Two-phase cold plate and liquid cooling device thereof

Abstract

The utility model discloses a two-phase cold plate and a liquid cooling device thereof, and relates to the technical field of thermal management, the two-phase cold plate is used for being arranged on a to-be-cooled part, and the two-phase cold plate is characterized by comprising a cold plate body used for absorbing heat of the to-be-cooled part, and the cold plate body comprises a plate body inlet and a plate body outlet; an inlet of the first pipeline is communicated with an external liquid supply component, and an outlet of the first pipeline is communicated with the plate body inlet, so that the cooling medium is transmitted to the cold plate body from the external liquid supply component; the second pipeline is arranged in the first pipeline and the cold plate body, the second pipeline comprises a plurality of pore structures, and the pore structures are used for adsorbing the cooling medium so as to allow the cooling medium to pass through and hinder reverse osmosis of gas; and the gas outflow pipeline is communicated with the plate body outlet so as to at least solve the problem that in the related technology, when liquid in the two-phase cold plate is gasified in the working process, the liquid is difficult to enter the cold plate.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, and in particular to a two-phase cold plate and its liquid cooling device. Background Technology

[0002] In existing two-phase cold plate liquid cooling system designs, to address the heat dissipation problem of high-power-density chips, a circulating pump typically provides high pressure to overcome the internal pressure generated by liquid vaporization during chip cooling, ensuring that the liquid smoothly enters the cold plate and carries away the heat generated by the chips. Simultaneously, to optimize the flow distribution to different chips, the system is usually equipped with flow control valves, as well as temperature and pressure sensors, to dynamically adjust the liquid flow rate based on the operating status of each chip (such as power consumption and temperature) to achieve the best cooling effect.

[0003] However, the above design has certain drawbacks. First, when the liquid in the two-phase cold plates vaporizes during operation, it causes a sharp increase in the internal pressure of the system, significantly hindering the inflow of liquid. Second, in high power density applications, such as data center or electronic device cooling systems, when the liquid cooling system's inlet pipe is connected to multiple branch cold plates (each corresponding to a chip), the varying power consumption of different chips will result in significant differences in the amount and pressure of vapor generated. This can make it difficult for the liquid in the branch's inlet pipe to smoothly enter the cold plate, and may even cause backflow. Utility Model Content

[0004] This application provides a two-phase cold plate and its liquid cooling device to at least solve the problem in the related art that when the liquid in the two-phase cold plate vaporizes during operation, it is difficult for the liquid to enter the cold plate.

[0005] This application provides a two-phase cold plate for mounting on a heat-dissipating component, comprising: a cold plate body for absorbing heat from the heat-dissipating component, the cold plate body including a plate inlet and a plate outlet; a first pipe, the inlet of the first pipe being connected to an external liquid supply component, and the outlet of the first pipe being connected to the plate inlet, so that a cooling medium is transferred from the external liquid supply component to the cold plate body; a second pipe disposed within the first pipe and the cold plate body, the second pipe including multiple pore structures for adsorbing the cooling medium to allow the cooling medium to pass through and to prevent gas reverse permeation; and a gas outlet pipe connected to the plate outlet.

[0006] Furthermore, the first pipeline includes a first pipe section and a second pipe section connected sequentially in a direction away from the cold plate body, the inner diameter of the first pipe section being larger than the inner diameter of the second pipe section; a portion of the second pipeline is located inside the first pipe section and spaced apart from the second pipe section to form a liquid storage chamber between them to store the cooling medium.

[0007] Furthermore, the porous structure includes a tubular structure layer, and the porous structure also includes a support layer and an adsorption layer arranged sequentially at intervals along a direction close to the center line of the tubular structure layer. The support layer has a support mesh, which is laid on the inner wall surface of the tubular structure layer and forms an adsorption filling space for filling the adsorption layer with adsorption material, thereby forming the adsorption layer.

[0008] Furthermore, the cold plate body also includes an evaporation chamber and a buffer chamber that are interconnected. The buffer chamber is located above the evaporation chamber, and the evaporation chamber is in contact with the heat-dissipating component and connected to the first pipeline to receive and store the cooling medium delivered from the first pipeline. The buffer chamber is connected to the gas outflow pipeline so that when the cooling medium is converted into gas in the evaporation chamber, the buffer chamber buffers the generated gas so that the gas flows out through the gas outflow pipeline.

[0009] This application also provides a liquid cooling device, including a two-phase cold plate, wherein the two-phase cold plate is the two-phase cold plate described above.

[0010] Furthermore, there are multiple two-phase cold plates, which are connected in parallel.

[0011] Furthermore, the liquid cooling device also includes: a liquid collection tank, located at the top of the liquid cooling device, which stores a cooling medium; two-phase cold plates are connected to the liquid collection tank to transfer the cooling medium in the liquid collection tank to the two-phase cold plates; and a condenser, which is used to convert gas into a cooling medium. The condenser is located between the liquid collection tank and the two-phase cold plates and is connected to both the liquid collection tank and the two-phase cold plates to receive gas from the two-phase cold plates and condense the gas into condensate, and then transport the condensed condensate to the liquid collection tank.

[0012] Furthermore, the liquid cooling device also includes a gas collection chamber located between the condenser and the two-phase cold plate, and connected to both the condenser and the two-phase cold plate respectively, to store gas from the two-phase cold plate and transport the gas to the condenser.

[0013] Furthermore, the liquid cooling device also includes a liquid inlet branch, which is divided into: a first liquid inlet branch, which is located between the liquid collection tank and the two-phase cold plate and is connected to both the outlet of the liquid collection tank and the inlet of the two-phase cold plate; and / or a second liquid inlet branch, which is located between the liquid collection tank and the condenser and is connected to both the inlet of the liquid collection tank and the outlet of the condenser.

[0014] Furthermore, the liquid cooling device also includes an air intake branch, which is divided into: a first air intake branch, which is located between the two-phase cold plate and the gas collecting chamber, and is connected to the outlet of the two-phase cold plate and the inlet of the gas collecting chamber respectively; and / or, a second air intake branch, which is located between the gas collecting chamber and the liquid collecting tank, and is connected to the outlet of the gas collecting chamber and the inlet of the liquid collecting tank respectively.

[0015] In this way, the two-phase cold plate of this application, by setting a second pipe between the first pipe and the cold plate body and filling it with a porous structure, allows the cooling medium to flow smoothly into the cold plate under the action of capillary force, while effectively preventing gas backflow. This design can avoid liquid backflow to the first pipe due to the high pressure generated by vaporization, eliminating the backflow phenomenon and thus improving the stability and reliability of the liquid cooling system; moreover, the porous structure of the second pipe optimizes the transmission efficiency of the cooling medium, ensuring that the cooling medium can cover the heat-dissipating components in a timely and uniform manner, achieving efficient heat exchange.

[0016] Meanwhile, the liquid cooling device of this application does not rely on additional pump power, reducing energy consumption. Through anti-backflow and self-priming design, the structure of the liquid cooling device is simplified, eliminating the need for complex flow control valves, pressure regulators and other components, reducing the complexity and cost of the device, and making the overall liquid cooling solution more economical and feasible.

[0017] Furthermore, in this application, the inlet and outlet of the cold plate body have clearly defined functions. The former is responsible for the input of the cooling medium, while the latter ensures the discharge of gases such as steam, achieving complete separation of gas and liquid. This avoids system instability and safety issues caused by gas-liquid mixing. Therefore, this two-phase cold plate design is particularly suitable for the heat dissipation needs of high power density chips, effectively handling large heat loads, reducing chip temperature, and ensuring high-performance operation of electronic devices. Even in the event of leakage, the backflow prevention characteristics of the cold plate body can prevent short-circuit risks, thereby reducing system failures and downtime maintenance time. This effectively solves the problem in related technologies where liquid is difficult to enter the cold plate when it vaporizes during operation. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a two-phase cold plate in one direction provided in an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the structure of a two-phase cold plate provided in an embodiment of this application in another direction;

[0021] Figure 3 This is a schematic diagram of the liquid cooling device provided in the embodiments of this application;

[0022] Figure 4 A schematic diagram of the extension direction of the pore structure provided in the embodiment of this application in a two-phase cold plate;

[0023] Figure 5 This is a schematic diagram of the pore structure provided in the embodiment of this application, which is arranged on the first pipeline.

[0024] The above figures include the following reference numerals:

[0025] 10. Cold plate body; 110. Plate inlet; 120. Plate outlet;

[0026] 20. First pipeline; 210. Inlet; 220. Outlet;

[0027] 230, First pipe section; 240, Second pipe section;

[0028] 30. Second pipeline; 310. Pore structure;

[0029] 40. Gas outflow pipeline;

[0030] 50. Liquid storage chamber;

[0031] 60. Liquid collection tank; 70. Two-phase cold plate; 80. Condenser; 90. Gas collection chamber;

[0032] 1. First liquid inlet branch; 2. Second liquid inlet branch;

[0033] 3. First intake branch; 4. Second intake branch;

[0034] 100. Components to be cooled. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0036] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] like Figures 1 to 5As shown, an embodiment of this application provides a two-phase cold plate for mounting on a heat-dissipating component 100, comprising: a cold plate body 10 for absorbing heat from the heat-dissipating component, the cold plate body 10 including a plate inlet 110 and a plate outlet 120; a first pipe 20, the inlet 210 of the first pipe 20 being connected to an external liquid supply component, and the outlet 220 of the first pipe 20 being connected to the plate inlet 110, so that cooling medium is transferred from the external liquid supply component to the cold plate body 10; a second pipe 30 disposed within the first pipe 20 and the cold plate body 10, the second pipe 30 including a plurality of pore structures 310 for adsorbing cooling medium to allow cooling medium to pass through and to prevent gas reverse permeation; and a gas outlet pipe 40 connected to the plate outlet 120. Preferably, the first pipe 20 is a liquid inlet pipe, and the second pipe 30 is a self-priming transfer pipe.

[0039] As can be seen, the two-phase cold plate of this application, by setting a second pipe 30 between the first pipe 20 and the cold plate body 10 and filling it with a porous structure 310, allows the cooling medium to flow smoothly into the cold plate under the action of capillary force, while effectively preventing gas backflow. This design can avoid liquid backflow to the liquid inlet pipe caused by high pressure generated by vaporization, eliminating backflow phenomenon and thus improving the stability and reliability of the liquid cooling system; moreover, the porous structure 310 of the second pipe 30 optimizes the transmission efficiency of the cooling medium, ensuring that the cooling medium can cover the heat-dissipating component 100 in a timely and uniform manner, achieving efficient heat exchange.

[0040] Meanwhile, the liquid cooling device of this application does not rely on additional pump power, reducing energy consumption. Through anti-backflow and self-priming design, the structure of the liquid cooling device is simplified, eliminating the need for complex flow control valves, pressure regulators and other components, reducing the complexity and cost of the device, and making the overall liquid cooling solution more economical and feasible.

[0041] Furthermore, in this application, the plate inlet 110 and plate outlet 120 inside the cold plate body 10 have clearly defined functions. The former is responsible for the input of the cooling medium, while the latter ensures the discharge of gases such as steam, achieving complete separation of gas and liquid. This avoids system instability and safety issues caused by gas-liquid mixing. Therefore, this two-phase cold plate design is particularly suitable for the heat dissipation needs of high power density chips, effectively handling large heat loads, reducing chip temperature, and ensuring high-performance operation of electronic devices. Even if leakage occurs, the backflow prevention characteristics of the cold plate body 10 can prevent short-circuit risks, thereby reducing system failures and downtime maintenance time. This effectively solves the problem in related technologies where liquid is difficult to enter the cold plate when it vaporizes during operation.

[0042] like Figure 4 and Figure 5As shown, specifically, each of the multiple pore structures 310 includes a first pore section and a second pore section connected to each other. The first pore sections of the multiple pore structures 310 are stacked in the first pipe 20, and the second pore sections of the multiple pore structures 310 are distributed at the bottom of the cold plate body 10.

[0043] The first pore section is designed to form a highly dense fluid inlet. By stacking within the first pipe 20, it can significantly enhance capillary action, ensuring stable and uniform liquid inflow, reducing the possibility of gas backflow, effectively preventing liquid backflow, and maintaining continuous system operation. The second pore section is located at the bottom of the cold plate body and is in direct contact with the heat source. Its purpose is to maximize the heat conduction area, accelerate the liquid evaporation and heat absorption process, thereby improving heat exchange efficiency, ensuring a tighter and more stable contact between the cold plate and the heat source, and improving overall heat dissipation performance.

[0044] like Figure 1 and Figure 2 As shown, the first pipe 20 includes a first pipe section 230 and a second pipe section 240 connected sequentially in a direction away from the cold plate body 10. The inner diameter of the first pipe section 230 is larger than the inner diameter of the second pipe section 240. A portion of the second pipe 30 is located inside the first pipe section 230 and is spaced apart from the second pipe section 240 to form a liquid storage chamber 50 between the second pipe section 240 and the second pipe section 240 to store the cooling medium.

[0045] This application enables the storage of additional cooling medium by providing a liquid storage chamber 50 in the first pipe 20, i.e., a portion of the second pipe 30 is located within the first pipe section 230 and forms a space with the second pipe section 240. This is particularly important when the heat load on the cold plate changes abruptly, as it can instantly replenish the liquid required for evaporation, ensuring the continuous heat dissipation performance of the cold plate, especially in high-power applications such as server cooling in data centers.

[0046] In this application, the larger inner diameter of the first pipe section 230 allows more cooling medium to flow in rapidly, while the smaller inner diameter of the second pipe section 240 restricts the reverse flow of vapor and other gases after evaporation. This not only helps to improve the heat transfer efficiency of the cooling medium, but also prevents vapor from obstructing the normal flow of the cooling medium, thereby ensuring the working stability and efficiency of the cold plate. By forming a liquid storage chamber 50 in the first pipe 20, this application effectively isolates the direct contact between vapor and cooling medium, avoiding the adverse effects of vapor pressure on the flow of cooling medium. This not only improves the gas management inside the two-phase cold plate, but also enhances the compatibility of the two-phase cold plate with other components of the liquid cooling device, such as the condenser and the liquid collection tank, ensuring the stable operation of the entire liquid cooling cycle.

[0047] Furthermore, the segmented design of the first pipeline 20 in this application, especially the connection method between the first pipeline segment 230 and the second pipeline segment 240, increases the overall structural strength of the pipeline. This design reduces the possibility of damage to the pipeline due to thermal expansion and contraction or vibration during long-term use, thereby reducing maintenance frequency and costs.

[0048] The design described in this application eliminates the need for additional power equipment such as pumps to circulate the cooling medium in the two-phase cold plate; the flow of the cooling medium relies entirely on gravity and the capillary effect of the second pipe 30. This not only simplifies the complexity of the two-phase cold plate but also reduces energy consumption.

[0049] Specifically, the pore structure 310 includes a tubular structure layer, and further includes a support layer and an adsorption layer arranged sequentially and at intervals along a direction close to the centerline of the tubular structure layer. The support layer has a support mesh, which is laid on the inner wall surface of the tubular structure layer and forms a filling space for filling the adsorption material to form the adsorption layer. In this application, the mesh structure of the support layer can effectively limit the width of the liquid flow path, while providing sufficient structural strength to prevent the adsorption material from shifting or deforming due to liquid flow, thus ensuring stable liquid flow in the pore structure.

[0050] The high thermal conductivity material of the adsorption layer can quickly absorb and transfer heat, promote liquid evaporation, and improve the overall heat exchange efficiency. The high liquid absorption performance of the adsorption material, combined with the porous structure of the support layer, automatically attracts liquid into the heat source area through capillary action, ensuring a stable liquid supply and preventing the system from drying out even without external pumping power.

[0051] Specifically, the support mesh is a copper mesh, the support material is copper powder, and the pore structure is a copper mesh and copper powder fired at high temperature.

[0052] By laying copper mesh on the inner wall of the tubular structure layer and filling the filling space with copper powder core, a dense capillary structure is formed. This structure significantly enhances the capillary effect of the second pipe 30, enabling the cooling medium to stably enter the cold plate body 10 through self-priming. Even under high heat load conditions, it can ensure an effective supply of liquid, thereby maintaining stable heat dissipation performance.

[0053] Preferably, due to the extremely small pores of copper powder, its structural design can effectively block gas passage, which is especially important when the cooling medium evaporates to generate steam and forms high pressure. By preventing steam backflow, this application avoids the backflow of the cooling medium under high pressure, prevents the two-phase cold plate from dry burning, and ensures the continuous operation of the two-phase cold plate and the safety of the components to be cooled.

[0054] The high-temperature sintered copper mesh and copper powder core in this application not only provide good physical stability, but also significantly improve heat exchange efficiency due to the high thermal conductivity of copper. The close contact between the cooling medium and these high-temperature sintered materials accelerates the absorption of heat energy, thereby optimizing the overall heat dissipation effect of the cold plate, which is particularly suitable for the efficient cooling of high power density chips.

[0055] Therefore, the porous structure design of this application enables the cold plate to be compatible with pump-free liquid cooling systems, simplifying the operation and maintenance of the liquid cooling system. The corrosion resistance and high thermal stability of copper material also ensure the reliable operation of the system in various environments. Furthermore, the use of high-temperature sintered copper mesh and copper powder core as the porous structure not only reduces the need for expensive and complex flow control and pressure regulation devices, but also lowers the overall manufacturing cost of the liquid cooling system.

[0056] Specifically, the cold plate body 10 also includes an evaporation chamber and a buffer chamber that are interconnected. The buffer chamber is located above the evaporation chamber, and the evaporation chamber is in contact with the heat-dissipating component 100 and connected to the first pipe 20 to receive and store the cooling medium delivered from the first pipe 20. The buffer chamber is connected to the gas outflow pipe 40 so that when the cooling medium is converted into gas in the evaporation chamber, the buffer chamber buffers the generated gas so that the gas flows out through the gas outflow pipe 40.

[0057] Preferably, in this application, the evaporation chamber is a liquid evaporation chamber and the buffer chamber is a gas buffer chamber.

[0058] In this application, the liquid evaporation chamber is in direct contact with the component 100 to be cooled, enabling rapid heat absorption. The cooling medium evaporates in this area, quickly converting into vapor, achieving effective heat transfer and rapid heat dissipation, making it particularly suitable for handling the large amounts of heat generated by high-power-density chips. The gas buffer chamber is positioned above the liquid evaporation chamber, forming a natural gas-liquid separation space. After vapor is generated in the evaporation chamber, it naturally rises to the gas buffer chamber due to density and buoyancy, separating it from the liquid. This design effectively avoids the influence of vapor on the inflow of the cooling medium, prevents the backflow of the cooling medium under high pressure, and ensures the continuity and stability of the heat dissipation process.

[0059] Preferably, the gas buffer chamber serves as a temporary storage area for steam, enabling a certain pressure balance to be formed inside the cold plate. Steam accumulates in the buffer chamber and is discharged through the gas outlet pipe 40, avoiding gas blockage caused by localized high pressure, optimizing the steam flow path, and improving the overall heat dissipation efficiency of the system. By designing a liquid evaporation chamber and a gas buffer chamber within the cold plate body, the internal structural layout is optimized, eliminating the need for additional gas separation devices or complex valve systems. This not only simplifies the overall design of the liquid cooling system and reduces the number of components but also lowers manufacturing costs and maintenance difficulty.

[0060] In this application, the separation of the gas buffer chamber and the liquid evaporation chamber, as well as the orderly discharge of steam through the gas outlet pipe 40, effectively avoids system failures that may be caused by the mixing of two phases inside the cold plate, such as dry burning and gas-liquid impact. This significantly improves the safety and reliability of the liquid cooling system and ensures that the cold plate can provide the best heat dissipation effect under various working conditions.

[0061] An embodiment of this application also provides a liquid cooling device, including a two-phase cold plate 70, wherein the two-phase cold plate 70 is the two-phase cold plate described above.

[0062] The two-phase cold plate in the liquid cooling device of this application can significantly improve heat dissipation efficiency through the optimized design of the liquid evaporation chamber and gas buffer chamber, as well as the capillary effect of the second pipe 30. It is especially suitable for handling the large amount of heat energy generated by high power density devices. The cooling medium absorbs heat quickly in the evaporation chamber and is converted into steam. The steam is temporarily stored and pressure balanced in the gas buffer chamber, and finally discharged through the gas outlet pipe 40, forming an efficient heat dissipation cycle.

[0063] Furthermore, the two-phase cold plate design in this application eliminates the need for additional pumps or other power units to maintain the circulation of the cooling medium in the liquid cooling device. The flow of the cooling medium relies entirely on the capillary effect and gravity of the second pipe 30. This design not only simplifies the system structure and reduces energy consumption but also reduces the use of complex components, thereby lowering manufacturing and maintenance costs. The gas-liquid separation characteristics of the two-phase cold plate enable the liquid cooling device to achieve the separation and circulation of the cooling medium and vapor without pump drive, significantly improving the overall compatibility of the liquid cooling device. The liquefaction of the cooling medium and the condensation of the vapor occur separately in the cold plate and condenser, respectively, avoiding problems that may be caused by gas-liquid mixing.

[0064] This application employs a liquid cooling device with two-phase cold plates. Through the gas blocking effect of the second pipeline 30 and the setting of the gas buffer chamber, the adverse effects of steam pressure on the flow of cooling medium are effectively avoided, the risk of dry burning of the cold plates is reduced, and the overall safety and reliability of the liquid cooling device are improved.

[0065] like Figure 3 As shown, there are multiple two-phase cold plates 70, and multiple two-phase cold plates 70 are arranged in parallel.

[0066] The parallel connection of multiple two-phase cold plates 70 in this application significantly increases the heat dissipation area and capacity, effectively addressing the high-power, high-density heat dissipation demands of scenarios such as data centers and high-performance computing equipment. The parallel cold plates can operate simultaneously, each independently handling heat, significantly improving the overall heat dissipation efficiency of the liquid cooling system. By connecting multiple two-phase cold plates 70 in parallel, the cooling medium can be more evenly distributed across each cold plate, preventing any single cold plate from bearing excessive heat load, which could lead to decreased heat dissipation performance or system failure. This design ensures that each cold plate operates under optimal conditions, enhancing the overall reliability and stability of the system.

[0067] The parallel-connected cold plates in this application can dynamically adjust their number of operation based on actual heat load, flexibly responding to load changes during server or equipment operation. Under low load, the number of cold plates in operation can be reduced, lowering energy consumption; under high load, all cold plates can operate simultaneously, providing sufficient heat dissipation capacity to ensure the system operates within a safe temperature range; even if one or more cold plates fail or require maintenance, the remaining cold plates can continue to operate, providing sufficient heat dissipation, avoiding the risk of system downtime due to a single point of failure, and improving system redundancy and fault tolerance.

[0068] Preferably, the parallel structure in this application reduces reliance on complex flow control and distribution systems. The liquid flow path for each cold plate is relatively independent, reducing the complexity of flow control. This design simplifies the overall system architecture, reduces the failure rate, and also lowers system and maintenance costs. The parallel cold plate structure is easily expandable; the number of cold plates can be gradually increased according to the growing heat dissipation needs of data centers or high-performance computing equipment, without requiring large-scale modifications to the entire liquid cooling system. This modular design improves the system's economy and flexibility.

[0069] Furthermore, connecting multiple two-phase cold plates in parallel can balance the pressure distribution within the system, preventing backflow of the cooling medium caused by excessive local pressure. By properly arranging the cold plates, the system can maintain pressure balance, ensure smooth cooling circulation, and reduce the risk of system failure.

[0070] Specifically, the liquid cooling device further includes: a liquid collection tank 60, located at the top of the liquid cooling device, containing a cooling medium; a two-phase cold plate 70 connected to the liquid collection tank 60 to transfer the cooling medium from the liquid collection tank 60 to the two-phase cold plate 70; and a condenser 80, used to convert gas into a cooling medium, located between the liquid collection tank 60 and the two-phase cold plate 70, and connected to both the liquid collection tank 60 and the two-phase cold plate 70 respectively, to receive gas from the two-phase cold plate 70 and condense the gas into condensate, and then transport the condensed condensate to the liquid collection tank 60.

[0071] In this application, the liquid collection tank 60 is located at the top of the liquid cooling device. The cooling medium stored inside flows naturally into the two-phase cold plate 70 under gravity, eliminating the need for pumps or other external power equipment. This simplifies the system structure and reduces energy consumption and maintenance costs. The condenser 80 is connected between the two-phase cold plate 70 and the liquid collection tank 60, responsible for condensing the vapor generated by the two-phase cold plate 70 back into a liquid state, which then returns to the liquid collection tank 60 under gravity. This design ensures the continuity and stability of the cooling cycle and improves heat dissipation efficiency. The liquid collection tank 60, located at the top, can automatically adjust the liquid level of the cooling medium according to the needs of the liquid cooling device, avoiding a decrease in heat dissipation performance due to insufficient liquid level, and also preventing overflow or oversaturation problems caused by excessive liquid level, thus maintaining the dynamic balance of the liquid cooling device.

[0072] The liquid evaporation chamber and gas buffer chamber design inside the two-phase cold plate 70 in this application achieves effective separation of cooling medium and vapor, avoiding the negative impact of gas-liquid mixing on the heat dissipation effect of the liquid cooling device. Gas enters the condenser 80 directly through the gas outlet pipe 40, while the cooling medium is input from the liquid collection tank 60 through the second pipe 30, which optimizes the system architecture and improves heat dissipation efficiency.

[0073] Furthermore, the positioning design of the liquid collection tank 60 and the condenser 80, as well as the gas-liquid separation mechanism of the two-phase cold plate 70, work together to reduce pressure fluctuations within the system, avoid interference of steam pressure on the flow of the cooling medium, reduce the risk of backflow and dry burning, enhance the overall safety of the liquid cooling device, and reduce the probability of failure. Therefore, the liquid cooling device of this application is particularly suitable for handling high heat load cooling requirements, such as in data centers and high-performance computing equipment. By adjusting the liquid level of the liquid collection tank 60, the design parameters of the two-phase cold plate 70, and the cooling efficiency of the condenser 80, the liquid cooling device can be flexibly adjusted according to actual heat dissipation requirements to maintain efficient operation.

[0074] Specifically, the liquid cooling device also includes a gas collection chamber 90, which is located between the condenser 80 and the two-phase cold plate 70 and is connected to both the condenser 80 and the two-phase cold plate 70 to store gas from the two-phase cold plate 70 and deliver the gas to the condenser 80.

[0075] In this application, the gas collecting chamber 90 serves as a temporary storage and collection space for gas, regulating the gas flow pressure between the two-phase cold plate 70 and the condenser 80. This avoids gas pressure fluctuations caused by direct connection, ensuring stable gas flow and improving the overall stability of the liquid cooling device. By setting up the gas collecting chamber 90, the liquid cooling device can achieve more thorough gas-liquid separation. After the gas is generated in the two-phase cold plate 70, it is guided to the gas collecting chamber and separated from the cooling medium at the inlet of the condenser 80. This avoids the impact of gas-liquid mixing on the working efficiency of the condenser 80, ensuring efficient gas condensation and smooth flow of the cooling medium.

[0076] The connection between the gas collecting chamber 90 and the two-phase cold plate 70 ensures that steam will not flow back into the liquid evaporation chamber of the cold plate, preventing liquid backflow caused by steam pressure, protecting the cold plate from the risk of dry burning, and improving the safety and reliability of the system.

[0077] The gas collection chamber 90 is designed to adapt to fluctuations in gas generation under different operating conditions, improving the heat dissipation capacity of the liquid cooling device for high-power chips. It also enhances the system's adaptability to changes in ambient temperature, ensuring efficient and stable heat dissipation under various conditions. The gas collection chamber 90 is independent of the condenser 80 and the two-phase cold plate 70, making system maintenance and troubleshooting more convenient. When gas flow problems occur in the liquid cooling device, the gas collection chamber 90 can be checked first, simplifying the problem localization process and improving system maintenance efficiency. Furthermore, as a gas buffer, the gas collection chamber 90 effectively mitigates system shocks caused by sudden changes in gas pressure, reduces internal mechanical stress, lowers the risk of equipment damage, and improves the overall safety performance of the liquid cooling device.

[0078] Optionally, the liquid cooling device further includes a liquid inlet branch, which is divided into: a first liquid inlet branch 1, which is located between the liquid collection tank 60 and the two-phase cold plate 70 and is connected to both the outlet of the liquid collection tank 60 and the inlet of the two-phase cold plate 70; and / or a second liquid inlet branch 2, which is located between the liquid collection tank 60 and the condenser 80 and is connected to both the inlet of the liquid collection tank 60 and the outlet of the condenser 80.

[0079] The arrangement of the first liquid inlet branch 1 and the second liquid inlet branch 2 in this application allows the liquid cooling device to more flexibly control the flow path of the cooling medium. The first liquid inlet branch 1 ensures that the cooling medium can flow stably from the collection tank 60 to the two-phase cold plate 70, while the second liquid inlet branch 2 can recover the cooling medium from the condenser 80 back to the collection tank 60, forming a more optimized circulation path and improving the system's response speed and control accuracy to cooling demands. Through the branch design, the distribution of the cooling medium can be dynamically adjusted according to the actual needs of system operation. When some two-phase cold plates 70 require higher cooling capacity, the first liquid inlet branch 1 can increase the flow rate of the cooling medium through that area; conversely, the second liquid inlet branch 2 can promptly recover the condensed cooling medium, avoiding resource waste and improving the overall heat dissipation efficiency and energy utilization efficiency of the liquid cooling system.

[0080] The presence of the liquid inlet branch ensures a more stable circulation path for the cooling medium inside the cooling device. Even under high heat loads or sudden changes in operating conditions, the system's thermal balance can be maintained by adjusting the branch flow rate, reducing system failures caused by insufficient or excessive cooling medium supply and improving the overall stability and reliability of the liquid cooling system. Through the flexible configuration of the first liquid inlet branch 1 and the second liquid inlet branch 2, the liquid cooling device can better adapt to the varying workloads and environmental conditions in scenarios such as data centers and high-performance computing equipment, ensuring efficient heat dissipation performance under various operating conditions.

[0081] Furthermore, the introduction of branch circuit design makes the liquid cooling unit more flexible when upgrading or expanding. The layout and flow rate of the branch circuit can be adjusted according to the layout of the newly added two-phase cold plate 70 or condenser 80 without the need for large-scale modification of the entire liquid cooling unit. The liquid inlet branch circuit design uses gravity and pressure to naturally drive the flow of the cooling medium, reducing the dependence on high-precision flow regulation equipment and lowering the long-term operating cost of the liquid cooling unit.

[0082] Optionally, the liquid cooling device further includes an air inlet branch, which is divided into: a first air inlet branch 3, which is located between the two-phase cold plate 70 and the gas collecting chamber 90, and is connected to the outlet of the two-phase cold plate 70 and the inlet of the gas collecting chamber 90 respectively; and / or a second air inlet branch 4, which is located between the gas collecting chamber 90 and the liquid collecting tank 60, and is connected to the outlet of the gas collecting chamber 90 and the inlet of the liquid collecting tank 60 respectively.

[0083] In this application, the first air inlet branch 3 ensures that the gas is directly guided from the evaporation area of ​​the two-phase cold plate 70 to the gas collection chamber 90, reducing the resistance and path length of gas flow and helping to accelerate the condensation process. The second air inlet branch 4 ensures that the condensed liquid coolant can quickly return to the liquid collection tank 60, forming a rapid circulation, which improves heat dissipation efficiency and system response speed. The flow of gas in the two-phase liquid cooling system may encounter local air resistance, especially in multi-parallel cold plates. The design of the first air inlet branch 3 and the second air inlet branch 4 reduces air resistance by providing dedicated gas flow channels, ensuring the smooth and continuous operation of the liquid cooling device.

[0084] The presence of the intake branch enhances the gas-liquid separation effect in the system, ensuring that gas and liquid flow separately in different pipes and chambers, avoiding safety hazards such as short circuits and dry burning that may be caused by gas-liquid mixing. It plays a key role in preventing liquid backflow, further improving the safety and reliability of the liquid cooling device.

[0085] The design of the intake branch in this application enables the liquid cooling system to better adapt to changes in the amount of gas generated by high-power chips under different operating conditions. The system can flexibly adjust the opening and closing of the intake branch and the flow rate according to actual needs, ensuring optimal heat dissipation and operating status under any conditions. The design of the first intake branch 3 and the second intake branch 4 helps maintain the pressure balance inside the system. Gas can flow out quickly and smoothly from the two-phase cold plate 70 and be rapidly recovered to the liquid collection tank 60 after condensation in the condenser 80, avoiding high-pressure fluctuations caused by gas accumulation and maintaining the stable operation of the liquid cooling device. Through the precise management of the intake branch, the system can accurately guide the generated gas to the condenser 80 for condensation, eliminating the need to carry uncondensed gas throughout the cycle. This improvement enhances energy utilization efficiency and reduces the overall energy consumption of the liquid cooling device.

[0086] The foregoing has provided a detailed description of a two-phase cold plate and its liquid cooling device. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A two-phase cold plate for mounting on a heat-dissipating component (100), characterized in that, include: The cold plate body (10) is used to absorb the heat of the heat-dissipating component. The cold plate body (10) includes a plate inlet (110) and a plate outlet (120). The first pipe (20) has an inlet (210) connected to an external liquid supply component and an outlet (220) connected to the plate inlet (110) so that the cooling medium is transferred from the external liquid supply component to the cold plate body (10). The second pipe (30) is disposed within the first pipe (20) and the cold plate body (10). The second pipe (30) includes a plurality of pore structures (310) for adsorbing the cooling medium to allow the cooling medium to pass through and to prevent gas reverse permeation. A gas outlet pipe (40) is connected to the plate outlet (120).

2. The two-phase cold plate according to claim 1, characterized in that, The first pipeline (20) includes a first pipe section (230) and a second pipe section (240) connected sequentially in a direction away from the cold plate body (10), wherein the inner diameter of the first pipe section (230) is larger than the inner diameter of the second pipe section (240); A portion of the second pipe (30) is located within the first pipe section (230) and spaced apart from the second pipe section (240) to form a liquid storage chamber (50) between the second pipe section (240) and the liquid storage chamber (50) to store the cooling medium.

3. The two-phase cold plate according to claim 2, characterized in that, The pore structure (310) includes a tubular structure layer. The pore structure (310) also includes a support layer and an adsorption layer arranged sequentially at intervals along a direction close to the center line of the tubular structure layer. The support layer has a support mesh, which is laid on the inner wall surface of the tubular structure layer and forms a filling space for filling the adsorption material to form the adsorption layer.

4. The two-phase cold plate according to claim 1, characterized in that, The cold plate body (10) also includes an evaporation chamber and a buffer chamber that are interconnected. The buffer chamber is located above the evaporation chamber. The evaporation chamber is in contact with the heat-dissipating component (100) and is connected to the first pipe (20) to receive and store the cooling medium delivered from the first pipe (20). The buffer chamber is connected to the gas outlet pipe (40) so that when the cooling medium is converted into gas in the evaporation chamber, the buffer chamber buffers the generated gas so that the gas flows out through the gas outlet pipe (40).

5. A liquid cooling device, characterized in that, Includes a two-phase cold plate (70), wherein the two-phase cold plate (70) is the two-phase cold plate according to any one of claims 1 to 4.

6. The liquid cooling device according to claim 5, characterized in that, The number of the two-phase cold plates (70) is multiple, and the multiple two-phase cold plates (70) are arranged in parallel.

7. The liquid cooling device according to claim 5, characterized in that, The liquid cooling device further includes: A liquid collection tank (60) is located at the top of the liquid cooling device. The liquid collection tank (60) stores the cooling medium. The two-phase cold plate (70) is connected to the liquid collection tank (60) to transfer the cooling medium in the liquid collection tank (60) to the two-phase cold plate (70). A condenser (80) is used to convert the gas into the cooling medium. The condenser (80) is located between the liquid collection tank (60) and the two-phase cold plate (70) and is connected to the liquid collection tank (60) and the two-phase cold plate (70) respectively, so as to receive the gas from the two-phase cold plate (70) and condense the gas into condensate, and transport the condensed condensate to the liquid collection tank (60).

8. The liquid cooling device according to claim 7, characterized in that, The liquid cooling device further includes: A gas collection chamber (90) is located between the condenser (80) and the two-phase cold plate (70) and is connected to the condenser (80) and the two-phase cold plate (70) respectively, to store the gas from the two-phase cold plate (70) and to deliver the gas to the condenser (80).

9. The liquid cooling device according to claim 8, characterized in that, The liquid cooling device further includes a liquid inlet branch, which is divided into: The first liquid inlet branch (1) is located between the liquid collection tank (60) and the two-phase cold plate (70), and is connected to both the outlet of the liquid collection tank (60) and the inlet of the two-phase cold plate (70); and / or, The second liquid inlet branch (2) is located between the liquid collection tank (60) and the condenser (80), and is connected to both the inlet of the liquid collection tank (60) and the outlet of the condenser (80).

10. The liquid cooling device according to claim 8, characterized in that, The liquid cooling device further includes an air inlet branch, which is divided into: The first intake branch (3) is located between the two-phase cold plate (70) and the gas collecting chamber (90), and is connected to the outlet of the two-phase cold plate (70) and the inlet of the gas collecting chamber (90), respectively; and / or, The second air intake branch (4) is located between the gas collecting chamber (90) and the liquid collecting tank (60), and is connected to the outlet of the gas collecting chamber (90) and the inlet of the liquid collecting tank (60), respectively.

Images