail, the edges of the U-shaped rail enter the relief groove 17, thereby reducing the pressure block 14 from damaging the edges of the U-shaped rail.

[0051] The clearance groove 17 located on the first clamping block 12 is arc-shaped away from the inner wall of the second mounting base 5, and the clearance groove 17 located on the pressure block 14 is inclined away from the inner wall of the second mounting base 5. After the pressure block 14 presses the U-shaped rail, the edges on both sides of the U-shaped rail are guided by the bending or inclination of the inner wall of the clearance groove 17, thereby facilitating the entry of the edges on both sides of the U-shaped rail into the clearance groove 17.

[0052] Reference Figure 6 The diameter of the elastic rod 152 gradually increases from one end near the pressure block 14 to the other end, which facilitates the contact between the rod body of the elastic rod 152 and the inner wall of the through hole, thereby reducing the occurrence of shaking of the pressure block 14.

[0053] In another embodiment, the clamping assembly 15 is a threaded drive rod with its threads threaded through a through hole, and one end of the drive rod is rotatably inserted into the pressure block 14. Rotating the drive rod then causes the pressure block 14 to clamp or loosen the U-shaped rail.

[0054] Reference Figure 5 A support plate 18 is fixedly installed on the side of the second clamping block 13 away from the second mounting base 5, and the pressure block 14 abuts against the support plate 18.

[0055] Reference Figure 4 A first connecting plate 19 is fixedly installed on both sides of the second mounting base 5, and a second connecting plate 20 is fixedly installed on the side of the first connecting plate 19 away from the second mounting base 5. The first connecting plate 19 is perpendicular to the second connecting plate 20 and the second mounting base 5, and a mounting notch 21 is provided on the side of the second connecting plate 20 away from the first connecting plate 19.

[0056] In cases where some electrical equipment lacks U-shaped rails, or where there are too many components to accommodate a solid-state relay, or where the U-shaped rails are not strong enough to support the solid-state relay, bolts can be used to pass through the mounting notch 21 and the holes opened in the electrical equipment for fixing, thus facilitating the installation of the solid-state relay in the electrical equipment.

[0057] When solid-state relays are installed on U-shaped rails, if the electrical equipment has holes for bolts to pass through, both fixing methods can be used together to improve the stability of the solid-state relay installation on the electrical equipment.

[0058] The implementation principle of the heat dissipation mechanism of the solid-state relay in this application embodiment is as follows: When the heat generated by the solid-state relay is transferred to the first heat dissipation fin 9 through the first mounting base 4 for heat dissipation, the first heat dissipation fin 9 not only has airflow to dissipate heat, but the second heat dissipation fin 10 will also absorb part of the heat dissipated by the first heat dissipation fin 9, thereby accelerating the heat dissipation effect of the first heat dissipation fin 9, and thus making it easier to reduce the size of the first heat dissipation fin 9.

[0059] After the second heat dissipation fin 10 absorbs the heat from the first heat dissipation fin 9, the heat from the second heat dissipation fin 10 is less than that from the first heat dissipation fin 9, which makes it easier to increase the size of the second heat dissipation fin 10 and thus improve the heat dissipation effect of the second heat dissipation fin 10.

[0060] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat dissipation mechanism for a solid-state relay, characterized in that: It includes a first mounting base (4) and a second mounting base (5). The first mounting base (4) is used to connect with a solid-state relay, and the second mounting base (5) is used to slide with a U-shaped rail. A support block (8) is fixedly installed between the first mounting base (4) and the second mounting base (5). Multiple first heat dissipation fins (9) are fixedly installed on the side of the first mounting base (4) near the second mounting base (5). Second heat dissipation fins (10) are fixedly installed on both sides of the support block (8).

2. The heat dissipation mechanism of the solid-state relay according to claim 1, characterized in that: The first heat dissipation fin (9) and the second heat dissipation fin (10) are both repeatedly bent into a pulse rectangle shape.

3. The heat dissipation mechanism of the solid-state relay according to claim 1, characterized in that: The second mounting base (5) is fixedly mounted with a first clamping block (12) and a second clamping block (13) on the side away from the first mounting base (4). The first clamping block (12) and the second clamping block (13) are used for the U-shaped rail to enter. The second clamping block (13) is provided with a pressure block (14). A clamping component (15) is installed between the pressure block (14) and the second clamping block (13). The clamping component (15) is used to drive the pressure block (14) to clamp the U-shaped rail.

4. The heat dissipation mechanism of the solid-state relay according to claim 3, characterized in that: The clamping assembly (15) includes a connecting rod (151), an elastic rod (152), a limiting block (153), and a spring (154). One end of the connecting rod (151) is fixedly connected to the pressure block (14), and the other end of the connecting rod (151) is fixedly connected to one end of the elastic rod (152). The other end of the elastic rod (152) is fixedly connected to the limiting block (153). The elastic rod (152) and the limiting block (153) have contraction openings. The second clamping block (13) has a through hole for the elastic rod (152) to pass through. The spring (154) is fixedly installed on the pressure block (14). The spring (154) is located between the pressure block (14) and the second clamping block (13). The spring (154) is used to drive the pressure block (14) away from the second clamping block (13).

5. The heat dissipation mechanism of the solid-state relay according to claim 4, characterized in that: The pressure block (14) and the first clamping block (12) are provided with a relief groove (17) on the side facing each other. The relief groove (17) is used for the edge of the U-shaped rail to enter.

6. The heat dissipation mechanism of the solid-state relay according to claim 4, characterized in that: The diameter of the elastic rod (152) gradually increases from one end near the pressure block (14) to the other end.

7. The heat dissipation mechanism of the solid-state relay according to claim 1, characterized in that: The first mounting base (4) and the second mounting base (5) are both provided with mounting holes (11), which are used to install fans.

8. The heat dissipation mechanism of the solid-state relay according to claim 1, characterized in that: The second mounting base (5) is fixedly mounted on both sides of the first connecting plate (19). The first connecting plate (19) is fixedly mounted on the side away from the second mounting base (5) with the second connecting plate (20). The first connecting plate (19) is perpendicular to the second connecting plate (20) and the second mounting base (5). The second connecting plate (20) is provided with an installation notch (21) on the side away from the first connecting plate (19).

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