Heat dissipation shell structure and spread spectrum signal amplifier

Abstract

The utility model relates to the field of spread spectrum signal amplification devices, in particular to a heat dissipation shell structure and a spread spectrum signal amplifier, the heat dissipation shell structure comprises a protective shell and an insertion piece radiator, and the heat conduction face of the insertion piece radiator is in contact with the heating position of a circuit board through a heat dissipation paster. Heat can be led out to the outside through the insert radiator on the protective shell, so that the temperature of the circuit board and the interior of the shell can be effectively reduced. And the middle radiator is arranged outside the protection shell, so that the heat dissipation area is larger, heat conduction can be carried out among the multiple insertion piece radiators, heat can circulate mutually, and the heat dissipation effect is improved. According to the utility model, a passive heat dissipation structure in the prior art is optimized to a certain extent, and the equipment can be kept in a stable working state only through a passive heat dissipation mode within a certain heat generation amount range.

Description

Technical Field

[0001] This utility model relates to the field of spread spectrum signal amplification devices, specifically to a heat dissipation housing structure and a spread spectrum signal amplifier. Background Technology

[0002] The spread spectrum signal amplification device can internally house two circuit boards: a core amplification board (main circuit board) and an auxiliary function board (secondary circuit board). The main circuit board integrates numerous heat-generating components, and to prevent signal interference between these components, its front is covered by multiple individual shielding covers, leading to heat accumulation. Existing technologies often employ openings in the circuit board or attaching thermally conductive metal to the back of the main heat-generating components to improve heat dissipation. However, these two methods are ineffective, and the generated heat still accumulates within the protective casing. Therefore, an improvement has been made by placing a large area of ​​thermally conductive metal on the back of the circuit board. While this significantly improves heat dissipation, the generated heat remains within the protective casing, preventing a substantial reduction in temperature inside. If active cooling, i.e., using a cooling fan to expel heat, is employed, the spread spectrum signal amplification device is typically used outdoors and operates continuously for extended periods; adding a cooling fan would also increase the failure rate.

[0003] Therefore, a heat dissipation shell structure needs to be designed to conduct heat to the outside through the protective shell structure, so as to effectively reduce the temperature of the circuit board and the inside of the shell. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation housing structure and a spread spectrum signal amplifier.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] The heat dissipation housing structure includes a protective shell and a finned heat sink. The heat-conducting surface of the finned heat sink contacts the heat-generating part of the circuit board through a heat dissipation pad. The heat dissipation surface of the finned heat sink passes through the protective shell and extends to the outside of the protective shell.

[0007] The protective shell is used to fix the finned heat sink.

[0008] Furthermore, there are multiple finned heat sinks, with an intermediate heat sink between two adjacent finned heat sinks. The intermediate heat sink is located on the outside of the protective shell, and each intermediate heat sink has a locking strip on both sides that engages with the finned heat sink. The finned heat sink cooperates with the locking strip through a slot.

[0009] Furthermore, the heat-conducting surface edge of the finned heat sink is provided with a step, and the inner surface of the protective shell is fixed to the heat sink by the step.

[0010] Furthermore, the inner surface of the intermediate heat sink is in contact with the outer surface of the protective shell.

[0011] Furthermore, the top of the protective shell is provided with a square perforation for the finned heat sink to pass through. Two horizontal baffles are fixedly installed on the top of the protective shell. The two horizontal baffles are located at the edges of the two outermost square perforations, and the ends of the two horizontal baffles are connected by a vertical baffle, which is used to limit the movement of the middle heat sink.

[0012] Furthermore, a grating plate is fixedly installed on the top of the protective shell, and a connecting post is fixedly installed on the protective shell. One side of the grating plate abuts against the connecting post, and the end of the bolt passes through the grating plate and engages with the connecting post.

[0013] Furthermore, the protective shell has a grid structure at both ends.

[0014] Furthermore, the grille is fixedly provided with a baffle, one side of which contacts the side of the intermediate radiator away from the longitudinal baffle.

[0015] Furthermore, the side of the heat sink that contacts the main circuit board has a groove for avoiding electrical components.

[0016] A spread spectrum signal amplifier, including the aforementioned heat dissipation housing structure.

[0017] The beneficial effects of this utility model are as follows: The heat dissipation shell structure described in this utility model can conduct heat to the outside through the heat sink on the protective shell, thereby effectively reducing the temperature of the circuit board and the inside of the shell. Furthermore, by setting an intermediate heat sink on the outside of the protective shell, the heat dissipation area is increased, and heat can be conducted between multiple heat sinks, allowing heat to circulate and improving the heat dissipation effect.

[0018] This invention optimizes the passive heat dissipation structure in the prior art. Within a certain range of heat generation, the equipment can be kept in a stable working state by passive heat dissipation alone. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments of this utility model will be briefly introduced below.

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0021] Figure 2 This is a schematic diagram of the installation structure of a finned heatsink.

[0022] Figure 3 This is a cross-sectional view of the present invention.

[0023] Figure 4 This is a three-dimensional sectional view of the present invention.

[0024] Figure 5 This is a schematic diagram of the three-dimensional structure of the protective shell.

[0025] Figure 6 This is a schematic diagram showing the contact between the baffle and the intermediate heat sink.

[0026] In the diagram: 1. Protective shell; 1a. Horizontal baffle; 1b. Vertical baffle; 1c. Square perforation; 2. Main circuit board; 3. Heat sink; 4. Finned heat sink; 4a. Groove; 4b. Step; 4c. Slot; 5a. Clip; 5. Intermediate heat sink; 6. Grille plate; 6a. Connecting post; 6b. Bolt; 6c. Baffle; 7. Secondary circuit board. Detailed Implementation

[0027] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0028] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of this utility model, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product.

[0029] Reference Figures 1 to 6 The heat dissipation housing structure shown includes a protective shell 1 and a finned heat sink 4. The heat-conducting surface of the finned heat sink 4 contacts the heat-generating part of the circuit board through a heat dissipation sticker 3. The heat-generating part of the circuit board is the back metal layer of the main circuit board 2. The heat dissipation surface of the finned heat sink 4 passes through the protective shell 1 and extends to the outside of the protective shell 1.

[0030] The protective shell 1 is used to fix the heat sink 4. The circuit board in this embodiment includes a main circuit board 2 and a secondary circuit board 7 that are stacked on top of each other.

[0031] When heat is generated on the main circuit board 2, it can be conducted to the heat sink 4 through the thermal conductive effect of the thermal pad 3, and then the heat sink 4 guides the heat to the outside of the protective shell 1 for heat dissipation, preventing heat from remaining inside the protective shell 1. Furthermore, by using the thermal pad 3 for heat conduction, compared to thermal grease, it can ensure the cleanliness of the circuit board and prevent damage caused by grease flow. The thermal pad 3 uses a polymer substrate as thin films on both sides, and then mixes thermally conductive filler materials and auxiliary materials to form the middle layer.

[0032] There are multiple finned heat sinks 4, with an intermediate heat sink 5 positioned between adjacent finned heat sinks 4. The intermediate heat sink 5 is located on the outside of the protective shell 1. Each intermediate heat sink 5 has a locking strip 5a on both sides that engages with the finned heat sink 4. The finned heat sink 4 engages with the locking strip 5a through a slot 4c. By setting the intermediate heat sink 5, the heat dissipation area is increased, improving the heat dissipation effect. The intermediate heat sink 5 enables contact heat conduction between adjacent finned heat sinks 4, which can evenly distribute the heat from multiple finned heat sinks 4 and help avoid heat concentration. When one finned heat sink 4 is at a lower temperature, it can help dissipate heat from other finned heat sinks 4 through heat conduction. The side of the finned heat sink 4 that contacts the main circuit board 2 has a groove 4a for avoiding electrical components.

[0033] The heat-conducting surface of the finned heat sink 4 is provided with a step 4b, and the inner surface of the protective shell 1 is fixed to the finned heat sink 4 by the step 4b. One side of the step 4b abuts against the inner edge of the protective shell 1, and one side of the intermediate heat sink 5 abuts against the outer edge of the protective shell 1.

[0034] The inner surface of the intermediate heat sink 5 is in contact with the outer surface of the protective shell 1. The intermediate heat sink 5 forms contact with the protective shell 1 through the step 4b, so that the finned heat sink 4 can be fixed on the protective shell 1, and the finned heat sink 4 is a detachable structure relative to the protective shell 1.

[0035] The top of the protective shell 1 has a square through-hole 1c for the heat sink 4 to pass through. Two horizontal baffles 1a are fixedly installed on the top of the protective shell 1, located at the edges of the two outermost square through-holes 1c. The ends of the two horizontal baffles 1a are connected by a vertical baffle 1b, which limits the movement of the intermediate heat sink 5 and contacts one side of the intermediate heat sink 5. The horizontal baffles 1a and vertical baffles 1b strengthen the edge structure of the protective shell 1 after the opening. When the signal amplifier is mounted on a wall, the vertical baffle 1b prevents the intermediate heat sink 5 from sliding down and falling off.

[0036] A grating plate 6 is fixedly installed on the top of the protective shell 1, and a connecting post 6a is fixedly installed on the protective shell 1. One side of the grating plate 6 abuts against the connecting post 6a, and the end of the bolt 6b passes through the grating plate 6 and engages with the connecting post 6a. The grating plate 6 serves a protective function, protecting the finned radiator 4 on the one hand, and preventing the finned radiator 4 from scratching workers on the other. The connecting post 6a and bolt 6b ensure that a gap remains between the grating plate 6 and the finned radiator 4 after installation, guaranteeing unobstructed airflow and avoiding affecting the heat dissipation effect.

[0037] The protective shell 1 has grille structures at both ends. These grille structures allow airflow to enter the interior of the protective shell 1. In practical applications, a dust filter can also be added inside the grille structure to isolate dust. Dust filter devices are existing technology and will not be described in detail in this embodiment. It should be noted that since this embodiment has already transferred the main heat of the circuit board to the heat sink 4 located outside the protective shell 1 via heat conduction, the grille structures at both ends can be selectively designed according to the specific application scenario and internal heat generation. For circuit boards with low power or applications with high sealing requirements, the grille structures at both ends can be removed.

[0038] The grille plate 6 is fixedly provided with a baffle 6c, one side of which contacts the side of the intermediate radiator 5 away from the longitudinal baffle 1b. By providing the baffle 6c, the baffle 6c and the longitudinal baffle 1b can achieve a clamping effect on the intermediate radiator 5, thereby improving the stability of the intermediate radiator 5 after installation.

[0039] This embodiment also describes a spread spectrum signal amplifier, including the heat dissipation housing structure described above. By using this heat dissipation housing, the spread spectrum signal amplifier can be operated without the problem of brief signal interruption due to excessive temperature.

[0040] The heat dissipation housing structure described in this embodiment can effectively alleviate the temperature of the circuit board and the interior of the housing by dissipating heat to the outside through the heat sink 4 on the protective housing. Furthermore, by setting an intermediate heat sink 5 on the outside of the protective housing 1, the heat dissipation area is increased, and heat can be conducted between multiple heat sinks 4, allowing heat to circulate and improving the heat dissipation effect.

[0041] This embodiment does not use a fan for active heat dissipation as in the prior art. Instead, it uses passive heat dissipation to expel heat in a timely manner by optimizing the housing structure and the connection between the housing and the internal circuit board.

[0042] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A heat dissipation housing structure, characterized in that, Includes a protective shell (1) and a heat sink (4). The heat-conducting surface of the heat sink (4) contacts the heat-generating part of the circuit board through a heat dissipation sticker (3). The heat dissipation surface of the heat sink (4) passes through the protective shell (1) and extends to the outside of the protective shell (1). The protective shell (1) is used to fix the finned heat sink (4).

2. The heat dissipation housing structure as described in claim 1, characterized in that, The number of the insert heat sinks (4) is multiple, and an intermediate heat sink (5) is provided between two adjacent insert heat sinks (4). The intermediate heat sink (5) is located on the outside of the protective shell (1). Each intermediate heat sink (5) has a locking strip (5a) on both sides that engages with the insert heat sink (4). The insert heat sink (4) engages with the locking strip (5a) through the locking groove (4c).

3. The heat dissipation housing structure as described in claim 2, characterized in that, The heat-conducting surface edge of the finned heat sink (4) is provided with a step (4b), and the inner surface of the protective shell (1) fixes the finned heat sink (4) through the step (4b).

4. The heat dissipation housing structure as described in claim 3, characterized in that, The inner surface of the intermediate heat sink (5) is in contact with the outer surface of the protective shell (1).

5. The heat dissipation housing structure as described in claim 3 or 4, characterized in that, The top of the protective shell (1) is provided with a square perforation (1c) for the finned heat sink (4) to pass through. Two horizontal bars (1a) are fixedly provided on the top of the protective shell (1). The two horizontal bars (1a) are located at the edges of the two outermost square perforations (1c) respectively, and the ends of the two horizontal bars (1a) are connected by a vertical bar (1b). The vertical bar (1b) is used to limit the middle heat sink (5).

6. The heat dissipation housing structure as described in claim 5, characterized in that, A grid plate (6) is fixedly installed on the top of the protective shell (1). Several connecting columns (6a) are fixedly installed on the protective shell (1). One side of the grid plate (6) abuts against the connecting column (6a). The end of the bolt (6b) passes through the grid plate (6) and engages with the connecting column (6a) to fix the grid plate (6).

7. The heat dissipation housing structure as described in claim 1, characterized in that, The protective shell (1) has a grid structure at both ends.

8. The heat dissipation housing structure as described in claim 6, characterized in that, The grating plate (6) is fixedly provided with a baffle (6c), and one side of the baffle (6c) contacts the side of the intermediate radiator (5) away from the longitudinal baffle (1b).

9. The heat dissipation housing structure as described in claim 1, characterized in that, The side of the heat sink (4) that contacts the main circuit board (2) has a groove (4a) for avoiding electrical components.

10. A spread spectrum signal amplifier, characterized in that, Includes the heat dissipation housing structure as described in any one of claims 1-4.

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